CN107565046B - Organic light emitting display panel and its manufacturing method and display device - Google Patents
Organic light emitting display panel and its manufacturing method and display device Download PDFInfo
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- CN107565046B CN107565046B CN201710705372.8A CN201710705372A CN107565046B CN 107565046 B CN107565046 B CN 107565046B CN 201710705372 A CN201710705372 A CN 201710705372A CN 107565046 B CN107565046 B CN 107565046B
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Abstract
This application discloses a kind of organic light emitting display panel and its manufacturing methods and display device.Organic light emitting display panel includes array substrate, cover board and inorganic sealant, array substrate is provided with power Metal layer, a plurality of first data wire lines and the first inorganic insulation layer in region that inorganic sealant covers, inorganic insulation layer is between the first data wire lines and power Metal layer, power Metal layer and the first data wire lines part are overlapping, first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arc-shaped recess portion, and the first inorganic insulation layer is at least partly directly contacted with inorganic sealant.According to the scheme of the application, it is arranged to multiple first arcuate projections and multiple first arc-shaped recess portion that have staggered by the first inorganic insulation layer for covering inorganic sealant, and contact the first inorganic insulation layer at least partly directly with inorganic sealant, improve the reliability of encapsulation.
Description
Technical field
Present application relates generally to field of display technology more particularly to a kind of organic light emitting display panel and its manufacturing method and
Display device.
Background technique
With the development of information technology, people are higher and higher to the performance requirement of FPD.As after cathode-ray tube
Third generation display technology after display and liquid crystal display, OLED (Organic Light Emitting Diode, organic light emission
Diode) display have at low cost, visual angle is wide, driving voltage is low, fast response time, luminous color are abundant, preparation process is simple,
The advantages that large area flexible display can be achieved, is considered one of display technology most with prospects.
Due to luminous organic material vulnerable to oxygen, moisture influence and fail, the requirement to encapsulation is higher, mostly uses glass at present
Glass glue carrys out encapsulating organic light emitting display panel.Glass cement is a kind of inorganic sealant, is melted and is solidified by laser irradiation, thus
The array substrate of organic light emitting display panel and cover board are bonded together and realize the effect of encapsulation.
However, needing to be provided in the following frame region (that is, side of connection integrated circuit) of organic light emitting display panel
Multilayer wiring, for example, data line, power supply line etc., and under normal conditions, power supply line is directly contacted with glass cement, and glass cement
It is weaker with metallic surface binding force, the reliability of encapsulation can be reduced.
Summary of the invention
In view of drawbacks described above in the prior art or deficiency, it is intended to provide a kind of organic light emitting display panel and its manufacturer
Method and display device, to solve the technical problems existing in the prior art.
According to the one aspect of the application, provide a kind of organic light emitting display panel, including array substrate, cover board and
Inorganic sealant for array substrate and cover board to be bonded together, array substrate include underlay substrate and are arranged in substrate
Power Metal layer, the first data metal layer and the first inorganic insulation layer on substrate, data metal layer include a plurality of first data
Metal wire；Between the first data metal layer and power Metal layer, the first data wire lines are set first inorganic insulation layer
In the fan-out area of peripheral region, power Metal layer and fan-out area part are overlapping, and peripheral region surrounds display area；It is inorganic
Sealant is arranged in the packaging area of peripheral region, and power Metal layer and the first data metal layer and packaging area are handed over
It is folded；In the region that fan-out area and packaging area overlap, the first inorganic insulation layer has staggered multiple first arcs
Protruding portion and multiple first arc-shaped recess portion, and the first inorganic insulation layer is at least partly directly contacted with inorganic sealant.
According to the another aspect of the application, a kind of production method of organic light emitting display panel is additionally provided, is included in lining
The fan-out area of substrate forms the first data metal layer, and the first data metal layer includes a plurality of first data wire lines, and first
Data metal layer and packaging area are overlapping；It covers the first data metal layer and forms the first inorganic insulation layer, in fan-out area and envelope
It fills in the overlapping region in region, the first inorganic insulation layer has staggered multiple first arcuate projections and multiple first arcs
Shape recessed portion；Power Metal layer is formed on the first inorganic insulation layer, in the region of power Metal layer overlapped with packaging area
It is middle to form multiple first openings, multiple second arcuate projections and multiple second arc-shaped recess portion, power Metal layer and fanout area
Domain part is overlapping, and power Metal layer and packaging area are overlapping, and the second arcuate projection covers the first arcuate projection, the second arc
Recessed portion covers the first arc-shaped recess portion；In the packaging area coating inorganic sealant of cover board；Fitting cover board simultaneously solidifies inorganic envelope
Frame glue makes cover board be bonded together with array substrate, and array substrate includes underlay substrate, power Metal layer, the first data metal
Layer and the first inorganic insulation layer, the first inorganic insulation layer are at least partly directly contacted with inorganic sealant；Wherein, fan-out area and
Packaging area is located at peripheral region, and peripheral region surrounds display area
According to the another aspect of the application, a kind of display device is additionally provided, including organic light emitting display panel as above.
Organic light emitting display panel and its manufacturing method and display device provided by the present application, by covering inorganic sealant
First inorganic insulation layer of lid is arranged to multiple first arcuate projections and multiple first arc-shaped recess portion that have staggered,
And contact the first inorganic insulation layer at least partly directly with inorganic sealant, improve the reliability of encapsulation.
Detailed description of the invention
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon:
Figure 1A shows the schematic diagram of the organic light emitting display panel of the application one embodiment；
Figure 1B shows the enlarged diagram of region SS in Figure 1A；
Fig. 1 C shows the sectional view of the line I-I along Figure 1B；
Fig. 1 D shows the sectional view of the line II-II along Figure 1B；
Fig. 2 shows a kind of schematic diagrames of optional implementation of Figure 1A illustrated embodiment；
Fig. 3 shows a kind of schematic diagram of optional implementation of Figure 1A illustrated embodiment；
Fig. 4 shows the schematic diagram of the organic light emitting display panel of another embodiment of the application；
Fig. 5 shows the laser irradiation effect diagram of the organic light emitting display panel of embodiment illustrated in fig. 4；
Fig. 6 shows the schematic diagram of the organic light emitting display panel of the another embodiment of the application；
Fig. 7 A shows the schematic diagram of first inorganic insulation layer of the application one embodiment；
Fig. 7 B shows the schematic diagram of first inorganic insulation layer of the application one embodiment；
Fig. 8 shows the schematic flow chart of one embodiment of the production method of the application organic light emitting display panel；
Fig. 9 A~Fig. 9 E shows cutting for the part manufacture craft of the organic light emitting display panel of the application one embodiment
Face figure；
Figure 10 A~Figure 10 B shows the sectional view of the manufacture craft of the inorganic insulation layer of the embodiment of the present application；
Figure 11 shows the schematic diagram being exposed using the first mask plate；
Figure 12 shows the schematic diagram of one embodiment of the display device of the application.
Specific embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, part relevant to invention is illustrated only in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Figure 1A shows the schematic diagram of the organic light emitting display panel of the application one embodiment, and Figure 1B is shown
The enlarged diagram of region SS in Figure 1A, Fig. 1 C show the sectional view of the line I-I along Figure 1B.
As shown in Figure 1A~Fig. 1 C, organic light emitting display panel may include array substrate 11, cover board 12 and inorganic sealant
13, inorganic sealant 13 is for array substrate 11 and cover board 12 to be bonded together.Organic light emitting display panel can be divided into display
Region DA and peripheral region NDA around display area DA, peripheral region NDA include fan-out area FA and packaging area PA, fan
The part region FA and packaging area PA is overlapping out.
Array substrate 11 includes underlay substrate SUB and the first data metal layer DL1 being arranged on underlay substrate SUB, the
One inorganic insulation layer IL1 and power Metal layer PL, the first data metal layer DL1 include a plurality of first data wire lines Da, it is used for
Transmit data voltage signal.Wherein, the first inorganic insulation layer IL1 be located at the first data metal layer DL1 and power Metal layer PL it
Between, the first data metal layer DL1 is arranged in the FA of fan-out area, and power Metal layer PL and the part fan-out area FA are overlapping, that is,
Orthographic projection and first data wire lines D of the power Metal layer PL to the first data metal layer DL1aIt is overlapping.
Inorganic sealant 13 is arranged in packaging area PA, and power Metal layer PL and the first data metal layer DL1
It is all overlapping with inorganic sealant 13.In the region that fan-out area FA and packaging area PA is overlapped, the first inorganic insulation layer IL1 tool
There are staggered multiple first arcuate projection ILa and multiple first arc-shaped recess portion ILb, and the first inorganic insulation layer
IL1 is at least partly directly contacted with inorganic sealant 13, for example, in the first inorganic insulation layer IL1 not by power Metal layer PL
In the region of covering.
In the present embodiment, by the way that the first inorganic insulation layer covered by inorganic sealant to be arranged to have multiple first arcs
Shape protruding portion and multiple first arc-shaped recess portion, increase the contact area between the first inorganic insulation layer and inorganic sealant,
The surface adhesion of the first inorganic insulation layer Yu inorganic sealant is increased, the reliability of encapsulation is improved.Meanwhile there is the arc
The lateral stress that first inorganic insulation layer of shape concaveconvex structure can generate inorganic sealant in encapsulation process is to other directions
Release to reduce the lateral stress that the first inorganic insulation layer is born, and then is avoided due to the first inorganic insulation layer transverse direction
Deformation is excessive and causes the metal wire of lower layer (for example, first data wire lines) generation bad (for example, fold, fracture etc..)
Although Figure 1B and Fig. 1 C shows the first inorganic insulation layer IL1 in the lower edges parallel with organic light emitting display panel
There is the first staggered arcuate projection ILa and the first arc-shaped recess portion ILb, but this is only schematical on direction.
It should be appreciated that the first inorganic insulation layer IL1 can also have on the direction vertical with the lower edge of organic light emitting display panel
Staggered the first arcuate projection and the first arc-shaped recess portion, or organic light emitting display panel lower edges parallel and
All there is the first staggered arcuate projection and the first arc-shaped recess portion, those skilled in the art can on vertical direction
It is configured according to the needs of practical application scene.
Optionally, it in the region that fan-out area FA and packaging area PA is overlapped, is provided in power Metal layer PL multiple
First opening OP1, in the first opening OP1, the first inorganic insulation layer IL1 is directly contacted with inorganic sealant 13.
Pass through setting it is multiple first opening, on the one hand, facilitate sufficiently discharge metal power layer generate stress (for example,
The metal stresses generated in encapsulation process), avoid metal power layer due to deformation is excessive and generating fold (and then causes to encapsulate
It is bad)；On the other hand, the contact area between the first inorganic insulation layer and inorganic sealant is further increased, is further increased
The big surface adhesion of inorganic sealant and the first inorganic insulation layer, improves the reliability of encapsulation.
Optionally, array substrate further includes the reflective metal layer being arranged between underlay substrate and the first inorganic insulation layer.
With specific reference to Fig. 1 D, the sectional view of the line II-II along Figure 1B is shown.As shown in figure iD, array substrate 11 is by nothing
It is additionally provided with reflective metal layer RL in the region that machine sealant 13 covers, reflective metal layer RL is located at the first inorganic insulation layer IL1
Between underlay substrate SUB, be provided in reflective metal layer RL it is multiple second opening OP2, and reflective metal layer RL be fanned out to
Region FA is not overlapped, that is to say, that the region not overlapped in packaging area PA with fan-out area FA is arranged in reflective metal layer RL
In.
By the way that reflective metal layer is arranged in the packaging area not overlapped with fan-out area, light source in encapsulation process can be improved
The utilization rate of (for example, laser) makes inorganic sealant sufficiently melt solidification, and the second opening can be such that reflective metal layer generates
Stress sufficiently discharges, avoid because stress is excessive and it is bad to generate deformation.
Optionally, the first inorganic insulation layer IL1 can have third opening OP3 in the second opening OP2, for further increasing
Add the contact area of the first inorganic insulation layer IL1 Yu inorganic sealant 13.
Although Fig. 1 D shows third opening, OP3 does not extend through the first inorganic insulation layer IL1, this is only schematic
, it should be understood that third is open OP3 can also be through the first inorganic insulation layer IL1, to make inorganic sealant 13 and the first nothing
Layer contact below machine insulating layer.
Optionally, array substrate further includes barrier metal layer and Source and drain metal level, barrier metal layer, Source and drain metal level and the first number
It is located at same metal layer with reflective metal layer according to one in metal layer.
With specific reference to Fig. 2, a kind of schematic diagram of optional implementation of Figure 1A illustrated embodiment is shown.Such as Fig. 2 institute
Show, array substrate further includes barrier metal layer and Source and drain metal level, and barrier metal layer includes multiple gate electrode GEs, and Source and drain metal level includes
Multiple source electrode SE and multiple drain electrode DE, gate electrode GE, source electrode SE and drain electrode DE constitute thin film transistor (TFT).
Wherein, one in barrier metal layer, Source and drain metal level and the first data metal layer DL1 is located at reflective metal layer RL
Same layer metal layer, and formed being made in patterning process with along with.For example, reflective metal layer RL passes through with barrier metal layer
Patterning process is made by same layer metal film with along with.
By the way that one in barrier metal layer, Source and drain metal level and the first data metal layer is set with reflective metal layer same layer
It sets, it may not be necessary to increase additional technique production reflective metal layer, to not increase technology difficulty and production cost.
Optionally, in the region of packaging area not overlapped with fan-out area, the first inorganic insulation layer IL1 also has friendship
The multiple third arcuate projection ILc and multiple third arc-shaped recess portion ILd of mistake arrangement, as shown in figure 3, showing shown in Figure 1A
A kind of schematic diagram of optional implementation of embodiment.
It, can be to other directions by the way that the first inorganic insulation layer in entire packaging area is arranged to arcuate relief structure
The lateral stress that inorganic sealant generates is discharged, lower metal (for example, reflective metal layer) is avoided fold occur.
With continued reference to Fig. 4, the schematic diagram of the organic light emitting display panel of another embodiment of the application is shown.
Similar with embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, organic light emitting display panel equally may include battle array
Column substrate 41, cover board 42 and inorganic sealant 43, array substrate 41 equally may include underlay substrate SUB, the first data metal layer
DL1, the first inorganic insulation layer IL1 and power Metal layer PL, the first inorganic insulation layer IL1 can equally have staggered multiple
First arcuate projection ILa and multiple first arc-shaped recess portion ILb.
Unlike embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, power Metal layer PL has been carried out into one
The restriction of step.
Specifically, as shown in figure 4, power Metal layer PL has more in the overlapping region in fan-out area and packaging area
A second arcuate projection PLa and multiple second arc-shaped recess portion PLb, wherein the second arcuate projection PLa covers the first arc
Protruding portion ILa, the second arc-shaped recess portion PLb cover the first arc-shaped recess portion PLb, the second arcuate projection PLa and the second arc
Recessed portion PLb is directly contacted with inorganic sealant 43.
The usefulness of the present embodiment is described below with reference to Fig. 5, the organic light emission that Fig. 5 shows embodiment illustrated in fig. 4 is aobvious
Show the laser irradiation effect diagram of panel.
When irradiating inorganic sealant (not shown) with light source (for example, laser), light is irradiated to electricity through inorganic sealant
It on the surface of source metal layer PL, is then reflected in inorganic sealant, so that the utilization rate of light source can be improved.
In the case where power Metal layer PL has flat surfaces, the laser only quilt on the direction of vertical substrates substrate SUB
Reflection, therefore the energy that the inorganic sealant on different height receives can be variant, so that it is heated to will lead to inorganic sealant
Uneven or heating is insufficient.And in the case where power Metal layer PL has arcuate relief structure, vertical substrates substrate SUB is incident
Laser can not only be reflected on different height, but also can be reflected to all directions, as shown by the arrows in Figure 5 that
Sample to keep the energy in inorganic sealant more uniform, and keeps inorganic sealant heated more sufficiently.
In the present embodiment, by the way that power Metal layer to be arranged to have multiple second arcuate projections and multiple second arcs
Recessed portion reflects light in different height, different angle, improves the uniformity of energy in inorganic sealant.
With continued reference to Fig. 6, the schematic diagram of the organic light emitting display panel of the another embodiment of the application is shown.
Similar with embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, organic light emitting display panel equally may include battle array
Column substrate 61, cover board 62 and inorganic sealant 63, array substrate 61 equally may include underlay substrate SUB, the first data metal layer
DL1, the first inorganic insulation layer IL1 and power Metal layer PL, the first inorganic insulation layer IL1 can equally have staggered multiple
First arcuate projection ILa and multiple first arc-shaped recess portion ILb.
Unlike embodiment shown in Figure 1A~Fig. 1 C, in the present embodiment, array substrate 61 has been carried out further
Restriction.
Specifically, as shown in fig. 6, array substrate 61 may also include the second insulating layer IL2 being arranged on underlay substrate SUB
It include a plurality of second data wire lines D with the second data metal layer DL2, the second data metal layer DL2b, it is used for transmission data electricity
Press signal.Wherein, second insulating layer IL2 is between the first data metal layer DL1 and the second data metal layer DL2, the second number
According to metal layer DL2 between second insulating layer IL2 and underlay substrate SUB, the second data metal layer DL2 is arranged on fanout area
It is in domain and overlapping with inorganic sealant 63.
In the present embodiment, by the first data metal layer of setting and the second data metal layer, in organic light emitting display panel
In the case that the total amount of data line remains unchanged, reduce the first data wire lines in the first data metal layer quantity and
Reduce the quantity of the second data wire lines in the second data metal layer, so as to reduce chip area shared by fan-out area,
It is advantageously implemented narrow frame and realizes the organic light emitting display panel of higher resolution.
Optionally, the first data wire lines DaOrthographic projection and the second data wire lines D to underlay substrate SUBbTo substrate base
The orthographic projection of plate SUB is staggered and does not overlap.
As the first data wire lines DaWith the second data wire lines DbThere are it is overlapping when, to organic light emitting display panel apply
When data-signal, the first data wire lines DaWith the second data wire lines DbOverlapping region can generate parasitic capacitance, to influence
The write-in of data.
Pass through the first data wire lines DaWith the second data wire lines DbIt is set as being staggered and not overlap, can avoid posting
Influence of the raw capacitor to data-signal, to mention high display quality.
In addition, when a layer data line such as first data metal layer DL1 is only arranged, between the first data wire lines between
Away from larger, such as 3 μm~4 μm.And be arranged after two layers of data line, although for the data metal for being located at same data metal layer
For line, spacing is still 3 μm~4 μm, but for the data line in different data metal layer, such as adjacent to each other
One data wire lines DaWith the second data wire lines DbBetween spacing be smaller than 1 μm, for example, only 0.7 μm or so, thus pole
The earth reduces the spacing between data line.
In addition, by by the first data wire lines DaWith the second data wire lines DbIt is set as being staggered and not overlap, also
It may make the first data wire lines DaWith the second data wire lines DbThe fan-out area of basic covering underlay substrate SUB, so that
Light in encapsulation process through the first inorganic insulation layer IL1 is by the first data wire lines DaWith the second data wire lines DbReflection, from
And further increase the utilization rate of light source.
Inventors have found that the first arcuate projection ILa and the first arc-shaped recess portion ILb exist in the first inorganic insulation layer IL1
Maximum distance on the direction vertical substrates substrate SUB will affect the table between the first inorganic insulation layer IL1 and inorganic sealant 63
Face bonding force and the lateral stress being applied on the first inorganic insulation layer IL1.
Optionally, on the direction of vertical substrates substrate, the first arcuate projection and the first adjacent arc-shaped recess portion it
Between maximum distance be the first inorganic insulation layer maximum gauge 10%~100%.
With specific reference to Fig. 7 A, the schematic diagram of first inorganic insulation layer of the application one embodiment is shown.Such as Fig. 7 institute
Show, on the direction of vertical substrates substrate SUB, between the first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb
Maximum distance is h, and the maximum gauge of the first inorganic insulation layer IL1 is d, then:
When the first arcuate projection ILa and the first arc-shaped recess portion ILb meet above-mentioned condition, can effectively increase inorganic
Bonding force between sealant and the first inorganic insulation layer IL1, and the transverse direction that the first inorganic insulation layer IL1 receiving is effectively reduced is answered
Power.
Optionally, on the direction of vertical substrates substrate, between each first arcuate projection and underlay substrate it is maximum away from
From identical, the minimum range between each first arc-shaped recess portion and underlay substrate is identical.
For example, in fig. 7, the maximum distance between the first arcuate projection ILa and each first arc-shaped recess portion ILb is equal
For h.
By setting identical for the maximum distance between each first arcuate projection and each first arc-shaped recess portion, in shape
At the technology difficulty phase in the technique in the first arcuate projection and the first arc-shaped recess portion, performed etching to the first inorganic insulation layer
To simple and also smaller to the damage of the film layer (for example, first data metal layer) below the first inorganic insulation layer.
Optionally, on the direction of vertical substrates substrate, there are at least two first arcuate projections and underlay substrate it
Between maximum distance it is different, and/or there are the minimum range between at least two first arc-shaped recess portions and underlay substrate is different.
For example, Fig. 7 B shows the schematic diagram of first inorganic insulation layer of the application one embodiment, in figure 7b, one
Maximum distance between first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb is h1, and another first arc is prominent
Maximum distance between portion ILa and the first adjacent arc-shaped recess portion ILb is h2, another first arcuate projection ILa with it is adjacent
The first arc-shaped recess portion ILb between maximum distance be h3, wherein h1 > h2 > h3.
It, can by setting different for the maximum distance between each first arcuate projection and each first arc-shaped recess portion
The contact area and contact depth for further increasing inorganic sealant and the first inorganic insulation layer are (in the side of vertical substrates substrate
To), and then increase package strength.In addition, when power Metal layer has the second arcuate projection and the second arc-shaped recess portion, the
Maximum distance between two arcuate projections and the second arc-shaped recess portion is also different, so that power Metal layer is to light source (example
Such as, laser) reflection it is more uniform, inorganic sealant received energy on different height, different directions is more uniform, into one
Step improves the uniformity of energy in inorganic sealant.
Although Fig. 7 B is shown on the direction of vertical substrates substrate SUB, the first arcuate projection ILa and underlay substrate
The distance between SUB is identical, and the first arc-shaped recess portion ILb is different from the distance between underlay substrate SUB, this is only schematic
's.It should be appreciated that the distance between the first arcuate projection ILa and underlay substrate SUB can also be different, the first arc-shaped recess portion
The distance between ILb and underlay substrate SUB can also be identical, simply by the presence of the first arcuate projection ILa and the first adjacent arc
Maximum distance between shape recessed portion ILb is different from other the first arcuate projection ILa and the first adjacent arc-shaped recess portion ILb
Between maximum distance.
In addition, disclosed herein as well is a kind of production method of organic light emitting display panel, for making above-mentioned each implementation
The organic light emitting display panel of example.
The production method that organic light emitting display panel is described below in conjunction with Fig. 8 and Fig. 9 A~Fig. 9 E, Fig. 8 show this
Apply for that the schematic flow chart of one embodiment of the production method of organic light emitting display panel, Fig. 9 A~Fig. 9 E show this Shen
Please one embodiment organic light emitting display panel part manufacture craft sectional view.
The production method of organic light emitting display panel includes:
Step 810, the first data metal layer is formed in the fan-out area of underlay substrate, the first data metal layer includes a plurality of
First data wire lines, the first data metal layer and packaging area are overlapping.
As shown in Figure 9 A, the first data metal layer DL1 is formed in the fan-out area (not shown) of underlay substrate SUB, first
Data metal layer DL1 includes a plurality of first data wire lines Da。
Step 820, the first data metal layer of covering forms the first inorganic insulation layer, overlapping in fan-out area and packaging area
Region in, the first inorganic insulation layer have staggered multiple first arcuate projections and multiple first arc-shaped recess portion.
As shown in Figure 9 B, the first data metal layer DL1 is covered on underlay substrate SUB forms the first inorganic insulation layer IL1,
In the region that fan-out area and packaging area (not shown) overlap, the first inorganic insulation layer IL1 is formed with multiple first arcs
Protruding portion ILa and multiple first arc-shaped recess portion ILb, the first arcuate projection ILa and the first arc-shaped recess portion ILb staggered row
Cloth.
The specific forming process of first inorganic insulation layer IL1, Figure 10 A~figure are described below in conjunction with Figure 10 A~Figure 10 B
10B shows the sectional view of the manufacture craft of the inorganic insulation layer of the embodiment of the present application.Form the first inorganic insulation layer IL1 packet
It includes:
Firstly, as shown in Figure 10 A, the first data metal layer DL1 is covered on underlay substrate SUB, and to be sequentially depositing first inorganic
Insulating film IL ' and the first photoresist film PR.
Then, as shown in Figure 10 B, the first photoresist film PR is exposed using the first mask plate (not shown), developed,
Form the first photoetching agent pattern PR ', wherein the first photoetching agent pattern PR ' is formed with staggered multiple arcs protruding portion PRa
With arc-shaped recess portion PRb.
Finally, being performed etching (for example, dry etching) to the first photoetching agent pattern PR ' and the first inorganic insulating membrane IL ', formed such as
First inorganic insulation layer IL1 shown in Fig. 9 B.
With continued reference to Fig. 8, step 830, power Metal layer is formed on the first inorganic insulation layer, power Metal layer with
Multiple first openings, multiple second arcuate projections and multiple second arc-shaped recess portion are formed in the overlapping region of packaging area,
Power Metal layer and fan-out area part are overlapping, and power Metal layer and packaging area are overlapping, the second arcuate projection covering first
Arcuate projection, the second arc-shaped recess portion cover the first arc-shaped recess portion.
As shown in Figure 9 C, power Metal layer PL is formed on the first inorganic insulation layer IL1, in packaging area, power supply gold
Belong to and is formed with multiple first opening OP1, multiple second arcuate projection PLa and multiple second arc-shaped recess portion PLb in layer PL, the
One opening OP1 the first inorganic insulation layer of exposure IL1, the second arcuate projection PLa covers the first arcuate projection ILa, the second arc
Shape recessed portion PLb covers the first arc-shaped recess portion ILb, and power Metal layer PL and the first part data metal layer DL1 are overlapping.
Through the above steps, the array substrate 91 of organic light emitting display panel is formed.
Step 840, in the packaging area coating inorganic sealant of cover board.
As shown in fig. 9d, in the packaging area coating inorganic sealant 93 of cover board 92, for example, glass cement.
Step 850, it is bonded cover board and solidifies inorganic sealant, so that cover board is bonded together with array substrate, array substrate
Including underlay substrate, power Metal layer, the first data metal layer and the first inorganic insulation layer, the first inorganic insulation layer and inorganic envelope
Frame glue at least partly directly contacts.
As shown in fig. 9e, the cover board 92 for being coated with inorganic sealant 93 fits in array substrate 91, then uses light
Source (for example, laser) melts and solidifies inorganic sealant 93, so that cover board 92 be made to be bonded together with array substrate 91.Wherein,
Power Metal layer PL is directly contacted with inorganic sealant 93, and the first inorganic insulation layer IL1 and inorganic sealant 93 are in the first opening
It is directly contacted in OP1.
Optionally, the first mask plate is double slit mask plate.
With specific reference to Figure 11, the schematic diagram being exposed using the first mask plate is shown.As shown in figure 11, double slit exposure mask
Version MASK is the mask plate for being exposed processing to photosensitive material (for example, photoresist) using the two-slit interference of light, and light can felt
Luminescent material surface forms alternatively distributed clear zone (superposition interference occurring, intensity of illumination is higher) and (destructive interference, light occur for dark space
It is weaker according to intensity), the photosensitive material positioned at clear zone is exposed, and the photosensitive material for being located at dark space is not exposed, to form tool
There is the photoetching agent pattern of multiple staggered arcuate projections and arc-shaped recess portion, for example, photoetching agent pattern shown in Figure 10 B
PR’。
Disclosed herein as well is a kind of display devices, as shown in Figure 12.Wherein, display device 1200 may include as above
Organic light emitting display panel.It will be appreciated by those skilled in the art that display device is in addition to including organic light emitting display face as above
It can also include some other well known structures except plate.It, will be no longer to known in these in order not to obscure the emphasis of the application
Structure be described further.
The display device of the application can be any device comprising organic light emitting display panel as above, including but unlimited
In cellular mobile phone 1200 as shown in figure 12, tablet computer, computer display, be applied to intelligent wearable device on
Display, applied to display device on the vehicles such as automobile etc..As long as display device contains disclosed in the present application
The structure of organic light emitting display panel has just been contemplated as falling within the protection scope of the application.
Organic light emitting display panel and its manufacturing method and display device, organic light emitting display panel provided by the present application exist
The first inorganic insulation layer with arcuate relief structure in the region that fan-out area and packaging area overlap, and first is inorganic exhausted
Edge layer is at least partly directly contacted with inorganic sealant, improves the reliability of encapsulation.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (14)
1. a kind of organic light emitting display panel, which is characterized in that including array substrate, cover board and be used for the array substrate
The inorganic sealant being bonded together with the cover board, the array substrate include underlay substrate and are successively set on the lining
The first data metal layer, the first inorganic insulation layer and power Metal layer on substrate, first data metal layer include more
The first data wire lines of item；
First inorganic insulation layer is between first data metal layer and the power Metal layer, first data
Metal wire is arranged in the fan-out area of peripheral region, and the power Metal layer and the fan-out area part are overlapping, described
Peripheral region surrounds display area；
The inorganic sealant is arranged in the packaging area of the peripheral region, and the power Metal layer and described
One data metal layer and the packaging area are overlapping；
In the region that the fan-out area and the packaging area overlap, first inorganic insulation layer has staggered
Multiple first arcuate projections and multiple first arc-shaped recess portion are provided with multiple first openings in the power Metal layer,
In first opening, first inorganic insulation layer is directly contacted with the inorganic sealant.
2. organic light emitting display panel according to claim 1, which is characterized in that in the fan-out area and the encapsulation
In the overlapping region in region, the power Metal layer has multiple second arcuate projections and multiple second arc-shaped recess portion, institute
It states the second arcuate projection and covers first arcuate projection, second arc-shaped recess portion covers first arc-shaped recess
Portion；
Second arcuate projection and second arc-shaped recess portion are directly contacted with the inorganic sealant.
3. organic light emitting display panel according to claim 1, which is characterized in that the array substrate further includes that setting exists
Reflective metal layer between the underlay substrate and first inorganic insulation layer, the reflective metal layer are located at the encapsulation region
Domain, and do not overlapped with the fan-out area；
Multiple second openings are provided in the reflective metal layer.
4. organic light emitting display panel according to claim 1, which is characterized in that the array substrate further includes second exhausted
Edge layer and the second data metal layer, second data metal layer include a plurality of second data wire lines, the second insulating layer
It is arranged between first data metal layer and second data metal layer, second data metal layer is arranged on
Between the underlay substrate and the second insulating layer；
Second data metal layer and the packaging area are overlapping.
5. organic light emitting display panel according to claim 4, which is characterized in that first data wire lines are to described
The orthographic projection of underlay substrate is staggered to the orthographic projection of the underlay substrate with second data wire lines and does not overlap.
6. organic light emitting display panel according to claim 3, which is characterized in that the array substrate further includes grid metal
Layer and Source and drain metal level；
One in the barrier metal layer, the Source and drain metal level and first data metal layer and the reflective metal layer position
It is made in patterning process in same metal layer and with along with.
7. organic light emitting display panel according to claim 3, which is characterized in that in the packaging area and the fan
In the region that region does not overlap out, first inorganic insulation layer has staggered multiple third arcuate projections and multiple
Third arc-shaped recess portion, the third arcuate projection and third arc-shaped recess portion directly connect with the inorganic sealant
Touching.
8. organic light emitting display panel according to claim 1, which is characterized in that in the direction of the vertical underlay substrate
On, the maximum distance between first arcuate projection and adjacent first arc-shaped recess portion is described first inorganic exhausted
The 10%~100% of edge layer maximum gauge.
9. organic light emitting display panel according to claim 8, which is characterized in that in the direction of the vertical underlay substrate
On, each first arcuate projection is identical as the maximum distance between the underlay substrate, each first arc-shaped recess portion
Minimum range between the underlay substrate is identical.
10. organic light emitting display panel according to claim 9, which is characterized in that in the side of the vertical underlay substrate
Upwards, there are at least two first arcuate projections are different from the maximum distance between the underlay substrate, and/or exist
At least two first arc-shaped recess portions are different from the minimum range between the underlay substrate.
11. a kind of display device, which is characterized in that including such as described in any item organic light emitting display faces claim 1-10
Plate.
12. a kind of production method of organic light emitting display panel characterized by comprising
The first data metal layer is formed in the fan-out area of underlay substrate, first data metal layer includes a plurality of first data
Metal wire, first data metal layer and packaging area are overlapping；
It covers first data metal layer and forms the first inorganic insulation layer, it is overlapping in the fan-out area and the packaging area
Region in, first inorganic insulation layer have staggered multiple first arcuate projections and multiple first arc-shaped recess
Portion；
Power Metal layer is formed on first inorganic insulation layer, in the overlapping with the packaging area of the power Metal layer
Region in form multiple first openings, multiple second arcuate projections and multiple second arc-shaped recess portion, the power Metal
Layer is overlapping with the fan-out area part, and the power Metal layer and the packaging area are overlapping, second arcuate projection
First arcuate projection is covered, second arc-shaped recess portion covers first arc-shaped recess portion；
In the packaging area coating inorganic sealant of cover board；
It is bonded the cover board and solidifies the inorganic sealant, so that the cover board is bonded together with array substrate, the array
Substrate includes the underlay substrate, the power Metal layer, first data metal layer and first inorganic insulation layer, institute
The first inorganic insulation layer is stated at least partly directly to contact with the inorganic sealant；
Wherein, the fan-out area and the packaging area are located at peripheral region, and the peripheral region surrounds display area.
13. production method according to claim 12, which is characterized in that covering first data metal layer is formed
First inorganic insulation layer includes:
It covers first data metal layer and is sequentially depositing the first inorganic insulating membrane and the first photoresist film；
First photoresist film is exposed using the first mask plate, it is overlapping in the fan-out area and the packaging area
Region in form staggered the first photoetching agent pattern of arcuate projection and arc-shaped recess portion；
First photoetching agent pattern and first inorganic insulating membrane are performed etching to form first inorganic insulating membrane.
14. production method according to claim 13, which is characterized in that first mask plate is double slit mask plate.
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| CN107565057B (en) * | 2017-08-29 | 2020-04-03 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN107833979A (en) * | 2017-10-31 | 2018-03-23 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN108493226B (en) * | 2018-05-14 | 2021-04-30 | 上海天马有机发光显示技术有限公司 | Electronic equipment, display panel and preparation method thereof |
| CN109192767B (en) * | 2018-11-01 | 2020-08-21 | 武汉天马微电子有限公司 | Display panel and display device |
| US20220320234A1 (en) * | 2020-09-29 | 2022-10-06 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, manufacturing method thereof, and display device |
| CN112397669B (en) * | 2020-11-26 | 2024-01-23 | 武汉天马微电子有限公司 | Display module, manufacturing method thereof and display device |
| US20230092961A1 (en) * | 2021-02-26 | 2023-03-23 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, method of manufacturing the same and display device |
| CN116897470A (en) * | 2022-01-29 | 2023-10-17 | 京东方科技集团股份有限公司 | Antenna, display substrate and display device |
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