CN204206610U - aluminum foil circuit board - Google Patents
aluminum foil circuit board Download PDFInfo
- Publication number
- CN204206610U CN204206610U CN201420705083.XU CN201420705083U CN204206610U CN 204206610 U CN204206610 U CN 204206610U CN 201420705083 U CN201420705083 U CN 201420705083U CN 204206610 U CN204206610 U CN 204206610U
- Authority
- CN
- China
- Prior art keywords
- aluminum foil
- circuit board
- copper
- aluminium foil
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052782 aluminium Inorganic materials 0.000 title abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract description 11
- 239000011888 foil Substances 0.000 title abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- 239000005030 aluminium foil Substances 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000011324 bead Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 229920000297 Rayon Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229920006335 epoxy glue Polymers 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 10
- 239000011247 coating layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
An aluminum foil circuit board, adopt the aluminum foil to replace the existing copper foil to produce the circuit board substrate, make the circuit through the traditional circuit board production method after the aluminum foil substrate is done, then do not need the position of power-on connection and do not need to weld electronic components or LED lamp pearl to coat a layer of solder mask or laminating layer, leak in the place that needs to weld naked, then lay a layer of copper, nickel or silver layer through the way of chemical deposition copper, nickel or silver in the welding position that leaks naked, in order to form the required solder joint of our, and do not change on the surface of aluminum foil of other positions, just so realized replacing the copper foil with the aluminum foil and producing the circuit board, solved the difficult problem that the aluminum foil does not weld the components and parts well at the same time, make the copper consumption on the circuit board reduce greatly, therefore the utility model discloses an aluminum foil circuit board is more environmental-friendly, the production cost is; in addition, the aluminum foil is beneficial to heat dissipation of electronic components on the circuit board, so that heat dissipation of electrical products is facilitated to prolong the service life of the products.
Description
Technical field
The utility model relates to a kind of wiring board techniques, refers in particular to aluminium foil wiring board.
Background technology
Need on the product of electricity consumption in household electrical appliance, LED etc., often all will use wiring board to lay electric elements or LED lamp bead etc.Current, the surface (conductive layer) of wiring board is all as conductive layer with Copper Foil, made a return journey by chemical corrosion method again when reality uses and remove those Copper Foils not needing the position of welding electronic component and conduction, copper is more valuable metal, adopting fine copper to produce wiring board causes the cost of wiring board to remain high, paste the wiring board of LED lamp bead for needing in addition, the wiring board thermal diffusivity adopting copper to produce not as aluminium, so not only not environmentally, but also cause the waste of copper.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides that one more environmental protection, production cost are lower, the better aluminium foil wiring board of radiating effect.
In order to solve the technical problem of above-mentioned existence, the utility model adopts following technical proposals:
A kind of aluminium foil wiring board, includes insulating barrier, by the aluminium foil of paste adhesive on insulating barrier or heat-conducting layer, needs energising connect and need the position of welding electronic component or LED lamp bead is provided with copper, nickel or silver layer at described aluminium foil surface.
In the improvement project to above-mentioned aluminium foil wiring board, described viscose glue is epoxy resin, glue or polyurethane.
Compared with prior art, the beneficial effects of the utility model are: it adopts aluminium foil to replace existing copper foil production line road plate substrate, Al foil substrate makes circuit by traditional wiring board mode of production after carrying out again, then the welding resistance continuing lower operation (is about to not need energising be connected and do not need the position of welding electronic component or LED lamp bead applies one deck solder mask or coating layer with coating technique, the place of needs welding is naked to be spilt), then electroless copper plating is passed through in the naked welding position spilt, the mode of nickel or silver lays one deck copper, nickel or silver layer, to form the solder joint required for us, thus help the welding conducting of electronic devices and components or LED lamp bead (because traditional tin cream directly cannot carry out weld job on aluminium), and the aluminium foil surface in other position does not do to change (because having solder mask or coating layer to cover), so just achieve and produce wiring board with aluminium foil replacement Copper Foil, also solve a difficult problem for the bad welding component of aluminium foil simultaneously, the copper consumption on wiring board is made greatly to reduce, therefore aluminium foil wiring board of the present utility model more environmental protection, production cost is lower, in addition, aluminium foil contributes to the heat radiation of the electronic devices and components on wiring board, thus the heat radiation contributing to electric equipment products is to improve the useful life of product.
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
[accompanying drawing explanation]
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the vertical view of Fig. 1.
[embodiment]
The utility model is a kind of aluminium foil wiring board, include insulating barrier 1, the aluminium foil 2 on insulating barrier or heat-conducting layer 1 is pasted onto by viscose glue 4, after aluminium foil circuit half forms circuit, need energising connect and need the position of welding electronic component or LED lamp bead is provided with copper at described aluminium foil surface, nickel or silver layer 3, so just can when welding, link together in the place and scolding tin that need welding desired electronic devices and components or the LED lamp bead of burn-oning, the utility model needs energising connect and need electroless copper plating is passed through in the position of welding electronic component or LED lamp bead at aluminium foil surface, the mode of nickel or silver arranges copper, nickel or silver layer help welding, and the aluminium foil surface in other position is not done to change, so successfully replace Copper Foil with aluminium foil to produce wiring board and make the copper consumption on wiring board greatly reduce, therefore aluminium foil wiring board of the present utility model more environmental protection, production cost is lower, in addition, aluminium foil contributes to the heat radiation of the electronic devices and components on wiring board, thus the heat radiation contributing to electric equipment products is to improve the useful life of product.
Aluminium foil wiring board of the present utility model to manufacture process as follows:
1, coat viscose glue 4 in the one side of aluminium foil 2, viscose glue can be epoxy resin, glue, polyurethane etc.;
2, on viscose glue 4, insulating barrier 1 is stained with, insulating barrier is PI film, glass-fiber-plate etc. normally, when insulating barrier adopts PI film, the Copper Foil composite base material produced is flexible, and when insulating barrier adopts glass-fiber-plate, the Copper Foil composite base material produced is rigidity, is namely usually said pcb board;
3, after the another side of described aluminium foil 2 forms circuit, the position of welding electronic component or LED lamp bead is coated coating one deck solder mask or coating layer by not needing; Play the effect of protection circuit.
4, adopt electroless copper plating, nickel or silver-colored mode, just can have heavy upper copper, nickel or the silver layer 3 in the position of solder mask (or coating layer) uncoated, form the circuit layers of copper required for us with this.
Although with reference to when embodiment describes principle of the present utility model and the scope of the claim restriction described in this patent in detail above; can make a variety of changes the utility model or revise; but be it will be apparent to one skilled in the art that by the disclosure; the detailed description of disclosure embodiment is only used for explaining; instead of be used for limiting the utility model, but be defined by the subject-matter of the claims the scope of protection.
Claims (2)
1. an aluminium foil wiring board, it is characterized in that, include insulating barrier, by the aluminium foil of paste adhesive on insulating barrier or heat-conducting layer, need energising connect and need the position of welding electronic component or LED lamp bead is provided with copper, nickel or silver layer at described aluminium foil surface.
2. aluminium foil wiring board according to claim 1, is characterized in that, described viscose glue is epoxy resin, glue or polyurethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705083.XU CN204206610U (en) | 2014-11-22 | 2014-11-22 | aluminum foil circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705083.XU CN204206610U (en) | 2014-11-22 | 2014-11-22 | aluminum foil circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204206610U true CN204206610U (en) | 2015-03-11 |
Family
ID=52664515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420705083.XU Active CN204206610U (en) | 2014-11-22 | 2014-11-22 | aluminum foil circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204206610U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113996515A (en) * | 2021-11-16 | 2022-02-01 | 江苏华旺新材料有限公司 | Film-coated copper-aluminum composite sheet and composite process thereof |
-
2014
- 2014-11-22 CN CN201420705083.XU patent/CN204206610U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113996515A (en) * | 2021-11-16 | 2022-02-01 | 江苏华旺新材料有限公司 | Film-coated copper-aluminum composite sheet and composite process thereof |
| CN113996515B (en) * | 2021-11-16 | 2022-06-24 | 江苏华旺新材料有限公司 | Film-coated copper-aluminum composite sheet and composite process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151211 Address after: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. Address before: 528400 Guangdong Province, Zhongshan Jianghai garden Yuanzhi Bay Street six building 1502 Patentee before: Wang Yanxin |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 528400 Guangdong province Jiangmen Jianghai Keyuan Road No. 17 building four floor B2 Patentee after: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. Address before: Keyuan Road 528400 in Guangdong province Zhongshan City Jianghai District No. 17 building four floor B2 Patentee before: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 528400 4th floor, building B2, No.17 Keyuan Road, Jianghai District, Jiangmen City, Guangdong Province Patentee after: Jiangmen Xinhengrui Electronics Co.,Ltd. Address before: 528400 4th floor, building B2, No.17 Keyuan Road, Jianghai District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Jianghai Yong Chong Xin Electronics Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230721 Address after: Building c8-c10, circuit board industrial park, No.9 Changxing Avenue, Dongbao District, Jingmen City, Hubei Province Patentee after: HUBEI YONGCHUANGXIN ELECTRONICS Co.,Ltd. Address before: 528400 4th floor, building B2, No.17 Keyuan Road, Jianghai District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Xinhengrui Electronics Co.,Ltd. |
|
| TR01 | Transfer of patent right |