CN1881551A - Method for restoring integrated circuit chip and printed steel plate private for the same - Google Patents
Method for restoring integrated circuit chip and printed steel plate private for the same Download PDFInfo
- Publication number
- CN1881551A CN1881551A CNA2005100267530A CN200510026753A CN1881551A CN 1881551 A CN1881551 A CN 1881551A CN A2005100267530 A CNA2005100267530 A CN A2005100267530A CN 200510026753 A CN200510026753 A CN 200510026753A CN 1881551 A CN1881551 A CN 1881551A
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- China
- Prior art keywords
- chip
- steel plate
- base
- printed steel
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method for repairing the integrated circuit chip, which comprises: first, using brand iron to clear the welding point of planted chip, and using alcohol to clean the chip and device; then arranging the low mould of printing steel plate on the base and arranging the planted chip on the low mould, turning on the vacuum valve of printing steel plate; then matching the up and low moulds of printing steel plate to be brushed in the groove of up mould for two time; taking out the up mould and turning down the vacuum valve; at last, taking out the chip, using static hot wind gun to fuse the tin pastern. The invention also discloses a relative printing steel plate formed by up mould, low mould and base; the low mould is arranged on the base horizontally; the chip is arranged between the up and low moulds; the base is mounted with a vacuum breaker, a vacuum steering valve and a gas inlet. The inventive repaired chip has high quality.
Description
Technical field
The present invention relates to a kind of method of restoring integrated circuit chip, also relate to a kind of printed steel plate that is exclusively used in this method.
Background technology
Repair the normally welding by hand of method of chip, if be that the chip of BGA (ball of arranging according to grid) just carries out the chip reparation with the repair platform.If it is bad but not former material is bad that chip causes when being SMT (surface mounting technology) piece, just chip planted ball, welds on the repair platform then.But because the client considers expense or consistency of product at design aspect, use some special materials, thereby on producing and keeping in repair, brought many troubles.
Fig. 1, Fig. 2 are the chips that uses in a Palm type.Fig. 1 is LCSP (nothing is planted ball Chip Packaging mode) the chip pictorial diagram of the BCM2002BlueQ of Broadcom company production.Fig. 2 is a chip feature schematic diagram shown in Figure 1.This chip tin sphere gap is 0.5mm, and the diameter of tin ball is 0.25～0.3mm, and solder mask definition tin ball has nickel plating or silver-plated on the Copper Foil.
Fig. 3 is this chip bad phenomenon data analysis table aborning.This chip has so high bad phenomenon, and its main cause is to have only PAD (pad) on this chip, does not have the tin ball.The SMT piece fully how by the tin cream quality on the PCB (printed circuit board (PCB)), so, be very high to the requirement of SMT piece.The reparation of corresponding these defective productss has also caused no small trouble to chip maker.
Fig. 4 is that the PAD size is identical, the similar chip product pictorial diagram that PAD spacing size is identical.As shown in Figure 4, though PAD and PAD spacing size is the same, clearly smaller of the distance between the chip PAD on the right.If with the general ball mode of planting, the tin ball can be melted in together in heating, can't plant ball at all.If as SMT print solder paste on PCB, owing on the PCB other components and parts have been arranged when repairing, reparation very difficult.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of method of restoring integrated circuit chip, and this method makes the reparation chip faster more convenient, and the chip quality of repairing is better.For this reason, the present invention also will provide a kind of printed steel plate that is exclusively used in this method.
For solving the problems of the technologies described above, the method for a kind of restoring integrated circuit chip of the present invention comprises following operating procedure: at first, the PAD cleaning of chip that will wait to plant ball with flatiron is clean, and is clean chip and equipment cleaning with alcohol; Then, the counterdie of printed steel plate is flat on the base, the chip of waiting to plant ball is placed on the counterdie, open the valve of the suction vacuum of printed steel plate; Then, the patrix of printed steel plate is cooperated fully with counterdie, in the groove of patrix, come backwash twice; Afterwards, take off patrix, turn off the valve of inhaling vacuum; At last, take off chip, use the static heat gun, tin cream is melted fully.
A kind of printed steel plate that is exclusively used in said method of the present invention mainly is made up of upper die and lower die and base, and counterdie is flat on the base, places chip between the upper die and lower die, is provided with vacuum brake, vacuum reversal valve and air admission hole on base.Described vacuum brake is located at the base lower right.Described vacuum reversal valve is located at the base lower left.Described air admission hole is located at chassis left side, and is positioned at the centre of chip placement location.
Compare with prior art, the present invention has following beneficial effect: utilize printed steel plate print solder paste on the PAD of chip, can reach the consistency of the planarization and the height of tin cream, make the quality of the typographic tin cream of chip better, and the mode speed of print solder paste be not only fast but also convenient.The method of this reparation chip makes the reparation chip faster more convenient, and the chip quality better effects if of repairing.
Description of drawings
Fig. 1 is LCSP (nothing is planted ball Chip Packaging mode) the chip pictorial diagram of the BCM2002BlueQ of prior art Broadcom company production;
Fig. 2 is a chip feature schematic diagram shown in Figure 1;
Fig. 3 is a chip shown in Figure 1 bad phenomenon data analysis table aborning;
Fig. 4 is that prior art PAD size is identical, the similar chip product pictorial diagram that PAD spacing size is identical;
Fig. 5 is the structural representation of printed steel plate of the present invention;
Fig. 6 is the effect contrast figure that the present invention and prior art are repaired chip.
Embodiment
The present invention is further detailed explanation below in conjunction with drawings and Examples.
The method of a kind of restoring integrated circuit chip of the present invention comprises following operating procedure: the first step, and the PAD cleaning is clean the chip that will plant ball with flatiron; Second step, clean the chip and the equipment cleaning of waiting to plant ball with alcohol; The 3rd step was flat on the counterdie of printed steel plate on the base, then the chip of waiting to plant ball was placed on the counterdie, then opened the valve of the suction vacuum of printed steel plate; The 4th step cooperated the patrix of printed steel plate fully with counterdie, came backwash twice then in the groove of patrix; The 5th step, take off patrix, turn off the valve of inhaling vacuum; The 6th step, take off chip, use the static heat gun then, tin cream is melted fully.
As shown in Figure 5, a kind of printed steel plate that is exclusively used in above-mentioned reparation chip method of the present invention mainly is made up of patrix 1, counterdie 2 and base 3.Counterdie 2 is flat on the base 3, places chip between patrix 1 and the counterdie 2.On base 3, be provided with vacuum brake 4, vacuum reversal valve 5 and air admission hole 6.Vacuum brake 4 is located at base 3 lower rights, and vacuum reversal valve 5 is located at base 3 lower lefts, and air admission hole 6 is located at base 3 left sides, and is positioned at the centre of chip placement location.This printed steel plate has added the function of inhaling vacuum in the position of placing chip, can reach the consistency of the planarization and the height of tin cream, make the quality of the typographic tin cream of chip better, and the mode speed of print solder paste is not only fast but also convenient.
As shown in Figure 6, the chip on the left side is with the general result that the ball mode is repaired that plants, and the chip on the right is the result who repairs with the printed steel plate mode.Through contrast, the chip on the right is better than the repairing quality of the chip on the left side.
Claims (5)
1, a kind of method of restoring integrated circuit chip is characterized in that, comprises following operating procedure: at first, the pad cleaning of chip that will wait to plant ball with flatiron is clean, and is clean chip and equipment cleaning with alcohol; Then, the counterdie of printed steel plate is flat on the base, the chip of waiting to plant ball is placed on the counterdie, open the valve of the suction vacuum of printed steel plate; Then, the patrix of printed steel plate is cooperated fully with counterdie, in the groove of patrix, come backwash twice; Afterwards, take off patrix, turn off the valve of inhaling vacuum; At last, take off chip, use the static heat gun, tin cream is melted fully.
2, a kind of printed steel plate that is exclusively used in the described method of claim 1, it is characterized in that this printed steel plate mainly is made up of upper die and lower die and base, counterdie is flat on the base, place chip between the upper die and lower die, on base, be provided with vacuum brake, vacuum reversal valve and air admission hole.
3, printed steel plate as claimed in claim 2 is characterized in that, described vacuum brake is located at the base lower right.
4, printed steel plate as claimed in claim 2 is characterized in that, described vacuum reversal valve is located at the base lower left.
5, printed steel plate as claimed in claim 2 is characterized in that, described air admission hole is located at chassis left side, and is positioned at the centre of chip placement location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100267530A CN100431123C (en) | 2005-06-15 | 2005-06-15 | Method for restoring integrated circuit chip and printed steel plate private for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100267530A CN100431123C (en) | 2005-06-15 | 2005-06-15 | Method for restoring integrated circuit chip and printed steel plate private for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1881551A true CN1881551A (en) | 2006-12-20 |
| CN100431123C CN100431123C (en) | 2008-11-05 |
Family
ID=37519676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100267530A Expired - Fee Related CN100431123C (en) | 2005-06-15 | 2005-06-15 | Method for restoring integrated circuit chip and printed steel plate private for the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100431123C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056478A (en) * | 2012-12-26 | 2013-04-24 | 美尔森电气保护系统(上海)有限公司 | Melt tin coating mechanism and tin coating method |
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN111299736A (en) * | 2020-03-18 | 2020-06-19 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110148565A (en) * | 2019-05-24 | 2019-08-20 | 深圳市视景达科技有限公司 | A kind of simplified method of plant ball of bga chip recycling |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652462A (en) * | 1993-04-05 | 1997-07-29 | Matsushita Electric Industrial Co., Ltd. | Multilevel semiconductor integrated circuit device |
| JP3381565B2 (en) * | 1997-07-29 | 2003-03-04 | 松下電器産業株式会社 | Bonding method of work with bump |
| CN2565235Y (en) * | 2002-04-24 | 2003-08-06 | 华为技术有限公司 | Tin bead placing device |
| CN2572556Y (en) * | 2002-10-08 | 2003-09-10 | 王卫平 | BGA integrated circuit tin-ball implanting device |
-
2005
- 2005-06-15 CN CNB2005100267530A patent/CN100431123C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN103855041B (en) * | 2012-12-06 | 2017-12-22 | 北京普源精电科技有限公司 | A kind of chip ball-planting device and method |
| CN103056478A (en) * | 2012-12-26 | 2013-04-24 | 美尔森电气保护系统(上海)有限公司 | Melt tin coating mechanism and tin coating method |
| CN103056478B (en) * | 2012-12-26 | 2016-04-13 | 美尔森电气保护系统(上海)有限公司 | A kind of melt Shang Xi mechanism and upper tin method |
| CN111299736A (en) * | 2020-03-18 | 2020-06-19 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
| CN111299736B (en) * | 2020-03-18 | 2021-09-28 | 英特尔产品（成都）有限公司 | Method for repairing product with desoldering failure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100431123C (en) | 2008-11-05 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20190615 |