CN204578887U - A kind of electromagnetic shielding film being applicable to Rigid Flex - Google Patents
A kind of electromagnetic shielding film being applicable to Rigid Flex Download PDFInfo
- Publication number
- CN204578887U CN204578887U CN201520257304.6U CN201520257304U CN204578887U CN 204578887 U CN204578887 U CN 204578887U CN 201520257304 U CN201520257304 U CN 201520257304U CN 204578887 U CN204578887 U CN 204578887U
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- 239000010410 layer Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 238000004544 sputter deposition Methods 0.000 claims abstract description 8
- 238000007766 curtain coating Methods 0.000 claims abstract description 7
- 239000012943 hotmelt Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 64
- 239000000203 mixture Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000643 oven drying Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of electromagnetic shielding film being applicable to Rigid Flex, this electromagnetic shielding film comprises oriented film layer, metal film layer, conduction adhesive layer and release protective layer; Metal film layer can adopt sputtering vacuum process to be formed, and also can adopt the better metal forming of effectiveness; Oriented film layer can adopt commercial high molecular polymer thin layer, also can by being coated with Polymer Solution and being formed through hot curing, can also be formed by hot melt curtain coating mode for high molecular polymer, hot strength can up to more than 120MPa, pliability is good, the high offset of Rigid Flex can be adapted to well, and there is good conduction property, conducting resistance is below 300 milliohms, effectiveness is good, can more than 50db be reached, meet the demand of electronic product industry well.
Description
Technical field
The utility model relates to a kind of electromagnetic shielding film, is specifically related to a kind of electromagnetic shielding film being applicable to Rigid Flex, has the feature of high tensile, resistance to high offset.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and ancillary equipment, communication product and consumption electronic products at present, along with the sustainable growth of consumption electronic products demand, the demand for printed circuit board (PCB) also grows with each passing day.In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, also more and more higher to the requirement of electromagnetic shielding.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
In flexible circuit board, the product having quite a few to be applied as soft board and hardboard to combine, the i.e. said Rigid Flex of industry, be exactly flexible circuit board and rigid wiring board, through operations such as pressings, combine by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.Such material has the requirement of electromagnetic shielding equally, and because hardboard is thick, thin the formed difference in height of soft board, therefore must ensure that screened film has good pliability, have good applicability to difference in height, this just has higher requirement to electromagnetic shielding film.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of electromagnetic shielding film being applicable to Rigid Flex, has the feature of high tensile, resistance to high offset.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
A kind of electromagnetic shielding film being applicable to Rigid Flex; for four-layer structure, comprising: oriented film layer, the metal film layer be formed on oriented film layer, coat the conduction adhesive layer on metal film layer and fit in conduction adhesive layer on release protective layer.
In order to increase the processability in FPC operation, the one side that oriented film layer is not formed metal film layer is fitted with micro-sticky diaphragm, protects and strengthening action, thus define the electromagnetic shielding film of five-layer structure to high oriented film layer.Particularly, the belt glue film that micro-sticky diaphragm is formed for pressure sensitive adhesive in PET, PEN or PI film coated, thickness is 20-200 μm.
As a kind of embodiment, aforementioned oriented film layer is high molecular polymer thin layer, and thickness is 6-100 μm, and described high molecular polymer is the modified film of one or more in PET, PEN, PI, PAI film.Aforementioned metal thin film layer thickness is 20-3000nm, and adopting sputtering vacuum process to be formed on oriented film layer, is the mixture of one or more in silver, copper, aluminium, nickel.
As another kind of embodiment, in order to increase effectiveness, aforementioned metal thin layer is metal forming, is made up of the mixture of one or more in copper, aluminium, nickel, and thickness is 2-18 μm.Oriented film layer is coated in metal forming by Polymer Solution and is formed, or is formed by hot melt curtain coating mode, and thickness is 3-50 μm, and described Polymer Solution is PAA or PAI solution.
In order to ensure the conduction property of excellence, conduction adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder, nickel powder and Graphene, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, elastic caoutchouc, phenolic resins, mylar and polyurethane resin, the thickness of conduction adhesive layer is 3-15 μm, and the particle diameter of conducting powder is 1-15 μm.
More preferably, aforementioned release protective layer thickness is 12-200 μm, is the one in PET release film, PP release film, PBT release film or release liners, and release protective layer is also coated with silicone oil or non-silicone oil mould release.
Usefulness of the present utility model is: electromagnetic shielding film of the present utility model comprises oriented film layer, metal film layer, conduction adhesive layer and release protective layer; Metal film layer can adopt sputtering vacuum process to be formed, and also can adopt the better metal forming of effectiveness; Oriented film layer can adopt commercial high molecular polymer thin layer, also can by being coated with Polymer Solution and being formed through hot curing, can also be formed by hot melt curtain coating mode for high molecular polymer, hot strength can up to more than 120MPa, and pliability is good, the high offset of Rigid Flex can be adapted to well, and have good conduction property, conducting resistance is below 300 milliohms, and effectiveness is good, can reach more than 50db, commercial introduction application prospect is good.
Accompanying drawing explanation
Fig. 1 is the structural representation being applicable to the embodiment 1 of the electromagnetic shielding film of Rigid Flex of the present utility model;
Fig. 2 is the structural representation being applicable to the embodiment 2 of the electromagnetic shielding film of Rigid Flex of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the utility model.
Embodiment 1
See Fig. 1; the electromagnetic shielding film being applicable to Rigid Flex of the present embodiment is four-layer structure, comprising: oriented film layer 11, the metal film layer 12 be formed on oriented film layer 11, coat the conduction adhesive layer 13 on metal film layer 12 and fit in conduction adhesive layer 13 on release protective layer 14.
Oriented film layer 11 plays stretch-proof, insulation and carrying effect, is generally commercially available high molecular polymer thin layer, specifically can be the modified film of one or more in PET, PEN, PI, PAI film, and thickness is 6-100 μm; Also can for by coating and the film that formed of hot curing, also can be the macromolecule membrane layer adopting and formed by hot melt curtain coating mode, thickness is 3-50 μm.
Metal film layer 12 can adopt sputtering vacuum process to be formed on oriented film layer 11, and sputter material is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm.
In order to ensure the conduction property of excellence, conduction adhesive layer 13 is made up of adhesive main body and the conducting powder be distributed in adhesive main body, conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder, nickel powder and Graphene, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, elastic caoutchouc, phenolic resins, mylar and polyurethane resin, the thickness of conduction adhesive layer is 3-15 μm, and the particle diameter of conducting powder is 1-15 μm.Conduction adhesive layer 13 is also fitted the release protective layer of one deck; give the characteristic that this conductive adhesive film can easily be peeled off; thickness is 12-200 μm; specifically can be the one in PET release film, PP release film, PBT release film or release liners, release protective layer is also coated with silicone oil or non-silicone oil mould release.
In order to understand the utility model better, the manufacturing process of the electromagnetic shielding film of the present embodiment is as follows: first, removes the greasy dirt on oriented film layer 11 and foreign matter, and carries out corona treatment to oriented film layer 11; Then, oriented film layer 11 forms metal film layer 12 by vacuum sputtering, and thickness is 20-3000nm; Then, metal film layer 12 is coated with one deck conduction adhesive layer 13, and thickness is 3-15 μm, enters oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min; Finally, the release protective layer 14 of thermal-adhering one deck in conduction adhesive layer 13, rolling.
Embodiment 2
In order to increase the processability in FPC operation; in the present embodiment, as shown in Figure 2, one side oriented film layer 21 not being formed metal film layer 22 is fitted with micro-sticky diaphragm 25; oriented film layer 21 is protected and strengthening action, thus defines the electromagnetic shielding film of five-layer structure.Particularly, the belt glue film that micro-sticky diaphragm 25 is formed for pressure sensitive adhesive in PET, PEN or PI film coated, thickness is 20-200 μm.
In addition, in order to increase effectiveness, metal film layer 22 is not that sputtering is formed, but directly adopts commercially available metal forming, and metal forming is made up of the mixture of one or more in copper, aluminium, nickel, and thickness is 2-18 μm.21, oriented film layer is coated in metal forming by Polymer Solution and is formed, or is formed by hot melt curtain coating mode, and thickness is 3-50 μm, and Polymer Solution specifically can be PAA or PAI solution.
In order to understand the utility model better, the manufacturing process of the electromagnetic shielding film of the five-layer structure of the present embodiment is as follows: first, at coated on one side one deck PAA or the PAI solution of metal forming; Then, through thermal response solidification, make PAA or PAI solution form oriented film layer 21; Then, applying conductive adhesive layer 23 on the another side of metal forming, thickness is 3-15 μm, enters oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min; The release protective layer 24 of thermal-adhering one deck in conduction adhesive layer 23 again; Finally, by volume to volume mode on oriented film layer 21, micro-sticky diaphragm 25 in laminating, rolling.
To sum up, the electromagnetic shielding film of four-layer structure of the present utility model and five-layer structure all has good stretch-resistance, hot strength reaches more than 120Mpa, the applicability of the high section difference of Rigid Flex can be met, and have good conduction property, conducting resistance is below 300 milliohms, and effectiveness is good, can more than 50db be reached, meet the demand of electronic product industry well.And, the operation such as removing foreign matter, corona, coating, baking and curing, vacuum sputtering, hot melt curtain coating used in the utility model is all mature common technologies of industry in prior art, make manufacturing process of the present utility model be simple and easy to realize and can effectively control cost, be convenient to industrially apply.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection range of the present utility model.
Claims (7)
1. one kind is applicable to the electromagnetic shielding film of Rigid Flex; it is characterized in that; for four-layer structure, comprising: oriented film layer, the metal film layer be formed on oriented film layer, coat the conduction adhesive layer on metal film layer and fit in conduction adhesive layer on release protective layer.
2. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 1; it is characterized in that; the one side that oriented film layer is not formed metal film layer is fitted with micro-sticky diaphragm; form five-layer structure; the belt glue film that described micro-sticky diaphragm is formed for pressure sensitive adhesive in PET, PEN or PI film coated, thickness is 20-200 μm.
3. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 1, it is characterized in that, described oriented film layer is high molecular polymer thin layer, and thickness is 6-100 μm, and described high molecular polymer is selected from the one in PET, PEN, PI or PAI film.
4. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 3, it is characterized in that, described metallic film layer thickness is 20-3000nm, and adopt sputtering vacuum process to be formed on oriented film layer, material is selected from the one in silver, copper, aluminium or nickel.
5. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 1, is characterized in that, described metal film layer is metal forming, is made up of the one in copper, aluminium, nickel, and thickness is 2-18 μm.
6. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 5, it is characterized in that, described oriented film layer is coated in metal forming by Polymer Solution and is formed, or is formed by hot melt curtain coating mode, thickness is 3-50 μm, and described Polymer Solution is PAA or PAI solution.
7. a kind of electromagnetic shielding film being applicable to Rigid Flex according to claim 1; it is characterized in that; described release protective layer thickness is 12-200 μm; for the one in PET release film, PP release film, PBT release film or release liners, release protective layer is also coated with silicone oil or non-silicone oil mould release.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520257304.6U CN204578887U (en) | 2015-04-24 | 2015-04-24 | A kind of electromagnetic shielding film being applicable to Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520257304.6U CN204578887U (en) | 2015-04-24 | 2015-04-24 | A kind of electromagnetic shielding film being applicable to Rigid Flex |
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| Publication Number | Publication Date |
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| CN204578887U true CN204578887U (en) | 2015-08-19 |
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| CN201520257304.6U Expired - Fee Related CN204578887U (en) | 2015-04-24 | 2015-04-24 | A kind of electromagnetic shielding film being applicable to Rigid Flex |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797081A (en) * | 2015-04-24 | 2015-07-22 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to rigid-flex printed circuit boards and production technique of electromagnetic shielding film |
| CN109247003A (en) * | 2018-04-12 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Electromagnetic shielding film and preparation method thereof |
| CN109246920A (en) * | 2017-06-08 | 2019-01-18 | 臻鼎科技股份有限公司 | Cover film and preparation method thereof |
| CN112310671A (en) * | 2020-07-27 | 2021-02-02 | 深圳市卓汉材料技术有限公司 | High-temperature-resistant grounding elastic piece and electronic equipment |
| CN112351666A (en) * | 2020-07-27 | 2021-02-09 | 深圳市卓汉材料技术有限公司 | Wrapped heat-conducting grounding elastic piece and electronic equipment |
-
2015
- 2015-04-24 CN CN201520257304.6U patent/CN204578887U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797081A (en) * | 2015-04-24 | 2015-07-22 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to rigid-flex printed circuit boards and production technique of electromagnetic shielding film |
| CN109246920A (en) * | 2017-06-08 | 2019-01-18 | 臻鼎科技股份有限公司 | Cover film and preparation method thereof |
| CN109246920B (en) * | 2017-06-08 | 2020-10-02 | 臻鼎科技股份有限公司 | Covering film and manufacturing method thereof |
| CN109247003A (en) * | 2018-04-12 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Electromagnetic shielding film and preparation method thereof |
| US11297748B2 (en) | 2018-04-12 | 2022-04-05 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Electromagnetic shielding film |
| CN112310671A (en) * | 2020-07-27 | 2021-02-02 | 深圳市卓汉材料技术有限公司 | High-temperature-resistant grounding elastic piece and electronic equipment |
| CN112351666A (en) * | 2020-07-27 | 2021-02-09 | 深圳市卓汉材料技术有限公司 | Wrapped heat-conducting grounding elastic piece and electronic equipment |
| CN112310671B (en) * | 2020-07-27 | 2022-04-12 | 深圳市卓汉材料技术有限公司 | High-temperature-resistant grounding elastic piece and electronic equipment |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 |
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| CF01 | Termination of patent right due to non-payment of annual fee |