M312189 八、新型說明： 【新型所屬之技術領域】 本創作有關一種多層複合熱傳導結構體，尤指一種具有三維 立體方向高效能熱料之多層複合熱料結構體。 【先前技術】 按’許多電子元件，尤其是大型的積體電路、微處理器等， 在運作中通常無可戦地會伴隨著產生高熱。而雜高熱若無法 及時排除，不齡賴軒零件的運作鱗及壽命，更甚者 將會導致電子70件的轉而喪失魏。制是現今電子產品為了 符合輕薄短巧的時代趨勢，侧微處理器大都逐漸採用高積合度 (degree of integration)的設計方式，使元件之每單位面積所釋放 的熱篁倍增’目此不足的冷卻所導致的*良影響或損害，也將益 形嚴重。 習知用以促進電器產品散熱效能的手段，通常是藉由在會發 熱的電器元件與散熱器之間配置散熱介質，例如導熱矽膠片、導 熱貧、導熱雙Φ膠帶及固態轉液態導熱相變化材，以便有效地將 會發熱電子7〇件所產生熱量轉移至散熱器上，以達冷卻電器設備 之目的。 但這種散熱介質的界面材料著重於將電子元件的熱量做上下 垂直轉移至散熱||上，再藉由散熱II進行散熱。惟此技術當電子 電器機構（外殼）不是良好的散熱材料時（如塑料），或在有限機 構空’狹随閉空間城法使用其他散熱科，就不能有效達 M312189 到冷卻電子元件或電子電器設備之目的 【新型内容】 ，成而==即在提供—種多層複合熱傳導結構趙，主要 /成二維财向破祕料，兼具高撓 絕緣構造，適合配置在電子元株鉻舶Α 立且了實靶 赠㈣賴11之間，以及高 有限空間或狹_铜内，能夠 作二維方她_職量，_全概魏散M312189 VIII. New description: [New technical field] The present invention relates to a multi-layer composite heat-conducting structure, especially a multi-layer composite hot material structure with high-efficiency energy in three-dimensional direction. [Prior Art] According to many electronic components, especially large integrated circuits, microprocessors, etc., in operation, it is usually unavoidably accompanied by high heat generation. If the miscellaneous heat is not removed in time, the operating scale and life span of the Lai Xuan parts will not be lost, and even more so, 70 pieces of electrons will be lost. In order to comply with the trend of light and thin, the side microprocessors are gradually adopting a high degree of integration design method, so that the enthusiasm released per unit area of the components is doubled. The good influence or damage caused by cooling will also be serious. Conventional means for promoting the heat dissipation performance of electrical products are generally provided by disposing a heat dissipating medium between the heat generating electrical component and the heat sink, such as a thermal conductive film, a heat conductive lean, a thermally conductive double Φ tape, and a solid-state liquid heat conduction phase change. In order to effectively transfer the heat generated by the heat-generating electronic components to the heat sink for the purpose of cooling the electrical equipment. However, the interface material of the heat dissipating medium focuses on transferring the heat of the electronic component vertically to the heat sink||, and then dissipating heat by the heat sink II. However, this technology can not effectively reach M312189 to cool electronic components or electronic appliances when the electronic and electrical equipment (enclosure) is not a good heat-dissipating material (such as plastic), or in other limited heat-dissipation space. The purpose of the equipment [new content], into the == that is to provide - a multi-layer composite heat conduction structure Zhao, the main / into the two-dimensional financial damage to the secret material, both high-flex insulation structure, suitable for configuration in the electronic element of the chrome And the real target gift (four) Lai 11 between, as well as high limited space or narrow _ copper, can be a two-dimensional party her _ position, _ full Wei
確實傳導排除電子元件所產生的絲，供確保树 率及使用壽命，賤產#_價值。 ㈣運作效 為達上揭目的，本_複合熱傳騎_結由—撓It does conduct the wire produced by the exclusion of electronic components to ensure tree rate and service life. (4) Operational efficiency In order to achieve the goal, this _ composite heat transmission ride _ knot by - scratch
膠層及一熱傳導歸相疊結合構成；該導娜射均勻分佈杜I 有多數熱傳導龍，以配置接觸於發熱電子元件的表面；該 _層的熱傳導係數高於該導熱膠層，以具備有三維立體方向高 效能熱傳導結構。 qThe glue layer and a heat conduction are combined to form a stack; the guide film uniformly distributes Du I having a plurality of heat conduction dragons to configure a surface contacting the heat-generating electronic component; the heat transfer coefficient of the layer is higher than the heat conductive layer to have High-efficiency heat conduction structure in three-dimensional direction. q
於#乂4土實婦彳巾，雜料結構體係由多數導_層與單層 或多數熱傳導熱層互相交錯相疊結合構成。 上述八中之一返離該電子元件的熱傳導熱層結合另一導熱腰 層，或者以導熱膠層結合另一熱傳導熱層。 / 上述導熱膠層相Φ膠合或較結合於熱料熱層，以製成三 維立體方向熱傳導複合結構體。 一 【實施方式】 有關本創作為達成上述目的，所採用之技術手段及其功效， M312189 鉍舉出可行實施例，並且配合圖面說明如下： 百先，請频第1至4圖，本創料層複合熱傳導結構體具 備二維立體方向熱傳導效能，如圖所示之熱傳導結構體實施例 中’至少包含-導熱膠層（i 〇)及—熱傳導熱層（2 Q)，該導 熱膠層（10)可選用如導熱砍膠片、導熱膠體，或使用具固態 轉液態相變化之高分子材料的導熱相變化材等導熱材，而熱傳導 熱層（2 0)可選用具高熱傳導係數之金屬或非金屬材料，如銅 /白紹V自、錫珀、石墨或石墨纖維材料等。本實施例導熱膠層（1 〇 )與熱傳導熱層（2 0 )厚度可各選用0.01mm〜15nim，使各 材料層之間彼此豐置密接結合，以形成一多層複合熱傳導結構體。 於第1至4圖所示之較佳實施例中，可選擇以單一或多數撓 性導熱膠層（1 0)、( i i)、( i 2)配合單一或多數熱傳導熱 層（2 0 )、（ 2 1 )，其彼此之間以交互層疊組成多層複合材料， 據以獲得具備三維熱傳導效能之複合結構體；又本形式的多層複 合材料具有質地柔韌及可撓的材料特性，因此可被密貼於會產生 熱源的電子元件（3 0)上，以有效率地將電子元件（3 〇)的 熱量導出傳送到散熱器（4 〇 )上，或者傳送到電子電器機構（外 殼）（5 0 )，避免在電子元件（3 0 )上累積熱量，造成故障； 從而一舉解決電子（電器）元件（3 〇 )運作時的散熱問題。 上述多層複合材料中的導熱膠層（1〇)係包含有熱傳導粉 體，以及用來結合前述熱傳導粉體微粒子的膠材，並利用混鍊製 程使該熱傳導粉體均勻分饰於膠材中，然後固定成型。其中，該 M312189 熱傳導粉體可翻如··氧她、氮她、氮化硼、石墨、铭粉、 銅私氧化銅、氧化鋅……等，該熱傳導粉體可能是前述材料之 -或是由二種以上材料混合而成者。而熱傳導粉體材料為不規則 型顆粒’ _適宜的平均減約αΐμιη〜1〇〇μιη。 而該膠材則可選用如··環氧樹脂、壓克力樹脂、紛酸樹脂、 聚酯樹脂、聚醋酸乙g旨樹脂（PVAC)、碎素（smeGn)樹脂或合 成橡膠......等’又’该膠材可以是前述材料之-或是由二種以上 材料混合而成。 上述環氧樹脂、壓克力樹脂、酚醛樹脂、聚酯樹脂、聚醋酸 乙醋樹脂(PVAC)、石夕素（Silicon)樹脂或合成橡膠......等，皆屬 於高分子量材料，但每種不同之膠材（樹脂）等皆有其 溶解稀釋（SP)劑（低分子量）之分解、包覆、融合，取得田(低 分子量）控制膠材（高分子量）的最低之共輛玻璃軟化點，這樣 則可得到籽餘麵〜励誦之籽4之騎，此膠材會因 分子量大小再不同的溫度下做固液相之變化，在第一次玻璃軟化 點不會產生氣相或碳化之變化，此種膠材我們稱為低溫相變膠 體，低溫相變膠體從35°C〜105°C。 前述導熱膠層（1 〇 )通常被製成0.02〜15mm厚度之面狀 或板片狀，且由於該導熱膠層（i 〇 )之材料質地柔韌，具備可 撓性及塑性變形的特性，因此可緊密、服貼的配置在發熱電子元 件（30)的表面，以降低界面之接觸熱阻，從而迅速將電子元 件（3 0)所產生的熱量傳導排除。 M312189 =，該導細⑴）可藉峨與熱傳導粉體的不同 獲得所欲的熱傳性及其他材_: =材射卿綱恤職,輸越佳，然 =的撓_觸難繼。U，#騎财的比例越 夕專熱效能較差，而材料的撓性與塑性等物性則較佳。通常係 選用·〜觀_卿9G%〜败物料粉體搭 ::導熱膠層(1 〇)可獲得約0觀〜歸她熱傳導係 t此之外，於選用氮她、氧化銘或氮化辦高電阻抗粉體 時，可使導熱膠層（1〇)具有高絕緣之電阻抗（1〇6〜心咖）。 ，卜本實施解熱騎（1⑸的混合材舰成型方式 製成板片狀’並且施作表面處理，再膠合貼著於熱傳導熱層（2 〇)的相對表面上。除此之外，亦可採用塗佈（喷塗或刮塗等） 方式或網版印刷方式’於熱傳導歸（2 Q)表面施作—厚度約 為_〜〇.3咖的導熱膠層（！ Q )，且藉由其膠材的分子結ς以 結合定位該等均勻分佈的熱傳導粉體。 於第1圖所示之_膠層（1 〇)密貼於電子元件（3 〇) 的發熱表面上，能夠有效傳導移轉熱量至熱傳導熱層（2 〇 )，以 進行全面擴散性散熱，同時將熱量高效率導出傳送到散熱器（4 )上除此之外’亦可如第2圖所示，由該熱傳導熱層（2 〇 ) 王面擴政傳導熱1至另—相對導熱膠層（1 1 )，以絕緣方式導出 傳送到電子電器機構（外殼）（5 0)。 · 本實施例複合熱傳導結構_導熱膠層（丨Q )及熱傳導熱 M312189 曰（2 Ο )具備可撓曲特性，因此可如第5及㈣所示進行任意 繞曲，以將熱源作三維方向性傳導移轉至適當位置進行熱擴散及 均溫。 於第7、8_示之實施例中，係在遠離電子元件的熱傳導 熱層（2 Q )的伸出部結合另—導熱膠層（i 3 )，以將熱源作三 維方向性料㈣輯當健進行熱擴散及均溫 。除此之外，亦 可如第9、1◦圖所示於其中之一遠離電子元件的導熱膠層（1 1)的伸出部結合另一熱傳導熱層（2 2)。 本創作多層複合熱料結制主要軸三維立财向高效能 熱傳導’兼具南撓曲特性，並且可實施絕緣構造，適合配置在電 子元件發熱表面與散熱器之間，以及高度撓曲設置在電子電器機 構的有限空間或狹P益賴空間内，能夠作三維方向性傳導移轉熱 里，達到全面性擴散迅速散熱效能，以確實傳導排除電子元件所 產生的向熱，供確保電子元件的運作效率及使用壽命，具備產業 利用價值，爰依法提出新型專利申請。 以上所舉實把例僅用為方便說明本創作，而並非加以限制， 在不離本創作精神範疇，熟悉此一行業技藝人士所可作之各種簡 易變化與修飾，均仍應含括於以下申請專利範圍中。 【圖式簡單說明】 第1圖係本創作第一實施例複合熱傳導結構體之斷面放大圖； 第2圖係本創作第二實施例之斷面放大圖； 第3圖係本創作第三實施例之結構圖； M312189 第4圖係本創作第四實施例之結構圖； 第5圖係本創作第五實施例之使用狀態圖； 第6圖係本創作第六實施例之使用狀態圖； 第7圖係本創作第七實施例之使用狀態圖； 第8圖係本創作第八實施例之使用狀態圖； 第9圖係本創作第九實施例之使用狀態圖；以及 第10圖係本創作第十實施例之使用狀態圖。 【主要元件符號說明】 (10)、（11)、（12)、（13)導熱膠層 (20)、（2 1)、（22)熱傳導熱層 (30)電子元件 (40)散熱器 (50)電子電器機構In the #乂4 soil, the structure of the miscellaneous material is composed of a plurality of layers, a single layer or a plurality of heat conducting layers interlaced. One of the above eight returns from the heat conducting thermal layer of the electronic component in combination with another thermally conductive waist layer, or in combination with another thermally conductive thermal layer. / The above-mentioned thermal conductive adhesive layer is Φ glued or bonded to the hot material hot layer to form a three-dimensional three-dimensional heat conduction composite structure. [Embodiment] For the purpose of achieving the above objectives, the technical means and its functions, M312189 cites a feasible example, and the following diagram is described as follows: Bai Xian, please frequency 1 to 4, this creation The composite thermal conduction structure of the material layer has a two-dimensional stereoscopic heat conduction performance, and the heat conduction structure embodiment as shown in the figure includes at least a thermal conductive adhesive layer (i 〇) and a thermal conductive thermal layer (2 Q), the thermal conductive adhesive layer (10) It is possible to use heat-conducting film, thermal paste, or heat-conducting material such as heat-conducting phase change material with solid-state liquid phase change, and heat-conducting layer (20) can be equipped with metal with high heat transfer coefficient. Or non-metallic materials, such as copper / white Sa V, tin, graphite or graphite fiber materials. In this embodiment, the thickness of the thermal conductive adhesive layer (1 〇 ) and the heat conductive thermal layer (20 ) can be selected from 0.01 mm to 15 nm each, so that the material layers are closely adhered to each other to form a multilayer composite heat conducting structure. In the preferred embodiment shown in FIGS. 1 to 4, a single or a plurality of thermally conductive adhesive layers (10), (ii), (i2) may be selected to be combined with a single or a plurality of thermally conductive thermal layers (20). (2 1 ), which are alternately laminated with each other to form a multilayer composite material, to obtain a composite structure having three-dimensional heat conduction performance; and the multilayer composite material of the present form has texture flexibility and flexible material properties, and thus can be It is attached to the electronic component (30) that generates heat source to efficiently transfer the heat of the electronic component (3 〇) to the heat sink (4 〇) or to the electronic device (outer casing) (5) 0), to avoid accumulation of heat on the electronic component (30), causing malfunction; thereby solving the heat dissipation problem when the electronic (electrical) component (3 〇) operates in one fell swoop. The thermal conductive adhesive layer (1〇) in the above multilayer composite material comprises a heat conductive powder, and a rubber material for combining the heat conductive powder fine particles, and the heat conductive powder is evenly distributed in the rubber material by a mixed chain process. And then fixed. Among them, the M312189 heat conduction powder can be turned into such as oxygen, nitrogen, boron, graphite, powder, copper oxide, zinc oxide, etc., the heat transfer powder may be the aforementioned material - or It is a mixture of two or more materials. The thermally conductive powder material is an irregular type of particles _ a suitable average reduction of about αΐμιη~1〇〇μιη. The adhesive material can be selected from epoxy resin, acrylic resin, acid resin, polyester resin, polyvinyl acetate resin (PVAC), smeGn resin or synthetic rubber. .. etc. 'And' the glue may be the aforementioned material - or a mixture of two or more materials. The above epoxy resin, acrylic resin, phenolic resin, polyester resin, polyvinyl acetate resin (PVAC), silicone resin or synthetic rubber, etc., are all high molecular weight materials. However, each of the different rubbers (resins) has the lowest decomposition of the dissolved (SP) agent (low molecular weight), coating, and fusion, and the lowest total of the field (low molecular weight) control rubber (high molecular weight). The softening point of the glass, so that the seed surface of the seed can be obtained. The rubber material will change in the solid-liquid phase at a temperature different from the molecular weight, and no gas will be generated at the first softening point of the glass. The phase or carbonization changes, we call this low temperature phase change colloid, low temperature phase change colloid from 35 ° C ~ 105 ° C. The thermal conductive adhesive layer (1 〇) is usually formed into a surface shape or a sheet shape having a thickness of 0.02 to 15 mm, and since the material of the thermal conductive adhesive layer (i 〇) is flexible and has characteristics of flexibility and plastic deformation, It can be placed tightly and conformally on the surface of the heat-generating electronic component (30) to reduce the contact thermal resistance of the interface, thereby quickly eliminating the heat conduction generated by the electronic component (30). M312189 =, the guide (1) can obtain the desired heat transfer and other materials by the difference between the heat transfer powder and the heat transfer powder. _: = The material is shot and the grade is better, but the change is better. The proportion of U,# riding is more efficient, and the physical properties such as flexibility and plasticity of the material are better. Usually choose ~ ~ view _ Qing 9G% ~ defeat material powder lap:: thermal adhesive layer (1 〇) can get about 0 ~ return to her heat conduction system t, in addition to nitrogen, oxidation or nitriding When the high-resistance anti-powder is used, the thermal conductive adhesive layer (1〇) can have a high insulation resistance (1〇6~心咖). , Buben implements the anti-heat riding (1 (5) mixed material ship forming method is made into a sheet shape' and is applied as a surface treatment, and is glued to the opposite surface of the heat conductive layer (2 〇). Applying by coating (spraying or doctoring, etc.) or screen printing method to the surface of the heat transfer (2 Q)—the thickness of the thermal conductive layer (! Q) of about _~〇.3 coffee, and by The molecular crucible of the rubber material is combined to position the uniformly distributed heat conduction powder. The glue layer (1 〇) shown in Fig. 1 is adhered to the heat generating surface of the electronic component (3 〇), and can be effectively conducted. Transfer heat to the heat-conducting thermal layer (2 〇) for full diffusive heat dissipation, while transferring heat efficiently to the heat sink (4). In addition, as shown in Figure 2, the heat conduction is performed. The thermal layer (2 〇) The king face expansion heat conduction 1 to the other - the relative thermal conductive layer (1 1 ), is exported and transmitted to the electrical and electronic mechanism (outer casing) (50). · The composite heat conduction structure of this embodiment _ The thermal conductive layer (丨Q) and the heat transfer heat M312189 2(2 Ο ) have flexible properties, so Any bending can be performed as shown in the fifth and fourth (4) to transfer the heat source to the appropriate position for thermal diffusion and temperature uniformity. In the seventh, eighth embodiment, the system is away from the electronic component. The extension portion of the heat conduction heat layer (2Q) is combined with the other heat conductive adhesive layer (i3) to heat-distribute the heat source into the three-dimensional directional material (4), and to achieve temperature uniformity. The protrusion of the thermal conductive adhesive layer (1 1), one of which is away from the electronic component, is combined with the other thermally conductive thermal layer (2 2) as shown in Fig. 9 and Fig. 1. The original multi-layer composite hot material is formed into a main axis three-dimensionally The high-energy heat conduction of the financial direction has both the characteristics of the south deflection and the insulation structure, which is suitable for being disposed between the heating surface of the electronic component and the heat sink, and the high deflection is set in the limited space or narrow space of the electronic and electrical mechanism. In the three-dimensional directional conduction transfer heat, it can achieve comprehensive diffusion and rapid heat dissipation performance, so as to accurately conduct the heat generated by the electronic components, to ensure the operation efficiency and service life of the electronic components, and to have industrial utilization value. According to law A new type of patent application has been made. The above examples are only used to illustrate the creation of the book, and are not intended to be limiting. In the spirit of this creation, all kinds of simple changes and modifications that can be made by those skilled in the industry should still be It is included in the scope of the following patent application. [Simplified illustration of the drawings] Fig. 1 is a cross-sectional enlarged view of the composite heat conduction structure of the first embodiment of the present invention; Fig. 2 is an enlarged sectional view of the second embodiment of the present creation 3 is a structural diagram of a third embodiment of the present creation; M312189 is a structural diagram of a fourth embodiment of the present creation; and FIG. 5 is a state diagram of the fifth embodiment of the present creation; The use state diagram of the sixth embodiment is created; the seventh diagram is the use state diagram of the seventh embodiment of the present creation; the eighth diagram is the usage state diagram of the eighth embodiment of the present creation; and the ninth embodiment is the ninth embodiment of the present creation A usage state diagram; and a tenth diagram is a usage state diagram of the tenth embodiment of the present creation. [Explanation of main component symbols] (10), (11), (12), (13) thermal conductive adhesive layer (20), (2 1), (22) heat conductive thermal layer (30) electronic component (40) heat sink ( 50) Electronic and electrical institutions
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