CN112397669A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN112397669A CN112397669A CN202011351799.0A CN202011351799A CN112397669A CN 112397669 A CN112397669 A CN 112397669A CN 202011351799 A CN202011351799 A CN 202011351799A CN 112397669 A CN112397669 A CN 112397669A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a display module, a manufacturing method thereof and a display device, and belongs to the technical field of display, wherein the display module comprises a substrate, a circuit layer and a packaging composite layer, the packaging composite layer comprises an insulating film and a hot melt adhesive, and the insulating film is positioned on one side of the hot melt adhesive, which is far away from the substrate; the hot melt adhesive comprises a first surface and a second surface, wherein the first surface is far away from one side of the substrate, the second surface is close to one side of the substrate, the first surface is fixedly attached to the insulating film, the second surface is of a concave-convex structure, the shape of the second surface is matched with the shape of the surface, far away from one side of the substrate, of the circuit layer, and the hot melt adhesive covers an element of the circuit layer. The manufacturing method of the display module is used for manufacturing the display module. The display device comprises a display panel and the display module which are electrically connected. The invention is beneficial to increasing the attaching area of the circuit layer and the packaging composite layer, and the insulating film of the packaging composite layer is not easy to fall off under the design structure of the hot melt adhesive, thereby being beneficial to improving the yield of products and improving the display reliability.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a manufacturing method of the display module and a display device.
Background
In recent years, with the technical development of personal smart terminal devices and wearable devices, the demand for flat panel displays has been more and more diversified. Such as organic light emitting diode displays, electrophoretic displays, liquid crystal displays, and the like. As a new generation of display technology, an OLED (Organic Light-Emitting Diode) display panel has advantages of low power consumption, high color gamut, high brightness, high resolution, wide viewing angle, high response speed, and the like, and is therefore popular in the market. In the prior art, the product yield is often affected due to the limitation of the process or the manufacturing material in the manufacturing process of the display screen, so that the product reliability does not meet the process requirement.
Therefore, it is an urgent need to solve the technical problems of the art to provide a stable and reliable display module, a method for manufacturing the same, and a display device to improve the yield and display quality of products.
Disclosure of Invention
In view of the above, the present invention provides a display module, a manufacturing method thereof and a display device, so as to solve the problems of low yield of the manufacturing process and influence on the reliability of the product in the prior art.
The invention discloses a display module, comprising: a substrate; the circuit layer is positioned on one side of the substrate and at least comprises two elements with different heights; the packaging composite layer is positioned on one side of the circuit layer, which is far away from the substrate; the packaging composite layer comprises an insulating film and a hot melt adhesive, wherein the insulating film is positioned on one side of the hot melt adhesive, which is far away from the substrate; the hot melt adhesive comprises a first surface and a second surface, wherein the first surface is far away from one side of the substrate, the second surface is close to one side of the substrate, the first surface is fixedly attached to the insulating film, the second surface is of a concave-convex structure, the shape of the second surface is matched with the shape of the surface, far away from one side of the substrate, of the circuit layer, and the hot melt adhesive covers an element of the circuit layer.
Based on the same inventive concept, the invention also discloses a manufacturing method of the display module, the manufacturing method is used for manufacturing the display module, and the manufacturing method comprises the following steps: providing a substrate, and manufacturing a circuit layer on one side of the substrate, wherein the circuit layer at least comprises two elements with different heights; providing a mould, wherein the mould comprises a third surface, and the shape of the third surface is the same as that of the surface of the circuit layer on the side far away from the substrate; providing an insulating film, and attaching an original hot melt adhesive to one side of the insulating film, which is close to the substrate, wherein the original hot melt adhesive is of a plate-shaped structure; covering the insulating film attached with the original hot melt adhesive on the third surface of the mold, and heating and pressing the insulating film attached with the original hot melt adhesive to melt the original hot melt adhesive to fill the third surface of the mold; cooling and shaping the insulating film attached with the original hot melt adhesive, and then taking down the insulating film to obtain a packaging composite layer, wherein the packaging composite layer comprises the insulating film and the shaped hot melt adhesive, and the shape of the surface of one side of the hot melt adhesive is the same as that of the surface of the circuit layer, which is far away from the substrate; the packaging composite layer and the circuit layer are mutually embedded and fixed.
Based on the same invention concept, the invention also discloses a display device which comprises a display panel and the display module which are electrically connected.
Compared with the prior art, the display module, the manufacturing method thereof and the display device provided by the invention at least realize the following beneficial effects:
the display module comprises an encapsulation composite layer, wherein a hot melt adhesive of the encapsulation composite layer comprises a first surface far away from one side of a substrate and a second surface close to one side of the substrate, the first surface is fixedly attached to an insulating film, the second surface of the hot melt adhesive is of a concave-convex structure, the concave-convex structure can be formed by prefabricating and shaping a die, and the shape of the second surface is matched with that of the surface of the circuit layer far away from the substrate, so that the hot melt adhesive covers all elements of the circuit layer. The hot melt adhesive comprises a second surface of a concave-convex structure matched with the surface of one side, far away from the substrate, of the circuit layer, and the packaging composite layer formed by the bonding of the insulating film and the hot melt adhesive can be prefabricated and shaped according to the surface shape of the circuit layer, so that the circuit layer and the packaging composite layer can be directly bonded in the process of manufacturing, other positioning designs are not needed, and the time and the speed are saved. The clearance that the component can be filled up to the concave convex column structure's of hot melt adhesive second surface is favorable to increasing the attached area of circuit layer and encapsulation composite bed, under this kind of project organization of hot melt adhesive, can make the insulating film of encapsulation composite bed be difficult for droing, is favorable to improving the product yield, promotes and shows the reliability.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic plan view of a display module according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view taken along line A-A' of FIG. 1;
FIG. 3 is a schematic structural view of the packaging laminate of FIG. 2;
FIG. 4 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;
FIG. 5 is a schematic view of the substrate, the circuit layer, and the liquid fluoride layer shown in FIG. 4;
FIG. 6 is a schematic cross-sectional view taken along line B-B' of FIG. 1;
FIG. 7 is a schematic view of another cross-sectional structure taken along line B-B' of FIG. 1;
fig. 8 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a circuit layer formed on a substrate;
FIG. 10 is a schematic structural view of a provided mold;
FIG. 11 is a schematic structural diagram of an insulating film with an original hot melt adhesive applied to a side thereof adjacent to a substrate;
FIG. 12 is a schematic view of the structure in which the insulating film with the original hot melt adhesive attached thereto is not yet applied to the third surface of the mold;
FIG. 13 is a schematic view of the structure of the third surface of the mold filled with the insulation film with the original hot melt adhesive attached thereto after heating and pressing;
FIG. 14 is a schematic structural view of the resulting packaging composite layer;
FIG. 15 is a schematic structural diagram of a display module fabricated by the fabrication method of the present embodiment;
FIG. 16 is a block diagram illustrating a manufacturing method of another display module according to an embodiment of the present invention;
fig. 17 is a schematic view showing a structure in which a layer of fluoride liquid is applied after a circuit layer is formed on one side of a substrate;
FIG. 18 is a block diagram illustrating a manufacturing method of another display module according to an embodiment of the present invention;
FIG. 19 is a schematic structural view of a vent hole formed after the packaging laminate is formed;
fig. 20 is a schematic plan view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the related art, each sub-pixel in the display panel needs to be connected with a driving circuit so that each sub-pixel can realize the display function. The driving Circuit is generally Integrated on an IC (Integrated Circuit), a Flexible Printed Circuit (FPC), a Printed Circuit Board (PCB), and directly bonded to the display panel to provide driving signals for each sub-pixel of the display panel. A large number of electronic components are required to be integrated on the driving chip or the flexible circuit board. When a driving chip or a flexible circuit board is packaged, the insulating film is adhered to the surface of a device to play a role in insulating protection, and due to the fact that the size and the height of electronic components of different types and models are possibly different, the surface of the device is prone to being uneven, the adhesion of the insulating film is blocked, the adhesion is prone to being insecure, and then the electronic components fall off in the subsequent processing procedure, and the yield and the reliability of products are affected.
Based on the problems, the application provides a display module, a manufacturing method thereof and a display device, which can enable an insulating film on a driving chip or a flexible circuit board to be difficult to fall off, improve the yield of products and improve the display reliability. The display module, the manufacturing method thereof, and the display device according to the embodiments of the present disclosure are described in detail as follows.
Referring to fig. 1 to fig. 3, fig. 1 is a schematic plan view illustrating a display module according to an embodiment of the present invention, fig. 2 is a schematic sectional view taken along a direction a-a' in fig. 1, fig. 3 is a schematic structural view illustrating an encapsulation composite layer in fig. 2, and a display module 000 according to an embodiment of the present invention includes:
a substrate 10;
a circuit layer 20, wherein the circuit layer 20 is positioned on one side of the substrate 10, and the circuit layer 20 at least comprises elements 201 with two different heights; it will be understood that the height of the element 201 refers to its height in a direction Z perpendicular to the plane of the substrate 10;
the packaging composite layer 30, the packaging composite layer 30 is positioned on one side of the circuit layer 20 far away from the substrate 10;
the packaging composite layer 30 comprises an insulating film 301 and a hot melt adhesive 302, wherein the insulating film 301 is positioned on one side of the hot melt adhesive 302 away from the substrate;
the hot melt adhesive 302 comprises a first surface 302A at the side far away from the substrate 10 and a second surface 302B at the side close to the substrate 10, the first surface 302A is fixedly attached to the insulating film 301, the second surface 302B is in a concave-convex structure, the shape of the second surface 302B is matched with the shape of the surface (understood as the surface formed by the elements 201 and the gaps) at the side far away from the substrate 10 of the circuit layer 20, and the hot melt adhesive 302 covers the elements 201 of the circuit layer 20.
Specifically, the display module 000 provided in this embodiment includes a substrate 10, the substrate 10 may be a carrier for carrying other components, the substrate 10 may be a metal-based heat dissipation plate (such as an aluminum substrate, a copper substrate, or an iron substrate), and is a unique metal-based copper clad plate having good thermal conductivity, electrical insulation performance, and machining performance, and may also be a substrate made of a flexible base material such as Polyimide (PI, Polyimide), which has many advantages that a rigid printed circuit board does not have, for example, it may be freely bent, wound, and folded, and is widely applied in the fields or products of aerospace, military, mobile communication, laptop, computer peripheral, PDA, digital camera, and the like. The circuit layer 20 on one side of the substrate 10 is used for integrally arranging a plurality of components 201, and optionally, a surface mount device (SMC or SMD, SMC refers to a surface mount device and mainly refers to some passive components such as resistors and inductors, which do not need to have polarization, and SMD refers to a surface mount device and mainly refers to active components such as capacitors, which need to have positive and negative polarities) may be mounted on the surface of the substrate 10 by SMT surface mount technology, and the circuit layer 20 is formed by soldering or dip soldering. Since each of the components 201 may include different types of components, and the volume size and height thereof may be different, that is, the circuit layer 20 may include at least two components 201 with different heights, where the height of the component 201 refers to the height thereof in the direction Z perpendicular to the plane of the substrate 10, and the surface of the circuit layer 20 on the side away from the substrate 10 is likely to be an uneven surface. One side of the circuit layer 20 far away from the substrate 10 is provided with an encapsulation composite layer 30, the encapsulation composite layer 30 comprises an insulating film 301 and a hot melt adhesive 302, the hot melt adhesive 302 plays a role in adhering the insulating film 301 to the circuit layer 20, and the insulating film 301 plays a role in encapsulating the element 201 on the insulating protective circuit layer 20. The hot melt adhesive 302 provided by this embodiment includes a first surface 302A on a side away from the substrate 10 and a second surface 302B on a side close to the substrate 10, where the first surface 302A is fixedly attached to the insulating film 301, and optionally, the first surface 302A may have a planar structure matching with the surface of the insulating film 301, so as to better attach to the insulating film 301; the second surface 302B of the hot melt adhesive 302 is a concave-convex structure, which can be formed by mold pre-forming, and the shape of the second surface 302B matches the shape of the surface of the circuit layer 20 on the side away from the substrate 10 (it can be understood that the concave-convex surface is formed by the elements 201 and the gaps), so that the hot melt adhesive 302 covers the elements 201 of the circuit layer 20. The hot melt adhesive 302 that this embodiment provided includes the concave-convex structure's that the surface matches with circuit layer 20 is far away from base plate 10 one side second surface 302B, the encapsulation composite layer 30 that insulating film 301 and hot melt adhesive 302 laminating constitute can be according to the prefabricated design of the surface shape of circuit layer 20, thereby can directly attach circuit layer 20 and encapsulation composite layer 30 in the processing procedure process, need not to do other location designs again, time saving is swift, the second surface 302B of the concave-convex structure of hot melt adhesive 302 can fill the clearance of full component 201, be favorable to increasing circuit layer 20 and encapsulation composite layer 30's attached area, under this kind of project organization of hot melt adhesive 302, can make encapsulation composite layer 30's insulating film 301 be difficult for droing, be favorable to improving the product yield, promote and show the reliability.
It should be noted that the display module 000 of this embodiment may be any one of an Integrated Circuit (IC) Integrated with a driving Circuit, a Flexible Printed Circuit (FPC), a Printed Circuit Board (PCB), and the like, and is used to be directly bound and electrically connected to the display panel to provide driving electrical signals for each sub-pixel of the display panel, so as to implement a display function. The present embodiment only exemplifies the structure of the display module 000, and in specific implementation, the structure of the display module 000 is not limited thereto, and may also include other structures capable of integrating a driving Circuit, which can be understood with reference to the structures of an IC (Integrated Circuit, driver chip, Integrated Circuit), a FPC (Flexible Printed Circuit Board), and a PCB (Printed Circuit Board) in the related art, which is not described in detail in the present embodiment.
In some optional embodiments, referring to fig. 1, fig. 4, and fig. 5 in combination, fig. 4 is another cross-sectional structure schematic view along a direction of a-a' in fig. 1, and fig. 5 is a structure schematic view of the substrate, the circuit layer, and the liquid fluoride layer in fig. 4, in which the display module 000 in this embodiment includes the substrate 10, the circuit layer 20, the encapsulation composite layer 30, and the liquid fluoride layer 40 is coated on a surface of the circuit layer 20 on a side away from the substrate 10.
This embodiment explains that the circuit layer 20 in the display module group 000 is far away from the surperficial liquid layer 40 that can also coat fluoride on the base plate 10 one side, the liquid that fluoride of liquid layer 40 is the precision instrument cleaner, be applied to the component 201 precision cleaning on the circuit layer 20, in order to get rid of impurity such as grease, wax, rosin scaling powder, fingerprint sweat stain, granule, and liquid layer 40 that fluoride can be used for the protective coating of circuit layer 20, the surface of the circuit layer 20 of the liquid layer 40 that has been coated leaves the thin transparent film of one deck, play dampproofing, antiseized effect. The cause value of the surface of the fluoride liquid layer 40 (the cause value measures the humidity of the surface, and it can be understood that the side angle of the droplet on the surface of the fluoride liquid layer 40 is measured, and when the droplet of the fluoride liquid layer 40 forms a small bead on the surface, the cause value of the surface of the fluoride liquid layer 40 is low) is low, and the lower the cause value is, the less energy is applied to the surface of the fluoride liquid layer 40, and therefore the surface of the fluoride liquid layer 40 is less likely to be attached to the hot melt adhesive 302, and the insulating film 301 is likely to fall off. Therefore, when the liquid fluoride layer 40 is coated on the surface of the circuit layer 20 in the display module 000 on the side away from the substrate 10, it is desirable that the second surface 302B of the hot melt adhesive 302 be designed to have a relief-like structure that matches the surface of the circuit layer 20 on the side away from the substrate 10, in the process, the circuit layer 20 including the fluorinated liquid layer 40 can be directly attached to the packaging composite layer 30 without other positioning designs, time and speed are saved, the second surface 302B of the concave-convex structure of the hot melt adhesive 302 can be filled in the gap of the element 201, which is beneficial to increasing the attachment area of the circuit layer 20 and the packaging composite layer 30, it is possible to avoid the influence of the low dyne value of the fluoride liquid layer 40 on the attaching effect of the insulating film 301, under this kind of design structure of hot melt adhesive 302, can further make the insulating film 301 of encapsulation composite layer 30 be difficult for droing, better improvement product yield, further promote the display reliability.
In some alternative embodiments, please refer to fig. 1 and fig. 6 in combination, fig. 6 is a schematic cross-sectional view taken along the direction B-B' in fig. 1, in this embodiment, the hot melt adhesive 302 includes a first region M and a second region N disposed around the first region M, and the first region M overlaps with the components 201 of the circuit layer 20 in the direction Z perpendicular to the plane of the substrate 10;
in the second region N, the second surface 302B of the hot melt adhesive 302 is bonded and fixed to the substrate 10.
The embodiment explains that in order to attach and fix the packaging composite layer 30 to the substrate 10 including the circuit layer 20, the hot melt adhesive 302 may be provided with a first region M and a second region N disposed around the first region M, in the direction Z perpendicular to the plane of the substrate 10, the first region M overlaps with the region where the component 201 of the circuit layer 20 is located, and in the second region N, the second surface 302B of the hot melt adhesive 302 is attached and fixed to the substrate 10, so that the gap between the component 201 can be filled with the hot melt adhesive 302 having the second surface 302B with the concave-convex structure, the effect of fixing and attaching the substrate 10, the circuit layer 20 and the insulating film 301 is ensured, and the phenomenon of yield reduction caused by the falling of the insulating film 301 is avoided.
In some alternative embodiments, please refer to fig. 1 and 7 in combination, fig. 7 is a schematic cross-sectional view taken along the direction B-B' in fig. 1, in this embodiment, at least one vent hole 303 is formed in the second surface 302B of the hot melt adhesive 302 within the second region N of the hot melt adhesive 302. Alternatively, the vent holes 303 may be formed at the edges of the hot melt adhesive 302 to be recessed from the second surface 302B in a direction approaching the first surface 302A.
This embodiment further illustrates that, within the second region N of the hot melt adhesive 302, at least one vent hole 303 is formed in the second surface 302B of the hot melt adhesive 302, since, after the completion of the encapsulation of the circuit layer 20 with the encapsulating composite layer 30, there may occur a case where the electrical connection is found unstable at the time of inspecting the performance, therefore, in order to facilitate disassembly during rework detection and repair, the present embodiment is disposed within the second region N of the hot melt adhesive 302, the second surface 302B of the hot melt adhesive 302 is provided with at least one vent hole 303, auxiliary raw materials with freezing function (utilizing the low-temperature characteristic of liquid nitrogen and having the function of freezing and disassembling a separating device) such as liquid nitrogen can be introduced into the joint surface of the hot melt adhesive 302 and the circuit layer 20 through the vent holes 303 to enter the hot melt adhesive 302, furthermore, the package composite layer 30 can be disassembled more quickly and conveniently without damaging the components 201 of the circuit layer 20 as much as possible.
It should be noted that fig. 7 of the present embodiment only illustrates the structure of one vent hole 303, and in the specific implementation, the number of vent holes 303 may be set according to the actual requirement according to the size of the whole display module 000 and the requirement of increasing the detachment speed, and the present embodiment is not limited in particular.
In some optional embodiments, please refer to fig. 1 to 7 and fig. 8 in combination, where fig. 8 is a flow chart of a manufacturing method of a display module according to an embodiment of the present invention, the manufacturing method of a display module 000 according to the embodiment is used for manufacturing the display module 000 according to the embodiment, and the manufacturing method includes:
s01: providing a substrate 10, manufacturing a circuit layer 20 on one side of the substrate 10, wherein the circuit layer 20 at least comprises two elements 201 with different heights, and the height of the element 201 refers to the height of the element in the plane direction Z perpendicular to the substrate 10, as shown in fig. 9, and fig. 9 is a schematic structural diagram of the circuit layer 20 manufactured on the substrate 10;
s02: providing a mold 50, wherein the mold 50 includes a third surface 50A, and the shape of the third surface 50A is the same as the shape of the surface of the circuit layer 20 on the side away from the substrate 10, as shown in fig. 10, and fig. 10 is a schematic structural diagram of the provided mold 50;
s03: providing an insulating film 301, attaching an original hot melt adhesive 302 ' to one side of the insulating film 301 close to the substrate 10, wherein the original hot melt adhesive 302 ' is in a plate-shaped structure, as shown in fig. 11, and fig. 11 is a schematic structural diagram after the original hot melt adhesive 302 ' is attached to one side of the insulating film 301 close to the substrate 10;
s04: covering the insulating film 301 attached with the original hot melt adhesive 302 ' on the third surface 50A of the mold 50, and heating and pressing the insulating film 301 attached with the original hot melt adhesive 302 ', so that the original hot melt adhesive 302 ' is melted to fill the third surface 50A of the mold 50, as shown in fig. 12 and 13, wherein fig. 12 is a schematic structural view of the insulating film 301 attached with the original hot melt adhesive 302 ' not yet covered on the third surface 50A of the mold 50, and fig. 13 is a schematic structural view of the insulating film 301 attached with the original hot melt adhesive 302 ' filled the third surface 50A of the mold 50 after heating and pressing;
s05: cooling and shaping the insulating film 301 attached with the original hot melt adhesive 302', and then taking down the insulating film to obtain the packaging composite layer 30, wherein the packaging composite layer 30 comprises the insulating film 301 and the shaped hot melt adhesive 302, the shape of the surface of one side of the hot melt adhesive 302 is the same as that of the surface of the side of the circuit layer 20 away from the substrate, as shown in fig. 14, and fig. 14 is a schematic structural diagram of the obtained packaging composite layer 30;
s06: the composite packaging layer 30 and the circuit layer 20 are fixed to each other by fitting, as shown in fig. 15, fig. 15 is a schematic structural view of the display module 000 manufactured by the manufacturing method of this embodiment.
Specifically, the method for manufacturing the display module 000 according to the embodiment is used for manufacturing the display module 000 according to the embodiment. The substrate 10 may be provided first, the substrate 10 may be used as a carrier for carrying other components, the substrate 10 may be a metal-based heat dissipation plate (such as an aluminum substrate, a copper substrate, an iron substrate), and is a unique metal-based copper clad plate, which has good thermal conductivity, electrical insulation performance, and machining performance, and may also be a flexible substrate such as a substrate made of Polyimide (PI, Polyimide), which has many advantages that a rigid printed circuit board does not have, for example, it may be freely bent, wound, and folded, and is widely applied in the fields or products of aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital cameras, and the like. The circuit layer 20 is manufactured on one side of the substrate 10, the circuit layer 20 at least includes two components 201 with different heights, the circuit layer 20 is used for integrating and arranging a plurality of components 201, optionally, surface mount devices (SMC or SMD, SMC refers to surface mount devices, mainly refers to passive components such as resistors and inductors without polarity separation, and SMD refers to surface mount devices, mainly refers to active devices such as capacitors requiring positive and negative polarity separation, and chip devices) without pins or short leads are mounted on the surface of the substrate 10 by SMT surface mount technology, and the circuit layer 20 is formed by soldering and assembling through methods such as reflow soldering or dip soldering. Since each of the components 201 may include different types of components, the volume size and the height of each of the components may be different, that is, the circuit layer 20 may include at least two types of components 201 with different heights, and the surface of the circuit layer 20 on the side away from the substrate 10 is likely to be an uneven surface. Then, manufacturing the packaging composite layer 30 on the side of the circuit layer 20 away from the substrate 10 by firstly providing a mold 50, wherein the mold 50 comprises a third surface 50A, and the shape of the third surface 50A is the same as that of the surface of the side of the circuit layer 20 away from the substrate 10; then, providing an insulating film 301, and attaching an original hot melt adhesive 302 'to one side, close to the substrate 10, of the insulating film 301, wherein the original hot melt adhesive 302' is of a plate-shaped structure; covering the insulating film 301 attached with the original hot melt adhesive 302 ' on the third surface 50A of the mold 50, and heating and pressing the insulating film 301 attached with the original hot melt adhesive 302 ', so that the original hot melt adhesive 302 ' is melted to fill the third surface 50A of the mold 50; and cooling and shaping the insulating film 301 attached with the original hot melt adhesive 302', and then taking down the insulating film to obtain the packaging composite layer 30, wherein the packaging composite layer 30 comprises the insulating film 301 and the shaped hot melt adhesive 302, and the shape of one side surface of the hot melt adhesive 302 is the same as that of one side surface of the circuit layer 20 far away from the substrate. The hot melt adhesive 302 functions as an adhesive for better fixing the insulating film 301 to the circuit layer 20, and the insulating film 301 functions to encapsulate the element 201 on the insulating protective circuit layer 20. In the display module 000 manufactured by the manufacturing method provided by this embodiment, the hot melt adhesive 302 includes a first surface 302A away from the substrate 10 and a second surface 302B close to the substrate 10, and the first surface 302A is fixedly attached to the insulating film 301, optionally, the first surface 302A may have a planar structure matching with the surface of the insulating film 301, so as to be better attached to the insulating film 301; the second surface 302B of the hot melt adhesive 302 is a concave-convex structure, which can be formed by pre-shaping the mold 50, and the shape of the second surface 302B matches the shape of the surface of the circuit layer 20 on the side away from the substrate 10 (which can be understood as the concave-convex surface formed by the components 201 and the gaps), so that the hot melt adhesive 302 covers the components 201 of the circuit layer 20. The hot melt adhesive 302 of the display module 000 manufactured in this embodiment includes the second surface 302B of the concave-convex structure matching with the surface of the circuit layer 20 away from the substrate 10, and the encapsulation composite layer 30 formed by the adhesion of the insulating film 301 and the hot melt adhesive 302 can be pre-formed according to the surface shape of the circuit layer 20, so that the circuit layer 20 and the encapsulation composite layer 30 can be directly attached in the process of manufacturing, and other positioning designs are not needed, thereby saving time and being fast. The second surface 302B of the concave-convex structure of the hot melt adhesive 302 can be filled with the gap of the component 201, which is beneficial to increasing the attaching area of the circuit layer 20 and the encapsulation composite layer 30, and under the design structure of the hot melt adhesive 302, the insulating film 301 of the encapsulation composite layer 30 is not easy to fall off, thereby being beneficial to improving the product yield and improving the display reliability.
It should be noted that, in the cross-sectional view of the display module 000 manufactured in this embodiment, the structure of the display module 000 is only exemplarily shown, and in a specific implementation, the structure of the display module 000 is not limited thereto, and may also include other structures capable of integrating a driving Circuit, which can be understood with reference to the structures of an IC (Integrated Circuit), a Flexible Printed Circuit (FPC), and a Printed Circuit Board (PCB) in the related art, which is not described in detail in this embodiment.
In some optional embodiments, please refer to fig. 16 and 17 in combination, where fig. 16 is a flowchart illustrating a manufacturing method of another display module according to an embodiment of the present invention, and fig. 17 is a schematic structural diagram illustrating a structure of applying a liquid fluoride layer 40 after a circuit layer 20 is manufactured on one side of a substrate 10, in the manufacturing method of the display module according to the embodiment, after the circuit layer 20 is manufactured on one side of the substrate 10, the method further includes: s07, applying the liquid fluoride layer 40 on the side of the circuit layer 20 away from the substrate 10.
The manufacturing method of the display module 000 provided by the embodiment further comprises the step of coating the fluorinated liquid layer 40 on the surface of the side, far away from the substrate 10, of the circuit layer 20 in the display module 000, wherein the fluorinated liquid of the fluorinated liquid layer 40 is a cleaning agent for precision instruments and is applied to precision cleaning of elements 201 on the circuit layer 20, so as to remove grease, wax, rosin soldering flux, fingerprint sweat, particles and other impurities, the fluorinated liquid layer 40 can be used for a protective coating of the circuit layer 20, and a thin transparent film is left on the surface of the circuit layer 20 coated with the fluorinated liquid layer 40, so that the moisture-proof and anti-sticking effects are achieved. The cause value of the surface of the fluoride liquid layer 40 (the cause value measures the humidity of the surface, and it can be understood that the side angle of the droplet on the surface of the fluoride liquid layer 40 is measured, and when the droplet of the fluoride liquid layer 40 forms a small bead on the surface, the cause value of the surface of the fluoride liquid layer 40 is low) is low, and the lower the cause value is, the less energy is applied to the surface of the fluoride liquid layer 40, and therefore the surface of the fluoride liquid layer 40 is less likely to be attached to the hot melt adhesive 302, and the insulating film 301 is likely to fall off. Therefore, when the liquid fluoride layer 40 is coated on the surface of the circuit layer 20 in the display module 000 on the side away from the substrate 10, it is desirable that the second surface 302B of the hot melt adhesive 302 be designed to have a relief-like structure that matches the surface of the circuit layer 20 on the side away from the substrate 10, in the process, the circuit layer 20 including the fluorinated liquid layer 40 can be directly attached to the packaging composite layer 30 without other positioning designs, time and speed are saved, the second surface 302B of the concave-convex structure of the hot melt adhesive 302 can be filled in the gap of the element 201, which is beneficial to increasing the attachment area of the circuit layer 20 and the packaging composite layer 30, it is possible to avoid the influence of the low dyne value of the fluoride liquid layer 40 on the attaching effect of the insulating film 301, under this kind of design structure of hot melt adhesive 302, can further make the insulating film 301 of encapsulation composite layer 30 be difficult for droing, better improvement product yield, further promote the display reliability.
In some optional embodiments, please refer to fig. 18 and 19 in combination, where fig. 18 is a flowchart of a manufacturing method of another display module according to an embodiment of the present invention, and fig. 19 is a schematic structural diagram of a vent 303 manufactured after a package composite layer 30 is manufactured, in the manufacturing method of a display module according to this embodiment, after the package composite layer 30 is manufactured, the method further includes: s08, vent holes 303 are formed in the surface of the hot melt adhesive 302 on the side close to the substrate 10. Alternatively, the vent holes 303 may be formed at the edges of the hot melt adhesive 302 to be recessed from the second surface 302B in a direction approaching the first surface 302A.
In the manufacturing method of the display module 000 further explained in this embodiment, after the manufacturing of the encapsulation composite layer 30, the manufacturing of the vent hole 303 on the surface of the hot melt adhesive 302 close to the substrate 10 is further included, because after the encapsulation of the circuit layer 20 by the encapsulation composite layer 30 is completed, a situation that the electrical connection is unstable during the detection performance may occur, so in order to facilitate the disassembly during the rework detection and repair, in this embodiment, after the manufacturing of the encapsulation composite layer 30, the vent hole 303 may be manufactured on the surface of the hot melt adhesive 302 close to the substrate 10, and auxiliary materials with freezing effect (having the effect of freezing and disassembling a separating device by using the low temperature characteristic of liquid nitrogen) such as liquid nitrogen may be introduced into the bonding surface of the hot melt adhesive 302 and the circuit layer 20 through the vent hole 303, so that the auxiliary materials enter the hot melt adhesive 302, and further, on the premise that the components 201 of the, the disassembly of the packaging composite layer 30 is more convenient and quicker.
Alternatively, as shown in fig. 19, the hot melt adhesive 302 may include a first region M overlapping the components 201 of the circuit layer 20 in the direction Z perpendicular to the plane of the substrate 10, and a second region N disposed around the first region M; in the second region N, the hot melt adhesive 302 is fixedly attached to the substrate 10; the vent 303 is located in the second region N. It is understood that fig. 19 of the present embodiment only illustrates the structure of one vent hole 303, and in the specific implementation, the number of vent holes 303 may be set according to the actual requirement according to the size of the whole display module 000 and the requirement of the lifting and detaching speed, and the present embodiment is not limited in particular.
In some optional embodiments, referring to fig. 20, fig. 20 is a schematic plan view illustrating a display device 111 according to an embodiment of the present invention, where the display device 111 according to the embodiment includes a display panel 222 and a display module 000 according to the above embodiment of the present invention. The embodiment of fig. 20 is only an example of a mobile phone, and the display device 111 is described, it is understood that the display device 111 provided in the embodiment of the present invention may be another display device 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display module 000 provided in the embodiment of the present invention, and specific descriptions of the display module 000 in the above embodiments may be specifically referred to, and this embodiment is not described herein again.
According to the embodiment, the display module, the manufacturing method thereof and the display device provided by the invention at least realize the following beneficial effects:
the display module comprises an encapsulation composite layer, wherein a hot melt adhesive of the encapsulation composite layer comprises a first surface far away from one side of a substrate and a second surface close to one side of the substrate, the first surface is fixedly attached to an insulating film, the second surface of the hot melt adhesive is of a concave-convex structure, the concave-convex structure can be formed by prefabricating and shaping a die, and the shape of the second surface is matched with that of the surface of the circuit layer far away from the substrate, so that the hot melt adhesive covers all elements of the circuit layer. The hot melt adhesive comprises a second surface of a concave-convex structure matched with the surface of one side, far away from the substrate, of the circuit layer, and the packaging composite layer formed by the bonding of the insulating film and the hot melt adhesive can be prefabricated and shaped according to the surface shape of the circuit layer, so that the circuit layer and the packaging composite layer can be directly bonded in the process of manufacturing, other positioning designs are not needed, and the time and the speed are saved. The clearance that the component can be filled up to the concave convex column structure's of hot melt adhesive second surface is favorable to increasing the attached area of circuit layer and encapsulation composite bed, under this kind of project organization of hot melt adhesive, can make the insulating film of encapsulation composite bed be difficult for droing, is favorable to improving the product yield, promotes and shows the reliability.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A display module, comprising:
a substrate;
the circuit layer is positioned on one side of the substrate and at least comprises elements with two different heights;
the packaging composite layer is positioned on one side of the circuit layer, which is far away from the substrate;
the packaging composite layer comprises an insulating film and a hot melt adhesive, and the insulating film is positioned on one side of the hot melt adhesive, which is far away from the substrate;
the hot melt adhesive is including keeping away from the first surface of base plate one side and being close to the second surface of base plate one side, the first surface with the insulating film laminating is fixed, the second surface is concave-convex structure, just the shape on second surface with the circuit layer is kept away from the shape on the surface of base plate one side matches each other, the hot melt adhesive covers the circuit layer the component.
2. The display module of claim 1, further comprising a liquid fluoride layer coated on a surface of the circuit layer on a side away from the substrate.
3. The display module assembly according to claim 1, wherein the hot melt adhesive comprises a first area and a second area disposed around the first area, the first area overlapping the elements of the circuit layer in a direction perpendicular to the plane of the substrate;
and in the second area, the second surface of the hot melt adhesive is fixedly attached to the substrate.
4. The display module assembly as claimed in claim 3, wherein at least one vent hole is formed on the second surface of the hot melt adhesive in the second region.
5. The display module assembly of claim 1, wherein the first surface of the hot melt adhesive is planar.
6. A method for manufacturing a display module according to any one of claims 1 to 5, the method comprising:
providing a substrate, and manufacturing a circuit layer on one side of the substrate, wherein the circuit layer at least comprises elements with two different heights;
providing a mould, wherein the mould comprises a third surface, and the shape of the third surface is the same as the shape of the surface of the circuit layer on the side far away from the substrate;
providing an insulating film, and attaching an original hot melt adhesive to one side, close to the substrate, of the insulating film, wherein the original hot melt adhesive is of a plate-shaped structure;
covering the insulating film attached with the original hot melt adhesive on the third surface of the mold, and heating and pressing the insulating film attached with the original hot melt adhesive to melt the original hot melt adhesive to fill the third surface of the mold;
cooling and shaping the insulating film attached with the original hot melt adhesive, and then taking down the insulating film to obtain a packaging composite layer, wherein the packaging composite layer comprises the insulating film and the shaped hot melt adhesive, and the shape of the surface of one side of the hot melt adhesive is the same as that of the surface of the circuit layer, which is far away from the substrate;
and embedding and fixing the packaging composite layer and the circuit layer.
7. The method as claimed in claim 6, further comprising, after the step of forming the circuit layer on the substrate, the steps of: and coating a fluoride liquid layer on one side of the circuit layer far away from the substrate.
8. The method for manufacturing a display module according to claim 6, further comprising, after the manufacturing of the encapsulation composite layer: and manufacturing a vent hole on the surface of the hot melt adhesive close to one side of the substrate.
9. The method of claim 8, wherein the hot melt adhesive comprises a first region and a second region surrounding the first region, the first region overlapping the components of the circuit layer in a direction perpendicular to the plane of the substrate; in the second area, the hot melt adhesive is fixedly attached to the substrate;
the vent is located within the second region.
10. A display device, comprising an electrically connected display panel and the display module according to any one of claims 1 to 5.
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