CN110484154A - A kind of multi-functional composite heat-conducting adhesive tape - Google Patents
A kind of multi-functional composite heat-conducting adhesive tape Download PDFInfo
- Publication number
- CN110484154A CN110484154A CN201910683919.8A CN201910683919A CN110484154A CN 110484154 A CN110484154 A CN 110484154A CN 201910683919 A CN201910683919 A CN 201910683919A CN 110484154 A CN110484154 A CN 110484154A
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- heat
- glue band
- conducting
- conducting glue
- film
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of multi-functional composite heat-conducting adhesive tapes, including black PI film, the first heat-conducting glue band, metallic film, the second heat-conducting glue band and the release film being successively bonded.A kind of multi-functional composite heat-conducting adhesive tape of the invention has the advantage that 1) thickness of composite material is thin, small in size；2) compared with common heat-conducting glue band, due to joined metallic film in composite construction, have preferable electrostatic dissipation and electromagnetic shielding action；3) heat dissipation with higher and even heat function；4) material can be processed into arbitrary shape, while can bend and be attached at curved surface, and fitting is easy to operate.
Description
Technical field
The present invention relates to heat-conducting glue band technical field more particularly to a kind of multi-functional composite heat-conducting adhesive tapes.
Background technique
For the very high electronic product of this integrated level of mobile phone, in order to it is slim and improve screen screen accounting,
The encapsulation technology of screen develops to COF from COG (Chip On Glass refers to that screen chip is directly placed on screen panel)
(Chip On PI refers to flexible screen directly (Chip On Film refers to screen integrated chip in flexible PCB) even COP
A part bending then encapsulate).The function of mobile phone is more at present, causes chip calorific value very big.And if COF chip exists for a long time
It works under high temperature, will affect service life and the performance of chip, it is therefore desirable to cool down to chip, common mode is using thermally conductive
Adhesive tape or use heat sink.There are mainly two types of the current heat dissipations of COF chip: first is that using common heat-conducting glue band, and it is general
Admittance thermal bonding tape can only play heat transfer effect, have a single function, and be unable to satisfy the heat dissipation that COF chip is more concentrated in small space
Demand, meanwhile, the program does not have elimination or shielding action to issuable electrostatic or electromagnetic interference；Another kind is common
Method is to use heat sink, and heat sink can occupy larger space, has been increasingly difficult to meet the requirement of electronic product slimming.
Summary of the invention
In view of above-mentioned defect existing in the prior art, the purpose of the present invention is to propose to a kind of multi-functional composite guide hot glues
Band provides thermally conductive, even heat, heat dissipation and shielding electromagnetic interference, and occupied space is few, is mounted directly on heat source surface.
To achieve the goals above, present invention employs following technical solutions:
A kind of multi-functional composite heat-conducting adhesive tape, including be successively bonded black PI film, the first heat-conducting glue band, metallic film,
Second heat-conducting glue band and release film.
Further, the black PI film with a thickness of be more than or equal to 5 μm, black PI film be with high temperature resistant and thermal conductivity
The fabulous PI film of energy, is used as carrier in the multi-functional composite heat-conducting adhesive tape, while having thermally conductive and heat dissipation function concurrently.
Further, the first heat-conducting glue band and the second heat-conducting glue band are by acrylic pressure sensitive adhesive and heat filling group
At the heat filling is nano-graphite, graphene, carbon nanotube, silver, nickel, one of copper or aluminium or a variety of.
Further, the thickness of the first heat-conducting glue band and the second heat-conducting glue band is less than or equal to 10 μm.
Further, the metallic film is copper foil, aluminium foil, copper mesh or conductive fabric, can play thermally conductive, even heat, heat dissipation,
And it can play the role of preventing electrostatic and shielding electromagnetic wave.
Further, the metallic film with a thickness of be more than or equal to 2 μm.
Protrusion effect of the invention are as follows: a kind of multi-functional composite heat-conducting adhesive tape of the invention has the advantage that
1) thickness of composite material is thin, small in size: black PI film minimum thickness is 5 μm, the first heat-conducting glue band and second thermally conductive
Hereinafter, metallic film minimum thickness is 2 μm, overall thickness can control to 27 μm hereinafter, normal compared on the market 10 μm of tape thickness
Heat-conducting glue band, thickness can reduce 20%~40%；Compared with common heat sink, thickness can reduce 50% or more；
2) compared with common heat-conducting glue band, due to joined metallic film in composite construction, has preferable electrostatic dissipation
And electromagnetic shielding action；
3) heat dissipation with higher and even heat function: metallic film thermal coefficient is high, and even heat is fast, can expand rapidly heat point source
Exhibition is plane heat source, and heat can be radiated in gap by black PI film, effectively realizes heat dissipation, reduces chip temperature；
4) material can be processed into arbitrary shape, while can bend and be attached at curved surface, and fitting is easy to operate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of 1-4 of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Embodiment 1
As shown in Figure 1, a kind of multi-functional composite heat-conducting adhesive tape of the present embodiment, including be successively bonded black PI film 1,
One heat-conducting glue band 2, metallic film 3, the second heat-conducting glue band 4 and release film 5.
Black PI film 1 with a thickness of 5 μm.
First heat-conducting glue band 2 and the second heat-conducting glue band 4 are made of acrylic pressure sensitive adhesive and heat filling, heat filling point
It Wei not nano-graphite and graphene.The thickness of first heat-conducting glue band 2 and the second heat-conducting glue band 4 is 10 μm.
Metallic film 3 is copper foil.Metallic film 3 with a thickness of 2 μm.
When using the present embodiment, a kind of multi-functional composite heat-conducting adhesive tape of the present embodiment is affixed directly on heat source i.e.
Can, facilitate pipelining.A kind of multi-functional composite heat-conducting adhesive tape of the present embodiment can be quickly by dotted or planar heat source
Heat by the second heat-conducting glue band 4 quickly to the longitudinal direction conduction of multi-functional composite heat-conducting adhesive tape, heat conducts to metal foil
Its fabulous transverse direction and longitudinal direction capacity of heat transmission can be relied on after film 3, open and amplify heat dissipation area and to air for heat is even rapidly
Middle conduction portion heat, excess heat then continue through the first heat-conducting glue band 2 to longitudinal conduction, until finally via black PI film
1 radiation effects heats sink to air or mobile phone backboard, quickly reduces heat source temperature, protects the normal operation of electronic component.
Embodiment 2
As shown in Figure 1, a kind of multi-functional composite heat-conducting adhesive tape of the present embodiment, including be successively bonded black PI film 1,
One heat-conducting glue band 2, metallic film 3, the second heat-conducting glue band 4 and release film 5.
Black PI film 1 with a thickness of 5 μm.
First heat-conducting glue band 2 and the second heat-conducting glue band 4 are made of acrylic pressure sensitive adhesive and heat filling, and heat filling is equal
Carbon nanotube.The thickness of first heat-conducting glue band 2 and the second heat-conducting glue band 4 is 8 μm.
Metallic film 3 is aluminium foil.Metallic film 3 with a thickness of 2 μm.
Embodiment 3
As shown in Figure 1, a kind of multi-functional composite heat-conducting adhesive tape of the present embodiment, including be successively bonded black PI film 1,
One heat-conducting glue band 2, metallic film 3, the second heat-conducting glue band 4 and release film 5.
Black PI film 1 with a thickness of 6 μm.
First heat-conducting glue band 2 and the second heat-conducting glue band 4 are made of acrylic pressure sensitive adhesive and heat filling, heat filling point
It Wei not silver and nickel.The thickness of first heat-conducting glue band 2 and the second heat-conducting glue band 4 is 9 μm.
Metallic film 3 is copper mesh.Metallic film 3 with a thickness of 4 μm.
Embodiment 4
As shown in Figure 1, a kind of multi-functional composite heat-conducting adhesive tape of the present embodiment, including be successively bonded black PI film 1,
One heat-conducting glue band 2, metallic film 3, the second heat-conducting glue band 4 and release film 5.
Black PI film 1 with a thickness of 6 μm.
First heat-conducting glue band 2 and the second heat-conducting glue band 4 are made of acrylic pressure sensitive adhesive and heat filling, heat filling point
It Wei not copper and aluminium.The thickness of first heat-conducting glue band 2 and the second heat-conducting glue band 4 is 10 μm.
Metallic film 3 is conductive fabric.Metallic film 3 with a thickness of 3 μm.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of multi-functional composite heat-conducting adhesive tape, it is characterised in that: including be successively bonded black PI film, the first heat-conducting glue band,
Metallic film, the second heat-conducting glue band and release film.
2. a kind of multi-functional composite heat-conducting adhesive tape according to claim 1, it is characterised in that: the thickness of the black PI film
For more than or equal to 5 μm.
3. a kind of multi-functional composite heat-conducting adhesive tape according to claim 1, it is characterised in that: the first heat-conducting glue band and
Second heat-conducting glue band is made of acrylic pressure sensitive adhesive and heat filling, and the heat filling is nano-graphite, and graphene, carbon receives
Mitron, silver, nickel, one of copper or aluminium or a variety of.
4. a kind of multi-functional composite heat-conducting adhesive tape according to claim 1, it is characterised in that: the first heat-conducting glue band and
The thickness of second heat-conducting glue band is less than or equal to 10 μm.
5. a kind of multi-functional composite heat-conducting adhesive tape according to claim 1, it is characterised in that: the metallic film is copper
Foil, aluminium foil, copper mesh or conductive fabric.
6. a kind of multi-functional composite heat-conducting adhesive tape according to claim 1, it is characterised in that: the thickness of the metallic film
For more than or equal to 2 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910683919.8A CN110484154A (en) | 2019-07-26 | 2019-07-26 | A kind of multi-functional composite heat-conducting adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910683919.8A CN110484154A (en) | 2019-07-26 | 2019-07-26 | A kind of multi-functional composite heat-conducting adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110484154A true CN110484154A (en) | 2019-11-22 |
Family
ID=68548566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910683919.8A Pending CN110484154A (en) | 2019-07-26 | 2019-07-26 | A kind of multi-functional composite heat-conducting adhesive tape |
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| CN (1) | CN110484154A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202773173U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Cover film having advantages of thermal conductivity and electromagnetic shielding |
| CN204652862U (en) * | 2015-06-12 | 2015-09-16 | 东莞市思泉实业有限公司 | Composite graphite fin |
| CN105517423A (en) * | 2016-01-25 | 2016-04-20 | 衡山县佳诚新材料有限公司 | High thermal conductivity graphene cooling metal foil |
| CN107624024A (en) * | 2017-09-29 | 2018-01-23 | 深圳市诚悦丰科技有限公司 | A kind of dilute glued membrane heat sink compound of graphite and manufacture craft |
| CN207418653U (en) * | 2017-10-12 | 2018-05-29 | 厦门海洋南方特种光电材料有限公司 | A kind of improved Heat dissipation adhesive tape |
-
2019
- 2019-07-26 CN CN201910683919.8A patent/CN110484154A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202773173U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Cover film having advantages of thermal conductivity and electromagnetic shielding |
| CN204652862U (en) * | 2015-06-12 | 2015-09-16 | 东莞市思泉实业有限公司 | Composite graphite fin |
| CN105517423A (en) * | 2016-01-25 | 2016-04-20 | 衡山县佳诚新材料有限公司 | High thermal conductivity graphene cooling metal foil |
| CN107624024A (en) * | 2017-09-29 | 2018-01-23 | 深圳市诚悦丰科技有限公司 | A kind of dilute glued membrane heat sink compound of graphite and manufacture craft |
| CN207418653U (en) * | 2017-10-12 | 2018-05-29 | 厦门海洋南方特种光电材料有限公司 | A kind of improved Heat dissipation adhesive tape |
Non-Patent Citations (4)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
| 周文英等: "《聚合物基导热复合材料》", 30 September 2017, 国防工业出版社 * |
| 孙酣经等: "《化工新材料产品及应用手册》", 31 January 2002, 中国石化出版社 * |
| 陈庭勋: "《电子技术实践 声音之重放》", 30 September 2018, 海洋出版社 * |
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Application publication date: 20191122 |