CN210298180U - Electronic circuit board and electronic equipment - Google Patents
Electronic circuit board and electronic equipment Download PDFInfo
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- CN210298180U CN210298180U CN201920735205.2U CN201920735205U CN210298180U CN 210298180 U CN210298180 U CN 210298180U CN 201920735205 U CN201920735205 U CN 201920735205U CN 210298180 U CN210298180 U CN 210298180U
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Abstract
An embodiment of the present application provides an electronic circuit board and an electronic device, the electronic circuit board includes: the electronic device comprises a first substrate, a first insulating layer and a metal layer, wherein an electronic element is arranged on the first substrate; the first insulating layer covers the electronic element and is attached to the top of the electronic element; the metal layer covers the first insulating layer, and the first insulating layer is located between the metal layer and the electronic element. By attaching the first insulating layer to the top of the electronic component, the overall height of the electronic circuit board can be reduced.
Description
Technical Field
The application relates to the technical field of electronics, in particular to an electronic circuit board and electronic equipment.
Background
Along with the development of electronic products, consumers have higher requirements on functions, performance and appearance of the electronic products, so that the area of an electronic circuit board (PCB) in the electronic products is smaller and smaller, more and more devices are arranged on the PCB, the overall height of the PCB is higher and higher, and the internal space of the electronic equipment is occupied.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an electronic circuit board and electronic equipment, can reduce the overall height of electronic circuit board, occupy less electronic equipment inner space.
An electronic circuit board comprising:
a first substrate on which an electronic element is disposed;
the first insulating layer covers the electronic element and is attached to the top of the electronic element;
the metal layer covers the first insulating layer, and the first insulating layer is located between the metal layer and the electronic element.
An electronic device comprises a shell and an electronic circuit board, wherein the electronic circuit board is arranged in the shell, and the electronic circuit board is as the electronic circuit board.
The electronic circuit board and the electronic equipment in the embodiment of the application are attached to the top of the electronic element through the first insulating layer, and the metal layer is arranged outside the first insulating layer, so that the overall height of the whole PCB can be reduced, and the shielding effect can be achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic view of a first structure of an electronic circuit board according to an embodiment of the present disclosure.
Fig. 2 is a schematic view of a second structure of an electronic circuit board according to an embodiment of the present application.
Fig. 3 is a schematic view of a third structure of an electronic circuit board according to an embodiment of the present application.
Fig. 4 is a schematic diagram of a fourth structure of the electronic circuit board according to the embodiment of the present application.
Fig. 5 is a schematic diagram of a fifth structure of an electronic circuit board according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a sixth structure of an electronic circuit board according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a first state of an electronic device according to an embodiment of the present application.
Fig. 8 is another schematic structural diagram of the first state of the electronic device according to the embodiment of the present application.
Fig. 9 is a schematic structural diagram of a second state of an electronic device according to an embodiment of the present application.
Fig. 10 is another schematic structural diagram of a second state of an electronic device according to an embodiment of the present application.
Detailed Description
Referring to the drawings, wherein like reference numbers refer to like elements, the principles of the present invention are illustrated as being implemented in a suitable computing environment. The following description is based on illustrated embodiments of the invention and should not be taken as limiting the invention with regard to other embodiments that are not detailed herein.
The embodiment of the application provides an electronic circuit board and electronic equipment. The details will be described below separately. The electronic device may be a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), VR glasses, or the like. The following is a detailed description of the analysis.
Referring to fig. 1, fig. 1 is a schematic view of a first structure of an electronic circuit board according to an embodiment of the present disclosure, in which an electronic circuit board 100 includes a first substrate 101, a first insulating layer 103, and a metal layer 104.
The electronic element 102 is disposed on the first substrate 101, the first substrate 101 is disposed with a pad, the electronic element 102 can be fixed on the first substrate 101 through the pad on the first substrate, the first insulating layer 103 covers the electronic element 102 and is attached to the top of the electronic element 102, the first insulating layer 103 can be an insulating material, such as a plastic insulating material, and the first insulating layer 103 can cover the electronic element 102 and is attached to the top of the electronic element 102 through a plastic molding process. The metal layer 104 covers the first insulating layer 103, the metal layer 104 is a shielding metal for shielding interference of an external signal to the electronic element 102, the metal layer may be covered on the first insulating layer 103 through a gold plating process, a spraying process, or the like, and the first insulating layer 103 is located between the metal layer 104 and the electronic element 102.
The thickness of the first insulating layer can be controlled within the range of 0.05mm-0.3mm through a plastic package process, the thickness of the first insulating layer can also be controlled within the range of 0.1mm-0.2mm, the thinnest thickness of the first insulating layer can be set to be 0.05mm, the thickness of the first insulating layer can be extremely controlled to be thin through a metal layer formed through a gold melting process, micron-sized thickness can be achieved, and the thickness can be ignored.
In some embodiments, the insulating material may also be resin, and the resin covers the electronic component 102 and is attached to the top of the electronic component 102 by a mold filling process or the like.
The insulating material may also be a curing adhesive, which is applied to cover the electronic component 102 by uv curing or the like, and is attached to the top of the electronic component 102.
Referring to fig. 2, fig. 2 is a schematic view of a second structure of an electronic circuit board according to an embodiment of the present disclosure, in which the electronic circuit board 100 may also include a first substrate 101, a first insulating layer 103, and a metal layer 104.
The first substrate 101 is provided with a plurality of electronic elements 102, the electronic elements 102 are a plurality of electronic elements 102 with different heights, the first insulating layer 103 covers the electronic elements 102 with different heights, the first insulating layer 103 is attached to the top of the electronic element 102 with the highest height in the electronic elements 102 with different heights, the first insulating layer 103 can be made of an insulating material, such as a plastic insulating material, the metal layer 104 covers the first insulating layer 103, the metal layer 104 is a shielding metal for shielding interference of external signals on the electronic elements 102, the metal layer can be covered on the first insulating layer 103 through a gold plating process, and the first insulating layer 103 is located between the metal layer 104 and the electronic elements 102.
Wherein, a heat dissipation material can be filled between the first insulating layer 103 and the electronic element 102 for heat dissipation of the electronic element. The heat dissipation material can be used for heat dissipation with high heat conductivity coefficient, such as graphene. The heat dissipation material may also be a material filled with heat dissipation particles, for example, the heat dissipation material includes a first material and a second material, the first material has a lower heat dissipation coefficient, the first material has a plurality of holes, such as nano holes or other holes, and the holes are filled with heat dissipation particles with a high heat dissipation coefficient.
Referring to fig. 3, fig. 3 is a schematic view of a third structure of an electronic circuit board according to an embodiment of the present disclosure, in which the electronic circuit board 100 may also include a first substrate 101, a first insulating layer 103, and a metal layer 104.
The first substrate 101 is provided with a plurality of electronic elements 102, the electronic elements 102 are a plurality of electronic elements 102 with different heights, the first insulating layer 103 covers the electronic elements 102 with different heights, the first insulating layer 103 is attached to the tops of the electronic elements 102 with different heights, the first insulating layer 103 can be made of an insulating material, such as a plastic insulating material, the metal layer 104 covers the first insulating layer 103, the metal layer 104 is a shielding metal for shielding the interference of external signals to the electronic elements 102, the metal can be covered on the first insulating layer 103 through a gold plating process, and the first insulating layer 103 is located between the metal layer 104 and the electronic elements 102. With this structure, the volume of the electronic circuit board can be further reduced.
Wherein, a heat dissipation material may be filled between the first insulating layer 103 and the electronic element 102. The heat dissipation material may be the heat dissipation material of the above embodiments, and is not described herein again.
Referring to fig. 4, fig. 4 is a schematic view of a fourth structure of the electronic circuit board according to the embodiment of the present disclosure, in this embodiment, the electronic circuit board 100 may also include a first substrate 101, a first insulating layer 103, and a metal layer 104.
The first substrate 101 is provided with an electronic element 102, a first insulating layer 103 is attached to a top of the electronic element 102, the first insulating layer 103 covers a surface of the electronic element 102 and a periphery of the electronic element 102, the first insulating layer 103 may be an insulating material, such as a plastic insulating material, the metal layer 104 covers the first insulating layer 103, the metal layer 104 is a shielding metal for shielding interference of external signals to the electronic elements 102, the metal layer 103 may be covered on the first insulating layer 103 by a gold plating process, and the first insulating layer 103 is located between the metal layer 104 and the electronic elements 102. With this structure, the volume of the electronic circuit board can be further reduced.
Referring to fig. 5, fig. 5 is a schematic view of a fifth structure of an electronic circuit board according to an embodiment of the present disclosure, in which the electronic circuit board 100 may also include a first substrate 101, a first insulating layer 103, and a metal layer 104.
The first substrate 101 is provided with electronic elements 102, a first insulating layer 103 is attached to the top of the electronic elements 102, the first insulating layer 103 covers the surface of the electronic elements 102 and covers the periphery of the electronic elements 102, the first insulating layer 103 is filled between the electronic elements 102, the first insulating layer 103 may be an insulating material, such as a plastic insulating material, the metal layer 104 covers the first insulating layer 103, the metal layer 104 is a shielding metal for shielding the interference of external signals to the electronic elements 102, the metal may be covered on the first insulating layer 103 through a gold plating process, and the first insulating layer 103 is located between the metal layer 104 and the electronic elements 102.
Wherein the thermal conductivity of the first insulating layer 103 is greater than that of air. The first insulating layer is made of plastic, resin, curing adhesive, etc., and covers the electronic component, so that when the electronic component generates heat, the heat is directly conducted to the outside through the first insulating layer, for example, when the first insulating layer is a plastic packaging layer, the first insulating layer is attached to the electronic component through the plastic packaging layer, and when the electronic component generates heat, the heat is conducted away through heat conduction, so as to improve the heat dissipation effect. Then, the heat is transmitted to the outside through the shielding case, so that the heat dissipation speed is low, the heat dissipation effect is poor, and the heat dissipation effect of the electronic element can be enhanced through the embodiment.
In some embodiments, the material of the first insulating layer may also be a heat dissipation material having a plurality of nanoscale heat dissipation holes, so as to further enhance the heat dissipation effect of the electronic component.
The material of the first insulating layer can also be an insulating medium filled with heat dissipation particles, so that the heat dissipation effect of the electronic element is further enhanced.
Referring to fig. 6, fig. 6 is a schematic diagram of a sixth structure of an electronic circuit board according to an embodiment of the present disclosure, in which the electronic circuit board further includes a second substrate 201 and a second insulating layer 202.
The second substrate 201 is disposed on a side of the first substrate 101 away from the electronic element 102, the second substrate 201 is connected to the first substrate 101 through a second insulating layer 202, and the electronic element 102 is disposed between the second substrate 201 and the second insulating layer 202.
The first substrate 101 includes a first portion and a second portion 203, the first insulating layer 103 covers the first portion, the second portion 203 is a portion not covered by the first insulating layer 103, the second portion 203 surrounds the first portion, and the second portion 203 is covered with a film, since the portion not covered by the first insulating layer is exposed to the outside, there is a certain probability that the portion is damaged by outside air, moisture, and dust, the second portion 203 can be covered with a protective film, which can protect the second portion 203 from being damaged by outside factors.
The structure is a stacked structure of PCBs, and in order to put more electronic components in a certain area, the height of the PCBs needs to be increased. In the related art, the electronic component on the top layer generally stops the interference of the external signal to the electronic component through the metal shielding cover, because the material of the shielding cover is copper or other metals or metal alloys, and the surface of some electronic components can have a metal shell, a certain distance needs to exist between the shielding cover and the electronic component, thereby avoiding the influence of the shielding cover on the electronic component, the whole height of the existing PCB is at least the thickness of the second substrate + the thickness of the second insulating layer + the thickness of the first substrate + the height of the shielding cover, because a certain distance needs to exist between the shielding cover and the electronic component, which is at least 0.1mm, the shielding cover needs to be made high, and the material of the shielding cover is metal such as aspen copper, the thickness of the shielding cover is at least 0.2-0.4 mm, the height of the electronic component is at least 0.2mm, thereby the shielding cover can be at least 0.5mm, and the electronic circuit board provided by the, the height of the PCB is the thickness of the second substrate, the thickness of the second insulating layer, the thickness of the first substrate, the height of the electronic element, the thickness of the first insulating layer, the thickness of the electronic element and the thickness of the metal layer are at least 0.2mm and at least 0.05mm, and the metal layer is plated with the first insulating layer through a gold plating process, so that the metal layer is extremely thin and can be in a micron order, and the thickness can be ignored, therefore, the height of the electronic element, the thickness of the first insulating layer and the thickness of the metal layer can be 0.205mm, the height of the PCB electronic circuit board can be reduced by at least 0.295mm, and for electronic equipment, such as a mobile phone, the reduction of the height of the electronic circuit board is vital, and even 0.1mm is extremely important for the electronic equipment which tends to be light and thin and is.
It should be noted that a plurality of second substrates may be disposed on a side of the first substrate away from the electronic component, each second substrate is connected to an adjacent second substrate through a second insulating layer, and each second substrate is provided with the electronic component.
Through the embodiment that this application provided, cover in electronic component through first insulating layer, and laminate with the electronic component top, then cover the metal level on the first insulating layer, can save the shielding lid, thereby save the shielding lid to electronic component's distance height, it is near and reduce whole PCB's thickness, can reach the shielded effect again, make the cell-phone tend to frivolousization, and laminate with electronic component through first insulating layer, directly conduct away the heat that electronic component produced through heat-conduction, improve electronic component's radiating effect.
The electronic circuit board can be manufactured by the following method, firstly, the electronic element is fixed on the first substrate in a welding mode, after the fixing is finished, the electronic element is subjected to plastic packaging through a jig and plastics, the plastic packaging effect can be achieved in a thermoplastic or cold plastic mode, the plastic layer after the plastic packaging is used as a first insulating layer, and the first insulating layer covers the electronic elements and is attached to the tops of the electronic elements. The distance between the top of the highest electronic element in the plurality of electronic elements and the surface of the first insulating layer is controlled within 0.05 mm-0.2 mm. And after plastic packaging is finished, carrying out chemical gold plating on the outer surface of the first insulating layer, wherein the chemical gold plating refers to chemical gold plating, an external power supply is not needed through a chemical gold plating process, a chemical reduction reaction is carried out only by a plating solution, so that a metal layer is formed on the outer surface of the first insulating layer, and metal ions can form the metal layer on the outer surface of the first insulating layer under the action of direct current through an electroplating process. And (3) pasting a film on the area without plastic packaging, protecting the area without plastic packaging from being influenced by the outside, and preventing water, dust and corrosion.
The electronic circuit board can be manufactured by a method that, firstly, for the divided regions of the electronic circuit board, each different region corresponds to a different mold, plastic is covered on a plurality of electronic elements in an injection molding mode, the plastic layer after injection molding is used as a first insulating layer, the height of the first insulating layer is controlled by the molds, and the first insulating layer is attached to the tops of the electronic elements. And after the injection molding is finished, the mold is taken away, the outer surface of the first insulating layer is subjected to chemical gold plating, the chemical gold plating refers to chemical gold plating, an external power supply is not needed through a chemical gold plating process, a chemical reduction reaction is carried out only through a plating solution, so that a metal layer is formed on the outer surface of the first insulating layer, and metal ions can form the metal layer on the outer surface of the first insulating layer under the action of direct current through an electroplating process. And (3) pasting a film on the area without injection molding, protecting the area without injection molding from being influenced by the outside, and preventing water, dust and corrosion. In the injection molding process, the distance from the top of the highest electronic element in the plurality of electronic elements to the surface of the first insulating layer can be controlled within 0.05 mm-0.2mm through a pressing process.
The electronic circuit board can be manufactured by a method that firstly, curing adhesive is covered on the surfaces of a plurality of electronic elements on a first substrate and is attached to the surfaces of the electronic elements, the distance from the top of the electronic element with the highest height in the electronic elements to the surface of a first insulating layer is controlled within 0.05 mm-0.2mm by pressing, then the curing adhesive is cured and formed by a lamp and the like, the cured adhesive layer is used as a first insulating layer, after the curing, gold melting is carried out on the outer surface of the first insulating layer, the gold melting refers to chemical gold plating, an external power supply is not needed by a gold melting process, a chemical reduction reaction is carried out by a plating solution, a metal layer is formed on the outer surface of the first insulating layer, and metal ions can form the metal layer on the surface of the first insulating layer under the action of direct current by an electroplating process. And pasting a film on the area which is not covered with the curing adhesive, wherein the film is used for protecting the uncovered area from being influenced by the outside and is used for preventing water, dust and corrosion.
Referring to fig. 7 to 10, fig. 7 is a schematic structural diagram of a first state of an electronic device according to an embodiment of the present disclosure, fig. 8 is another schematic structural diagram of the first state of the electronic device according to the embodiment of the present disclosure, fig. 9 is a schematic structural diagram of a second state of the electronic device according to the embodiment of the present disclosure, and fig. 10 is another schematic structural diagram of the second state of the electronic device according to the embodiment of the present disclosure. The first state may be a state in which the electronic device 100 does not turn on the camera function, such as a standby state and a state in which the camera is not turned on when the screen is bright. The second state is a state when the electronic device 100 turns on the image capturing function.
In this embodiment, the electronic device 100 may include a display 12, an electronic circuit board 13, a battery 14, a housing 15, a front camera 161, and a rear camera 162. Note that the electronic apparatus 100 is not limited to the above.
In some embodiments, the electronic device 100 may further include a sliding device coupled to the housing, the sliding device being slidable relative to the housing. The front camera 161 and the rear camera 162 are provided on the slide device on opposite sides, respectively.
When the electronic equipment is in the first state, and the sliding device is in the initial state, the sliding device is positioned in the shell. When the electronic device is in the second state and the camera function is turned on, the sliding mechanism slides out of the housing 15, and the sliding mechanism is provided with a front camera 161 and a rear camera 162. When the slide mechanism does not slide out of the housing 15, the front camera 161 and the rear camera 162 are hidden in the housing, and the electronic apparatus 100 is in the second state. When the slide mechanism slides out of the housing 15, photographing, image pickup, and the like can be performed using the front camera 161 and the rear camera 162.
Wherein the display screen 12 is mounted in the housing 15. The display 12 is electrically connected to the electronic circuit board 13 to form a display surface of the electronic apparatus 100. The display 12 may be in a regular shape, such as a rectangular parallelepiped structure, and the display 12 may cover the entire display surface of the electronic device 100, that is, a full screen display of the electronic device 100 is realized.
In some embodiments, the Display 12 may be a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display.
The electronic circuit board 13 is mounted in the housing 15, the electronic circuit board 13 may be a main board of the electronic device 100, and one, two or more functional components of a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, a front camera 161, a rear camera 162, a receiver 171, a distance sensor, an ambient light sensor, a processor, and the like may be integrated on the electronic circuit board 13. It is noted that, in the description of the present application, "a plurality" means two or more unless specifically defined otherwise.
In some embodiments, the electronic circuit board 13 may be screwed into the housing 15 by screws, or may be snap-fit into the housing 15. It should be noted that the way of specifically fixing the electronic circuit board 13 in the housing 15 according to the embodiment of the present application is not limited to this, and other ways, such as a way of fixing by a snap and a screw together, are also possible.
The electronic device 100 may further include a cover plate mounted to the display 12 to cover the display 12. The cover may be a clear glass cover so that the display 12 is transparent to the cover for display. In some embodiments, the cover plate may be a glass cover plate made of a material such as sapphire.
The electronic circuit board may be a Printed Circuit Board (PCB). The electronic circuit board includes: a first substrate on which an electronic element is disposed; the first insulating layer covers the electronic element and is attached to the top of the electronic element; the metal layer covers the first insulating layer, and the first insulating layer is located between the metal layer and the electronic element. By attaching the first insulating layer to the top of the electronic component, the overall height of the electronic circuit board can be reduced.
It should be noted that in the description of the present application, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
The electronic circuit board and the electronic device provided by the embodiment of the invention are described in detail, and the principle and the embodiment of the invention are explained by applying specific examples, and the description of the embodiment is only used for helping understanding the invention. Meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. An electronic circuit board, comprising:
a first substrate on which an electronic element is disposed;
the first insulating layer covers the electronic element and is attached to the top of the electronic element;
the metal layer covers the first insulating layer, and the first insulating layer is located between the metal layer and the electronic element.
2. The electronic circuit board according to claim 1, wherein the electronic component is a plurality of electronic components having different heights, and the first insulating layer is attached to a top portion of a highest electronic component among the plurality of electronic components having different heights.
3. The electronic circuit board according to claim 1, wherein the electronic component is a plurality of electronic components having different heights, and tops of the plurality of electronic components having different heights are bonded to the first insulating layer.
4. The electronic wiring board of claim 1, wherein the first insulating layer covers a peripheral edge of the electronic component.
5. The electronic circuit board of claim 1, wherein the electronic component is a plurality of electronic components, and the first insulating layer is filled between the plurality of electronic components.
6. The electronic circuit board of any of claims 1-5, wherein the first insulating layer has a thermal conductivity greater than that of air.
7. The electronic circuit board according to claim 1, further comprising a second substrate located on a side of the first substrate facing away from the electronic component, the second substrate being connected to the first substrate through a second insulating layer, and the electronic component being disposed between the second substrate and the second insulating layer.
8. The electronic circuit board of claim 7, wherein the first substrate includes a first portion and a second portion, the first insulating layer covering the first portion;
the electronic circuit board further comprises a thin film layer, and the thin film layer covers the second portion.
9. The electronic circuit board of claim 8, wherein the second portion surrounds the first portion.
10. An electronic device comprising a housing and an electronic circuit board disposed in the housing, the electronic circuit board being according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920735205.2U CN210298180U (en) | 2019-05-20 | 2019-05-20 | Electronic circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920735205.2U CN210298180U (en) | 2019-05-20 | 2019-05-20 | Electronic circuit board and electronic equipment |
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| CN210298180U true CN210298180U (en) | 2020-04-10 |
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| CN201920735205.2U Active CN210298180U (en) | 2019-05-20 | 2019-05-20 | Electronic circuit board and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397669A (en) * | 2020-11-26 | 2021-02-23 | 上海天马有机发光显示技术有限公司 | Display module, manufacturing method thereof and display device |
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2019
- 2019-05-20 CN CN201920735205.2U patent/CN210298180U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397669A (en) * | 2020-11-26 | 2021-02-23 | 上海天马有机发光显示技术有限公司 | Display module, manufacturing method thereof and display device |
| CN112397669B (en) * | 2020-11-26 | 2024-01-23 | 武汉天马微电子有限公司 | Display module, manufacturing method thereof and display device |
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