KR102407887B1 - Organic light emitting diode display apparatus and manufacturing method of the same - Google Patents

Abstract

According to an embodiment of the present invention, there is provided an organic light emitting display device capable of minimizing substrate sagging and luminance imbalance of a large area organic light emitting display device. A first substrate is provided in which a unit pixel area including a light-emitting area and a non-emission area is defined. The light emitting area of the first substrate includes a driving device, a pixel electrode, an organic light emitting layer, and a common electrode, and the non-emission area includes a reverse tapered substrate sag prevention layer. In addition, a second substrate facing the first substrate and including a black matrix is provided and bonded to the first substrate to constitute an organic light emitting display device, wherein the substrate sag prevention layer supports the first substrate in bonding with the first substrate Substrate sagging can be minimized.

Description

Organic light emitting display device and manufacturing method thereof

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more particularly, to an organic light emitting display device capable of minimizing substrate sagging and luminance imbalance of a large-area organic light emitting display device, and a manufacturing method thereof.

An organic light emitting display device (OLED) is a self-emission type display device, and unlike a liquid crystal display device, it does not require a separate light source, so it can be manufactured in a lightweight and thin form. In addition, the organic light emitting display device is being studied as a next-generation display because it is advantageous in terms of power consumption due to low voltage driving, and also has excellent color realization, response speed, viewing angle, and contrast ratio (CR).

In recent years, display devices, including organic light emitting display devices, have been manufactured in large sizes, and curved products are also widely manufactured in order to add a sense of immersion to a user's image.

On the other hand, as organic light emitting display devices become larger, research is being conducted to secure uniform luminance of the display area, and research is being actively conducted to minimize the phenomenon of sagging of the substrate due to the weight of the enlarged substrate.

In the case of a top emission type organic light emitting display device among organic light emitting display devices, a transparent electrode or a transflective electrode is used as a cathode in order to emit light emitted from the organic light emitting layer to the upper portion of the organic light emitting display device. use. In order to obtain sufficient light transmittance of the cathode, the cathode needs to be formed very thin. For example, the cathode is made of an alloy of silver (Ag) and magnesium (Mg) or a transparent conductive oxide (TCO) having a sufficiently thin thickness. However, decreasing the thickness of the cathode increases the electrical resistance of the cathode electrode. For this reason, in the case of an organic light emitting diode display having a large area, a voltage drop is more severe as it moves away from the Vss voltage supply pad that applies the Vss voltage to the cathode, so that the luminance of the organic light emitting display device is not uniform and unbalanced. This can happen.

In order to ensure uniform luminance of the organic light emitting display device, a method of lowering the electrical resistance of the cathode by disposing an auxiliary electrode separately from the driving element and connecting the auxiliary electrode to the cathode may be used.

In order to electrically connect the auxiliary electrode and the cathode, after forming the barrier rib structure in the non-emission area of the organic light emitting display device, a method of exposing the auxiliary electrode at the bottom of the barrier rib structure to connect to the cathode may be used. .

On the other hand, an enlarged organic light emitting display device is manufactured by bonding an upper substrate including a driving element and an organic light emitting element to a lower substrate including a black matrix. The central portion of the sags, which causes the components formed on the lower substrate to be pressed by the upper substrate.

The non-uniform distance between the lower substrate and the upper substrate may affect display quality such as luminance and viewing angle of the organic light emitting display panel, and may cause a problem in that components disposed on the lower substrate are damaged.

[Related technical literature]

1. Organic electroluminescent device and its manufacturing method (Patent Application No. 10-2009-0061834)

Accordingly, the inventors of the present invention studied a structure employing a substrate support layer supporting the upper substrate while connecting the auxiliary electrode and the cathode to support the upper substrate while reducing the resistance of the cathode by using the auxiliary electrode.

The inventors of the present invention found that, as the organic light emitting display device becomes larger, in the process of bonding the upper substrate and the lower substrate, the central portion of the upper substrate is closer to the lower substrate due to the weight of the upper substrate including the black matrix and optionally the color filter. and recognized the problem that the bonding distance increases toward the periphery of the upper substrate. In addition, it was recognized that when a dam for protecting the organic light emitting layer of the organic light emitting display device from moisture and oxygen is disposed around the upper substrate, the bonding distance of the substrate is more distinctly changed.

When the bonding distance of the substrate is changed, color mixing occurs in the organic light emitting display device, and thus a problem occurs in that uniform luminance and a clear image cannot be displayed.

Accordingly, the inventors of the present invention have invented a new structure and method of an organic light emitting display device capable of minimizing the sagging of the upper substrate by employing the support layer.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting display device capable of minimizing sagging of an upper substrate by disposing a substrate sag prevention layer on a lower substrate, and a method of manufacturing the same.

The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

An organic light emitting display device capable of minimizing sagging of an upper substrate according to an embodiment of the present invention is provided. A driving device, an organic light emitting device, a planarization layer, a bank layer, and a substrate sag prevention layer are disposed on a first substrate having a unit pixel area defined as a light emitting area and a non-emission area defined, facing the first substrate and including a black matrix A second substrate is disposed. In the organic light emitting display device according to an embodiment of the present invention, a substrate sag prevention layer is disposed on the bank layer, and a height corresponding to the bonding distance with the second substrate is maintained to minimize the sagging phenomenon of the second substrate when bonding to the second substrate. can do.

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention is provided. After the driving device and the wiring electrode are formed on the first substrate, a planarization layer is formed to planarize it, and the planarization layer is formed to include the TFT connection electrode and the auxiliary electrode connected to the driving device.

Meanwhile, a color filter layer and a black matrix are formed on the second substrate facing the first substrate to be bonded to the first substrate.

In addition, a pixel electrode connected to the TFT connection electrode, a connection electrode connected to the auxiliary electrode, and at least one bank layer are formed on the planarization layer of the first substrate. In addition, the substrate sag prevention layer is formed on one bank layer selected from among the bank layers, but is formed at a height of a bonding distance to the second substrate.

Meanwhile, the organic light emitting layer and the common electrode are formed on the pixel electrode of the first substrate so that the common electrode is connected to the connection electrode exposed under the sag prevention layer of the substrate to be connected to the auxiliary electrode.

The first and second substrates are bonded together using an adhesive side such as resin. In this case, the second substrate is supported by the substrate sag prevention layer to form a uniform bonding gap, and color mixing can be minimized.

The present invention is effective in making the bonding gap of the organic light emitting display device uniform by providing the substrate sag prevention layer.

In addition, the present invention has the effect of minimizing the color mixing phenomenon of the organic light emitting display device by securing a uniform bonding gap by using the substrate sag prevention layer.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a schematic cross-sectional view of an organic light emitting diode display for explaining a structure in which a substrate sag preventing layer supports a second substrate according to an exemplary embodiment of the present invention.
2A is a schematic plan view of an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.
FIG. 2B is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line AB of FIG. 2A .
FIG. 2C is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along the CD of FIG. 2A .
FIG. 2D is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line EF of FIG. 2A .
3A is a schematic plan view of an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.
FIG. 3B is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line AB of FIG. 3A .
3C is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along the CD of FIG. 3A .
FIG. 3D is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line EF of FIG. 3A .
4A to 4H are schematic cross-sectional views illustrating a method of manufacturing an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, cases including the plural are included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention can be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or implemented together in a related relationship. may be

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings for various configurations of an organic light emitting display device including a substrate sag prevention layer according to an embodiment of the present invention.

1 is a schematic cross-sectional view of an organic light emitting diode display for explaining a structure in which a substrate sag preventing layer supports a second substrate according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , the organic light emitting display apparatus 100 includes a first substrate 120 having a unit pixel region 110 defined by a light emitting area 111 and a non-emission area 112 defined, and a first substrate ( and a second substrate 150 facing the 120 and including the black matrix 152 .

The first substrate 120 includes a driving device 121 disposed in the unit pixel region 110 , an organic light emitting device 130 connected to the TFT connection electrode 125 and connected to the driving device 121 , and at least one bank layer. 134 , a connection electrode 124 connected to the auxiliary electrode 123 , and a substrate sag prevention layer 140 disposed on the selected bank layer 134 .

The second substrate 150 includes a black matrix 152 and a color filter 152 , and is bonded to the first substrate 120 to constitute an organic light emitting display device.

The driving device 121 disposed on the first substrate 120 may be a thin film transistor composed of a gate electrode, a source electrode, and a drain electrode. More specifically, the electron movement speed is faster than that of an amorphous thin film transistor composed of a semiconductor layer made of amorphous silicon. It may be a driving device using an oxide semiconductor having a simpler manufacturing process and a relatively lower manufacturing cost than a polysilicon thin film transistor having a semiconductor layer made of polysilicon.

A planarization layer 122 is disposed on the driving device 121 , and the planarization layer 122 may be disposed in one or more layers to include the TFT connection electrode 125 and the auxiliary electrode 123 .

The auxiliary electrode 123 may be included in the planarization layer 122 or disposed on the same plane as the driving device 121 , but is not limited thereto.

A pixel electrode 131 , a bank layer 134 , and a connection electrode 124 are disposed on the flat layer 122 , and the TFT connection electrode 125 connected to the driving device 121 is connected to the pixel electrode 131 and auxiliary The electrode 123 is connected to the connection electrode 124 .

The organic light emitting device 130 including the pixel electrode 131 , the organic light emitting layer 132 , and the common electrode 133 emits light by receiving electrons and holes from the pixel electrode 131 and the common electrode 133 .

The organic light emitting layer 132 may be a red, green, blue or white organic light emitting layer 132, and for smoother injection and transport of electrons and holes, an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, etc. It may be composed of a multi-layer structure including

The auxiliary electrode 123 is connected to the connection electrode 124 , and the connection electrode 124 is connected to the common electrode 133 under the substrate sag prevention layer 140 on the bank layer 134 .

The common electrode 133 may be made of a transparent conductive material such as TCO, and may be formed thin to increase transparency. When the common electrode 133 is thinly formed, the electrical resistance of the common electrode 133 may be increased.

When the electrical resistance of the common electrode 133 is increased, the luminance imbalance of the organic light emitting display apparatus 100 may occur. To solve this problem, the auxiliary electrode 123 may be disposed, and the auxiliary electrode 123 may be connected to the common electrode 133 . In this case, since the electrical resistance of the common electrode 133 is lowered, the luminance imbalance of the organic light emitting display apparatus 100 may be minimized.

Meanwhile, the second substrate 150 may include a black matrix 152 and a color filter 151 corresponding to the non-emission region. The color filter 151 may include one or more color filters selected from among red, blue, and green color filters. An overlapping section may exist between the color filter 151 and the black matrix 152 .

As described above, the first substrate 120 and the second substrate 150 on which each component is disposed are bonded by the adhesive layer 160 . If a uniform bonding distance cannot be maintained during bonding, luminance imbalance of the organic light emitting display apparatus 100 and color mixing between pixels may occur.

The substrate sag prevention layer 140 is disposed on the bank layer 134 , and when the first substrate 120 and the second substrate 150 are bonded, the substrate sag prevention layer 140 is applied to the black of the second substrate 150 . contact with the matrix. By adopting this structure, a uniform bonding distance between the first substrate 120 and the second substrate 150 is maintained while the second substrate 150 is supported by the substrate sag prevention layer 140 .

When the first substrate 120 and the second substrate 150 are bonded using the adhesive layer 160 , in order to further minimize the sagging of the second substrate 150 , the substrate sag prevention layer 140 , the color filter 151 and the black matrix 152 may vertically overlap.

2A is a schematic plan view of an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.

Referring to FIG. 2A , the organic light emitting display apparatus 200 includes a unit pixel area 210 defined by a light emitting area 211 and a non-emission area 212 .

The non-emission region 212 includes a substrate sag prevention layer 240 disposed on the bank layer 234 , and the substrate sag prevention layer 240 is disposed on the first substrate 220 at regular intervals to form the first substrate ( 220) to be able to support the load on the substrate to be cemented on it.

FIG. 2B is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along lines A-B of FIG. 2A .

Referring to FIG. 2B , a planarization layer 222 is disposed on the first substrate 220 on which the driving device 221 and the auxiliary electrode 223 are disposed.

A pixel electrode 231 and a connection electrode 224 are disposed on the planarization layer 222 , and a bank layer 234 is disposed.

The pixel electrode 231 may be made of a metal material that reflects light, and is connected to the driving device 221 to control light emission of a unit pixel.

The connection electrode 224 may be made of substantially the same material as the pixel electrode 231 , but is not limited thereto.

FIG. 2C is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line C-D of FIG. 2A .

Referring to FIG. 2C , a connection electrode 224 , a bank layer 234 , and a substrate sag prevention layer 240 are disposed on the first substrate 220 on which the auxiliary electrode 223 and the planarization layer 222 are disposed.

A substrate sag prevention layer 240 is disposed on the bank layer 234 disposed on the connection electrode 224 , and the substrate sag prevention layer 240 is disposed in a reverse tapered shape to form a common electrode (not shown) and a connection electrode 224 . ) to be electrically connected at the bottom of the substrate sag prevention layer 240 .

FIG. 2D is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along lines E-F of FIG. 2A .

Referring to FIG. 2D , an auxiliary electrode 223 is disposed on the first substrate 220 , and a flattening layer 222 is disposed on the auxiliary electrode 223 .

A connection electrode 224 is disposed on the planarization layer 222 , and the planarization layer 222 includes at least one contact hole for electrically connecting the auxiliary electrode 223 and the connection electrode 224 .

At least one bank layer 234 is disposed on the connection electrode 224 , the substrate sag prevention layer 240 is disposed on the bank layer 234 , and the substrate sag prevention layer 240 may be disposed in a reverse tapered shape. However, the present invention is not limited thereto.

3A is a schematic plan view of an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.

Referring to FIG. 3A , the organic light emitting display device 300 includes a first substrate 310 including a unit pixel area 310 defined by a light emitting area 311 and a non-emission area 312 .

The non-emission region 312 includes a bank layer 334 and a substrate sag prevention layer 340 , and the substrate sag prevention layer 340 is disposed to extend to the adjacent unit pixel region 310 .

3B is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along lines A-B of FIG. 3A .

Referring to FIG. 3B , a driving device 321 and an auxiliary electrode 323 are disposed on a first substrate 320 , and a planarization layer 322 and a bank layer 334 including at least one contact hole are disposed. do.

A pixel electrode 331 and a connection electrode 324 are disposed on the flattening layer 322 , and the pixel electrode 331 is connected to the driving device 321 through a contact hole of the flattening layer 322 , and an auxiliary electrode ( The 323 is connected to the connection electrode 324 through the contact hole of the planarization layer 322 .

The substrate sag prevention layer 340 is disposed on the bank layer 334 , and the substrate sag prevention layer 340 is disposed in a reverse tapered shape so that the connection electrode 324 and the common electrode (not shown) are smoothly connected. do.

3C is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along line C-D of FIG. 3A .

Referring to FIG. 3C , an auxiliary electrode 323 , a planarization layer 322 , a connection electrode 324 , a bank layer 334 , and a substrate sag prevention layer 340 are sequentially disposed on the first substrate 320 .

3C shows a substrate sag prevention layer 340 in the non-emission region 312 of the unit pixel region 310 adjacent to the substrate sag prevention layer 340 disposed in the non-emission region 312 of the unit pixel region 310 of FIG. 3A. ) is a diagram for explaining a structure arranged to extend.

3D is a schematic cross-sectional view of an organic light emitting display device including a substrate anti-sag layer according to an embodiment of the present invention taken along lines E-F of FIG. 3A .

Descriptions of the same or corresponding components as those described with reference to FIGS. 3A to 3C will be omitted. Referring to FIG. 3D , the substrate sag prevention layer 340 is disposed to extend to the plurality of bank layers 334 disposed on the connection electrode 324 , and may have a bridge shape between the plurality of bank layers 334 . have.

4A to 4H are schematic cross-sectional views illustrating a method of manufacturing an organic light emitting display device including a substrate sag preventing layer according to an embodiment of the present invention.

A driving device 421 is formed on the substrate 420 , a planarization layer 422 is primarily formed on the driving device 421 , and a contact hole corresponding to the driving device 421 is formed.

A TFT connection electrode 425 and an auxiliary electrode 423 are formed on the flattening layer 422 . Next, a second planarization layer 422 is formed, but a contact hole is formed to expose a portion of the TFT connection electrode 425 and the auxiliary electrode 423 .

In the method of forming the planarization layer 422 at once instead of dividing it into two parts, the driving device 421 and the auxiliary electrode 423 are formed on the first substrate 420 , and the planarization layer 422 is formed, A contact hole is formed to expose a portion of the device 421 and the auxiliary electrode 423 .

Next, a pixel electrode 431 and a connection electrode 424 corresponding to the emission region (not shown) are formed on the planarization layer 422 .

The pixel electrode 431 is formed to be connected to the driving element 421 or the TFT connection electrode 425 , and the connection electrode 424 is formed to be connected to the auxiliary electrode 423 .

The auxiliary electrode 423 may be formed of the same material as an electrode selected from a source electrode, a drain electrode, and a gate electrode constituting the driving device 421 .

Next, a bank layer 434 is formed in a non-emission area (not shown), but a predetermined portion of the connection electrode 424 is exposed.

A substrate sag prevention layer 440 is formed on the bank layer 434 formed to expose a portion of the connection electrode 424 .

Next, an organic light emitting layer 432 is formed and a common electrode 433 is formed. Since the organic light emitting layer 432 has a low step coverage, a certain portion of the connection electrode 424 is exposed by the substrate sag prevention layer 440 . do. Since the common electrode 433 has a higher step coverage than the organic emission layer 432 , it is connected to the exposed connection electrode 424 .

The substrate sag prevention layer 440 is formed by adjusting the height in consideration of the distance to the substrate to be bonded thereon, but to have a uniform height so that a uniform bonding distance to the substrate to be bonded can be maintained.

According to another feature of the present invention, the second substrate may further include a color filter layer.

According to another feature of the present invention, the color filter layer may include a color filter layer selected from a red color filter layer, a green color filter layer, and a blue color filter layer.

According to another feature of the present invention, in the color filter layer, at least two color filter layers selected from a red color filter layer, a green color filter layer, and a blue color filter layer overlap the black matrix, and the substrate sag prevention layer may be connected to the overlapping color filter layer.

According to another feature of the present invention, the substrate anti-sag layer may be located on the bank layer.

According to another feature of the present invention, the planarization layer may include an auxiliary electrode, the organic light emitting device may include a pixel electrode, an organic emission layer, and a common electrode, and the auxiliary electrode may be adjacent to the substrate sag prevention layer and connected to the common electrode.

According to another feature of the present invention, the substrate sag prevention layer may be connected to the substrate sag prevention layer of an adjacent unit pixel area.

According to another feature of the present invention, the substrate anti-sag layer may be connected to the black matrix.

According to another feature of the present invention, forming the common electrode may include connecting the auxiliary electrode and the common electrode.

According to another feature of the present invention, the forming of the planarization layer may include forming at least one contact hole in the planarization layer.

According to another feature of the present invention, the step of forming the color filter layer and the black matrix on the second substrate includes forming a red color filter layer, a blue color filter layer and a green color filter layer, and on the black matrix, the red color filter layer The method may include forming at least two color filter layers selected from a color filter layer, a blue color filter layer, and a green color filter layer to overlap.

According to another feature of the present invention, the step of bonding the first substrate and the second substrate with the adhesive layer includes adjusting the bonding position so that the overlapping at least two color filter layers and the substrate anti-sag layer are in contact to support the second substrate. may include

Claims (13)

a first substrate on which a unit pixel area including a light emitting area and a non-emission area is defined;
a second substrate facing the first substrate and including a black matrix and a color filter layer;
a driving device, a planarization layer, and an organic light emitting device on the first substrate;
a bank layer on the planarization layer;
an auxiliary electrode disposed on the planarization layer in the non-emission region and a connection electrode connected to the auxiliary electrode and a common electrode of the organic light emitting device; and
It is positioned on the bank layer in the non-emission region and includes a substrate sag prevention layer having a reverse taper shape,
The substrate sag prevention layer extends to adjacent unit pixel areas and has a bridge shape between a plurality of bank layers,
In the non-emission region, the bank layer is disposed to be in direct contact with the connection electrode,
The organic light emitting display device according to claim 1, wherein the connection electrode, the bank layer of the non-emission area, two color filter layers respectively disposed in two adjacent unit pixel areas, the black matrix, and the substrate sag prevention layer are vertically overlapped at the same time. According to claim 1,
The color filter layer is disposed under the second substrate, and the black matrix is disposed under the color filter layer. According to claim 1,
The color filter layer comprises a color filter layer selected from a red color filter layer, a green color filter layer, and a blue color filter layer. 4. The method of claim 3
The substrate sag prevention layer is an organic light emitting display device, characterized in that connected to the overlapping color filter layer. delete According to claim 1,
The organic light emitting device includes a pixel electrode, an organic light emitting layer, and the common electrode,
The auxiliary electrode is adjacent to the substrate sag prevention layer and the organic light emitting display device, characterized in that connected to the common electrode. delete According to claim 1,
The substrate sag prevention layer is an organic light emitting display device, characterized in that connected to the black matrix. forming a driving device and a wiring electrode on a first substrate in which a unit pixel area including a light emitting area and a non-emission area is defined;
forming a color filter layer and a black matrix on a second substrate;
forming a flattening layer including a TFT connection electrode connected to the driving device and an auxiliary electrode on the driving device;
forming a pixel electrode connected to the TFT connection electrode, a connection electrode connected to the auxiliary electrode, and a plurality of bank layers on the planarization layer;
forming a substrate sag prevention layer to have a bridge shape between adjacent bank layers on a selected one of the plurality of bank layers;
forming an organic light emitting layer and a common electrode on the pixel electrode; and
bonding the first substrate and the second substrate with an adhesive layer such that the connection electrode, the bank layer of the non-emission region, two color filter layers, the black matrix, and the substrate sag prevention layer are vertically overlapped at the same time, ,
The method of manufacturing an organic light emitting display device, characterized in that in the non-emission region, the bank layer is disposed to be in direct contact with the connection electrode. 10. The method of claim 9,
The forming of the common electrode comprises connecting the auxiliary electrode and the common electrode. 10. The method of claim 9,
The forming of the planarization layer may include forming at least one contact hole in the planarization layer. 10. The method of claim 9,
forming a color filter layer and a black matrix on the second substrate;
Forming a red color filter layer, a blue color filter layer, and a green color filter layer,
and forming, on the black matrix, at least two color filter layers selected from the red color filter layer, the blue color filter layer, and the green color filter layer to overlap each other. 13. The method of claim 12,
bonding the first substrate and the second substrate with an adhesive layer;
and adjusting a bonding position so that the overlapping at least two color filter layers and the substrate sag prevention layer come into contact with each other to support the second substrate.

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