KR20110020663A

KR20110020663A - Mounting module of electronic components

Info

Publication number: KR20110020663A
Application number: KR1020090078390A
Authority: KR
Inventors: 신동민
Original assignee: 삼성전기주식회사
Priority date: 2009-08-24
Filing date: 2009-08-24
Publication date: 2011-03-03

Abstract

PURPOSE: A mounting assembly module is provided to mount a plurality of mounting devices on a printed circuit board by guiding the mounting position on the right position of the pad. CONSTITUTION: A device mounting module comprises a printed circuit board(100), a pad(120) of the rectangular type, a solder layer(140), and an LED module(160). The LED module forms the solder layer by being supplied with the soldering lead on the pad. The solder lead is electrically bonded by the soldering.

Description

Mounting module of electronic components

The present invention relates to a mounting component module, and more particularly, to a mounting component module that can be stably mounted in a fixed position without distorting left and right or up and down when mounting an electronic component on a printed circuit board.

In general, most IT devices and electronics are being developed in a multifunctional trend to meet the needs of consumers.

As the multifunctionalization of electronic products proceeds as described above, a method of precisely mounting a large number of electronic components in a small area of a printed circuit board is continuously required.

A printed circuit board component mounting process is a work process of fixing a surface mounted device (SMD) or an injection mounted device (IMD) by soldering to a surface of a printed circuit board. However, only one type of insert is mounted, or surface mount parts and inserts are mounted together, and recently, surface mount parts and inserts are often mounted together.

1 is a schematic view showing a structure of a printed circuit board on which the surface mount component 10 according to the related art is mounted.

As illustrated in FIG. 1, electrodes (not shown) are formed at both ends of the surface mount component 10, and the surface mount component 10 corresponds to each electrode at a position where the surface mount component 10 is disposed. Pads 35 are formed respectively.

At this time, a solder 50 made of solidified lead, which is a medium for bonding each pad 35 and each electrode, is formed at a portion at which each electrode of the surface mounting component 10 is bonded to each pad 35.

In the surface-mounting component 10 as described above, both ends of the surface-mounting component 10 on which the electrode is formed are placed on the solder layer in a state in which solidified lead is supplied on each pad 35 to form a solder 50 layer. The printed circuit board 30 on which the component 10 is mounted is passed through a heating furnace of a hot atmosphere where the soldering temperature is set, thereby melting the solder of the solder layer and soldering the solder onto the pad 35 to electrically bond the same. .

However, in the soldering process of the surface mount component 10, the surface mount component 10 may not be fixed at the correct position on the pad 35 due to various external factors such as vibration, and may be distorted vertically or horizontally. 2A and 2B, the surface mounting component 10 is distorted in the vertical direction or the left and right directions of the pad 35, or various twisting phenomena such as the surface mounting component 10 is rotated at an angle as shown in FIG. 2C. There was a problem that occurred.

In particular, when the surface-mounting component 10 emits light, there may be a problem in that brightness variation occurs due to misalignment when the component is mounted or interference with an external device is reduced. The size of the pad 35 may be designed to improve the distortion of the mounting parts. However, in this case, the heat of the mounting parts may not be smooth, thereby affecting the performance of itself and the peripheral parts due to heat generated during LED emission. There was a problem going crazy.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to form a non-thermally conductive region partitioned in an arc shape in the corner portion of the mounting pad for electrically bonding the mounting component to the printed circuit board, The present invention provides a mounting component module which can be stably mounted without mounting left and right or up and down when mounting a component on a printed circuit board and precisely mounts a plurality of mounting components in a narrow area in the printed circuit board.

Component mounting module of the present invention for solving the above technical problem, a printed circuit board; A pad stacked on the printed circuit board; A solder layer formed on the pad; An electrode is provided at one side, and the electrode is electrically bonded to the pad through the solder layer, and includes a mounting component mounted on the pad. An edge portion of the pad has an arc shape in an inner direction of the pad. And a rounded portion which is a partitioned non-thermally conductive region is formed.

The round part may be formed at at least one corner of the pad.

In this case, the round part may be formed by covering a part of the pad by a PSR layer stacked on the printed circuit board.

As the mounting component, an LED component expressing light may be employed.

According to the mounting component module of the present invention having the above-described configuration, by forming a round portion, which is a non-thermally conductive region partitioned in an arc shape, at a corner portion of a pad for joining components to a printed circuit board, the solder layer is melted to form the component on the pad. In the case of joining, the solder layer can be pushed and formed only in the heat conduction area of the pad located inside the round part, so that the mounting position of the component is guided to the pad position. It can be minimized, and thus there is an advantage in that a plurality of components can be mounted more precisely within a narrow area of the printed circuit board. In particular, when the component to be mounted is an LED component that emits light, it is possible to prevent the brightness deviation due to the distortion when the LED component is mounted and the brightness deterioration due to interference with external equipment, and to increase additional costs or to manufacture additional equipment. The advantage is that no additional cost is incurred.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view showing the structure of a component mounting module according to an embodiment of the present invention, Figure 4 is a cross-sectional view of the component mounting module shown in FIG.

As shown in Figure 3 and 4, the component mounting module according to the present invention is a printed circuit board 100, the pad 120 of the rectangular shape stacked on the printed circuit board 100 at regular intervals, and It includes a solder layer (140) which is a solder layer formed on the pad 120, and the LED module 160, which is a mounting component electrically bonded to the pad 120 through the solder layer 140.

The LED module 160 includes an LED device capable of emitting light by receiving power, and electrodes (not shown) having polarities of (+) / (-) are formed on the bottom of both ends thereof.

At this time, the LED module 160 is placed on the solder layer 140 in the state that the solder is supplied on the pad 120 and the solder layer 140 is formed, and solder the printed circuit board on which the LED module 160 is mounted. By passing through a heating furnace of a hot atmosphere having a set temperature, the solder of the solder layer 140 is melted and soldered onto the pad 120 to be electrically bonded.

The pads 120 are formed in the same rectangular shape as the LED module 160 and are respectively bonded to both ends of the LED module 160, and the four corner portions of each pad 120 are soldered when soldering the LED module 160 to each other. The round part 124, which is a non-heat conduction region in which heat conduction by the layer 140 is not formed, is partitioned.

At this time, the round part 124 is an arc-shaped area around each corner of the rectangular pad 120 and invaded inwardly of the pad 120, and the round part 124 is printed as shown in FIG. 4. A portion of the edge of the pad 120 is covered by the PSR layer 130 stacked on the circuit board 100.

The round part 124 is formed on at least one or more corner portions of the pad 120, and may be formed by varying the number of the round parts 124 as necessary.

In addition, the round portion 124 may be formed by varying the radius (R) from the corner portion of the pad 120, which is the center of the arc, round depending on the size of the LED module 160 mounted on the pad 120 The radius R of the part 124 may be variously changed and applied.

In addition, the present invention can be implemented in the same form as the above-described LED module 160 mounting structure by applying a variety of mounting components other than the LED module 160 on the printed circuit board 100.

According to the present invention having the above-described configuration, the round portion 124 which is an arc-shaped non-heat conduction region is formed at each corner of the pad 120 for electrically bonding the LED module 160 to the printed circuit board 100. When the solder of the solder layer 140 is melted to bond the LED module 160 to the pad 120, the round parts 124 each of which the solder layer 140 is formed of the PSR layer 130, which is a non-heat conductive region, is formed. Interfering with each other and being pushed into the pad 120, both ends of the LED module 160 to be mounted is guided and fixed on the pad 120. Accordingly, when the LED module 160 is mounted, the phenomenon in which the pad 120 is shifted from side to side or up and down can be minimized, and the plurality of LED modules 160 are more precisely mounted in a narrow area of the printed circuit board 100. As a result, it is possible to prevent the brightness deviation due to the distortion of the LED components and the brightness deterioration due to the interference with external devices, and the additional cost such as additional cost increase or additional production of equipment is incurred. .

1 is a schematic view showing a structure of a printed circuit board mounted with a surface mount component according to the prior art.

Figures 2a to 2c is an exemplary view schematically showing a state that the upper and lower sides and various changes to the mounting pad when mounting the surface mounting component according to the prior art.

3 is a plan view showing the structure of a component mounting module according to an embodiment of the present invention.

4 is a cross-sectional view of the component mounting module shown in FIG. 3.

100: printed circuit board 120: pad

124: round part 130: PSR layer

140: solder layer 160: LED module

Claims

Printed circuit board;

A pad stacked on the printed circuit board;

A solder layer formed on the pad;

An electrode is provided at one side, and the electrode is electrically bonded to the pad through the solder layer to include a mounting component mounted on the pad.

And a round part formed at a corner portion of the pad, wherein the round part is formed in an arc shape in an inner direction of the pad and is partitioned in a non-heat conduction area.

The mounting component module of claim 1, wherein the round part is formed at at least one corner of the pad.

The mounting component module of claim 2, wherein the round part is formed by covering a portion of the pad by a PSR layer formed on the printed circuit board.

The mounting component module according to claim 1 or 2, wherein the mounting component is an LED component expressing light.