CN210725882U - Electromagnetic shielding film with heat dissipation function - Google Patents
Electromagnetic shielding film with heat dissipation function Download PDFInfo
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- CN210725882U CN210725882U CN201921497666.7U CN201921497666U CN210725882U CN 210725882 U CN210725882 U CN 210725882U CN 201921497666 U CN201921497666 U CN 201921497666U CN 210725882 U CN210725882 U CN 210725882U
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Abstract
The utility model discloses an electromagnetic shielding membrane with heat dissipation function, including coincide in proper order the carrier rete, from type layer, heat insulating layer, metal level, tie coat, protection rete. The utility model discloses an electromagnetic shielding film have high dyne value, high heat dispersion and insulating properties, be applicable to aspects or fields such as electromagnetic shield, copper-clad plate, flexible circuit board (FPC), demonstration. The utility model discloses an insulating layer of electromagnetic wave shielding function membrane uses heat radiation material, has improved heat dispersion greatly, has solved the problem that electromagnetic shielding membrane radiating effect is low.
Description
Technical Field
The utility model belongs to the communication field, in particular to electromagnetic shielding membrane, conductive adhesive film, FPC, function membrane such as demonstration with heat dissipation insulating layer.
Background
The rapid development of information technology enables the chip power consumption of electronic components to be remarkably increased, heat dissipation becomes an important part of the electronic components, and the development of a heat dissipation film with high heat conductivity is an effective means for realizing high-efficiency heat dissipation under the conditions of integration, high density and miniaturization of electronic equipment and instruments. The current internal heat dissipation mode of the mobile phone mainly uses graphite sheet heat dissipation. The graphite sheet heat dissipation film adopts an artificial graphite film formed by carbonizing and graphitizing a Polyimide (PI) film at high temperature, has complex process, high cost and unsatisfactory shielding effect, and cannot meet the requirement of high-frequency and high-speed signal transmission in the 5G era. The utility model discloses the product uses novel heat dissipation coating, has prepared the electromagnetic shielding membrane that has heat insulating layer, and not only production simple process, low cost have solved the problem that electromagnetic shielding membrane heat dissipation and radiating effect are low moreover.
Disclosure of Invention
The utility model aims to overcome the problems of the prior art and provide an electromagnetic shielding film with a heat dissipation insulating structure, which is formed by reasonably superposing a release layer, a heat dissipation insulating layer and a metal layer; the electromagnetic wave shielding film with the heat dissipation function of the utility model has simple preparation method, the functional film of the utility model is simple, light and thin, convenient to use, can be produced in batch, and is suitable for various electronic products and communication equipment; the utility model discloses an electromagnetic shielding film's insulating layer is made by the printing ink that contains the heat dissipation material, has effectively solved the not enough problem of current electromagnetic shielding film heat dissipation function.
In order to realize the utility model discloses an object, the utility model discloses an aspect provides an electromagnetic shielding film with heat dissipation function, include: the heat dissipation insulation film layer, the metal film layer and the bonding film layer are sequentially connected from top to bottom.
Wherein, the lower surface of the bonding layer is connected with a protective film layer.
Particularly, a release layer is connected to the upper surface of the heat dissipation insulating layer; the upper surface of the release layer is connected with a carrier film layer.
Another aspect of the present invention provides an electromagnetic shielding film with a heat dissipation function, including: the heat-dissipation film comprises a carrier film layer, a release layer, a heat-dissipation insulating layer, a metal layer, a bonding layer and a protective film layer which are sequentially overlapped from top to bottom.
The carrier film layer is a polyester film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI), Polyethylene (PE), polypropylene (PP) and the like.
The release layer is a film layer made of a release agent coating; the thickness of the release layer is 0.05-2 μm. The release agent coating comprises a release agent and an organic solvent; the release agent is a silicon-containing release agent or a non-silicon release agent.
In particular, the silicon-containing release agent is a silicone release agent or a modified silicone resin, such as silicone oil, silicone grease, etc., a curable silicone (release silicone oil: release silicone oil from Dow Corning Co., Ltd., release silicone oil KF 868 from shin-Etsu chemical industries, Ltd., release silicone oil from Wake-Country, Germany)
SFX195, etc.); the non-silicon release agent is acrylic resin, polyester, polyurethane, melamine resin, organic fluorine resin (such as Teflon) or corresponding modified resin thereof; the organic solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester, PMA and the like.
And mixing a release agent and an organic solvent to prepare a release agent coating, coating the release agent coating on the carrier film layer, and volatilizing or drying the organic solvent to form the release layer.
The release layer is formed by diluting resins such as acrylic resin, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and the like or modified resins thereof with an organic solvent, coating the diluted resins on the surface of the carrier film layer, and drying.
The release layer is a silicon-containing or non-silicon release film, wherein the silicon-containing release film is preferably an addition type release agent containing dimethyl siloxane, a vinyl silicone oil release agent and the like; the non-silicon release agent is a resin type release agent, such as an acrylic resin release agent, an epoxy resin release agent, an alkyl or polyethyleneimine type release agent, and the like.
The release film layer has the functions of thermal transfer printing and heat dissipation insulation layer protection. The coating mode of the release layer is realized by a slightly concave or mesh roller (500 meshes) coating mode.
The heat dissipation insulating layer is a heat dissipation ink coating film layer formed by coating heat dissipation ink coating on the surface of the release layer; the thickness of the heat dissipation insulating layer is 1 to 30 μm, preferably 2 to 20 μm.
In particular, the heat dissipation material includes graphene, alumina, and the like.
Particularly, the heat-dissipating ink coating comprises the following raw materials in parts by weight:
wherein the resin is polyurethane resin, epoxy resin, acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide or magnesium hydroxide; the auxiliary agent is a surface wetting agent or a surface coupling agent, OFX-5211 (polyether modified silicone oil, Dow Corning) and the like; the heat dissipation material is graphene, aluminum oxide and the like; the filler is silicon dioxide, micro silicon powder, barium sulfate and the like; the diluent is water, butanone, butyl ester, toluene and other solvents.
In particular, the heat dissipation material is graphene; the curing agent is isocyanate; the flame retardant is aluminum hydroxide; the auxiliary agent is OFX-5211; the filler is silicon dioxide; the diluent is water.
In particular, the heat-dissipating ink coating is:
the heat dissipation ink coating is a known material, and besides the heat dissipation ink coating, other materials such as graphene heat conduction ink and alumina heat conduction ink (for example, nanocarbon heat conduction ink produced by shenzhen tengyu high-new materials limited company, 808R type; graphene heat conduction slurry produced by Kun mountain seal reachable new materials company) are all suitable for the heat dissipation ink coating of the utility model.
The surface insulation resistance value of the heat dissipation insulation layer is more than or equal to 108Omega. The coating method of the heat dissipation insulating layer is common screen printing, micro gravure or slit extrusion coating. The heat dissipation insulating layer can meet the requirements of production, use and the like of a circuit board and a shielding film, such as: the high temperature is resisted for 5 times of 288 ℃, and each time is 10 seconds (the method is suitable for a reflow soldering SMT process); chemical resistance, weather resistance, acid and alkali resistance, and the like.
The metal layer is a metal foil layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or alloy thereof; the thickness of the metal layer is 0.01-10 μm, preferably 0.01-5 μm.
In particular, the metal layer is one of gold, silver, copper, aluminum or an alloy thereof, preferably copper.
The metal layer plays a shielding role, the thickness of the metal layer is set according to the frequency, the thicker the metal layer is, the higher the shielding efficiency is, different thicknesses can be designed according to different frequency band products, and the shielding efficiency is achieved.
A layer of metal foil film, namely a metal layer, is deposited on the surface of the heat-radiating insulating layer by utilizing a vacuum coating mode on the lower surface of the heat-radiating insulating layer, and the heat-radiating insulating layer has a high dyne value and strong adhesive force, so that the metal layer is favorably attached; the vacuum coating mode is selected from magnetron sputtering, vacuum evaporation, ion plating, chemical vapor deposition and the like.
The surface of the heat dissipation insulating layer has a high dyne value, so that surface metallization can be realized, and vacuum coating can be realized on the surface of the heat dissipation insulating layer. If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
The bonding layer is a film layer made of conductive adhesive paint or non-conductive adhesive paint or heat-conducting adhesive paint; the thickness of the adhesive layer is 3-20 μm.
Particularly, the bonding layer is formed by coating a conductive adhesive coating or a heat-conducting adhesive coating on the surface of the metal film layer.
The conductive adhesive layer can be an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer, and the conductive adhesive coating comprises matrix resin, conductive particles, inorganic filler, a curing agent and an organic solvent, wherein the conductive particles can be conductive particles with transverse or longitudinal orientation or omnibearing conductive particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the conductive particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the conductive adhesive coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
The heat-conducting glue coating comprises matrix resin, heat-conducting particles, inorganic filler, a curing agent and an organic solvent, wherein the heat-conducting particles can be heat-conducting particles with transverse or longitudinal orientation or omnibearing heat-conducting particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the heat conducting particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the heat conducting glue coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
Particularly, the matrix resin is epoxy resin, acrylic acid, polyurethane, polyester or modified resin thereof; the conductive particles are gold, silver, nickel, copper, cadmium, chromium, zinc, iron and the like or alloys thereof; the inorganic filler is one or more of barium sulfate, calcium carbonate, talcum powder, mica, wollastonite, kaolin, aluminum hydroxide and magnesium hydroxide, and barium sulfate is preferred; the curing agent is one or more of isocyanate, acid anhydride and amino resin, and the solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester or PMA.
In particular, the thermally conductive particles are selected from synthetic diamond and have an average particle size of less than 10 μm.
Particularly, the conductive adhesive coating is as follows: 25% of epoxy resin, 20% of conductive particles, 10% of barium sulfate, 5% of amino resin and 40% of butanone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; or 40% of acrylic resin, 10% of conductive particles, 5% of barium sulfate, 3% of amino resin and 42% of butanone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; or 10% of epoxy resin, 10% of conductive particles, 4% of talcum powder, 1% of isocyanate resin and 75% of acetone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1.
The conductive adhesive layer can be used for grounding the electromagnetic waves absorbed and/or conducted by each layer through soft connection or thermosetting connection. The bonding performance of the bonding layer is good, the bonding layer is well bonded with the workpiece, the bonding layer keeps good bonding performance, conductivity and resistance stability after subsequent processing, and the performance of the bonding layer meets the processing requirements of the circuit board.
Particularly, the bonding layer is a modified epoxy adhesive film layer.
The conductive adhesive and the heat-conducting adhesive can be epoxy films, the conductive adhesive is filled in the epoxy films, and the heat-conducting adhesive is filled in the epoxy films.
The conductive adhesive coating used in the bonding layer in the utility model adopts the coating with the patent number of 201320106820. X; the invention discloses the same conductive adhesive in a patent of 'a wave-absorbing magnetic-conducting shielding film with a laminated structure'. The matrix resin in the bonding layer is epoxy resin adhesive, acrylic resin, polyurethane, polyester or modified resin adhesive thereof, which are all common adhesives in the market.
Wherein the protective film layer is a polymer film of PET, PEN, PI, PE or PP and the like; the thickness of the protective film layer is 30-120 mu m.
The protective film layer protects the bonding layer glue from being polluted. When in use, the adhesive is torn off during the lamination through the protection of the processes of cutting, punching, die cutting and the like.
The utility model discloses another aspect provides a preparation method of electromagnetic shielding film with heat dissipation function, include: and coating a release layer on the surface of one pretreated side of the carrier film layer, and then sequentially superposing a heat dissipation insulating layer, a metal layer, a bonding layer and a protective film layer on the surface of the release layer.
Wherein the pretreatment is corona treatment or plasma treatment.
Particularly, the method for preparing the electromagnetic shielding film with the heat dissipation function comprises the following steps:
1) pretreating one side surface of the carrier membrane layer, and coating a release agent coating on the pretreated one side surface to form a release layer, wherein the thickness of the release layer is 0.05-2 mu m;
2) coating heat dissipation insulating ink paint on the surface of the release layer to form a heat dissipation insulating layer, wherein the thickness of the heat dissipation insulating layer is 1-30 microns;
3) superposing a metal layer on the surface of the insulating layer in a vacuum coating mode, wherein the thickness of the metal layer is 0.01-5 mu m;
4) coating conductive adhesive or non-conductive adhesive or heat-conducting adhesive paint on the surface of the metal layer to form a bonding layer, wherein the thickness of the bonding layer is 3-20 mu m;
5) and attaching a protective film layer on the surface of the bonding layer.
Wherein, the pretreatment in the step 1) is corona treatment and plasma treatment, and preferably corona treatment.
Wherein, the carrier film layer in the step 1) is a polyester film such as PET, PEN, PI, PE, PP and the like.
Wherein, the voltage in the corona pretreatment process of the step 1) is 5000-.
The release layer in the step 1) is formed by coating a release agent coating on the pretreatment film surface of the carrier film in a coating mode.
And coating a release agent coating by adopting a common screen printing method, a screen roller, slit extrusion or a micro-gravure method to form a release layer. The release agent coating used by the release layer of the utility model is the conventionally used release agent existing in the field.
Particularly, the release agent coating comprises a release agent and an organic solvent.
Wherein the release agent is a silicon-containing release agent or a non-silicon release agent.
In particular, the silicon-containing release agent is a silicone release agent or a modified silicone resin (e.g., silicone oil, release silicone oil); the non-silicon release agent is acrylic resin, polyester, polyurethane, melamine resin, organic fluorine resin (such as Teflon) or corresponding modified resin thereof.
In particular, the release agent is dissolved in an organic solvent, and then applied to the surface of the carrier film layer, the organic solvent is volatilized, and the release agent adheres to the surface of the carrier film layer, thereby forming a release layer.
In particular, the organic solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester, PMA and the like.
Particularly, after the release agent is dissolved in the organic solvent, the content of the release agent is 1 wt% -40 wt%.
In particular, the release agent component is a curing type siloxane (release silicone oil, dowanning 7458 release silicone oil), a silicone release agent or a modified silicone resin (such as silicone oil, silicone grease, etc.) or other types of release resins; the non-silicon release agent is acrylic resin, polyester, polyurethane, melamine resin, organic fluorine resin (such as Teflon) or corresponding modified resin thereof.
The heat dissipation insulating ink coating in the step 2) comprises resin, a curing agent, a flame retardant, an auxiliary agent, a heat dissipation material, a filler and a diluent.
The heat dissipation insulating layer is a heat dissipation ink coating film layer formed by coating heat dissipation ink coating on the surface of the release layer; the thickness of the heat dissipation insulating layer is 1 to 30 μm, preferably 2 to 20 μm.
In particular, the heat dissipation material includes graphene, alumina, and the like.
Particularly, the heat-dissipating ink coating comprises the following raw materials in parts by weight:
wherein the resin is polyurethane resin, epoxy resin, acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide or magnesium hydroxide; the auxiliary agent is a surface wetting agent or a surface coupling agent, OFX-5211 (polyether modified silicone oil, Dow Corning) and the like; the heat dissipation material is graphene, aluminum oxide and the like; the filler is silicon dioxide, micro silicon powder, barium sulfate and the like; the diluent is water, butanone, butyl ester, toluene and other solvents.
In particular, the heat dissipation material is graphene; the curing agent is isocyanate; the flame retardant is aluminum hydroxide; the auxiliary agent is OFX-5211; the filler is silicon dioxide; the diluent is water.
In particular, the heat-dissipating ink coating is:
the heat dissipation ink coating is a known material, and besides the heat dissipation ink coating, other known conventionally used water-based or oil-based ink such as graphene heat conduction ink, alumina heat conduction ink and the like (for example, nano carbon heat conduction ink produced by Shenzhen Shangyu high New Material Co., Ltd., 808R type; graphene heat conduction slurry produced by Kun mountain seal accessible New Material Co., Ltd.) are all suitable for the present invention.
The coating method is common screen printing, micro gravure or slit extrusion coating.
Wherein, the metal foil in the step 3) is made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or alloy metal thereof.
In particular, the metal foil layer is selected from one of gold, silver, copper, aluminum or an alloy foil thereof, and is preferably copper.
In the step 3), a metal foil is laminated on the surface of the heat dissipation insulating layer, vacuum coating is performed on the surface of the insulating layer, a metal foil film is vacuum-coated on the surface of the heat dissipation insulating layer, the metal foil film is laminated on the surface of the insulating layer, and the thickness of the metal film layer coated on the surface of the insulating layer is 0.01-10 μm, preferably 0.01-5 μm.
In particular, the vacuum coating mode is selected from magnetron sputtering, vacuum evaporation, ion plating, chemical vapor deposition and the like.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Wherein, the bonding layer in the step 4) is a film layer made of conductive adhesive paint or non-conductive paint or heat-conducting adhesive paint.
Particularly, the bonding layer is formed by coating a conductive adhesive coating or a heat-conducting adhesive coating on the surface of the metal film layer.
In particular, the conductive adhesive layer can be an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer, and the conductive adhesive coating comprises a matrix resin, conductive particles, an inorganic filler, a curing agent and an organic solvent, wherein the conductive particles can be conductive particles with transverse or longitudinal orientation or all-directional conductive particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the conductive particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the conductive adhesive coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
Particularly, the heat-conducting glue coating comprises matrix resin, heat-conducting particles, inorganic filler, a curing agent and an organic solvent, wherein the heat-conducting particles can be heat-conducting particles with transverse or longitudinal orientation or omnibearing heat-conducting particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the heat conducting particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the heat conducting glue coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
Particularly, the matrix resin is organic silicon, organic fluorine, epoxy resin, acrylic acid, polyurethane, polyester or modified resin thereof; the conductive particles are gold, silver, nickel, copper, cadmium, chromium, zinc, iron and the like or alloys thereof; the inorganic filler is one or more of barium sulfate, calcium carbonate, talcum powder, mica, wollastonite, kaolin, aluminum hydroxide and magnesium hydroxide, and barium sulfate is preferred; the curing agent is one or more of isocyanate, acid anhydride and amino resin, and the solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester or PMA.
In particular, the thermally conductive particles are selected from synthetic diamond and have an average particle size of less than 10 μm.
Particularly, the bonding layer is a modified epoxy adhesive film layer.
The coating method of the bonding layer comprises micro-concave coating, roll coating, blade coating and slit extrusion coating.
The utility model discloses a conductive adhesive coating, heat conduction glue coating that the tie coat used are the glue that has the conventional use known in the art.
Wherein, the protective film layer in the step 5) is a PET, PEN, PI, PE or PP film.
The electromagnetic shielding film with the heat dissipation insulating structure layer manufactured by the method consists of a carrier film layer, a release layer, a heat dissipation insulating layer, a metal layer, a bonding layer and a protective film layer which are sequentially stacked. When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to an FPC (flexible printed circuit) or other attached objects, the adhesive layer is attached at a normal temperature (when the adhesive layer is acrylic glue), the carrier film layer is torn off at a temperature of 180 ℃ and under a pressure of 80KG (2 minutes) during hot pressing (when the adhesive layer is thermosetting glue), and the insulating layer is leaked. The fitting parameters known in the art are all suitable for the present invention.
Compared with the prior art, the utility model have following advantage and effect:
1. the utility model discloses an electromagnetic shield membrane with heat dissipation insulating structure layer has the heat dissipation function, does benefit to operation processing function, promotes low-cost with metal cohesion.
2. The utility model discloses an electromagnetic shield membrane with heat dissipation insulating structure layer has overcome current insulating layer effectively and has need dispel the heat and the not enough technical problem of heat dissipation function.
3. The utility model discloses an electromagnetic shielding film has heat dissipation insulating structure layer, and the heat dissipation material layer is the dope layer of containing materials such as graphite alkene, aluminium oxide, and the radiating efficiency is high.
4. The utility model discloses an electromagnetic shielding film application scope is wide, is applicable to the shielding film production of any model thickness.
5. The utility model discloses electromagnetic shielding film's preparation method is simple, and is easy and simple to handle, and is safe convenient, suitable industrialization is promoted, and the rete is frivolous evenly fine and close, and soft bendable, tensile strength are excellent, and the insulating layer is made by heat dissipation coating in addition, reduces the heat and piles up in the preparation process, can help reducing the circuit board defective rate.
Drawings
Fig. 1 is a schematic structural view of the electromagnetic shielding film with a heat dissipation insulating structure layer of the present invention.
Description of the reference numerals
1. A carrier film layer; 2. a release layer; 3. a heat-dissipating insulating layer; 4. a metal layer; 5. a bonding layer; 6. and (5) a protective film layer.
Detailed Description
The invention will be further described with reference to specific embodiments, the advantages and features of the invention will become more apparent as the description proceeds. These examples are merely illustrative and do not limit the scope of the invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Example 1
Like fig. 1, the utility model discloses an electromagnetic shielding membrane with heat dissipation function includes carrier film layer 1 in proper order from last to lower, from type layer 2, heat insulating layer 3, metal level 4, tie coat 5, protection film 6.
1. Preparation of the Carrier film layer
A PET polyester film having a thickness of 50 μm and a width of 600mm is selected as a carrier film, and one side surface of the film is subjected to corona pretreatment (pretreatment other than corona treatment, plasma pretreatment is also possible), wherein the voltage during corona pretreatment is 20000V (usually 5000-20000V) until the surface tension reaches 60 dynes (usually 35-60 dynes).
2. Laminated release layer
And coating a release agent coating on the corona-pretreated surface of the carrier film layer by adopting a slit extrusion mode, and drying after coating to form a release layer, wherein the thickness of the release layer is 1 mu m (usually 0.05-2 mu m), the drying time is 2 minutes (usually 2-5 minutes), and the drying temperature is 160 ℃ (usually 150-. Wherein the release agent coating is curing type siloxane release silicone oil 7485 type release silicone oil of Dow Corning company.
In the preparation process, the release agent and the organic solvent are mixed to prepare the release agent coating, namely the release agent is dissolved in volatile organic solvent acetone (usually the organic solvent is butanone, acetone, ethyl ester, butyl ester, PMA and the like) to prepare the release agent coating with the release agent content of 30 wt% (usually 1-40 wt%), and then the release agent coating is coated on the pretreated surface of the carrier film layer and dried to prepare the release film layer.
The organosilicon release agent is preferably Dow Corning curing organosilicon release agent (Dow Corning 7485), so that release components do not pollute the surface of the insulating layer after curing; the non-silicon release agent is preferably melamine resin and can be cured at the hot pressing temperature of 170 ℃, so that the insulating ink layer attached to the surface of the non-silicon release agent falls off, and the thermal transfer effect is achieved.
In this embodiment, the release agent is a curable silicone (e.g., Dow Corning 7458 release silicone oil), and besides Dow Corning release silicone oil, release agents known in the art are suitable for the present invention, such as: release silicone oil KF 868 of shin-Etsu chemical Co., Ltd, Germany Wake Release silicone oil
SFX195)。
The release agent in the release agent coating can also be acrylic acid, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and other resins or modified resins thereof.
3. Superposed heat dissipation insulating layer
And coating heat dissipation insulating ink paint on the surface of the release layer in a slit extrusion manner, and drying after coating to form a heat dissipation insulating layer, wherein the thickness of the heat dissipation insulating layer is 15 micrometers (usually 1-20 micrometers, preferably 2-20 micrometers), the drying time is 3min (usually 2-5min), and the drying temperature is 160 ℃ (usually 150-.
The heat dissipation material is graphene; the curing agent is isocyanate; the flame retardant is aluminum hydroxide; the auxiliary agent is OFX-5211; the filler is silicon dioxide; the diluent is water.
The heat dissipation ink coating comprises:
the solid matter in the heat dissipation ink coating is powder, the average particle size is less than 10 mu m, and the content of the solid matter is 42%. And preparing the coating according to the proportion, mixing and stirring uniformly.
Besides the above components, the heat-dissipating ink coating with other weight ratios is also suitable for the utility model discloses, for example:
wherein the resin is polyurethane resin, epoxy resin, acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin, preferably isocyanate; the flame retardant is aluminum hydroxide or magnesium hydroxide, preferably aluminum hydroxide; the auxiliary agent is a surface wetting agent or a surface coupling agent, OFX-5211 (polyether modified silicone oil, Dow Corning) and the like; the heat dissipation material is graphene, aluminum oxide and the like, and is preferably graphene; the filler is silicon dioxide, micro silicon powder, barium sulfate and the like, and preferably silicon dioxide; the diluent is water, butanone, butyl ester, toluene and other solvents, and is preferably water.
The above heat-dissipating ink coating materials are known materials, and in addition to the above heat-dissipating ink coating materials, other conventionally used oil-based or water-based inks are known, such as: graphite alkene heat conduction printing ink, aluminium oxide heat conduction printing ink etc. all are applicable to the utility model discloses.
4. Superimposed metal layers
And plating a layer of metal copper foil film on the surface of the insulating layer by adopting a vacuum plating mode (vacuum evaporation), wherein the thickness of the formed metal layer is 2 microns (usually 0.01-5 microns), and performing vacuum plating on the surface of the insulating layer to form a metal shielding layer.
Wherein, the working conditions in the vacuum evaporation coating process are as follows:
the temperature of a cold roll of the equipment is as follows; 25 deg.C
The vacuum degree is as follows: 2.0X 10-2Handkerchief
Vehicle speed: 5 m/min.
The metal layer may also be a thin metal layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or an alloy thereof.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Besides vacuum evaporation plating, other vacuum coating methods, such as magnetron sputtering, vacuum sputtering plating, vacuum ion plating, vacuum plasma plating or vacuum beam deposition, are suitable for the invention; furthermore, metals other than copper, such as gold, silver, nickel, aluminum, nickel silver, nickel copper or alloys thereof, are suitable for use in the present invention.
5. Superimposed adhesive layer
And coating a conductive adhesive coating on the surface of the metal layer in a slit extrusion manner to form a conductive adhesive layer, wherein the thickness of the conductive adhesive layer is 50 microns.
The conductive adhesive coating comprises the following components in percentage by weight:
wherein the solid matter in the coating is powdery, the average particle size is less than 10 μm, and the content of the solid matter is 60%. Particularly, the conductive particles are formed by mixing nickel, copper and iron according to the proportion of 1:1: 1.
The components are prepared according to the proportion, fully dispersed and stirred, and are kept stand for 1h to prepare for coating, and the coating adopts an extrusion (or scraper and the like) coating mode, and the drying temperature is 160 ℃ for 2 min.
Besides the conductive adhesive coating with the above proportion, the conductive adhesive coating with the following existing known components is also suitable for the utility model: for example:
40% of acrylic resin, 10% of conductive particles, 5% of barium sulfate, 3% of amino resin and 42% of butanone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; the solid matters in the coating are powdery, the average particle size is less than 10 mu m, and the content of the solid matters is 58 percent; or 10% of epoxy resin, 10% of conductive particles, 4% of talcum powder, 1% of isocyanate resin and 75% of acetone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; the solid matter in the coating is powdery, the average particle size is less than 10 mu m, and the content of the solid matter is 60 percent.
In addition to the above-described conductive paste coating, conductive pastes known in the art are suitable for the present invention.
6. Laminating protective film layer
A PET polyester film having a thickness of 50 μm (usually 30 to 100 μm) is attached to the surface of the adhesive layer as a protective film layer.
The protective film layer can also be a PET, PEN, PI, PE or PP film.
When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to a workpiece such as a circuit board (FPC, flexible circuit board) or other attached objects, the carrier film layer is torn off after the pressure of 80KG is applied through hot pressing (170 and 180 ℃) at normal temperature (when the adhesive layer needs acrylic glue), the insulating layer is leaked after 2 minutes (when the adhesive layer selects thermosetting epoxy glue), and then printing and attaching are carried out.
Example 2
Like fig. 1, the utility model discloses an electromagnetic shielding membrane with heat dissipation function includes carrier film layer 1 in proper order from last to lower, from type layer 2, heat insulating layer 3, metal level 4, tie coat 5, protection film 6.
1. Preparation of the Carrier film layer
A PET polyester film having a thickness of 50 μm and a width of 600mm is selected as a carrier film, and one side surface of the film is subjected to corona pretreatment (pretreatment other than corona treatment, plasma pretreatment is also possible), wherein the voltage during corona pretreatment is 20000V (usually 5000-20000V) until the surface tension reaches 60 dynes (usually 35-60 dynes).
2. Laminated release layer
And coating a release agent coating on the corona-pretreated surface of the carrier film layer by adopting a slit extrusion mode, and drying after coating to form a release layer, wherein the thickness of the release layer is 1 mu m (usually 0.05-2 mu m), the drying time is 2 minutes (usually 2-5 minutes), and the drying temperature is 160 ℃ (usually 150-. Wherein the release agent coating is release silicone oil KF 868 of shin-Etsu chemical Co.
In the preparation process, the release agent and the organic solvent are mixed to prepare the release agent coating, namely the release agent is dissolved in volatile organic solvent acetone (usually the organic solvent is butanone, acetone, ethyl ester, butyl ester, PMA and the like) to prepare the release agent coating with the release agent content of 30 wt% (usually 1-40 wt%), and then the release agent coating is coated on the pretreated surface of the carrier film layer and dried to prepare the release film layer.
The organosilicon release agent is preferably Dow Corning curing organosilicon release agent (Dow Corning 7485), so that release components do not pollute the surface of the insulating layer after curing; the non-silicon release agent is preferably melamine resin and can be cured at the hot pressing temperature of 170 ℃, so that the insulating ink layer attached to the surface of the non-silicon release agent falls off, and the thermal transfer effect is achieved.
In this embodiment, the release agent is a curable silicone (e.g., Dow Corning 7458 release silicone oil), and besides Dow Corning release silicone oil, release agents known in the art are suitable for the present invention, such as: release silicone oil KF 868 of shin-Etsu chemical Co., Ltd, Germany Wake Release silicone oil
SFX195)。
The release agent in the release agent coating can also be acrylic acid, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and other resins or modified resins thereof.
3. Superposed heat dissipation insulating layer
Coating heat dissipation insulating ink paint on the surface of the release layer in a slit extrusion mode, and drying after coating to form a heat dissipation insulating layer, wherein the thickness of the heat dissipation insulating layer is 15 micrometers (usually 1-20 micrometers, preferably 2-20 micrometers), the drying time is 2min (usually 2-5min), and the drying temperature is 160 ℃ (usually 150-; the heat dissipation insulating ink coating is 808R type nano carbon heat conduction ink produced by Shenzhen Tengyun high-new materials Limited.
The heat-dissipation ink coating comprises resin, a heat-dissipation material, a curing agent, a flame retardant, an auxiliary agent, a filler and a diluent, wherein the resin is polyurethane resin, epoxy resin, acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino curing agent; the heat dissipation material is graphene or aluminum oxide and the like; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide or magnesium hydroxide; the auxiliary agent is a wetting agent and a coupling agent; the filler is silicon dioxide, micro silicon powder and barium sulfate; the diluent is water.
In the embodiment of the invention, the heat dissipation insulating ink coating can be prepared from nanocarbon heat conduction ink (808R type) produced by Tengyu high-new material company, Shenzhen, and graphene heat conduction slurry produced by Kunshan brand accessible new material company. Other heat dissipating and insulating ink coatings known in the art are suitable for use in the present invention, such as graphene thermal conductive inks, alumina thermal conductive inks, and the like.
4. Superimposed metal layers
And plating a layer of metal copper foil film on the surface of the insulating layer by adopting a vacuum plating mode (vacuum evaporation), wherein the thickness of the formed metal layer is 2 microns (usually 0.01-5 microns), and performing vacuum plating on the surface of the insulating layer to form a metal shielding layer.
Wherein, the working conditions in the vacuum evaporation coating process are as follows:
the temperature of a cold roll of the equipment is as follows; 25 deg.C
The vacuum degree is as follows: 2.0X 10-2Handkerchief
Vehicle speed: 5 m/min.
The metal layer may also be a thin metal layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or an alloy thereof.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Besides vacuum evaporation plating, other vacuum coating methods, such as magnetron sputtering, vacuum sputtering plating, vacuum ion plating, vacuum plasma plating or vacuum beam deposition, are suitable for the invention; furthermore, metals other than copper, such as gold, silver, nickel, aluminum, nickel silver, nickel copper or alloys thereof, are suitable for use in the present invention.
5. Superimposed adhesive layer
And coating a conductive adhesive coating on the surface of the metal layer in a slit extrusion manner to form a conductive adhesive layer, wherein the thickness of the conductive adhesive layer is 50 microns.
The conductive adhesive coating comprises the following components in percentage by weight:
wherein the solid matter in the coating is powdery, the average particle size is less than 10 μm, and the content of the solid matter is 60%. Particularly, the conductive particles are formed by mixing nickel, copper and iron according to the proportion of 1:1: 1.
The components are prepared according to the proportion, fully dispersed and stirred, and are kept stand for 1h to prepare for coating, and the coating adopts an extrusion (or scraper and the like) coating mode, and the drying temperature is 160 ℃ for 2 min.
Besides the conductive adhesive coating with the above proportion, the conductive adhesive coating with the following existing known components is also suitable for the utility model: for example:
40% of acrylic resin, 10% of conductive particles, 5% of barium sulfate, 3% of amino resin and 42% of butanone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; the solid matters in the coating are powdery, the average particle size is less than 10 mu m, and the content of the solid matters is 58 percent; or 10% of epoxy resin, 10% of conductive particles, 4% of talcum powder, 1% of isocyanate resin and 75% of acetone, wherein the conductive particles are nickel, copper and iron in a molar ratio of 1:1: 1; the solid matter in the coating is powdery, the average particle size is less than 10 mu m, and the content of the solid matter is 60 percent.
In addition to the above-described conductive paste coating, conductive pastes known in the art are suitable for the present invention.
6. Laminating protective film layer
A PET polyester film having a thickness of 50 μm (usually 30 to 100 μm) is attached to the surface of the adhesive layer as a protective film layer.
The protective film layer can also be a PET, PEN, PI, PE or PP film.
When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to a workpiece such as a circuit board (FPC, flexible circuit board) or other attached objects, the carrier film layer is torn off after the pressure of 80KG is applied through hot pressing (170 and 180 ℃) at normal temperature (when the adhesive layer needs acrylic glue), the insulating layer is leaked after 2 minutes (when the adhesive layer selects thermosetting epoxy glue), and then printing and attaching are carried out.
Example 3
Like fig. 1, the utility model discloses an electromagnetic shielding membrane with heat dissipation function includes carrier film layer 1 in proper order from last to lower, from type layer 2, heat insulating layer 3, metal level 4, tie coat 5, protection film 6.
1. Preparation of the Carrier film layer
A PET polyester film having a thickness of 50 μm and a width of 600mm is selected as a carrier film, and one side surface of the film is subjected to corona pretreatment (pretreatment other than corona treatment, plasma pretreatment is also possible), wherein the voltage during corona pretreatment is 20000V (usually 5000-20000V) until the surface tension reaches 60 dynes (usually 35-60 dynes).
2. Laminated release layer
And coating a release agent coating on the corona-pretreated surface of the carrier film layer by adopting a slit extrusion mode, and drying after coating to form a release layer, wherein the thickness of the release layer is 1 mu m (usually 0.05-2 mu m), the drying time is 2 minutes (usually 2-5 minutes), and the drying temperature is 160 ℃ (usually 150-. Wherein the release agent coating is curing type siloxane release silicone oil 7485 type release silicone oil of Dow Corning company.
In the preparation process, the release agent and the organic solvent are mixed to prepare the release agent coating, namely the release agent is dissolved in volatile organic solvent acetone (usually the organic solvent is butanone, acetone, ethyl ester, butyl ester, PMA and the like) to prepare the release agent coating with the release agent content of 30 wt% (usually 1-40 wt%), and then the release agent coating is coated on the pretreated surface of the carrier film layer and dried to prepare the release film layer.
The organosilicon release agent is preferably Dow Corning curing organosilicon release agent (Dow Corning 7485), so that release components do not pollute the surface of the insulating layer after curing; the non-silicon release agent is preferably melamine resin and can be cured at the hot pressing temperature of 170 ℃, so that the insulating ink layer attached to the surface of the non-silicon release agent falls off, and the thermal transfer effect is achieved.
In this embodiment, the release agent is a curable silicone (e.g., Dow Corning 7458 release silicone oil), and besides Dow Corning release silicone oil, release agents known in the art are suitable for the present invention, such as: release silicone oil KF 868 of shin-Etsu chemical Co., Ltd, Germany Wake Release silicone oil
SFX195)。
The release agent in the release agent coating can also be acrylic acid, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and other resins or modified resins thereof.
3. Superposed heat dissipation insulating layer
Coating heat dissipation insulating ink paint on the surface of the release layer in a slit extrusion mode, and drying after coating to form a heat dissipation insulating layer, wherein the thickness of the heat dissipation insulating layer is 15 micrometers (usually 1-20 micrometers, preferably 2-20 micrometers), the drying time is 2min (usually 2-5min), and the drying temperature is 160 ℃ (usually 150-; the heat dissipation insulating ink coating is 808R type nano carbon heat conduction ink produced by Shenzhen Tengyun high-new materials Limited.
The heat-dissipation ink coating comprises resin, a heat-dissipation material, a curing agent, a flame retardant, an auxiliary agent, a filler and a diluent, wherein the resin is polyurethane resin, epoxy resin, acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino curing agent; the heat dissipation material is graphene or aluminum oxide and the like; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide or magnesium hydroxide; the auxiliary agent is a wetting agent and a coupling agent; the filler is silicon dioxide, micro silicon powder and barium sulfate; the diluent is water.
In the embodiment of the invention, the heat dissipation insulating ink coating can be prepared from nanocarbon heat conduction ink (808R type) produced by Tengyu high-new material company, Shenzhen, and graphene heat conduction slurry produced by Kunshan brand accessible new material company. Other heat dissipating and insulating ink coatings known in the art are suitable for use in the present invention, such as graphene thermal conductive inks, alumina thermal conductive inks, and the like.
4. Superimposed metal layers
And plating a layer of metal copper foil film on the surface of the insulating layer by adopting a vacuum plating mode (vacuum evaporation), wherein the thickness of the formed metal layer is 2 microns (usually 0.01-5 microns), and performing vacuum plating on the surface of the insulating layer to form a metal shielding layer.
Wherein, the working conditions in the vacuum evaporation coating process are as follows:
the temperature of a cold roll of the equipment is as follows; 25 deg.C
The vacuum degree is as follows: 2.0X 10-2Handkerchief
Vehicle speed: 5 m/min.
The metal layer may also be a thin metal layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or an alloy thereof.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Besides vacuum evaporation plating, other vacuum coating methods, such as magnetron sputtering, vacuum sputtering plating, vacuum ion plating, vacuum plasma plating or vacuum beam deposition, are suitable for the invention; furthermore, metals other than copper, such as gold, silver, nickel, aluminum, nickel silver, nickel copper or alloys thereof, are suitable for use in the present invention.
5. Superimposed adhesive layer
And coating heat-conducting adhesive coating on the surface of the metal layer in a slit extrusion mode to form a heat-conducting adhesive layer, wherein the thickness of the heat-conducting adhesive layer is 50 microns.
The heat-conducting glue coating comprises the following components in percentage by weight:
wherein the solid matter in the coating is powdery, the average particle size is less than 10 μm, and the content of the solid matter is 60%. In particular, the heat conducting particles are artificial diamond.
The components are prepared according to the proportion, fully dispersed and stirred, and are kept stand for 1h to prepare for coating, and the coating adopts an extrusion (or scraper and the like) coating mode, and the drying temperature is 160 ℃ for 2 min.
Besides the conductive adhesive coating with the above proportion, the following heat-conducting adhesive coating with known components is also suitable for the utility model discloses: for example:
40% of acrylic resin, 10% of heat conducting particles, 5% of barium sulfate, 3% of amino resin and 42% of butanone, wherein the heat conducting particles are aluminum oxide or graphene; the solid matters in the coating are powdery, the average particle size is less than 10 mu m, and the content of the solid matters is 58 percent; or 10% of epoxy resin, 10% of conductive particles, 4% of talcum powder, 1% of isocyanate resin and 75% of acetone, wherein the conductive particles are alumina or graphene; the solid matter in the coating is powdery, the average particle size is less than 10 mu m, and the content of the solid matter is 60 percent.
In addition to the above-mentioned heat conductive adhesive coating, heat conductive adhesives known in the art are suitable for the present invention.
6. Laminating protective film layer
A PET polyester film having a thickness of 50 μm (usually 30 to 100 μm) is attached to the surface of the adhesive layer as a protective film layer.
The protective film layer can also be a PET, PEN, PI, PE or PP film.
When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to a workpiece such as a circuit board (FPC, flexible circuit board) or other attached objects, the carrier film layer is torn off after the pressure of 80KG is applied through hot pressing (170 and 180 ℃) at normal temperature (when the adhesive layer needs acrylic glue), the insulating layer is leaked after 2 minutes (when the adhesive layer selects thermosetting epoxy glue), and then printing and attaching are carried out.
According to the standard GB/T30142-2013 'method for measuring the shielding effectiveness of planar electromagnetic shielding materials', the shielding effectiveness of the electromagnetic shielding functional film with the heat dissipation function prepared by the method is tested, and the test result is shown in Table 1.
Table 1 test results of the shielding effect of the electromagnetic shielding film prepared in table 1
The furnace temperature tester is adopted to measure the heat dissipation effect, and the model is SMT-7-128-500-K. The electromagnetic shielding functional films prepared in the examples and the comparative examples were placed in a thermostat at 48 ℃ for 1 hour, then taken out, placed at room temperature under natural convection conditions, and the temperature of the samples was measured after a certain period of time (30 seconds), and the test results are shown in table 2.
Table 2 test results of heat dissipation effect of insulation layer of electromagnetic shielding film
Comparative example
The same as the example except that non-heat-dissipating ink was used for the lamination of the insulating layer in step 3).
The non-heat-dissipation ink glue used in the comparative example is a conventionally used formula in the field, and specifically comprises the following components:
wherein the filler is aluminum hydroxide; the curing agent is dicyandiamide and imidazole (wherein the mass ratio of dicyandiamide to imidazole is 1.0: 0.2); the special epoxy resin is phenoxy resin 1256;
the above embodiments of the present invention are only exemplary, and do not limit the scope of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (10)
1. An electromagnetic shielding film with a heat dissipation function, comprising: the heat dissipation insulating layer, the metal layer and the bonding layer are sequentially overlapped from top to bottom.
2. The electromagnetic shielding film with heat dissipating function as claimed in claim 1, wherein a protective film layer is attached to a lower surface of the adhesive layer.
3. The electromagnetic shielding film with heat dissipating function as claimed in claim 1 or 2, wherein a release layer is attached to the upper surface of the heat dissipating insulating layer.
4. The electromagnetic shielding film with heat dissipating function as claimed in claim 3, wherein a carrier film layer is attached to an upper surface of the release layer.
5. The electromagnetic shielding film with heat dissipation function as claimed in claim 3, wherein the release layer is a film layer made of a silicon-containing type release agent or a non-silicon type release agent.
6. The electromagnetic shielding film with heat dissipating function according to claim 1 or 2, wherein the heat dissipating insulating layer is a film layer formed of a heat dissipating insulating ink paint; the thickness of the heat dissipation insulating layer is 1-30 μm.
7. The electromagnetic shielding film with heat dissipation function as claimed in claim 1 or 2, wherein the metal layer is a metal foil layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or an alloy thereof; the thickness of the metal layer is 0.01-10 μm.
8. The electromagnetic shielding film with heat dissipation function as claimed in claim 1 or 2, wherein the bonding layer is a functional film layer made of conductive adhesive paint, non-conductive adhesive paint or heat conductive adhesive paint; the thickness of the bonding layer is 3-20 μm.
9. The electromagnetic shielding film with heat dissipation function as claimed in claim 2, wherein said protective film layer is a PET, PEN, PI, PE or PP film.
10. An electromagnetic shielding film with a heat dissipation function, comprising: the heat-dissipation film comprises a carrier film layer, a release layer, a heat-dissipation insulating layer, a metal layer, a bonding layer and a protective film layer which are sequentially overlapped from top to bottom.
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| CN113660842A (en) * | 2021-07-22 | 2021-11-16 | 苏州市新广益电子有限公司 | Shielding film with radiation heat dissipation function and manufacturing method thereof |
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