CN107565046A - Organic electroluminescence display panel and its manufacture method and display device - Google Patents
Organic electroluminescence display panel and its manufacture method and display device Download PDFInfo
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- CN107565046A CN107565046A CN201710705372.8A CN201710705372A CN107565046A CN 107565046 A CN107565046 A CN 107565046A CN 201710705372 A CN201710705372 A CN 201710705372A CN 107565046 A CN107565046 A CN 107565046A
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Abstract
This application discloses a kind of organic electroluminescence display panel and its manufacture method and display device.Organic electroluminescence display panel includes array base palte, cover plate and inorganic sealant, power Metal layer, a plurality of first data wire lines and the first inorganic insulation layer are provided with the region that array base palte is covered by inorganic sealant, inorganic insulation layer is between the first data wire lines and power Metal layer, power Metal layer overlaps with the first data wire lines part, first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arc-shaped recess portions, and the first inorganic insulation layer at least partly directly contacts with inorganic sealant.According to the scheme of the application, it is arranged to that there is staggered multiple first arcuate projections and multiple first arc-shaped recess portions by the first inorganic insulation layer for covering inorganic sealant, and the first inorganic insulation layer is at least partly directly contacted with inorganic sealant, improve the reliability of encapsulation.
Description
Technical field
Present application relates generally to display technology field, more particularly to a kind of organic electroluminescence display panel and its manufacture method and
Display device.
Background technology
With the development of information technology, performance requirement more and more higher of the people to FPD.As after cathode-ray tube
Third generation Display Technique after display and liquid crystal display, OLED (Organic Light Emitting Diode, organic light emission
Diode) display have cost is low, visual angle is wide, driving voltage is low, fast response time, luminous color are abundant, preparation technology is simple,
The advantages that large area flexible display can be achieved, is considered as one of Display Technique most with prospects.
Because luminous organic material is easily influenceed by oxygen, moisture and fail, the requirement to encapsulation is higher, at present to use glass more
Glass glue carrys out encapsulating organic light emitting display panel.Glass cement is a kind of inorganic sealant, is irradiated by laser and melts and solidify, so as to
The array base palte of organic electroluminescence display panel and cover plate are bonded together and realize the effect of encapsulation.
However, in the lower frame region of organic electroluminescence display panel (that is, the side for connecting integrated circuit), it is necessary to be provided with
Multilayer wiring, for example, data wire, power line etc., and under normal circumstances, power line directly contacts with glass cement, and glass cement
It is weaker with metallic surface adhesion, the reliability of encapsulation can be reduced.
The content of the invention
In view of drawbacks described above of the prior art or deficiency, it is expected to provide a kind of organic electroluminescence display panel and its manufacturer
Method and display device, to solve technical problem present in prior art.
According to the one side of the application, there is provided a kind of organic electroluminescence display panel, including array base palte, cover plate and
For the inorganic sealant that array base palte and cover plate are bonded together, array base palte includes underlay substrate and is arranged on substrate
Power Metal layer, the first data metal layer and the first inorganic insulation layer on substrate, data metal layer include a plurality of first data
Metal wire；Between the first data metal layer and power Metal layer, the first data wire lines are set first inorganic insulation layer
In the fan-out area of peripheral region, power Metal layer overlaps with fan-out area part, and peripheral region surrounds viewing area；It is inorganic
Sealant is arranged in the packaging area of peripheral region, and power Metal layer and the first data metal layer are handed over packaging area
It is folded；In the region that fan-out area and packaging area overlap, the first inorganic insulation layer has staggered multiple first arcs
Protuberance and multiple first arc-shaped recess portions, and the first inorganic insulation layer at least partly directly contacts with inorganic sealant.
According to the another aspect of the application, a kind of preparation method of organic electroluminescence display panel is additionally provided, is included in lining
The fan-out area of substrate forms the first data metal layer, and the first data metal layer includes a plurality of first data wire lines, and first
Data metal layer overlaps with packaging area；Cover the first data metal layer and form the first inorganic insulation layer, in fan-out area and envelope
Fill in the overlapping region in region, the first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arcs
Shape depressed part；Power Metal layer is formed on the first inorganic insulation layer, in the region overlapped with packaging area of power Metal layer
It is middle to form multiple first openings, multiple second arcuate projections and multiple second arc-shaped recess portions, power Metal layer and fanout area
Domain part overlaps, and power Metal layer overlaps with packaging area, and the second arcuate projection covers the first arcuate projection, the second arc
Depressed part covers the first arc-shaped recess portion；In the packaging area coating inorganic sealant of cover plate；Fitting cover plate simultaneously solidifies inorganic envelope
Frame glue, cover plate is set to be bonded together with array base palte, array base palte includes underlay substrate, power Metal layer, the first data metal
Layer and the first inorganic insulation layer, the first inorganic insulation layer at least partly directly contact with inorganic sealant；Wherein, fan-out area and
Packaging area is located at peripheral region, and peripheral region surrounds viewing area
According to the another aspect of the application, a kind of display device, including organic electroluminescence display panel as above are additionally provided.
The organic electroluminescence display panel and its manufacture method and display device that the application provides, by the way that inorganic sealant is covered
First inorganic insulation layer of lid is arranged to have staggered multiple first arcuate projections and multiple first arc-shaped recess portions,
And the first inorganic insulation layer is at least partly directly contacted with inorganic sealant, improve the reliability of encapsulation.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is other
Feature, objects and advantages will become more apparent upon：
Figure 1A shows the schematic diagram of the organic electroluminescence display panel of the application one embodiment；
Figure 1B shows the enlarged diagram of region SS in Figure 1A；
Fig. 1 C show the sectional view along Figure 1B line I-I；
Fig. 1 D show the sectional view along Figure 1B line II-II；
Fig. 2 shows a kind of schematic diagram of optional implementation of Figure 1A illustrated embodiments；
Fig. 3 shows a kind of schematic diagram of optional implementation of Figure 1A illustrated embodiments；
Fig. 4 shows the schematic diagram of the organic electroluminescence display panel of another embodiment of the application；
Fig. 5 shows the laser radiation response schematic diagram of the organic electroluminescence display panel of embodiment illustrated in fig. 4；
Fig. 6 shows the schematic diagram of the organic electroluminescence display panel of the another embodiment of the application；
Fig. 7 A show the schematic diagram of first inorganic insulation layer of the application one embodiment；
Fig. 7 B show the schematic diagram of first inorganic insulation layer of the application one embodiment；
Fig. 8 shows the indicative flowchart of one embodiment of the preparation method of the application organic electroluminescence display panel；
Fig. 9 A~Fig. 9 E show cutting for the part manufacture craft of the organic electroluminescence display panel of the application one embodiment
Face figure；
Figure 10 A~Figure 10 B show the sectional view of the manufacture craft of the inorganic insulation layer of the embodiment of the present application；
Figure 11 shows the schematic diagram being exposed using the first mask plate；
Figure 12 shows the schematic diagram of one embodiment of the display device of the application.
Embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
It is easy to describe, the part related to invention is illustrate only in accompanying drawing.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Figure 1A shows the schematic diagram of the organic electroluminescence display panel of the application one embodiment, and Figure 1B is shown
Region SS enlarged diagram in Figure 1A, Fig. 1 C show the sectional view along Figure 1B line I-I.
As shown in Figure 1A~Fig. 1 C, organic electroluminescence display panel may include array base palte 11, cover plate 12 and inorganic sealant
13, inorganic sealant 13 is used to array base palte 11 and cover plate 12 being bonded together.Organic electroluminescence display panel can be divided into display
The region DA and peripheral region NDA around viewing area DA, peripheral region NDA include fan-out area FA and packaging area PA, fan
It is overlapping to go out region FA and packaging area PA parts.
Array base palte 11 includes underlay substrate SUB and the first data metal layer DL1 being arranged on underlay substrate SUB, the
One inorganic insulation layer IL1 and power Metal layer PL, the first data metal layer DL1 include a plurality of first data wire lines Da, it is used for
Transmit data voltage signal.Wherein, the first inorganic insulation layer IL1 be located at the first data metal layer DL1 and power Metal layer PL it
Between, the first data metal layer DL1 is arranged in the FA of fan-out area, and power Metal layer PL and fan-out area FA parts are overlapping, i.e.
Orthographic projections of the power Metal layer PL to the first data metal layer DL1 and the first data wire lines DaIt is overlapping.
Inorganic sealant 13 is arranged in packaging area PA, and power Metal layer PL and the first data metal layer DL1
It is all overlapping with inorganic sealant 13.In the region that fan-out area FA and packaging area PA is overlapped, the first inorganic insulation layer IL1 tools
There are staggered multiple first arcuate projection ILa and multiple first arc-shaped recess portion ILb, and the first inorganic insulation layer
IL1 at least partly directly contacts with inorganic sealant 13, for example, in the first inorganic insulation layer IL1 not by power Metal layer PL
In the region of covering.
In the present embodiment, by the way that the first inorganic insulation layer covered by inorganic sealant to be arranged to have multiple first arcs
Shape protuberance and multiple first arc-shaped recess portions, add the contact area between the first inorganic insulation layer and inorganic sealant,
The surface adhesion of the first inorganic insulation layer and inorganic sealant is increased, improves the reliability of encapsulation.Meanwhile there is the arc
First inorganic insulation layer of shape concaveconvex structure can by inorganic sealant in encapsulation process caused lateral stress to other directions
Release, so as to reduce the lateral stress that the first inorganic insulation layer is born, and then avoid because the first inorganic insulation layer is horizontal
Deformation is excessive and causes the metal wire of lower floor (for example, first data wire lines) generation bad (for example, fold, fracture etc..)
Although Figure 1B and Fig. 1 C show the first inorganic insulation layer IL1 in the lower edges parallel with organic electroluminescence display panel
There is the first staggered arcuate projection ILa and the first arc-shaped recess portion ILb, but this is only schematical on direction.
It should be appreciated that the first inorganic insulation layer IL1 can also have on the direction vertical with the lower edge of organic electroluminescence display panel
The first staggered arcuate projection and the first arc-shaped recess portion, or organic electroluminescence display panel lower edges parallel and
All there is the first staggered arcuate projection and the first arc-shaped recess portion, those skilled in the art can on vertical direction
It is configured according to the needs of practical application scene.
Alternatively, in the region that fan-out area FA and packaging area PA is overlapped, it is provided with power Metal layer PL multiple
First opening OP1, in the first opening OP1, the first inorganic insulation layer IL1 directly contacts with inorganic sealant 13.
By setting multiple first openings, on the one hand, help fully to discharge stress caused by metal power layer (for example,
The caused metal stresses in encapsulation process), avoid metal power layer due to deformation is excessive and producing fold (and then causes to encapsulate
It is bad)；On the other hand, the contact area between the first inorganic insulation layer and inorganic sealant is further increased, is further increased
Big surface adhesion of the inorganic sealant with the first inorganic insulation layer, improve the reliability of encapsulation.
Alternatively, array base palte also includes the reflective metal layer being arranged between underlay substrate and the first inorganic insulation layer.
With specific reference to Fig. 1 D, the sectional view along Figure 1B line II-II is shown.As shown in figure iD, array base palte 11 is by nothing
Reflective metal layer RL is additionally provided with the region that machine sealant 13 covers, reflective metal layer RL is located at the first inorganic insulation layer IL1
Between underlay substrate SUB, multiple second opening OP2 are provided with reflective metal layer RL, and reflective metal layer RL is with being fanned out to
Region FA is not overlapped, that is to say, that reflective metal layer RL is arranged on the region not overlapped with fan-out area FA in packaging area PA
In.
By setting reflective metal layer in the packaging area not overlapped with fan-out area, light source in encapsulation process can be improved
The utilization rate of (for example, laser), inorganic sealant is set fully to melt solidification, and the second opening can make caused by reflective metal layer
Stress fully discharges, avoid because stress is excessive and it is bad to produce deformation.
Alternatively, the first inorganic insulation layer IL1 can have the 3rd opening OP3 in the second opening OP2, for further increasing
Add the first inorganic insulation layer IL1 and inorganic sealant 13 contact area.
Although Fig. 1 D show that the 3rd opening OP3 does not extend through the first inorganic insulation layer IL1, this is only schematic
, it will be appreciated that the 3rd opening OP3 can also run through the first inorganic insulation layer IL1, so that the nothing of inorganic sealant 13 and first
Layer contact below machine insulating barrier.
Alternatively, array base palte also includes barrier metal layer and Source and drain metal level, barrier metal layer, Source and drain metal level and the first number
It is located at same metal level according to one in metal level and reflective metal layer.
With specific reference to Fig. 2, a kind of schematic diagram of optional implementation of Figure 1A illustrated embodiments is shown.Such as Fig. 2 institutes
Show, array base palte also includes barrier metal layer and Source and drain metal level, and barrier metal layer includes multiple gate electrode GEs, and Source and drain metal level includes
Multiple source electrode SE and multiple drain electrode DE, gate electrode GE, source electrode SE and drain electrode DE can form thin film transistor (TFT).
Wherein, one in barrier metal layer, Source and drain metal level and the first data metal layer DL1 is located at reflective metal layer RL
Same layer metal level, and make and formed in the patterning process with along with.For example, reflective metal layer RL passes through with barrier metal layer
Patterning process is made by same layer metal film with along with.
By the way that one in barrier metal layer, Source and drain metal level and the first data metal layer is set with reflective metal layer with layer
Put, it may not be necessary to increase extra technique and make reflective metal layer, so as to not increase technology difficulty and production cost.
Alternatively, in the region not overlapped with fan-out area of packaging area, the first inorganic insulation layer IL1, which also has, to be handed over
The multiple 3rd arcuate projection ILc and multiple 3rd arc-shaped recess portion ILd of mistake arrangement, as shown in figure 3, showing shown in Figure 1A
A kind of schematic diagram of optional implementation of embodiment.
, can be to other directions by the way that the first inorganic insulation layer in whole packaging area is arranged into arcuate relief structure
Lateral stress caused by discharging inorganic sealant, lower metal (for example, reflective metal layer) is avoided fold occur.
With continued reference to Fig. 4, the schematic diagram of the organic electroluminescence display panel of another embodiment of the application is shown.
Similar with the embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, organic electroluminescence display panel equally may include battle array
Row substrate 41, cover plate 42 and inorganic sealant 43, array base palte 41 equally may include underlay substrate SUB, the first data metal layer
DL1, the first inorganic insulation layer IL1 and power Metal layer PL, the first inorganic insulation layer IL1 can equally have staggered multiple
First arcuate projection ILa and multiple first arc-shaped recess portion ILb.
Unlike the embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, power Metal layer PL is carried out entering one
The restriction of step.
Specifically, as shown in figure 4, in the overlapping region in fan-out area and packaging area, power Metal layer PL has more
Individual second arcuate projection PLa and multiple second arc-shaped recess portion PLb, wherein, the second arcuate projection PLa covers the first arc
Protuberance ILa, the second arc-shaped recess portion PLb cover the first arc-shaped recess portion PLb, the second arcuate projection PLa and the second arc
Depressed part PLb directly contacts with inorganic sealant 43.
The usefulness of the present embodiment is described with reference to Fig. 5, Fig. 5 shows that the organic light emission of embodiment illustrated in fig. 4 shows
Show the laser radiation response schematic diagram of panel.
When irradiating inorganic sealant (not shown) with light source (for example, laser), light is irradiated to electricity through inorganic sealant
On source metal level PL surface, then it is reflected in inorganic sealant, so as to improve the utilization rate of light source.
In the case where power Metal layer PL has flat surfaces, laser quilt only on vertical substrates substrate SUB direction
Reflection, therefore the energy that the inorganic sealant on different height receives can be variant, so as to which inorganic sealant can be caused to be heated
Uneven or heating is insufficient.And in the case where power Metal layer PL has arcuate relief structure, vertical substrates substrate SUB is incident
Laser can not only be reflected on different height, but also can be reflected to all directions, as shown by the arrows in Figure 5 that
Sample, so that the energy in inorganic sealant is more uniform, and make inorganic sealant heated more abundant.
In the present embodiment, by the way that power Metal layer to be arranged to have multiple second arcuate projections and multiple second arcs
Depressed part, light is reflected in different height, different angle, improve the uniformity of energy in inorganic sealant.
With continued reference to Fig. 6, the schematic diagram of the organic electroluminescence display panel of the another embodiment of the application is shown.
Similar with the embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, organic electroluminescence display panel equally may include battle array
Row substrate 61, cover plate 62 and inorganic sealant 63, array base palte 61 equally may include underlay substrate SUB, the first data metal layer
DL1, the first inorganic insulation layer IL1 and power Metal layer PL, the first inorganic insulation layer IL1 can equally have staggered multiple
First arcuate projection ILa and multiple first arc-shaped recess portion ILb.
Unlike the embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, array substrate 61 has been carried out further
Restriction.
Specifically, as shown in fig. 6, array base palte 61 may also include the second insulating barrier IL2 being arranged on underlay substrate SUB
Include a plurality of second data wire lines D with the second data metal layer DL2, the second data metal layer DL2b, for transmitting data electricity
Press signal.Wherein, the second insulating barrier IL2 is between the first data metal layer DL1 and the second data metal layer DL2, the second number
According to metal level DL2 between the second insulating barrier IL2 and underlay substrate SUB, the second data metal layer DL2 is arranged on fanout area
It is in domain and overlapping with inorganic sealant 63.
In the present embodiment, by setting the first data metal layer and the second data metal layer, in organic electroluminescence display panel
In the case that the total amount of data wire keeps constant, reduce the first data wire lines in the first data metal layer quantity and
Reduce the quantity of the second data wire lines in the second data metal layer, so as to reduce the chip area shared by fan-out area,
It is advantageously implemented narrow frame and realizes the organic electroluminescence display panel of higher resolution.
Alternatively, the first data wire lines DaOrthographic projection and the second data wire lines D to underlay substrate SUBbTo substrate base
Plate SUB orthographic projection is staggered and not overlapped.
As the first data wire lines DaWith the second data wire lines DbIn the presence of it is overlapping when, to organic electroluminescence display panel apply
During data-signal, the first data wire lines DaWith the second data wire lines DbOverlapping region can produce parasitic capacitance, so as to influence
The write-in of data.
Pass through the first data wire lines DaWith the second data wire lines DbIt is arranged to be staggered and does not overlap, can avoids posting
Influence of the raw electric capacity to data-signal, so as to improve display quality.
In addition, when only setting a layer data line such as first data metal layer DL1, between the first data wire lines between
Away from larger, such as 3 μm~4 μm.And after two layers of data wire is set, although for the data metal positioned at same data metal layer
For line, spacing is still 3 μm~4 μm, but for the data wire in different pieces of information metal level, such as adjacent to each other the
One data wire lines DaWith the second data wire lines DbBetween spacing be smaller than 1 μm, for example, only 0.7 μm or so, so as to pole
The earth reduces the spacing between data wire.
In addition, by by the first data wire lines DaWith the second data wire lines DbIt is arranged to be staggered and does not overlap, also
It may be such that the first data wire lines DaWith the second data wire lines DbBasic covering underlay substrate SUB fan-out area, so that
The first inorganic insulation layer IL1 light is passed through in encapsulation process by the first data wire lines DaWith the second data wire lines DbReflection, from
And further improve the utilization rate of light source.
Inventor has found that the first arcuate projection ILa and the first arc-shaped recess portion ILb exists in the first inorganic insulation layer IL1
Ultimate range on vertical substrates substrate SUB directions can influence the table between the first inorganic insulation layer IL1 and inorganic sealant 63
Face bonding force and the lateral stress being applied on the first inorganic insulation layer IL1.
Alternatively, on the direction of vertical substrates substrate, the first arcuate projection and the first adjacent arc-shaped recess portion it
Between ultimate range be the first inorganic insulation layer maximum gauge 10%~100%.
With specific reference to Fig. 7 A, the schematic diagram of first inorganic insulation layer of the application one embodiment is shown.Such as Fig. 7 institutes
Show, on vertical substrates substrate SUB direction, between the first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb
Ultimate range is h, and the first inorganic insulation layer IL1 maximum gauge is d, then：
When the first arcuate projection ILa and the first arc-shaped recess portion ILb meet above-mentioned condition, can effectively increase inorganic
Bonding force between sealant and the first inorganic insulation layer IL1, and effectively reduce the transverse direction that the first inorganic insulation layer IL1 is born and answer
Power.
Alternatively, on the direction of vertical substrates substrate, between each first arcuate projection and underlay substrate it is maximum away from
From identical, the minimum range between each first arc-shaped recess portion and underlay substrate is identical.
For example, in fig. 7, the ultimate range between the first arcuate projection ILa and each first arc-shaped recess portion ILb is equal
For h.
By the way that the ultimate range between each first arcuate projection and each first arc-shaped recess portion is arranged into identical, in shape
Into in the technique in the first arcuate projection and the first arc-shaped recess portion, the technology difficulty phase that is performed etching to the first inorganic insulation layer
To simple, and the damage to the film layer (for example, first data metal layer) below the first inorganic insulation layer is also smaller.
Alternatively, on the direction of vertical substrates substrate, exist at least two first arcuate projections and underlay substrate it
Between ultimate range it is different, and/or the minimum range existed between at least two first arc-shaped recess portions and underlay substrate is different.
For example, Fig. 7 B show the schematic diagram of first inorganic insulation layer of the application one embodiment, in figure 7b, one
Ultimate range between first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb is h1, and another first arc protrudes
Ultimate range between portion ILa and the first adjacent arc-shaped recess portion ILb is h2, another first arcuate projection ILa with it is adjacent
The first arc-shaped recess portion ILb between ultimate range be h3, wherein, h1 ＞ h2 ＞ h3.
, can by the way that the ultimate range between each first arcuate projection and each first arc-shaped recess portion is arranged into different
Further increase the contact area of inorganic sealant and the first inorganic insulation layer and contact depth (in the side of vertical substrates substrate
To), and then increase package strength.In addition, when power Metal layer has the second arcuate projection and the second arc-shaped recess portion, the
Ultimate range between two arcuate projections and the second arc-shaped recess portion is also different, so that power Metal layer is to light source (example
Such as, laser) reflection it is more uniform, the energy that inorganic sealant receives on different height, different directions is more uniform, enters one
Step improves the uniformity of energy in inorganic sealant.
Although Fig. 7 B are shown on vertical substrates substrate SUB direction, the first arcuate projection ILa and underlay substrate
The distance between SUB is identical, and the distance between the first arc-shaped recess portion ILb and underlay substrate SUB difference, this is only schematic
's.It should be appreciated that the distance between the first arcuate projection ILa and underlay substrate SUB can also be different, the first arc-shaped recess portion
The distance between ILb and underlay substrate SUB can also be identical, simply by the presence of the first arcuate projection ILa and the first adjacent arc
Ultimate range between shape depressed part ILb is different from other the first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb
Between ultimate range.
In addition, disclosed herein as well is a kind of preparation method of organic electroluminescence display panel, for making above-mentioned each implementation
The organic electroluminescence display panel of example.
The preparation method that organic electroluminescence display panel is described below in conjunction with Fig. 8 and Fig. 9 A~Fig. 9 E, Fig. 8 show this
Apply for the indicative flowchart of one embodiment of the preparation method of organic electroluminescence display panel, Fig. 9 A~Fig. 9 E show this Shen
Please one embodiment organic electroluminescence display panel part manufacture craft sectional view.
The preparation method of organic electroluminescence display panel includes：
Step 810, the first data metal layer is formed in the fan-out area of underlay substrate, the first data metal layer includes a plurality of
First data wire lines, the first data metal layer overlap with packaging area.
As shown in Figure 9 A, the first data metal layer DL1 is formed in underlay substrate SUB fan-out area (not shown), first
Data metal layer DL1 includes a plurality of first data wire lines Da。
Step 820, cover the first data metal layer and form the first inorganic insulation layer, overlapped in fan-out area and packaging area
Region in, the first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arc-shaped recess portions.
As shown in Figure 9 B, the first data metal layer DL1 is covered on underlay substrate SUB and forms the first inorganic insulation layer IL1,
In the region that fan-out area and packaging area (not shown) overlap, the first inorganic insulation layer IL1 is formed with multiple first arcs
Protuberance ILa and multiple first arc-shaped recess portion ILb, the first arcuate projection ILa and the first arc-shaped recess portion ILb staggered rows
Cloth.
First inorganic insulation layer IL1 specific forming process, Figure 10 A~figure are described below in conjunction with Figure 10 A~Figure 10 B
10B shows the sectional view of the manufacture craft of the inorganic insulation layer of the embodiment of the present application.Form the first inorganic insulation layer IL1 bags
Include：
First, as shown in Figure 10 A, the first data metal layer DL1 is covered on underlay substrate SUB, and to be sequentially depositing first inorganic
Dielectric film IL ' and the first photoresist film PR.
Then, as shown in Figure 10 B, the first photoresist film PR is exposed using the first mask plate (not shown), developed,
The first photoetching agent pattern PR ' is formed, wherein, the first photoetching agent pattern PR ' is formed with staggered multiple arcs protuberance PRa
With arc-shaped recess portion PRb.
Finally, the first photoetching agent pattern PR ' and the first inorganic insulating membrane IL ' are performed etching (for example, dry etching), formed such as
The first inorganic insulation layer IL1 shown in Fig. 9 B.
With continued reference to Fig. 8, step 830, power Metal layer is formed on the first inorganic insulation layer, power Metal layer with
Multiple first opening, multiple second arcuate projections and multiple second arc-shaped recess portions are formed in the overlapping region of packaging area,
Power Metal layer overlaps with fan-out area part, and power Metal layer overlaps with packaging area, the second arcuate projection covering first
Arcuate projection, the second arc-shaped recess portion cover the first arc-shaped recess portion.
As shown in Figure 9 C, power Metal layer PL is formed on the first inorganic insulation layer IL1, in packaging area, power supply gold
Belong in layer PL formed with the multiple first opening OP1, multiple second arcuate projection PLa and multiple second arc-shaped recess portion PLb, the
One opening OP1 the first inorganic insulation layers of exposure IL1, the second arcuate projection PLa covers the first arcuate projection ILa, the second arc
Shape depressed part PLb covers the first arc-shaped recess portion ILb, and power Metal layer PL and the first data metal layer DL1 parts are overlapping.
By above-mentioned steps, the array base palte 91 of organic electroluminescence display panel is formed.
Step 840, in the packaging area coating inorganic sealant of cover plate.
As shown in fig. 9d, in the packaging area coating inorganic sealant 93 of cover plate 92, for example, glass cement.
Step 850, it is bonded cover plate and solidifies inorganic sealant, cover plate is bonded together with array base palte, array base palte
Including underlay substrate, power Metal layer, the first data metal layer and the first inorganic insulation layer, the first inorganic insulation layer and inorganic envelope
Frame glue at least partly directly contacts.
As shown in fig. 9e, the cover plate 92 for being coated with inorganic sealant 93 is fitted on array base palte 91, then using light
Source (for example, laser) melts and solidifies inorganic sealant 93, so that cover plate 92 is bonded together with array base palte 91.Wherein,
Power Metal layer PL directly contacts with inorganic sealant 93, and the first inorganic insulation layer IL1 is with inorganic sealant 93 in the first opening
Directly contacted in OP1.
Alternatively, the first mask plate is double slit mask plate.
With specific reference to Figure 11, the schematic diagram being exposed using the first mask plate is shown.As shown in figure 11, double slit mask
Version MASK is the mask plate for being exposed processing to photosensitive material (for example, photoresist) using the two-slit interference of light, and light can felt
Luminescent material surface forms alternatively distributed clear zone (superposition interference occurring, intensity of illumination is higher) and (destructive interference, light occur for dark space
It is weaker according to intensity), the photosensitive material positioned at clear zone is exposed, and the photosensitive material positioned at dark space is not exposed, so as to form tool
There are multiple staggered arcuate projections and the photoetching agent pattern in arc-shaped recess portion, for example, the photoetching agent pattern shown in Figure 10 B
PR’。
Disclosed herein as well is a kind of display device, as shown in Figure 12.Wherein, display device 1200 may include as above
Organic electroluminescence display panel.It will be appreciated by those skilled in the art that display device is except including organic light emitting display face as above
Outside plate, some other known structures can also be included., will be no longer to known in these for the emphasis of not fuzzy the application
Structure be described further.
The display device of the application can be any device for including organic electroluminescence display panel as above, including but unlimited
In cellular mobile phone 1200 as shown in figure 12, tablet personal computer, the display of computer, applied in Intelligent worn device
Display, applied to display device on the vehicles such as automobile etc..As long as display device contains disclosed in the present application
The structure of organic electroluminescence display panel, has just been contemplated as falling within the protection domain of the application.
The organic electroluminescence display panel and its manufacture method and display device, organic electroluminescence display panel that the application provides exist
There is the first inorganic insulation layer of arcuate relief structure, and first is inorganic exhausted in the region that fan-out area and packaging area overlap
Edge layer at least partly directly contacts with inorganic sealant, improves the reliability of encapsulation.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (15)
1. a kind of organic electroluminescence display panel, it is characterised in that including array base palte, cover plate and for by the array base palte
The inorganic sealant being bonded together with the cover plate, the array base palte include underlay substrate and are arranged on the substrate base
Power Metal layer, the first data metal layer and the first inorganic insulation layer on plate, the data metal layer include a plurality of first number
According to metal wire；
First inorganic insulation layer is between first data metal layer and the power Metal layer, first data
Metal wire is arranged in the fan-out area of peripheral region, and the power Metal layer overlaps with the fan-out area part, described
Peripheral region surrounds viewing area；
The inorganic sealant is arranged in the packaging area of the peripheral region, and the power Metal layer and described
One data metal layer overlaps with the packaging area；
In the region that the fan-out area and the packaging area overlap, first inorganic insulation layer has staggered
Multiple first arcuate projections and multiple first arc-shaped recess portions, and first inorganic insulation layer and the inorganic sealant
At least partly directly contact.
2. organic electroluminescence display panel according to claim 1, it is characterised in that in the fan-out area and the encapsulation
In the overlapping region in region, multiple first openings are provided with the power Metal layer；
In the described first opening, first inorganic insulation layer directly contacts with the inorganic sealant.
3. organic electroluminescence display panel according to claim 1, it is characterised in that in the fan-out area and the encapsulation
In the overlapping region in region, the power Metal layer has multiple second arcuate projections and multiple second arc-shaped recess portions, institute
State the second arcuate projection and cover first arcuate projection, the second arc-shaped recess portion covers first arc-shaped recess
Portion；
Second arcuate projection and the second arc-shaped recess portion directly contact with the inorganic sealant.
4. organic electroluminescence display panel according to claim 1, it is characterised in that the array base palte also includes being arranged on
Reflective metal layer between the underlay substrate and first inorganic insulation layer, the reflective metal layer are located at the encapsulation region
Domain, and do not overlapped with the fan-out area；
Multiple second openings are provided with the reflective metal layer.
5. organic electroluminescence display panel according to claim 1, it is characterised in that it is exhausted that the array base palte also includes second
Edge layer and the second data metal layer, second data metal layer include a plurality of second data wire lines, second insulating barrier
It is arranged between first data metal layer and second data metal layer, second data metal layer is arranged on
Between the underlay substrate and second insulating barrier；
Second data metal layer overlaps with the packaging area.
6. organic electroluminescence display panel according to claim 5, it is characterised in that first data wire lines are to described
The orthographic projection of underlay substrate is staggered with orthographic projection of second data wire lines to the underlay substrate and not overlapped.
7. organic electroluminescence display panel according to claim 4, it is characterised in that the array base palte also includes grid metal
Layer and Source and drain metal level；
One in the barrier metal layer, the Source and drain metal level and first data metal layer and the reflective metal layer position
It is made in same metal level and in the patterning process with along with.
8. organic electroluminescence display panel according to claim 4, it is characterised in that in the packaging area and the fan
Go out in the region that region does not overlap, first inorganic insulation layer has staggered multiple 3rd arcuate projections and multiple
3rd arc-shaped recess portion, the 3rd arcuate projection and the 3rd arc-shaped recess portion directly connect with the inorganic sealant
Touch.
9. organic electroluminescence display panel according to claim 1, it is characterised in that in the direction of the vertical underlay substrate
On, the ultimate range between first arcuate projection and adjacent the first arc-shaped recess portion is inorganic exhausted for described first
The 10%~100% of edge layer maximum gauge.
10. organic electroluminescence display panel according to claim 9, it is characterised in that in the side of the vertical underlay substrate
Upwards, each first arcuate projection is identical with the ultimate range between the underlay substrate, each first arc-shaped recess
Minimum range between portion and the underlay substrate is identical.
11. organic electroluminescence display panel according to claim 10, it is characterised in that in the side of the vertical underlay substrate
Upwards, it is different from the ultimate range between the underlay substrate to there are at least two first arcuate projections, and/or exists
At least two first arc-shaped recess portions are different from the minimum range between the underlay substrate.
12. a kind of display device, it is characterised in that including the organic light emitting display face as described in claim any one of 1-11
Plate.
A kind of 13. preparation method of organic electroluminescence display panel, it is characterised in that including：
The first data metal layer is formed in the fan-out area of underlay substrate, first data metal layer includes a plurality of first data
Metal wire, first data metal layer overlap with packaging area；
Cover first data metal layer and form the first inorganic insulation layer, overlapped in the fan-out area and the packaging area
Region in, first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arc-shaped recess
Portion；
Power Metal layer is formed on first inorganic insulation layer, is overlapped in the power Metal layer with the packaging area
Region in form multiple first openings, multiple second arcuate projections and multiple second arc-shaped recess portions, the power Metal
Layer overlaps with the fan-out area part, and the power Metal layer overlaps with the packaging area, second arcuate projection
First arcuate projection is covered, the second arc-shaped recess portion covers the first arc-shaped recess portion；
In the packaging area coating inorganic sealant of cover plate；
It is bonded the cover plate and solidifies the inorganic sealant, the cover plate is bonded together with array base palte, the array
Substrate includes the underlay substrate, the power Metal layer, first data metal layer and first inorganic insulation layer, institute
The first inorganic insulation layer is stated at least partly directly to contact with the inorganic sealant；
Wherein, the fan-out area and the packaging area are located at peripheral region, and the peripheral region surrounds viewing area.
14. preparation method according to claim 13, it is characterised in that covering first data metal layer is formed
First inorganic insulation layer includes：
Cover first data metal layer and be sequentially depositing the first inorganic insulating membrane and the first photoresist film；
First photoresist film is exposed using the first mask plate, overlapped in the fan-out area and the packaging area
Region in form staggered the first photoetching agent pattern of arcuate projection and arc-shaped recess portion；
First photoetching agent pattern and first inorganic insulating membrane are performed etching to form first inorganic insulating membrane.
15. preparation method according to claim 14, it is characterised in that first mask plate is double slit mask plate.
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| CN201710705372.8A CN107565046B (en) | 2017-08-17 | 2017-08-17 | Organic light emitting display panel and its manufacturing method and display device |
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| CN201710705372.8A CN107565046B (en) | 2017-08-17 | 2017-08-17 | Organic light emitting display panel and its manufacturing method and display device |
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| CN107833979A (en) * | 2017-10-31 | 2018-03-23 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN108493226A (en) * | 2018-05-14 | 2018-09-04 | 上海天马有机发光显示技术有限公司 | A kind of electronic equipment, display panel and preparation method thereof |
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| CN112397669A (en) * | 2020-11-26 | 2021-02-23 | 上海天马有机发光显示技术有限公司 | Display module, manufacturing method thereof and display device |
| WO2022067520A1 (en) * | 2020-09-29 | 2022-04-07 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
| WO2022178809A1 (en) * | 2021-02-26 | 2022-09-01 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
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