JP4727249B2 - Repair tool and electronic device repair device - Google Patents

Description

The present invention relates to a repair tool and an electronic component repair device, and more specifically, used when repairing such as replacement or repair of an electronic component (BGA (Ball Grit Array) package, etc.) mounted on a substrate. The present invention relates to a repair tool and an electronic device repair device.

FIG. 6 is a partial cross-sectional side view schematically showing a repair electronic component local heating device described in Patent Document 1 as an example of a conventional repair device for this type of electronic component.
The local heating device 51 includes a shield case 54 that covers an upper part of a BGA package 52 that is a repair electronic component and shields it in close contact with a flat portion of the printed wiring board 53, and a nozzle that is disposed inside the shield case 54 and that blows hot air. A local heater 56 having a section 55;
A spring 57 and a spring support plate 58 that are disposed on the shield case 54 and press the shield case 54 against the flat portion of the printed wiring board 53 to be in close contact with each other. The hot air blown from the portion 55 is circulated in the shield case 54 and then discharged upward from an exhaust hole 59 provided in the upper part of the shield case 54.

FIG. 7 is a partial cross-sectional side view schematically showing an electronic component replacement nozzle device described in Patent Document 2 below as another example of this type of conventional electronic device repair device.
The electronic component replacement nozzle device 61 is seated on a space portion 64a capable of accommodating the BGA package 62 to be replaced, a plurality of cutouts 64b serving as discharge ports at the opening edge, and a component mounting surface 63a of the circuit board 63. A hot air supply nozzle 64 that has a seating portion 64 c and supplies hot air for heating and melting the joint between the BGA package 62 and the circuit board 63, and the BGA package 62 within the space 64 a of the hot air supply nozzle 64. And a component suction nozzle 65 capable of sucking. When supplying hot air, the BG in the hot air supply nozzle 64 on the circuit board 63 is used.
The hot air for the A package 62 is exhausted from the notch 64 b without staying in the hot air supply nozzle 64.

However, in the apparatus described in Patent Document 1, the nozzle portion 5 of the local heater 56 is used.
The hot air blown out from the BGA package 52 is blown from the four sides of the rectangular BGA package 52 to the lower side of the BGA package 52 at substantially the same pressure.
Among the solder bumps arranged on the bottom surface of No. 2, the amount of hot air blown to the solder bump near the center of the BGA package 52 is small, and the temperature of the solder bump is difficult to rise.

Further, in the apparatus described in Patent Document 2 described above, the hot air supplied to the hot air supply nozzle 64 is discharged to the outside from the notches 64b positioned facing the respective side surfaces of the four sides of the BGA package 62. Therefore, the hot air hardly flows between the BGA package 62 and the circuit board 63, that is, the hot air is not sufficiently blown to the solder bumps arranged on the bottom surface of the BGA package 62, and particularly the solder bump near the center of the package. The temperature of the structure was difficult to rise.

Therefore, a temperature difference occurs between the solder bumps near the outer edge and the center of the BGA packages 52 and 62, that is, the solder bumps near the outer edges of the BGA packages 52 and 62 are melted. The solder bumps are not sufficiently melted due to insufficient heating, and if the BGA packages 52 and 62 are removed from the substrate in this state, the wiring on the substrate near the center of the BGA packages 52 and 62 is damaged. As a result, there is a risk that the substrate cannot be used.

In order to completely melt the solder bumps near the center of the BGA packages 52 and 62, the temperature of the hot air can be increased, the air volume can be increased, or the hot air supply time can be increased. Then, excessive heat is applied to the peripheral portions of the BGA packages 52 and 62, the substrate, etc., and there is a risk that the substrate and components are thermally damaged. Also, such a BGA package 52,
The problem that the heating temperature distribution in the 62 solder bumps (joint portions) becomes non-uniform is more noticeable as the package size increases.
Japanese Patent Laid-Open No. 11-330688 Japanese Patent Laid-Open No. 11-312865

Means for solving the problems and their effects

The present invention has been made in view of the above problems, and can uniformize the heating temperature at the joint between the substrate and the electronic component when the electronic component is removed, without causing damage to the substrate or the electronic component. An object of the present invention is to provide a repair tool capable of replacing or repairing parts, and a repair device for electronic parts.

In order to achieve the above object, a repair tool (1) according to the present invention is a repair tool for blowing hot air onto an electronic component mounted on a board, and an opening for accommodating the electronic component is formed on the bottom surface. The electronic component is provided only from the inside of one side wall surface of the cylindrical main body with the cylindrical main body formed, and the opening of the cylindrical main body accommodates the electronic component in the opening. And is discharged from the second side wall surface opposite to the one side wall surface to the outside through the space between the electronic component and the substrate . The hot air inflow prevention means for preventing the hot air from flowing into the lower side of the electronic component from the side wall surface side is disposed on the side wall surface inner side and the both side wall inner surfaces adjacent to the second side wall surface, The hot air inflow prevention means is at least the cylindrical book A plate-like body having a shape surrounding the inner side of the second side wall surface and the inner sides of both side walls adjacent to the second side wall surface, and the upper peripheral edge of the electronic component is brought into contact with the lower surface of the plate-like body It is characterized by being configured to obtain .

According to the repair tool (1), in the state in which the opening portion of the cylindrical main body accommodates the electronic component in the opening portion, the hot air is transmitted only from the inside of one side wall surface of the cylindrical main body. The electronic component is configured to flow into the lower part of the component and pass through between the electronic component and the substrate to be discharged from below the second side wall surface facing the one side wall surface. In the repair, the hot air can be poured into the junction between the electronic component and the substrate in a certain direction, the heating of the junction can be performed efficiently, and the heating temperature at the junction can be increased. It is possible to make uniform, prevent variations in the molten state of the joint (for example, solder), local overheating of the substrate and the electronic component, and the like without damaging the substrate or the electronic component. Repair electronic parts Ukoto can. It is also possible to set the temperature of the hot air to a temperature close to the melting temperature of the joint, or to shorten the time until the joint is melted, and to reduce the power consumption for supplying hot air on the device side. Can be reduced.

According to the repair tool ( 1 ), the hot air is prevented from flowing into the electronic component from the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both sides adjacent to the second side wall surface by the hot air inflow prevention means. The hot air can flow into the lower part of the electronic component only from the inner side of the one side wall surface of the cylindrical main body, pass between the electronic component and the substrate, and 2
You can be discharged to the outside from the lower wall surface of the.

According to the repair tool ( 1 ), the hot air inflow prevention means surrounds at least the second side wall surface inside the cylindrical main body and the both side wall inner surfaces adjacent to the second side wall surface, for example, a flat surface Since it is configured to have a plate-like body having a substantially U-shape in view, a substantially B-shape in plan view, and the like, the upper surface peripheral edge portion of the electronic component can be brought into contact with the lower surface of the plate-like body, Even if the side surface of the electronic component is not brought into contact with the inner side of the second side wall surface of the cylindrical main body or the side wall surfaces adjacent to the second side wall surface, the upper surface of the electronic component is placed on the lower surface of the plate-like body. By bringing the peripheral edge into contact with each other, the hot air may be prevented from flowing into the lower side of the electronic component from the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface. I can . In addition, by utilizing the width of the plate-like body in the inner direction, it can be used for repairing the electronic parts having different sizes, and the positional accuracy when the cylindrical body is put on the electronic parts is improved. A margin can be given.

Further, the repair tool ( 2 ) according to the present invention is the repair tool ( 1 ), wherein the plate-like body is located on the inner side of the second side wall surface of the tubular body and on the inner side of both side walls adjacent to the second side wall surface. It is characterized by being configured to be movable in the vertical direction along the lines.

According to the repair tool ( 2 ), the plate-like body is movable in the vertical direction along the second side wall surface inside of the cylindrical main body and the both side wall surfaces adjacent to the second side wall surface. Since it is comprised, the said electronic component can be moved to an up-down direction in the state which contacted the upper surface peripheral part of the said electronic component with the lower surface of the said plate-shaped object. Therefore, even in the electronic component having a different height, the hot air flows into the lower part of the electronic component from the inside of the second side wall surface of the cylindrical main body and the inside of both side wall surfaces adjacent to the second side wall surface. Can not be. In addition, operations such as removal of the electronic component can be performed without any problem.

Further, the repair tool ( 3 ) according to the present invention includes a discharge direction changing means for changing a discharge direction of hot air discharged from below the second side wall surface of the cylindrical body in the repair tool (1) or (2) . It is characterized by having.

According to the repair tool ( 3 ), the discharge direction changing means can change the discharge direction of hot air discharged from below the second side wall surface of the cylindrical main body, and is mounted on the substrate. It is possible to prevent hot air from being blown to other parts, and to avoid thermal damage of the other parts.

Moreover, the repair tool ( 4 ) according to the present invention is a repair tool for blowing hot air onto an electronic component mounted on a substrate, and a cylindrical main body having an opening for accommodating the electronic component formed on the bottom surface In the state where the opening of the cylindrical main body accommodates the electronic component in the opening, the hot air is sent from the inside of a plurality of side wall surfaces excluding one side wall surface of the cylindrical main body to the lower side of the electronic component. The hot air flows into the one side wall surface of the cylindrical main body through the space between the electronic component and the substrate. A hot air inflow prevention means for preventing the air from flowing from the wall surface to the lower side of the electronic component is disposed, and the hot air inflow prevention means includes a plate-like body having a shape surrounding at least one side wall surface of the cylindrical body. Comprising the electronic component on the lower surface of the plate-like body. It is characterized by being configured so as to contact the surface periphery.

According to the repair tool ( 4 ), a plurality of side wall surfaces excluding one side wall surface of the cylindrical main body in a state where the opening of the cylindrical main body accommodates the electronic component in the opening. When the electronic component is repaired, it flows into the lower part of the electronic component from the inside, passes through between the electronic component and the substrate, and is discharged from the bottom of the one side wall surface to the outside. In addition, the hot air can be poured into the bonding portion between the electronic component and the substrate in a certain direction from the inside of the plurality of side wall surfaces, and the bonding portion can be heated more efficiently. The heating temperature can be made uniform, and it is possible to prevent variations in the molten state of the joints, local overheating of the substrate and electronic components, and the like without damaging the substrate or electronic components. Repair parts Ukoto can. It is also possible to set the temperature of the hot air to a temperature close to the melting temperature of the joint, and to shorten the time until the joint is melted, thereby reducing the power consumption of the heater on the apparatus side. be able to.

According to the repair tool ( 4 ), the hot air inflow prevention means can be configured to prevent the hot air from flowing from the inside of one side wall surface of the cylindrical main body to the lower side of the electronic component. It can flow into the lower part of the electronic component from the inside of the plurality of side wall surfaces of the main body, and can be discharged to the outside through the space between the electronic component and the substrate.

According to the repair tool ( 4 ), the hot air inflow prevention means includes a plate-like body having a shape surrounding at least one side wall surface of the cylindrical main body, and the upper surface of the electronic component is provided on the lower surface of the plate-like body. Since the peripheral portion can be brought into contact, the upper peripheral edge of the electronic component can be brought into contact with the lower surface of the plate-like body without contacting the side surface of the electronic component with one side wall surface of the cylindrical body. By abutting the part, the hot air can be prevented from flowing into the lower side of the electronic component from the inside of one side wall surface of the cylindrical main body. In addition, by utilizing the width of the plate-like body in the inner direction, it can be used for repairing the electronic parts having different sizes, and the positional accuracy when the cylindrical body is put on the electronic parts is improved. A margin can be given.

Moreover, the repair tool ( 5 ) which concerns on this invention WHEREIN: In the said repair tool ( 4 ), the said plate-shaped body is comprised so that a vertical movement is possible along the one side wall surface inside of the said cylindrical main body. It is a feature.

According to the repair tool ( 5 ), since the plate-like body is configured to be movable in the vertical direction along the inner side wall surface of the cylindrical body, the electronic component is placed on the lower surface of the plate-like body. The electronic component can be moved in the up-down direction in a state in which the peripheral edge of the upper surface is in contact. Therefore, even if the electronic components have different heights, the hot air can be prevented from flowing into the lower side of the electronic component from the inside of one side wall surface of the cylindrical main body. In addition, operations such as removal of the electronic component can be performed without any problem.

Moreover, the repair tool ( 6 ) which concerns on this invention is equipped with the discharge direction change means which changes the discharge direction of the hot air discharged from the one side wall surface of the said cylindrical main body in the said repair tool (4) or (5) . It is characterized by being.

According to the repair tool ( 6 ), the discharge direction changing means can change the discharge direction of the hot air discharged from the one side wall surface of the cylindrical main body, and the other mounted on the substrate. It is possible to prevent hot air from being blown to the parts, and to avoid thermal damage of the other parts.

Moreover, the repair tool ( 7 ) which concerns on this invention is characterized by the said cylindrical main body being comprised including the heat insulation member in any one of the said repair tools (1)-( 6 ).
According to the repair tool ( 7 ), since the cylindrical main body includes a heat insulating member, the heat inside the cylindrical main body can be made difficult to be radiated to the outside. The heating efficiency by the hot air inside the main body can be further increased.

An electronic component repair device (1) according to the present invention is characterized in that any one of the repair tools (1) to ( 7 ) is mounted.
According to the electronic device repair device (1), it is possible to realize a repair device capable of obtaining the effects of the repair tools (1) to ( 7 ).

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a repair tool and a repair device according to the present invention will be described with reference to the drawings. FIG. 1A shows an electronic component (in this case, B) using the repair tool according to the embodiment (1).
FIG. 1B is a partial cross-sectional side view schematically showing a state in which the GA package is being repaired, and FIG. 1B is a cross-sectional view taken along line BB in FIG. FIG. 2 shows the embodiment (1).
It is the perspective view which showed typically the repair tool which concerns on.

In the figure, reference numeral 10 denotes a repair tool for blowing hot air on the BGA package 2 mounted on a device (not shown) for repairing the BGA package 2 mounted on a printed wiring board (hereinafter simply referred to as a board) 1. Show.

The repair tool 10 includes a cylindrical main body 11 having a substantially rectangular opening 12 for accommodating the BGA package 2 formed on the bottom surface. The cylindrical main body 11 is formed using a heat insulating material (for example, ceramic fiber or the like), and the side wall surface 13 of the cylindrical main body 11 is bent by a predetermined width from approximately the center of the side wall surface 13 toward the inside. After that, it is folded back so as to be substantially parallel to the opposing side wall surface 14.

When the lower end portion 13a of the side wall surface 13 is positioned above the lower end portions of the other side wall surfaces 14, 15, 16 and the opening 12 of the cylindrical main body 11 is covered with the BGA package 2 on the substrate 1, the substrate 1 and a lower end portion 13a of the side wall surface 13 are formed with a gap A for discharging hot air. The height of the gap A is set to such a height that the side surface of the BGA package 2 to be repaired can be brought into contact with the inside of the lower end portion 13a of the side wall surface 13 and hot air can be smoothly discharged.

The width B from the inside of the lower end 13a of the side wall surface 13 of the cylindrical main body 11 to the inside of the side wall surface 14 is BG.
Hot air is applied to the inside of the side wall surface 14 and the side surface of the BGA package 2 so as to be larger than the width of the A package 2, that is, in a state where the side surface of the BGA package 2 is in contact with the inside of the lower end portion 13 a of the side wall surface 13. It is set so that a gap D having a predetermined width as an inflow portion is formed. On the other hand, the width C from the inside of the side wall surface 15 to the inside of the side wall surface 16 of the cylindrical main body 11 is set to be substantially the same as the vertical width of the BGA package 2, and each inner side of the side wall surfaces 15 and 16 of the cylindrical main body 11. BGA
The side surface of the package 2 can be brought into contact (that is, hot air does not flow).

A hot air flow path changing plate 17 joined to the side wall surfaces 15 and 16 is disposed outside the lower end portion 13 a of the side wall surface 13 of the cylindrical main body 11, and the lower end portion 13 a of the side wall surface 13 and the hot air flow path are arranged. Change plate 17
Thus, a hot air exhaust passage 18a and an exhaust port 18b are formed.

Further, a heater (not shown) for blowing hot air is disposed above the cylindrical main body 11 so that the hot air from the heater is supplied to the internal space 11 a of the cylindrical main body 11. Yes. Further, a component suction nozzle 30 for sucking the BGA package 2 is disposed in the internal space 11a so as to be movable up and down. The repair tool 10 is repaired by a repair device (not shown)
Drive control such as movement in the vertical direction and movement in a predetermined horizontal direction is performed. Further, a bottom heater 31 is disposed on the lower surface side of the substrate 1, and heating control of the heater and the bottom heater 31 is also performed by a repair device.

Next, a repair method for the BGA package 2 using the repair tool 10 according to the embodiment (1) will be described with reference to FIG. In order to replace a BGA package 2 that has been determined to be defective by a function inspection or the like with a non-defective BGA package 2, the defective BGA on the substrate 1 is replaced with a conventional BGA package 2.
After the package 2 is removed, a good BGA package 2 is attached on the substrate 1.

First, when the defective BGA package 2 is removed from the substrate 1, the substrate 1 is fixed to an XY table (not shown) of the repair device, and the defective BGA package 2 is repaired.
It is arranged at a predetermined position below.

Next, the repair tool 10 is lowered from above the BGA package 2 so that the opening 12 of the cylindrical main body 11 covers the BGA package 2, and the side wall surfaces 14, 15, 16 of the cylindrical main body 11, and the hot air flow path The lower end portion of the change plate 17 is brought into contact (sitting) on the substrate 1. At this time, the repair tool 10 is driven and controlled so that the side surface of the BGA package 2 is brought into contact with the inside of the lower end portion 13a of the side wall surface 13 and the insides of the side wall surfaces 15 and 16.

Next, the heater is operated to supply hot air set to a predetermined temperature from the upper part of the cylindrical main body 11 of the repair tool 10 toward the BGA package 2, and the bottom heater 31 also heats from the lower side of the substrate 1. Do. At this time, from the upper part of the cylindrical main body 11, the BGA package 2
The hot air supplied toward the air flows into the lower side of the BGA package 2 only from the gap D between the side wall surface 14 of the cylindrical main body 11 and the BGA package 2.
Via the joint 2a with the package 2, the gap A under the lower end 13a of the side wall surface 13 passes through the exhaust passage 18a and is discharged to the outside from the exhaust port 18b. The joint 2a of the package 2 is heated and melted uniformly in a short time.

Thereafter, hot air is supplied for a predetermined time required to melt the joint portion 2a of the BGA package 2, and then the BGA package 2 is sucked and raised by the component suction nozzle 30 to remove the BGA package 2 from the substrate 1. While removing, the repair tool 10 is also raised,
Retreat to a predetermined position.

Next, when the non-defective BGA package 2 is mounted on the substrate 1, an operation opposite to this is performed. First, the non-defective BGA package 2 is sucked by the component sucking nozzle 30, and the repair tool 10 in a state where the BGA package 2 is held inside the cylindrical main body 11 is lowered to a predetermined mounting position of the substrate 1. The package 2 is placed at a predetermined mounting position of the substrate 1.
At this time, the side walls 14, 15, 16 forming the opening 12 of the cylindrical body 11 and the lower end of the hot air flow path changing plate 17 are brought into contact with the substrate 1, and the inner side of the lower end 13 a of the side wall 13, Side wall surface 15
Drive control of the repair tool 10 is performed so that the side surfaces of the BGA package 2 are brought into contact with the inner sides of the BGA package 2.

Next, the heater is operated to supply hot air set to a predetermined temperature from above the cylindrical main body 11 of the repair tool 10 toward the BGA package 2 and also heated from the bottom side of the substrate 1 by the bottom heater 31. I do.

At this time, the hot air supplied from the upper part of the cylindrical main body 11 toward the BGA package 2 flows into the lower side of the BGA package 2 only from the gap D between the inside of the side wall surface 14 of the cylindrical main body 11 and the BGA package 2. The hot air passes through the joint 2 a between the substrate 1 and the BGA package 2, passes through the exhaust passage 18 a from the gap A below the lower end portion 13 a of the side wall surface 13, and enters the exhaust port 1.
8b is discharged to the outside, and hot air blows the joint 2 of the BGA package 2
a is uniformly heated and melted in a short time. After heating for a predetermined time to join the joint 2a of the BGA package 2 and the contact of the substrate 1, the suction of the component suction nozzle 30 is released, the repair tool 10 is retreated upward, and the BGA package 2 Finish mounting.

According to the repair tool 10 according to the embodiment (1), the opening 12 of the cylindrical main body 11 is
Considering the size of the BGA package 2 to be repaired, the side surface of the BGA package 2 can be brought into contact with the inner side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11 and the inner sides of the side wall surfaces 15 and 16. Therefore, the inner side of the lower end portion 13 a of the side wall surface 13 of the cylindrical body 11 and the side wall surfaces 15, 1
6, the BGA package 2 can be accommodated in the opening 12 in a state in which the side surface of the BGA package 2 is in contact with each inner side of the BGA 6 (that is, in a state where hot air does not flow). Only the gap D inside the wall surface 14 is allowed to flow into the lower part of the BGA package 2 and the BGA
Via the joint 2a between the package 2 and the substrate 1, the gap A under the lower end portion 13a of the side wall surface 13 can be discharged from the exhaust port 18b through the exhaust passage 18a. Therefore, hot air can be poured into the joint 2a of the BGA package 2 in a certain direction.
While heating the joint part 2a of the GA package 2 can be efficiently performed with hot air,
The heating temperature at the joint portion 2a can be made uniform, and variations in the molten state of the joint portion 2a (solder) and local overheating of the substrate 1 and the BGA package 2 can be prevented. The BGA package 2 can be repaired without damaging it. It is also possible to set the temperature of the hot air to a temperature close to the melting temperature of the joint portion 2a, or to shorten the time until the joint portion 2a is melted, such as a heater for supplying hot air on the repair device side. Power consumption can be reduced.

Further, the hot air flow path changing plate (discharge direction changing means) 17 can change the discharge direction of the hot air discharged from the gap A below the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11 upward. A structure in which hot air is not blown onto other components mounted thereon can be achieved, and thermal damage to other components on the substrate 1 can be avoided.

Moreover, since the cylindrical main body 11 is comprised from the heat insulation member, it can be set as the structure where the heat inside the cylindrical main body 11 is not easily radiated outside, and the heating efficiency by the hot air inside the cylindrical main body 11 is improved. It can be further enhanced.

FIG. 3A is a partial side cross-sectional view schematically showing a state in which the BGA package is repaired using the repair tool according to the embodiment (2), and FIG. It is a BB line sectional view in 3 (a). However, the same reference numerals are given to components having the same functions as those of the repair tool 10 shown in FIG. 1, and the description thereof is omitted here.

In the repair tool 10 according to the embodiment (1), the opening 12 of the cylindrical main body 11 takes into consideration the size of the BGA package 2 to be repaired, and the inside and the side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11. The side surfaces of the BGA package 2 can be brought into contact with the inner surfaces of the wall surfaces 15 and 16, but in the repair tool 10A according to the embodiment (2), the internal space 1 of the cylindrical main body 11A
1a, hot air having an L-shaped cross section having a substantially U-shape in plan view that is movable in the vertical direction while being in contact with the inside of the side wall surface 13 of the cylindrical main body 11A and the insides of the side wall surfaces 15 and 16 The point where the inflow prevention plate 20 is disposed is a main difference from the repair tool 10 according to the embodiment (1).

In the repair tool 10A according to the embodiment (2), a repair operation such as hot air supply is performed in a state where the upper surface periphery of the BGA package 2 is in contact with the lower surface of the hot air inflow prevention plate 20. . The overhanging width E toward the inner side of the lower surface of the hot air inflow prevention plate 20 is the BG to be repaired.
The required width is set in consideration of the size of the A package 2.

Further, the width B from the inside of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11A to the inside of the side wall surface 14
Is larger than the width of the BGA package 2, that is, in a state where the peripheral edge of the upper surface of the BGA package 2 is in contact with the lower surface of the hot air inflow prevention plate 20 inside the side wall surface 13, A gap D having a predetermined width that becomes a hot air inflow portion is formed between the side surfaces of the package 2. On the other hand, the width C from the inside of the side wall surface 15 to the inside of the side wall surface 16 of the cylindrical main body 11A is set to be slightly larger than the vertical width of the BGA package 2, and each inner side of the side wall surfaces 15 and 16 of the cylindrical main body 11A. The peripheral edge of the upper surface of the BGA package 2 is brought into contact with the lower surface of the hot air inflow prevention plate 20 disposed in the upper part.

Further, a protruding locking piece 21 for locking the lower surface side of the hot air inflow prevention plate 20 is provided on the inner side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11A and the inner side of the side wall surfaces 15 and 16. Formed,
On each inner side of the side wall surfaces 15, 16, a protruding slip prevention piece 22 for preventing lateral displacement of the hot air inflow prevention plate 20 is formed.

The repair method for the BGA package 2 using the repair tool 10A according to the embodiment (2) is performed in substantially the same manner as when using the repair tool 10 according to the above-described embodiment (1). As shown in FIG. 3, B is formed from the upper part of the cylindrical main body 11A.
The hot air supplied toward the GA package 2 is formed inside the side wall surface 14 of the cylindrical main body 11A and the BGA.
The hot air that has flowed into the lower part of the BGA package 2 only from the gap D with the side surface of the package 2 passes through the joint 2a between the substrate 1 and the BGA package 2, and the gap A below the lower end part 13a of the side wall surface 13 From the exhaust port 18b through the exhaust passage 18a.

According to the repair tool 10A according to the embodiment (2), the L-shaped cross section having a substantially U-shape in plan view surrounding the inner side of the side wall surface 13 and the inner side of the side wall surfaces 15 and 16 of the cylindrical main body 11. Since the hot air inflow prevention plate 20 is disposed so that the upper surface peripheral edge portion of the BGA package 2 can be brought into contact with the lower surface thereof, the inner side of the side wall surface 13 and the inner side of the side wall surfaces 15 and 16 of the cylindrical main body 11A The hot air cannot flow into the lower part of the BGA package 2 from the hot air.
The BGA package 2 is allowed to flow into the lower side of the BGA package 2 only from the inside of the side wall surface 14 of A.
Through the joint 2a between the substrate 1 and the substrate 1, the gap A under the lower end 13a of the side wall surface 13 can be discharged to the outside through the exhaust passage 18a and exhausted from the exhaust port 18b. The effect substantially the same as the repair tool 10 which concerns on a form (1) can be acquired.

In addition, by using the width of the hot air inflow prevention plate 20 in the inner direction, different sizes of BGA
It can also be used for repairing the package 2, and a margin can be given to the positional accuracy when the cylindrical main body 11 </ b> A is placed on the BGA package 2.

Moreover, since the hot air inflow prevention plate 20 is configured to move in the vertical direction along the inside of the side wall surface 13 and the inside of each of the side wall surfaces 15 and 16 of the cylindrical main body 11A, the inside of the cylindrical main body 11A Thus, the BGA package 2 can be moved in the vertical direction, and the work such as removal of the BGA package 2 by the component suction nozzle 30 can be performed without any trouble.
When A is put on the BGA package 2, the bottom surface of the hot air inflow prevention plate 20 and the BGA package 2
Since the hot air inflow preventing plate 20 can be moved upward in a state in which the peripheral surface of the upper surface is in contact with each other, the present invention can also be applied to BGA packages 2 having different heights.

In the repair tool 10A according to the embodiment (2), the hot air inflow prevention plate 20 can move in the vertical direction along the lower end portion 13a of the side wall surface 13 and the inner sides of the side wall surfaces 15 and 16. However, in another embodiment, in consideration of the height position of the BGA package 2 to be repaired, the hot air inflow prevention plate 20 may be fixed inside the side wall surfaces 13, 15, 16. When the package 2 is removed, if the repair tool 10A is raised while the BGA package 2 is sucked by the component suction nozzle 30, the removal or the like can be performed without any trouble.

Further, instead of providing the locking piece 21 for locking the hot air inflow prevention plate 20 and the slip prevention piece 22, the hot air inflow prevention plate 20 and the component suction nozzle 30 are connected by a connecting member such as a connecting rod. It is good also as a structure which raises / lowers the hot air inflow prevention board 20 in conjunction with the raising / lowering operation | movement of the suction nozzle 30, In this case, in the state which adsorbed the BGA package 2 with the component suction nozzle 30,
If the upper peripheral edge of the BGA package 2 is brought into contact with the lower surface of the hot air inflow prevention plate 20, the hot air does not flow downward from the inner sides of the lower end portion 13 a and the side wall surfaces 15, 16 of the side wall surface 13. Work can be performed without any problems.

In the embodiment (2), the hot air inflow preventing plate 20 having a substantially U-shape in plan view is applied, but the hot air inflow preventing plate 20 has at least the side wall surface 1 of the cylindrical main body 11A.
3 may be of any shape that surrounds the inner side and the inner side of the side wall surfaces 15, 16. For example, a shape having a substantially square shape in a plan view (a shape that surrounds the peripheral edge of the upper surface of the BGA package 2) can also be applied. .

FIG. 4A is a partial side cross-sectional view schematically showing a state in which the BGA package is repaired using the repair tool according to the embodiment (3), and FIG. It is a BB line sectional view in 4 (a). However, the same reference numerals are given to components having the same functions as those of the repair tool 10 shown in FIG. 1, and the description thereof is omitted here.

In the repair tool 10 according to the embodiment (1), the opening 12 of the cylindrical main body 11 takes into consideration the size of the BGA package 2 to be repaired, and the inside and the side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11. The side surfaces of the BGA package 2 can be brought into contact with the inner surfaces of the wall surfaces 15 and 16, but in the repair tool 10B according to the embodiment (3), the opening 12 of the cylindrical main body 11B.
However, in consideration of the size of the BGA package 2 to be repaired, the side surface of the BGA package 2 can be brought into contact only with the inner side of the lower end portion 13 a of the side wall surface 13 of the cylindrical main body 11.

That is, in the state where the opening 12 of the cylindrical main body 11B accommodates the BGA package 2 in the opening 12, the hot air is blown from the inside of the side wall surfaces 14, 15, 16 excluding the side wall surface 13 of the cylindrical main body 11B. 2, the hot air that has flowed in is exhausted from a rectangular cutout portion 13 b formed in the lower end portion 13 a of the side wall surface 13 via the joint portion 2 a between the substrate 1 and the BGA package 2. It is formed so as to be discharged from the exhaust port 18b through the flow path 18a. In addition, the height of the notch 13b is lower than the height of the BGA package 2 to be repaired, and its width is set to a size that allows hot air to be discharged smoothly.

The width B from the inside of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11B to the inside of the side wall surface 14 is B
The lower end portion 13a of the side wall surface 13 is set to be larger than the lateral width of the GA package 2.
A gap D having a predetermined width as a hot air inflow portion is formed between the inside of the side wall surface 14 and the side surface of the BGA package 2 with the side surface of the BGA package 2 in contact with the inside. . On the other hand, the width C from the inside of the side wall surface 15 to the inside of the side wall surface 16 of the cylindrical main body 11B is set to be larger than the vertical width of the BGA package 2, and the inner side of the side wall surfaces 15 and 16 of the cylindrical main body 11 A gap F having a predetermined width serving as a hot air inflow portion is formed between both side surfaces of the BGA package 2.

About the repair method of the BGA package 2 using the repair tool 10B which concerns on embodiment (3), it is performed by the method substantially the same as the case where the repair tool 10 which concerns on above-mentioned embodiment (1) is used. As shown in FIG. 4, the hot air supplied from the upper part of the cylindrical main body 11B toward the BGA package 2 is the side wall surfaces 14, 15, 1 of the cylindrical main body 11B.
6 and the gap D, F between the inner side of the BGA package 2 and the lower side of the BGA package 2 from the gaps D and F. The hot air that has flowed in passes through the junction 2a between the substrate 1 and the BGA package 2,
From the notch 13b formed in the lower end 13a of the side wall surface 13 through the exhaust passage 18a,
It is discharged from the exhaust port 18b to the outside.

According to the repair tool 10B according to the embodiment (3), the opening 12 of the cylindrical main body 11B.
However, in consideration of the size of the BGA package 2 to be repaired, the side surface of the BGA package 2 can be brought into contact only with the inner side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11B.
By accommodating the BGA package 2 in the opening 12 in a state where one side surface of the BGA package 2 is in contact with the inner side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11B (that is, a state where hot air does not flow), Hot air is allowed to flow under the BGA package 2 from the gaps D and F inside the side wall surfaces 14, 15 and 16 of the cylindrical main body 11B, through the joint 2a between the BGA package 2 and the substrate 1, and then the side wall surface. 13 can be discharged to the outside from the exhaust port 18b through the exhaust channel 18a from the notch 13b formed in the lower end 13a. Therefore, B
Hot air can be poured into the joint portion 2a of the GA package 2 from a plurality of side wall surfaces in a certain direction, and the joint portion 2a of the BGA package 2 can be heated more efficiently. The effect substantially the same as the repair tool 10 which concerns on can be acquired.

FIG. 5A is a partial side cross-sectional view schematically showing a state in which the BGA package is repaired using the repair tool according to the embodiment (4), and FIG. It is a BB line sectional view in 5 (a). However, the same reference numerals are given to components having the same functions as those of the repair tool 10B shown in FIG. 4, and the description thereof is omitted here.

In the repair tool 10C according to the embodiment (4), on the inner side of the side wall surface 13 of the cylindrical main body 11C,
In order to prevent hot air from flowing below the BGA package 2, a hot air inflow prevention plate 20A having an L-shaped cross section that is movable up and down while being in contact with the inside of the side wall surface 13 of the cylindrical main body 11C is provided. This is different from the repair tool 10B according to the embodiment (3).

In the repair tool 10C according to the embodiment (4), a BGA is formed on the lower surface of the hot air inflow preventing plate 20A.
A repair operation such as supplying hot air is performed in a state in which the peripheral edge of the upper surface of the package 2 is in contact. The overhanging width E inside the lower surface of the hot air inflow prevention plate 20A is the BG to be repaired.
The required width is set in consideration of the size of the A package 2.

Further, a protruding locking piece 21 for locking the lower surface side of the hot air inflow prevention plate 20A is provided on the inner side of the lower end portion 13a of the side wall surface 13 of the cylindrical main body 11C and the inner side of the side wall surfaces 15 and 16. Are formed on the inner sides of the side wall surfaces 15 and 16, respectively, so as to prevent a lateral displacement of the hot air inflow prevention plate 20A.

The method for repairing the BGA package 2 using the repair tool 10C according to the embodiment (4) is performed in substantially the same manner as when using the repair tool 10B according to the above-described embodiment (3). As shown in FIG. 5, the hot air supplied from the upper part of the cylindrical main body 11C toward the BGA package 2 is the side wall surfaces 14, 15, 1 of the cylindrical main body 11C.
6 flows into the lower part of the BGA package 2 from the gaps D and F between the inner side of the BGA package 2 and the BGA package 2, and the hot air that has flowed in passes through the joint 2 a between the BGA package 2 and the substrate 1. The notch 13b formed in 13a passes through the exhaust passage 18a and is discharged from the exhaust port 18b to the outside.

According to the repair tool 10C according to the embodiment (4), the side wall surface 13 of the cylindrical main body 11C.
Since the hot air inflow prevention plate 20A disposed inside the lower end portion 13a of the BGA package 2 is disposed so that the lower surface of the hot air inflow prevention plate 20A can be brought into contact with the lower surface, the side wall surface 13 of the cylindrical main body 11C.
A structure can be adopted in which hot air does not flow into the lower side of the BGA package 2 from the inside, and hot air is caused to flow into the lower side of the BGA package 2 from the inner side of the plurality of side walls of the cylindrical main body 11C to join the BGA package 2 and the substrate 1 together. Through the portion 2a, the cutout portion 13b formed in the lower end portion 13a of the side wall surface 13 can be exhausted from the exhaust port 18b through the exhaust passage 18a. The effect substantially the same as the repair tool 10B which concerns on can be acquired.

Also, by using the width inward of the hot air inflow prevention plate 20A, BGs having different sizes can be used.
It can also be used for repair of the A package 2, and a margin can be given to the positional accuracy when the cylindrical main body 11 </ b> C is put on the BGA package 2.

Further, since the hot air inflow prevention plate 20A is configured to move in the vertical direction along the inside of the side wall surface 13 of the cylindrical main body 11C, the BGA package 2 is moved in the vertical direction inside the cylindrical main body 11C. The operation of removing the BGA package 2 by the component suction nozzle 30 can be performed without hindrance, and when the cylindrical main body 11C is placed on the BGA package 2, the bottom surface of the hot air inflow prevention plate 20A Since the hot air inflow preventing plate 20A can be moved upward in a state in which the peripheral edge of the upper surface of the BGA package 2 is in contact, the present invention can also be applied to BGA packages 2 having different heights.

In the repair tool according to the above-described embodiments (1) to (4), the case where the BGA package is repaired has been described. However, various electronic components in which a joint portion by solder or the like is formed between the substrate and the electronic component. It can also be applied to.

(A) is the fragmentary sectional side view which showed typically the state which is repairing a BGA package using the repair tool which concerns on embodiment (1), (b) is B in (a). FIG. It is the perspective view which showed typically the repair tool which concerns on embodiment (1). (A) is the fragmentary sectional side view which showed typically the state which is repairing a BGA package using the repair tool which concerns on embodiment (2), (b) is B in (a). FIG. (A) is the fragmentary sectional side view which showed typically the state which is repairing a BGA package using the repair tool which concerns on embodiment (3), (b) is B in (a). FIG. (A) is the fragmentary sectional side view which showed typically the state which is repairing a BGA package using the repair tool which concerns on embodiment (4), (b) is B in (a). FIG. It is the fragmentary sectional side view which showed typically the local heating apparatus of the repair electronic component described in patent document 1 as an example of the conventional repair apparatus of this kind of electronic component. It is the partial cross section side view which showed typically the nozzle apparatus for electronic component replacement described in patent document 2 as another example of the conventional repair apparatus of this kind of electronic component.

Explanation of symbols

1 Board (printed wiring board)
2 BGA package 10, 10A, 10B, 10C Repair tool 11, 11A, 11B, 11C Cylindrical body 12 Opening 13 Side wall surface 14 Side wall surface

Claims (8)

A repair tool for blowing hot air on electronic components mounted on a board,
A cylindrical main body having an opening for accommodating the electronic component formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is allowed to flow downward from the inside of one side wall surface of the cylindrical body to the lower side of the electronic component. And between the substrate and the substrate, the second side wall surface facing the one side wall surface is configured to be discharged to the outside ,
Hot air inflow for preventing the hot air from flowing into the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface from the side of the side wall surface. Preventive means are arranged,
The hot air inflow prevention means includes a plate-like body having a shape surrounding at least the second side wall surface inside of the cylindrical main body and both side wall inner surfaces adjacent to the second side wall surface, and the lower surface of the plate-like body A repair tool , wherein the upper peripheral edge of the electronic component can be brought into contact with the repair tool. The plate-like body is configured to be movable in the vertical direction along the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface. Item 1. The repair tool according to Item 1 . The repair tool according to claim 1 or 2, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from below the second side wall surface of the cylindrical main body. A repair tool for blowing hot air on electronic components mounted on a board,
A cylindrical main body having an opening for accommodating the electronic component formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is allowed to flow downward from the inside of the plurality of side walls except for one side wall of the cylindrical body. , Configured to be discharged from the bottom of the one side wall through the electronic component and the substrate ,
Inside the one side wall surface of the cylindrical main body, hot air inflow prevention means for preventing the hot air from flowing into the lower side of the electronic component from the one side wall surface side is disposed,
The hot air inflow prevention means includes a plate-like body having a shape surrounding at least one side wall surface of the cylindrical main body, and is configured so that the upper peripheral edge of the electronic component can be brought into contact with the lower surface of the plate-like body Repair tool characterized by being made . The repair tool according to claim 4 , wherein the plate-like body is configured to be movable in a vertical direction along an inner side surface of the cylindrical main body. The repair tool according to claim 4 or 5, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from one side wall surface of the cylindrical main body. Repair tool according to any one of claims 1-6, wherein the tubular body, characterized in that it is configured to include a heat insulating member. Repair apparatus for an electronic component, characterized in that the repair tool according is attached to any one of claims 1-7.

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