JP2004136673A - Bonded structure, liquid crystal device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a bonded structure which can increase the force of adhesion to each object to be bonded, even in the case of the adhesion to two kinds of the objects to be bonded, different in the properties of materials, and to prevent the occurrence of a poor connection between electrode terminals which are formed in the objects to be bonded. <P>SOLUTION: The thickness of the electrode terminal 12 from the surface of a glass substrate 11 is smaller than that of the electrode terminal 14 from the surface of a tape carrier package (TCP) 13; a first adhesive layer 4 and a second adhesive layer 5 are laminated together in an adhesive 1; the adhesive layer 4 includes conductive particles 3; the thickness of the adhesive layer 4 is greater in dimension than the diameter of the conductive particle 3; the force of the adhesion of the adhesive layer 4 to the glass substrate 11 is greater than that of the adhesion of the adhesive layer 5 thereto; and the force of the adhesion of the adhesive layer 5 to the TCP 13 is greater than that of the adhesion of the adhesive layer 4 thereto. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an adhesive, particularly to an anisotropic conductive adhesive containing conductive particles. Further, the present invention relates to a liquid crystal device using an anisotropic conductive adhesive for connecting a liquid crystal panel to an external circuit board or a semiconductor element, and a method for manufacturing the same. In addition, the present invention relates to an electronic device including the liquid crystal device as a display unit.

For connection between fine pitch terminals, such as connection between an input terminal provided on a glass substrate of a liquid crystal panel and a terminal of a TCP (Tape Carrier Package) (a bump may be formed on the terminal). Uses an anisotropic conductive adhesive.

(4) A conventional anisotropic conductive adhesive is composed of a thermosetting or thermoplastic insulating adhesive material such as an epoxy resin, and a plurality of conductive particles arranged in the adhesive. Here, since the insulating adhesive material is bonded to the adherend, that is, the glass substrate and the TCP made of polyimide, a general-purpose adhesive is used so that the insulating adhesive material can adhere to any of the adherends having different materials with a predetermined adhesive force. Highly adhesive was used.

However, a versatile adhesive can provide a certain level of adhesive force to any material to be bonded, but if a certain level of adhesive force is required for one of the materials to be bonded, the other will be used. There has been a problem that the adhesive force with the object to be bonded is reduced, and the adhesive force of a certain level or more cannot be obtained as a whole.

Especially, when a glass substrate is used for a liquid crystal panel and the glass substrate is connected to a polymer substrate which is an external circuit substrate, the adhesive characteristics of the two may be significantly different. For this reason, the defect due to the peeling of the adhesive tends to easily occur in only one of the glass substrate and the polymer substrate.

An object of the present invention is to realize an adhesive structure using an anisotropic conductive adhesive that can improve the adhesive force with each of the adherends even when the adherends are bonded to two types of adherends having different materials. It is another object of the present invention to realize a liquid crystal device in which a connection failure does not occur and an electronic device using the same.

The bonding structure according to the present invention is a bonding structure in which a first bonded object and a second bonded object are bonded by an adhesive, wherein the first electrode terminal formed on the first bonded object and the second bonding object are provided. A second electrode terminal formed on the adhesive; a thickness of the first electrode terminal from a surface of the first adhesive; a thickness of the second electrode terminal from a surface of the second adhesive; The first adhesive layer is made of a laminate of a first adhesive layer and a second adhesive layer, the first adhesive layer contains conductive particles, and the thickness of the first adhesive layer is Thicker than the diameter of the particles, the first adhesive layer has a higher adhesive force to the first adherend than the second adhesive layer, and the second adhesive layer has an adhesive force to the second adherend. Higher than the first adhesive layer, the first adhesive layer is adhered to the first adherend, the second adhesive layer, That it is adhered to the serial second adherend, characterized.

In the case where the first adherend and the second adherend are adhered to each other using the adhesive structure of the present invention, the first adhesive layer and the first adherend are brought into contact with each other, and the second adhesive layer is The second object can be brought into contact with the second object. By doing so, each of the adherends is adhered to the other adherend under the adhesive characteristics according to each, so that the adherence between the adherends becomes strong.

(4) When it is necessary to make an electrical connection between the first adherend and the second adherend, conductive particles may be mixed into the first adhesive layer as in the present invention. Of course, conductive particles may be mixed in the second adhesive layer, but usually, when electrical connection is made between the first adherend and the second adherend, the first adhesive is used. The object to be bonded and the second object to be bonded are bonded by pressing each other. Therefore, if the conductive particles are mixed only in the first adhesive layer, electrical connection can be made.

(4) If the conductive particles are arranged only in the first adhesive layer, the number and arrangement of the conductive particles can be easily controlled, so that an anisotropic conductive adhesive can be easily produced. In this case, since the second adhesive layer only needs to be used only for adhesion with the second adherend, the thickness of the adhesive layer can be made smaller than that of the first adhesive layer.

一般 Generally, the bonding of the objects is performed by pressure bonding. During this crimping, the adhesive is pushed out by the electrode terminals and flows out. As a matter of course, the amount of the adhesive extruded by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive extruded by the electrode terminal having the small thickness. In order to make a reliable electrical connection between the first adherend and the second adherend, it is preferable to prevent outflow of the conductive particles.

In the present invention, since the first layer in which the conductive particles are mixed is brought into contact with the substrate having the electrode terminals with thin electrode terminals, it is possible to prevent the conductive particles from flowing out at the time of crimping.

Further, the bonding structure of the present invention is a bonding structure in which a first bonded object and a second bonded object are bonded by an adhesive, wherein the first electrode terminal formed on the first bonded object, 2 having a second electrode terminal formed on the adherend, wherein the thickness of the first electrode terminal from the surface of the first adherend is from the surface of the second adherend of the second electrode terminal. The adhesive is formed by laminating a first adhesive layer, a second adhesive layer, and a conductive layer, and the conductive layer is laminated between the first adhesive layer and the second adhesive layer. And conductive particles, wherein the thickness of the second adhesive layer is greater than the thickness of the first adhesive layer, and the first adhesive layer has a higher adhesive force to the first adherend than the second adhesive layer. The second adhesive layer has a higher adhesive strength to the second adherend than the first adhesive layer, and the first adhesive layer is The first is adhered to the adherend, the second adhesive layer, it is bonded to the second adherend, characterized.

In this case, since the third adhesive layer on which the conductive particles are arranged does not directly contact the adherend, there is no need to select a material according to the adherend. Therefore, even when the adhesive is adhered to any adherend, only the adhesive properties of the first and second adhesive layers need to be set according to those adherends, and the insulating property of the conductive layer can be reduced. Since the adhesive material can be used in common, production efficiency can be improved and cost can be reduced in producing anisotropically conductive adhesives having various adhesive properties.

Further, since the thicker electrode terminal is in contact with the second adhesive layer having a thicker layer, and the thinner electrode terminal is in contact with the first adhesive layer having a thinner layer. The layer containing the conductive particles can be prevented from being pushed out by the electrode terminals, and reliable conduction between the electrode terminals can be obtained.

Specific means for adjusting the adhesive properties of the first and second adhesive layers include:
(1) The main component of the insulating adhesive material in the first adhesive layer is different from the main component of the insulating adhesive material in the second adhesive layer. (2) The first adhesive layer and the second (3) A different coupling agent may be added to the first adhesive layer and the second adhesive layer as a main component of the insulating adhesive material and a different coupling agent to be added. However, the same insulating adhesive material is used for the first adhesive layer and the second adhesive layer, and a first coupling agent corresponding to the first adherend is added to the first adhesive layer. If the second coupling agent is added to the second adhesive layer according to the second adherend, the characteristics of the adhesive can be changed only by changing the type of the coupling agent. The types of insulating adhesive materials used can be reduced, the production efficiency can be improved, and the cost can be reduced.

Further, a liquid crystal device according to the present invention is a liquid crystal device having a pair of substrates for sandwiching liquid crystal and a circuit board adhered to one of the pair of substrates, wherein the first electrode formed on the one substrate is provided. A terminal, and a second electrode terminal formed on the circuit board, wherein the thickness of the first electrode terminal from the surface of the one substrate is greater than the thickness of the second electrode terminal from the surface of the circuit board. The adhesive is thin, a first adhesive layer and a second adhesive layer are laminated, the first adhesive layer includes conductive particles, and the thickness of the first adhesive layer is the conductive particles. Thicker than the diameter of the first adhesive layer, the first adhesive layer has a higher adhesive force to the one substrate than the second adhesive layer, and the second adhesive layer has an adhesive force to the circuit board higher than the first adhesive layer. High, said first adhesive layer is adhered to said one substrate, Serial second adhesive layer, it is bonded to the circuit board, and wherein.

According to the liquid crystal device of the present invention, a plurality of adhesive layers having adhesive characteristics according to each substrate are used for connection between a liquid crystal panel substrate (mainly a glass substrate) and a circuit substrate (mainly a polymer substrate). Use some adhesive. As a result, the adhesive strength between the two substrates becomes uniform and strong, and the connection reliability of the liquid crystal device is improved.

Generally, the connection between the liquid crystal panel substrate and the external circuit board is performed by crimping. During this crimping, the adhesive is pushed out by the electrode terminals and flows out. As a matter of course, the amount of the adhesive extruded by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive extruded by the electrode terminal having the small thickness. In order to make a reliable electrical connection between the liquid crystal panel substrate and the external circuit substrate, it is preferable to prevent outflow of the conductive particles. In the present invention, the first layer in which the conductive particles are mixed is brought into contact with the substrate on which the electrode terminals having a small electrode terminal thickness are formed, so that the conductive particles can be prevented from flowing out during crimping.

Further, a liquid crystal device according to the present invention is a liquid crystal device having a pair of substrates sandwiching liquid crystal, and a semiconductor element adhered to one of the pair of substrates, wherein the first electrode formed on the one substrate is provided. A terminal, and a second electrode terminal formed on the semiconductor element, wherein the thickness of the first electrode terminal from the surface of the one substrate is greater than the thickness of the second electrode terminal from the surface of the semiconductor element. The adhesive is thin, a first adhesive layer and a second adhesive layer are laminated, the first adhesive layer includes conductive particles, and the thickness of the first adhesive layer is the conductive particles. Thicker than the diameter of the first adhesive layer, the first adhesive layer has a higher adhesive force to the one substrate than the second adhesive layer, and the second adhesive layer has an adhesive force to the semiconductor element higher than the first adhesive layer. High, said first adhesive layer adheres to said one substrate Cage, the second adhesive layer, it is bonded to the semiconductor element, characterized by.

According to the present invention, in a so-called COG (Chip on Glass) type liquid crystal device in which a semiconductor element is directly mounted on a liquid crystal panel substrate, the connection between the liquid crystal panel substrate and the semiconductor element can be strengthened.

Generally, an electrode terminal formed on a liquid crystal panel substrate is a transparent conductive film (ITO), and an electrode terminal formed on a circuit board or a semiconductor element is often a metal film. The first adhesive layer may be in contact with the liquid crystal panel substrate, and the second adhesive layer may be in contact with the circuit board. This is because ITO is usually formed thinner than a metal film.

The electronic apparatus of the present invention includes the above-described liquid crystal device as a display unit, and includes a housing in which the display unit is housed. The electronic device of the present invention is, for example, a mobile phone, a wristwatch, or a notebook computer, and uses the adhesive of the present invention for bonding a liquid crystal device to an external circuit or a semiconductor element. The adhesive strength of a semiconductor element can be improved, the incidence of defective products in liquid crystal devices and electronic devices can be reduced, and manufacturing costs can be reduced.

さ ら に The following is a more detailed description with reference to the embodiments of the present invention shown in the drawings.

FIG. 1 shows an adhesive 1 used in a first embodiment of the adhesive structure of the present invention. The adhesive 1 includes a first adhesive layer 4 on which a plurality of conductive particles 3 are arranged, and a second adhesive layer 5 laminated on the first adhesive layer 4.

The conductive particles 3 may be solder particles, single metal particles such as Ni, Au, Ag, Cu, Pb, and Sn, composite metal particles formed by a mixture of a plurality of metals, an alloy, plating, or the like, or plastic particles (polystyrene-based). , A polycarbonate-based resin, an acrylic-based resin, a dibenylbenzene-based resin), a single particle or a plurality of particles of Ni, Au, Cu, Fe, or the like, or carbon particles.

In addition, the first adhesive layer 4 and the second adhesive layer 5 are mainly composed of an insulating adhesive material having a high adhesive strength to an object to which the adhesive layers 4 and 5 are adhered. .

For example, as shown in FIG. 2, when the adhesive 1 is disposed between the electrode terminal 12 provided on the glass substrate 11 of the liquid crystal panel and the electrode terminal 14 of the TCP 13, the first adhesive layer 4 Is mainly composed of an insulating adhesive material having a high adhesive strength to a glass substrate 11 and a terminal 12 made of ITO or the like. The second adhesive layer 5 is made of a TCP 13 made of polyimide and an electrode made of tin-plated copper. An insulating adhesive material having a high adhesive strength to the terminal 14 is used as a main component.

The first adhesive layer 4 is adhered to the glass substrate 11 and the electrode terminals 12. Since the larger adhesion area is due to the adhesion with the glass substrate 11, the adhesive strength with the glass substrate 11 is larger. Such an insulating adhesive material may be used as a main component.

Similarly, the second adhesive layer 5 may also use, as a main component, an insulating adhesive material having a larger adhesive strength with TCP 13 (made of polyimide) having a large adhesive area.

The insulating adhesive material used as a main component of each of the adhesive layers 4 and 5 may be, for example, a styrene-butadiene-styrene (SBS) -based, an epoxy-based, an acrylic-based, a polyester-based, or a urethane-based single or a plurality of mixtures or And the like. At this time, different types of insulating adhesive materials may be used as main components of the adhesive layers 4 and 5, but in the present embodiment, the same type of insulating adhesive material is used, and the type of coupling agent to be added is changed. Change the adhesive properties.

Specific coupling agents used for the adhesive layer 4 include dimethyldimethoxysilane, γ-aminopropyltriethoxysilane, and the like. However, if the coupling agent contains a large number of methoxy groups or ethoxy groups as functional groups, the coupling agent may be glass. Adhesive strength can be increased.

Specific examples of the coupling agent used for the adhesive layer 5 include N-β (aminoethyl) γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and the like. If the coupling agent contains a large amount of epoxy groups, the adhesive strength with polyimide can be increased.

In the adhesive 1 having such a configuration, for example, a first adhesive layer 4 containing conductive particles 3 is laminated on a base plate or a separator for production, and a second adhesive layer 5 is laminated thereon. It is manufactured by doing.

The adhesive 1 configured as described above is disposed between the glass substrate 11 of the liquid crystal panel and the TCP 13 as shown in FIG. Then, the respective electrode terminals 12 and 14 are pressed into the adhesive 1 side by thermocompression bonding or the like, and the conductive particles 3 are interposed between the respective electrode terminals 12 and 14 to conduct electricity. Adhere to TCP13.

According to such a procedure, as shown in FIG. 3, the liquid crystal device 100 in which the liquid crystal panel 10 and the TCP 13 on which the liquid crystal driver IC 15 is mounted is bonded with the adhesive 1 is configured.
The liquid crystal device 100 is used by being incorporated in housings of various electronic devices. For example, it is incorporated in the housing 201 of the mobile phone 200 shown in FIG. 5 or used in the housing 301 of the notebook computer 300 shown in FIG.

The first embodiment has the following effects.
Since the adhesive 1 is formed by laminating the first and second two types of adhesive layers 4 and 5, the first adhesive layer 4 bonded to the glass substrate 11 and the electrode terminals 12 is replaced with the glass substrate 11 or the like. And the second adhesive layer 5 to be bonded to the TCP 13 and the terminal 14 can be formed of a type of adhesive layer having a high adhesive strength to the TCP 13 and the like. For this reason, compared to the case where the glass substrate 11 and the TCP 13 are adhered by one kind of adhesive layer as in the related art, the adhesive 1 having the excellent adhesive property can be improved in the adhesive force with the adherends 11 and 13. It can be.

Since the conductive particles 3 are contained only in the first adhesive layer 4, the number and arrangement of the conductive particles 3 are easier to manage than in the case where the conductive particles 3 are arranged on both of the adhesive layers 4 and 5. , Can be easily manufactured. Further, since the type of coupling agent to be added is changed without changing the type of insulating adhesive material when changing the adhesive characteristics of each of the adhesive layers 4 and 5, the adhesive characteristics of each of the adhesive layers 4 and 5 can be reduced. And can be easily set.

接着 Generally, the bonding between the glass substrate 11 and the TCP 13 is performed by pressure bonding. During this crimping, the adhesive is pushed out by the electrode terminals and flows out. As a matter of course, the amount of the adhesive extruded by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive extruded by the electrode terminal having the small thickness. In order to make reliable electrical connection between the glass substrate 11 and the TCP 13, it is preferable to prevent the conductive particles 3 from flowing out. In the present invention, since the first adhesive layer 4 into which the conductive particles 3 are mixed is brought into contact with the glass substrate 11 on which the electrode terminal 12 having a smaller thickness is formed, the conductive particles 3 at the time of pressure bonding are brought into contact. Outflow can be prevented.

Next, a second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same or similar components as those of the first embodiment are denoted by the same reference numerals, and the description is omitted or simplified.

The adhesive 1 (anisotropic conductive adhesive) used in the bonding structure of the second embodiment includes a conductive layer 4 on which a plurality of conductive particles 3 are arranged, and a first bonding layer laminated below the conductive layer 4. It has a layer 6 and a first adhesive layer 5 laminated on the conductive layer 4.

Here, the conductive layer 7 is made of an adhesive that easily mixes the conductive particles 3, and is formed relatively thin so that the conductive particles 3 are arranged in a line (one layer) in the film thickness direction. If the number of conductive particles is one, the amount of the conductive particles that move between the terminals at the time of bonding decreases, and the possibility of short-circuit between the terminals further decreases.

Further, the first and second adhesive layers 6 and 5 are, like the adhesive layers 4 and 5 in the first embodiment, bonded to each other with a high adhesive strength to the adherend to which the adhesive layers 6 and 5 are bonded. It is composed of layers.
For example, as shown in FIG. 7, when the adhesive 1 is disposed between the electrode terminal 12 provided on the glass substrate 11 of the liquid crystal panel and the terminal (bump) 22 of the IC 21, the first adhesive As the layer 6, an adhesive layer having a high adhesive strength to the glass substrate 11 and the electrode terminal 12 made of ITO or the like is used. An adhesive layer having a high adhesive strength is used.

Also in the present embodiment, since the first adhesive layer 6 has a large adhesive area with the glass substrate 11, an adhesive layer having a larger adhesive strength with the glass substrate 11 may be used. The second adhesive layer 5 may also use an adhesive layer having a larger adhesive strength with the IC 21 having a larger adhesive area. The insulating adhesive material used as a main component for each of the adhesive layers 6, 5 and the conductive layer 4 is the same as in the first embodiment, and the type of the coupling agent to be added is changed to change the adhesive characteristics. .

The adhesive 1 having such a configuration is obtained, for example, by laminating a first adhesive layer 6 on a base plate or a separator for production, and further forming a conductive layer 4 containing conductive particles 3 thereon and a second adhesive layer. It is manufactured by sequentially laminating the layers 5.

The adhesive 1 configured as described above is disposed between the glass substrate 11 of the liquid crystal panel and the IC 21 as shown in FIG. Then, the respective electrode terminals 12 and 22 are pressed into the adhesive 1 by thermocompression bonding or the like, and the conductive particles 3 are interposed between the respective terminals 12 and 22 to conduct electricity. Glue. Further, in order to input a signal to the IC 21, a flexible substrate is connected to the electrode terminal 12 connected to the input terminal of the IC 21, and the connection between the flexible substrate and the electrode terminal 12 on the glass substrate is performed by the first method. It is preferable to use the adhesive described in the embodiment.

The second embodiment has the same effect as the first embodiment.
That is, since the first adhesive layer 6, the second adhesive layer 5, and the conductive layer 4 are laminated to form the adhesive 1, the first adhesive bonded to the glass substrate 11 and the electrode terminals 12 is formed. The layer 6 is an adhesive layer having a high adhesive strength to the glass substrate 11 or the like, and the second adhesive layer 5 bonded to the IC 21 or the electrode terminal 22 is an adhesive layer having a high adhesive strength to the IC 21 or the like. It can be composed of layers. For this reason, compared with the case where the glass substrate 11 and the IC 21 are bonded to each other with a single type of bonding layer as in the related art, it is possible to improve the adhesive force with each of the objects to be bonded and to provide the adhesive 1 having excellent bonding characteristics. Can be.

Since the conductive particles 3 are included only in the conductive layer 4, the number and arrangement of the conductive particles 3 are easier to manage and easier than when the conductive particles 3 are arranged on the adhesive layers 6, 5 and the conductive layer 4. Can be manufactured.

１ The first and second adhesive layers 6 and 5 can be formed arbitrarily in thickness because the conductive particles 3 are not arranged. In the present invention, the thickness of the first adhesive layer 6 is formed smaller than the thickness of the second adhesive layer 5. As a result, the first adhesive layer 6 can be brought into contact with the glass substrate 11 on which the thinner electrode terminal 12 is formed, similarly to the first embodiment, and the conductive particles 3 can be contacted at the time of pressure bonding. Outflow can be prevented.

(4) Since the adhesive properties of the adhesive layers 6 and 5 are changed depending on the type of the coupling agent to be added, the adhesive properties of the adhesive layers 6 and 5 can be easily set at low cost.

Further, according to the second embodiment, since the conductive layer 4 containing the conductive particles 3 is disposed in the middle of the adhesive 1 and does not directly contact the adherend, the material is adjusted according to the adherends 11 and 21. There is no need to select. Therefore, even when the adhesive 1 is adhered to any adherend, the first adhesive layer 6 and the second adhesive layer 5 may be set according to the adherend, and the conductive layer 4 Can be used in common, so that in manufacturing the adhesive 1 having various adhesive properties, the manufacturing efficiency can be improved and the cost can be reduced.

Since the conductive particles 3 are arranged in one row (one layer) in the thickness direction of the adhesive 1, the number of the conductive particles 3 interposed between the electrode terminals 12 and 22 is The number of conductive particles 3 interposed between the electrode terminals 12 and 22, that is, the conductive performance, can be easily controlled by the area of the connection surface of the conductive particles 12 and 22 and the number of the conductive particles 3 sprayed per unit area. Can be adjusted and set.

The present invention is not limited to the above-described embodiments, but includes modifications and improvements as long as the object of the present invention can be achieved.

For example, in each of the above embodiments, the conductive particles 3 are included only in the first adhesive layer in the first embodiment or the conductive layer 4 in the second embodiment. However, other layers, for example, the first embodiment. In the second adhesive layer 5 or the second adhesive layer 5 in the first embodiment, or the first adhesive layer 4 in the first embodiment or the conductive layer 4 in the second embodiment contains conductive particles. However, even if another layer, for example, the second adhesive layer 5 in the first embodiment or a configuration in which only the second adhesive layer 5 contains conductive particles is employed, the first adhesive is not sufficient in terms of adhesive strength. Or, secondly, the same effect as in the embodiment can be obtained.

In addition, the conductive particles 3 may be uniformly arranged on an adhesive layer having a relatively large film thickness as shown in FIG. 1 or may be arranged on an adhesive layer having a relatively thin film thickness as shown in FIG. You may arrange so that it may become about 1-2 rows in a film thickness direction.

Furthermore, the adhesive 1 may have a laminated structure of four or more layers. In this case, in addition to the adhesive bonded to the glass substrate 11, the TCP 13, and the IC 21, an adhesive layer bonded to each of the electrode terminals 12, 14, and 22 is separately provided, and each adhesive layer is bonded to the object 12. , 14, 22 can be used, and the adhesive strength between the adhesive and the adherend can be further improved.

Further, the adhesive 1 having a three-layer structure of the second embodiment may be used for conductive connection between the electrode terminal 12 of the glass substrate 11 for a liquid crystal panel of the first embodiment and the electrode terminal 14 of the TCP 13, or vice versa. Alternatively, the adhesive 1 having a two-layer structure of the first embodiment may be used for bonding the glass substrate 11 and the IC 21 of the second embodiment.

Further, the adhesive of the present invention can be widely used not only for bonding components for liquid crystal panels but also for conducting various electrical components. In addition, the setting of the adhesive properties of the adhesive layers 4, 5, 6 and the conductive layer 4 is not limited to the case where a coupling agent is added, but by changing the type of the main component of the insulating adhesive material itself. Or may be set by appropriately adding other additives and the like.

In short, the material (the type of the main component of the insulating adhesive material and the type of the coupling agent to be added), the size (the film thickness and the particle size) of the adhesive layers 4, 5, 6 of the adhesive 1, the conductive layer 4 and the conductive particles 3. The diameter and the like may be appropriately set according to the type of the adherend to be applied. Therefore, the electronic device using the adhesive 1 of the present invention is not limited to the electronic device including the liquid crystal device 100 as a display unit, such as the mobile phone 200 or the notebook computer 300, but is also applicable to various electronic devices not including a liquid crystal device. it can.

It is a figure showing the section of the adhesive used by a 1st embodiment of the present invention. FIG. 3 is a diagram illustrating a cross section of a connection portion between a liquid crystal panel substrate and a TCP substrate in the first embodiment. It is a perspective view of the liquid crystal device in the present invention. It is a perspective view of the mobile phone in the present invention. FIG. 2 is a perspective view showing a noscon in the present invention. It is a figure showing a section of an adhesive in a 2nd embodiment of the present invention. It is a figure showing the section of the connection part of the liquid crystal panel board and the semiconductor element in a 2nd embodiment of the present invention.

Claims (7)

In an adhesion structure in which the first adherend and the second adherend are adhered by an adhesive,
A first electrode terminal formed on the first adherend, and a second electrode terminal formed on the second adherend;
A thickness of the first electrode terminal from a surface of the first adherend is smaller than a thickness of the second electrode terminal from a surface of the second adherend;
The adhesive is formed by laminating a first adhesive layer and a second adhesive layer,
The first adhesive layer includes conductive particles,
The thickness of the first adhesive layer is larger than the diameter of the conductive particles,
The first adhesive layer has a higher adhesive strength to the first adherend than the second adhesive layer,
The second adhesive layer has a higher adhesive strength to the second adherend than the first adhesive layer,
The first adhesive layer is adhered to the first adherend,
The second adhesive layer is adhered to the second adherend;
Adhesive structure characterized by the following. In an adhesion structure in which the first adherend and the second adherend are adhered by an adhesive,
A first electrode terminal formed on the first adherend, and a second electrode terminal formed on the second adherend;
A thickness of the first electrode terminal from a surface of the first adherend is smaller than a thickness of the second electrode terminal from a surface of the second adherend;
The adhesive is formed by laminating a first adhesive layer, a second adhesive layer, and a conductive layer,
The conductive layer contains conductive particles, and is laminated between the first adhesive layer and the second adhesive layer,
The thickness of the second adhesive layer is greater than the thickness of the first adhesive layer,
The first adhesive layer has a higher adhesive strength to the first adherend than the second adhesive layer,
The second adhesive layer has a higher adhesive strength to the second adherend than the first adhesive layer,
The first adhesive layer is adhered to the first adherend,
The second adhesive layer is adhered to the second adherend;
Adhesive structure characterized by the following. In a liquid crystal device including a pair of substrates that sandwich liquid crystal and a circuit board that is bonded to one of the pair of substrates,
A first electrode terminal formed on the one substrate, and a second electrode terminal formed on the circuit board;
A thickness of the first electrode terminal from a surface of the one substrate is smaller than a thickness of the second electrode terminal from a surface of the circuit board;
The adhesive is formed by laminating a first adhesive layer and a second adhesive layer,
The first adhesive layer includes conductive particles,
The thickness of the first adhesive layer is larger than the diameter of the conductive particles,
The first adhesive layer has a higher adhesive strength to the one substrate than the second adhesive layer,
The second adhesive layer has a higher adhesive strength to the circuit board than the first adhesive layer,
The first adhesive layer is adhered to the one substrate,
The second adhesive layer is adhered to the circuit board;
A liquid crystal device characterized by the above-mentioned. In a liquid crystal device including a pair of substrates that sandwich liquid crystal and a semiconductor element adhered to one of the pair of substrates,
A first electrode terminal formed on the one substrate, and a second electrode terminal formed on the semiconductor element;
A thickness of the first electrode terminal from a surface of the one substrate is smaller than a thickness of the second electrode terminal from a surface of the semiconductor element;
The adhesive is formed by laminating a first adhesive layer and a second adhesive layer,
The first adhesive layer includes conductive particles,
The thickness of the first adhesive layer is larger than the diameter of the conductive particles,
The first adhesive layer has a higher adhesive strength to the one substrate than the second adhesive layer,
The second adhesive layer has a higher adhesive force to the semiconductor element than the first adhesive layer,
The first adhesive layer is adhered to the one substrate,
The second adhesive layer is adhered to the semiconductor element;
A liquid crystal device characterized by the above-mentioned. 4. The liquid crystal device according to claim 2, wherein the first electrode terminal is a transparent conductive film, and the second electrode terminal is a metal film. An electronic device using the adhesive structure according to claim 1 or 2. An electronic apparatus using the liquid crystal device according to claim 3.

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