KR20080043451A - Apparatus for reparing of ball grid array - Google Patents

Apparatus for reparing of ball grid array Download PDF

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KR20080043451A
KR20080043451A KR1020060112025A KR20060112025A KR20080043451A KR 20080043451 A KR20080043451 A KR 20080043451A KR 1020060112025 A KR1020060112025 A KR 1020060112025A KR 20060112025 A KR20060112025 A KR 20060112025A KR 20080043451 A KR20080043451 A KR 20080043451A
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package
circuit board
bga package
bracket
bad
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KR1020060112025A
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Korean (ko)
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KR100847109B1 (en
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이종애
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이종애
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A repairing apparatus of a BGA package is provided to perform easily a bad BGA package removal process by using a balance weight. A repairing apparatus of a BGA package separates a printed circuit board(100) and a BGA package(200) mounted on the printed circuit board from each other. A heating unit applies hot wind to the printed circuit board and the bad BGA package. A separation unit(300) is positioned under the bad BGA package to separate the bad BGA package and the printed circuit board from each other. The separation unit includes a bracket(310) fixed to the outside of the bad package and a balance weight(320) positioned at a lower center surface of the bracket.

Description

비지에이 패키지의 리페어링 장치{apparatus for reparing of ball grid array}Apparatus for reparing of ball grid array}

도 1은 종래 비지에이 패키지의 리페어링 장치를 나타낸 구성도.1 is a block diagram illustrating a repairing apparatus of a conventional BG package.

도 2는 본 발명에 따른 비지에이 패키지의 리페어링 장치를 나타낸 구성도.Figure 2 is a block diagram showing a repairing apparatus of a busy package according to the present invention.

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

100 : 회로기판 200 : (비지에이)패키지100: circuit board 200: (VISA) package

300 : 분리수단 310 : 브래킷300: separating means 310: bracket

320 : 무게추320: weight

본 발명은 반도체 패키지의 리페어링(reparing) 장치에 관한 것으로서, 보다 상세하게는 비지에이 패키지의 리페어링 장치에 관한 것이다.The present invention relates to a repairing apparatus for a semiconductor package, and more particularly, to a repairing apparatus for a visual package.

근래들어 반도체 제품은 멀티미디어의 확대, 디지털의 진전에 따라 대규모화, 대용량화, 동작의 고속화, 다기능화, 소형화, 및 저소비전력화의 요구가 점점 높아짐에 따라 파인 피치(fine pitch) 및 다 핀화가 이루어지고 있다.In recent years, semiconductor products have become fine pitch and multi-finger as the demand for large-scale, large-capacity, high-speed operation, multi-functional, miniaturized, and low power consumption increases with the expansion of multimedia and digital progress. have.

이에따라 패키지 형태는 인쇄회로기판을 사용한 비지에이(BGA;Ball Grid Array) 패키지로 전화되는 추세이며, 이러한 비지에이 패키지로는 마이크로 패키지나 와이어 본딩 비지에이 패키지등이 있다.Accordingly, the package type is being converted into a ball grid array (BGA) package using a printed circuit board, and such a package includes a micro package or a wire bonding visual package.

이들 비지에이 형태를 갖는 패키지들은 활성면에 솔더볼을 부착하여 제조되며, 보통 하나의 기판에 2개 이상 수십개의 비지에이들이 부착되는 구조를 취하고 있다.Packages having these shapes are manufactured by attaching solder balls to an active surface, and usually have two or more dozens of devices on one substrate.

한편, 이러한 비지에이 패키지를 인쇄회로기판에 부착한후에 불량이 발생될 수 있는 바, 이런 경우에는 불량 패키지를 제거하고 새로운 양질의 패키지를 리페어링하게 된다.On the other hand, a defect may occur after attaching such a package to a printed circuit board. In this case, the defective package is removed and a new high quality package is repaired.

도 1에는 이러한 불량 패키지를 제거하기 위한 종래 리페어링 장치를 나타내 보였다.1 shows a conventional repairing apparatus for removing such a defective package.

이는, 회로기판(10)상에 실장된 볼 그리드 어레이 패키지(20)상에 불량이 야기될 경우 이를 분리 제거하기 위하여, 패키지(20) 상부에서 가열수단(30)을 통해 패키지(20)상에 열풍(熱風)을 가하여 융점 온도까지 도달하게 되면, 도시되지 않은 진공노즐(미도시)를 통해 불량 상태의 패키지(20)를 제거하고 세로운 패키지(20)를 실장하는 구조이다.This is carried out on the package 20 through the heating means 30 on the top of the package 20 in order to separate and remove a defect in the case of a failure on the ball grid array package 20 mounted on the circuit board 10. When hot air is applied to reach the melting point temperature, the package 20 is removed and a new package 20 is mounted through a vacuum nozzle (not shown).

그러나 이러한 종래 리페어링 장치에 있어서는, 열풍을 통해 가하는 시간이 매우 오래 걸림으로써 신속한 리페어링이 이루어지지 못하는 문제점이 야기된다.또한 열풍을 가하는 과정에서 불량 상태가 아닌 온전한 상태의 패키지(20)에도 영향을 주게됨으로서 실장된 패턴상에 문제점이 발생될 우려가 야기되며, 전체적으로 고르게 열풍이 가해지지 않고 일측으로 집중적으로 가해지기 때문에 열 전도의 불균일에 의한 패턴상의 불량이 야기될 치명적인 문제점이 내재되어 있다.However, in such a conventional repairing apparatus, the time required for applying the hot air is very long, which causes a problem that rapid repairing cannot be performed. In addition, in the hot air applying process, it may affect the package 20 in an intact state rather than a bad state. As a result, there is a concern that a problem may occur on the mounted pattern, and since a hot air is intensively applied to one side rather than being uniformly applied as a whole, a fatal problem that causes a pattern defect due to uneven heat conduction is inherent.

이외에도 분리된 패키지를 흡착하기 위한 고가의 진공노즐을 마련하여야 하는 부담감이 있는 문제점도 내재되어 있다.In addition, there is a problem in that there is a burden of providing an expensive vacuum nozzle for adsorbing the separated package.

본 발명은 이와같은 종래의 제반 문제점을 해결하기 위하여 창출된 것으로서, 불량 패키지를 신속하고 정확하게 분리 제거할 수 있으며, 다른 온전한 상태의 패키지에 영향을 끼치지 않는 것은 물론이고, 저가의 장비를 통해 불량 패키지의 제거를 신속하게 행할 수 있는 비지에이 패키지의 리페어링 장치를 제공함에 그 목적이 있다.The present invention was created in order to solve such a conventional problem, it is possible to quickly and accurately remove and remove the defective package, and does not affect other intact packages, as well as low-cost equipment through It is an object of the present invention to provide a repairing apparatus for a busy package capable of quickly removing a package.

이와같은 목적을 달성하기 위하여 본 발명에 따른 비지에이 패키지의 리페어링 장치는, 회로기판과, 이에 실장된 비지에이 패키지를 분리하기 위한 비지에이 리페어링 장치를 구성함에 있어서, 상기 회로기판과 불량이 야기된 패키지상에 균일하게 가열수단을 통해 열풍을 가하고, 상기 불량 야기된 패키지 직하면에 무게에 의해 패키지와 회로기판을 분리시키는 분리수단을 마련하여 된 것을 그 특징으로 한다.In order to achieve the above object, a repairing apparatus of a BG package according to the present invention comprises a circuit board and a BG repairing apparatus for separating a BG package mounted thereon, whereby a defect occurs with the circuit board. The hot air is uniformly applied to the package through the heating means, and a separation means for separating the package and the circuit board by weight is provided on the directly underside of the defective-induced package.

본 발명의 바람직한 한 특징은, 상기 분리수단은, 불량이 야기된 패키지의 외측면 에 이를 감싸는 형태로 걸림 고정되는 브래킷과; 상기 브래킷의 하부 중심면에 마련되며 소정의 중량을 갖는 무게추;로 이루어진 것에 있다.One preferred feature of the present invention, the separating means, and the bracket is fixed to the form that wraps around the outer surface of the package caused the defect; It is provided in the lower center surface of the bracket and having a weight having a predetermined weight.

본 발명의 바람직한 다른 한 특징은, 상기 회로기판과 비지에이 패키지를 가열수단을 통해 균일하게 가열하는 것은, 리플로우 장비상에서 이루어지는 것에 있다.Another desirable feature of the present invention is to uniformly heat the circuit board and the BG package through heating means, on a reflow equipment.

이와같은 본 발명의 특징적인 구성 및 이에따른 작용효과는 후술하는 첨부된 도면을 참조한 발명의 상세한 설명을 통해 더욱 명확해 질 것이다.Such a characteristic configuration and the resulting effects of the present invention will become more apparent from the following detailed description of the invention with reference to the accompanying drawings.

도 2는 본 발명에 따른 리페어링 장치의 개략적 구성도이다.2 is a schematic configuration diagram of a repairing apparatus according to the present invention.

이에 나타내 보인 바와 같이 본 고안에 따른 비지에이 패키지의 리페어링 장치는, 회로기판과, 이에 실장된 비지에이 패키지를 분리하기 위한 비지에이 리페어링 장치를 구성함에 있어서, 회로기판(100)과 불량이 야기된 패키지(200)상에 균일하게 가열수단(미도시)을 통해 열풍을 가하고, 불량 야기된 패키지(200) 직하면에 무게에 의해 패키지(200)와 회로기판(100)을 분리시키는 분리수단(300)이 마련된다.As shown therein, the repairing apparatus of the BG package according to the present invention comprises a circuit board and a BG repairing device for separating the BG package mounted thereon, whereby a defect occurs with the circuit board 100. Separation means 300 to apply a hot air uniformly on the package 200 through a heating means (not shown), and separate the package 200 and the circuit board 100 by weight on the surface directly below the defective package 200 ) Is provided.

이때 전술한 도시되지 않은 가열수단은 통상의 전기적인 가열장치를 사용함이 바람직하며, 특히 회로기판(100)과 패키지(200)를 전체적으로 균일하게 가열하기 위해서는 근래에 각광을 받고 있는 통상의 리플로우 장비 예컨대 리플로우 오븐등지에서 이루어지도록 함이 더욱 바람직할 것이다.한편, 분리수단(300)은 실질적으로 본 발명의 특징적인 요소를 갖고 있는 것으로서, 그 구조를 보면, 크게 브래킷(bracket;310)과, 무게추(weight抽;320)로 이루어진다.In this case, it is preferable that the above-mentioned heating means not shown uses a conventional electric heating device. In particular, in order to uniformly heat the circuit board 100 and the package 200 as a whole, the conventional reflow equipment has been in the spotlight in recent years. For example, it may be more preferable to make it in a reflow oven or the like. On the other hand, the separating means 300 has substantially the characteristic elements of the present invention. It consists of weight 320 (320).

브래킷(310)은 대략 사각틀 형상을 이루고 있는 것으로서, 불량이 야기된 패키지(200)의 외측면에 이를 감싸는 형태로 걸림 고정된다.The bracket 310 is formed in a substantially rectangular frame shape, and is fixed to the outer surface of the package 200 in which the defect is caused in such a manner as to surround the bracket 310.

즉, 사용자가 불량이 야기된 패키지(200)상에 이를 직접 걸림 고정시키는 것이다.In other words, the user directly locks the package 200 on the defective package.

무게추(320)는, 소정의 중량을 갖고 있는 것으로서, 브래킷(310)의 중심 하면에 고정 설치된다.The weight 320 has a predetermined weight and is fixed to the center lower surface of the bracket 310.

이와같이 구성된 본 발명에 따른 비지에이 패키지 리페어링 장치는, 먼저 리플로우 장비상에 회로기판(100)과 패키지(200)를 위치시키고, 도시되지 않은 가열수단을 통해 전체적으로 균일하게 열풍을 가한다.In the BGA repairing apparatus according to the present invention configured as described above, the circuit board 100 and the package 200 are first placed on the reflow equipment, and the hot air is uniformly applied throughout the heating means (not shown).

물론 이때 불량이 야기된 패키지(200)상에는 분리수단(300) 즉, 브래킷(310)과 무게추(320)가 위치된 상태이다.Of course, the separation means 300, that is, the bracket 310 and the weight 320 is located on the package 200 caused the defect.

이러한 상태에서 어느 일정시간 열풍이 균일하게 가해지게 되면, 융점 온도에 달하게 되고, 무게추(320)의 중량에 의해 불량이 야기된 패키지(200)가 회로기판(100)으로부터 탈락하게 되고, 이를 제거한 상태에서 새로운 패키지(200)를 실장하게 되면, 온전한 비지에이 패키지를 얻을 수 있게된다.In this state, if the hot air is uniformly applied for a certain time, the melting point temperature is reached, and the package 200 caused by the weight of the weight 320 falls out of the circuit board 100 and is removed. When the new package 200 is mounted in the state, it is possible to obtain a complete business package.

이상에서는 본 발명을 특정의 실시예로써 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형이 가능할 것이다.Although the present invention has been described in terms of specific embodiments, the present invention is not limited to the above-described embodiments, and those skilled in the art without departing from the gist of the present invention claimed in the claims. Anyone can make a variety of variations.

상술한 바와 같이 본 발명에 따른 비지에이 패키지의 리페어링 장치에 의하면, 회로기판과 이에 실장된 비지에이 패키지간에 불량이 야기될 경우, 전체적으로 균일 하게 열풍을 가하는 것은 물론이고, 무게추를 통해 불량 상태의 패키지 제거 작업을 수행할 수 있게된다.As described above, according to the repairing apparatus of the BG package according to the present invention, when a failure occurs between the circuit board and the BG package mounted thereon, the hot air is uniformly applied as a whole, and the weight of the bad You will be able to remove the package.

이를 통해서는 주변의 온전한 패키지 및 패턴상에 영향을 주지 않게되어 불량품을 줄일 수 있는 효과와 진공노즐을 사용하지 않고 저가의 분리수단을 통해 불량 패키지의 제거가 가능하여 코스트 절감을 도모한 효과가 있다.Through this, there is no effect on the surrounding intact package and pattern, which can reduce the defective product, and it is possible to reduce the cost by removing the defective package through low-cost separation means without using the vacuum nozzle. .

Claims (3)

회로기판과, 이에 실장된 비지에이 패키지를 분리하기 위한 비지에이 리페어링 장치를 구성함에 있어서,In constructing a circuit board and a visual repairing device for detaching a visual package mounted thereon, 상기 회로기판과 불량이 야기된 패키지상에 균일하게 가열수단을 통해 열풍을 가하고,Hot air is uniformly applied through the heating means on the circuit board and the package causing the defect, 상기 불량 야기된 패키지 직하면에 무게에 의해 패키지와 회로기판을 분리시키는 분리수단을 마련하여 된 것을 특징으로 하는 비지에이 패키지 리페어링 장치.And a separating means for separating the package from the circuit board by weight on a directly underside of the defective-induced package. 제 1 항에 있어서, The method of claim 1, 상기 분리수단은, 불량이 야기된 패키지의 외측면에 이를 감싸는 형태로 걸림 고정되는 브래킷과;The separation means, and the bracket is fixed in the form of wrapping it on the outer surface of the package caused the failure; 상기 브래킷의 하부 중심면에 마련되며 소정의 중량을 갖는 무게추;로 이루어진 것을 특징으로 하는 비지에이 패키지 리페어링 장치.Vigge package repairing device, characterized in that consisting of; a weight provided on the lower center surface of the bracket having a predetermined weight. 제 1 항에 있어서,The method of claim 1, 상기 회로기판과 비지에이 패키지를 가열수단을 통해 균일하게 가열하는 것은, 리플로우 장비상에서 이루어지는 것을 특징으로 하는 비지에이 패키지 리페어링 장치.And uniformly heating the circuit board and the BG package through heating means is performed on a reflow device.
KR1020060112025A 2006-11-14 2006-11-14 apparatus for reparing of ball grid array KR100847109B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102441865A (en) * 2011-09-19 2012-05-09 工业和信息化部电子第五研究所 Method and device for prizing up BGA (ball grid array) in staining test
CN102922477A (en) * 2012-11-15 2013-02-13 苏州华碧微科检测技术有限公司 Tool for extraction of BGA (ball grid array) in dye test and use method of tool

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KR100951648B1 (en) * 2008-08-26 2010-04-07 이종애 Apparatus for reparing of ball gridarray

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JPH1126929A (en) * 1997-06-30 1999-01-29 Hitachi Ltd Bga repair method and device therefor
JP4331069B2 (en) * 2004-07-29 2009-09-16 株式会社日立製作所 Electronic component repair device
JP4727249B2 (en) 2005-02-15 2011-07-20 富士通テン株式会社 Repair tool and electronic device repair device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102441865A (en) * 2011-09-19 2012-05-09 工业和信息化部电子第五研究所 Method and device for prizing up BGA (ball grid array) in staining test
CN102441865B (en) * 2011-09-19 2016-03-23 工业和信息化部电子第五研究所 Method and the device of BGA is levered up in a kind of dye test
CN102922477A (en) * 2012-11-15 2013-02-13 苏州华碧微科检测技术有限公司 Tool for extraction of BGA (ball grid array) in dye test and use method of tool

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