JP2006228771A5 - - Google Patents

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Publication number
JP2006228771A5
JP2006228771A5 JP2005037133A JP2005037133A JP2006228771A5 JP 2006228771 A5 JP2006228771 A5 JP 2006228771A5 JP 2005037133 A JP2005037133 A JP 2005037133A JP 2005037133 A JP2005037133 A JP 2005037133A JP 2006228771 A5 JP2006228771 A5 JP 2006228771A5
Authority
JP
Japan
Prior art keywords
side wall
wall surface
repair tool
electronic component
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005037133A
Other languages
Japanese (ja)
Other versions
JP2006228771A (en
JP4727249B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005037133A priority Critical patent/JP4727249B2/en
Priority claimed from JP2005037133A external-priority patent/JP4727249B2/en
Publication of JP2006228771A publication Critical patent/JP2006228771A/en
Publication of JP2006228771A5 publication Critical patent/JP2006228771A5/ja
Application granted granted Critical
Publication of JP4727249B2 publication Critical patent/JP4727249B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (14)

基板に搭載された電子部品熱風を吹き付けるためのリペア用具であって、
前記電子部品を収容するための開口部が底面に形成された筒状本体を備え、
該筒状本体の前記開口部が、該開口部に前記電子部品を収容させた状態で、前記熱風を
前記筒状本体の一側壁面内側からのみ前記電子部品の下方に流入させ、該電子部品と前記
基板との間を経由させて、前記一側壁面に対向する第2の側壁面下から外部へ排出させる
ように構成されていることを特徴とするリペア用具。
The electronic components mounted on the substrate a repair tool for blowing hot air,
A cylindrical main body having an opening for accommodating the electronic component formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is allowed to flow downward from the inside of one side wall surface of the cylindrical body to the electronic component. A repair tool configured to be discharged to the outside from below the second side wall surface facing the one side wall surface through a space between the substrate and the substrate.
前記筒状本体の開口部が、リペアする前記電子部品のサイズを考慮して、前記筒状本体
の第2の側壁面下端部内側と該第2の側壁面に隣接する両側壁面内側とに、前記電子部品
の側面を当接可能な形状になっていることを特徴とする請求項1記載のリペア用具。
In consideration of the size of the electronic component to be repaired, the opening of the cylindrical main body is arranged on the inner side of the lower end of the second side wall surface of the cylindrical main body and the inner side of both side walls adjacent to the second side wall surface. The repair tool according to claim 1, wherein the repair tool has a shape capable of contacting a side surface of the electronic component.
前記筒状本体の第2の側壁面内側と該第2の側壁面に隣接する両側壁面内側とに、前記
熱風がこれら側壁面側から前記電子部品の下方に流れ込まないようにするための熱風流入
防止手段が配設されていることを特徴とする請求項1記載のリペア用具。
Hot air inflow for preventing the hot air from flowing into the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface from the side of the side wall surface. 2. The repair tool according to claim 1, wherein a prevention means is provided.
前記熱風流入防止手段が、少なくとも前記筒状本体の第2の側壁面内側と該第2の側壁
面に隣接する両側壁面内側とを囲う形状をした板状体を備え、該板状体の下面に前記電子
部品の上面周縁部を当接させ得るように構成されていることを特徴とする請求項3記載の
リペア用具。
The hot air inflow prevention means includes a plate-like body having a shape surrounding at least a second side wall surface inside the cylindrical main body and both side wall inner surfaces adjacent to the second side wall surface, and a lower surface of the plate-like body The repair tool according to claim 3, wherein the electronic device is configured to be able to contact a peripheral edge portion of the upper surface of the electronic component.
前記板状体が、前記筒状本体の第2の側壁面内側と該第2の側壁面に隣接する両側壁面
内側とに沿って上下方向に移動可能に構成されていることを特徴とする請求項4記載のリ
ペア用具。
The plate-like body is configured to be movable in the vertical direction along the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface. Item 5. The repair tool according to Item 4.
前記筒状本体の第2の側壁面下から排出される熱風の排出方向を変える排出方向変更手
段を備えていることを特徴とする請求項1〜5のいずれかの項に記載のリペア用具。
The repair tool according to any one of claims 1 to 5, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from below the second side wall surface of the cylindrical main body.
基板に搭載された電子部品熱風を吹き付けるためのリペア用具であって、
前記電子部品を収容するための開口部が底面に形成された筒状本体を備え、
該筒状本体の開口部が、該開口部に前記電子部品を収容させた状態で、前記熱風を前記
筒状本体の一側壁面を除く複数の側壁面内側から前記電子部品の下方に流入させ、該電子
部品と前記基板との間を経由させて、前記一側壁面下から外部へ排出させるように構成さ
れていることを特徴とするリペア用具。
The electronic components mounted on the substrate a repair tool for blowing hot air,
An opening for accommodating the electronic component includes a cylindrical main body formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is caused to flow downward from the inside of a plurality of side wall surfaces excluding one side wall surface of the cylindrical body to the lower side of the electronic component. The repair tool is configured to be discharged from the bottom of the one side wall surface through between the electronic component and the substrate.
前記筒状本体の開口部が、リペアする前記電子部品のサイズを考慮して、前記筒状本体
の一側壁面下端部内側にのみ前記電子部品の側面を当接可能な形状になっていることを特
徴とする請求項7記載のリペア用具。
In consideration of the size of the electronic component to be repaired, the opening of the cylindrical main body has a shape capable of contacting the side surface of the electronic component only inside the lower end portion of one side wall surface of the cylindrical main body. The repair tool according to claim 7.
前記筒状本体の一側壁面内側に、前記熱風が前記一側壁面側から前記電子部品の下方に
流れ込まないようするための熱風流入防止手段が配設されていることを特徴とする請求項
7記載のリペア用具。
The hot air inflow prevention means for preventing the hot air from flowing into the lower side of the electronic component from the one side wall surface side is provided inside the one side wall surface of the cylindrical main body. The repair tool described.
前記熱風流入防止手段が、少なくとも前記筒状本体の一側壁面内側を囲う形状をした板
状体を備え、該板状体の下面に前記電子部品の上面周縁部を当接させ得るように構成され
ていることを特徴とする請求項9記載のリペア用具。
The hot air inflow prevention means includes a plate-like body having a shape surrounding at least one inner side wall surface of the cylindrical main body, and is configured such that the upper peripheral edge of the electronic component can be brought into contact with the lower surface of the plate-like body The repair tool according to claim 9, wherein the repair tool is provided.
前記板状体が、前記筒状本体の一側壁面内側に沿って上下方向に移動可能に構成されて
いることを特徴とする請求項10記載のリペア用具。
The repair tool according to claim 10, wherein the plate-like body is configured to be movable in a vertical direction along an inner side surface of the cylindrical main body.
前記筒状本体の一側壁面下から排出される熱風の排出方向を変える排出方向変更手段を
備えていることを特徴とする請求項7〜11のいずれかの項に記載のリペア用具。
The repair tool according to any one of claims 7 to 11, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from one side wall surface of the cylindrical main body.
前記筒状本体が、断熱部材を含んで構成されていることを特徴とする請求項1〜12の
いずれかの項に記載のリペア用具。
The repair tool according to claim 1, wherein the cylindrical main body includes a heat insulating member.
請求項1〜13のいずれかの項に記載のリペア用具が装着されることを特徴とする電子
部品のリペア装置。
An apparatus for repairing an electronic component, to which the repair tool according to any one of claims 1 to 13 is mounted.
JP2005037133A 2005-02-15 2005-02-15 Repair tool and electronic device repair device Expired - Fee Related JP4727249B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005037133A JP4727249B2 (en) 2005-02-15 2005-02-15 Repair tool and electronic device repair device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037133A JP4727249B2 (en) 2005-02-15 2005-02-15 Repair tool and electronic device repair device

Publications (3)

Publication Number Publication Date
JP2006228771A JP2006228771A (en) 2006-08-31
JP2006228771A5 true JP2006228771A5 (en) 2008-04-03
JP4727249B2 JP4727249B2 (en) 2011-07-20

Family

ID=36989906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005037133A Expired - Fee Related JP4727249B2 (en) 2005-02-15 2005-02-15 Repair tool and electronic device repair device

Country Status (1)

Country Link
JP (1) JP4727249B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100847109B1 (en) 2006-11-14 2008-07-18 이종애 apparatus for reparing of ball grid array
WO2008120299A1 (en) * 2007-03-28 2008-10-09 Fujitsu Limited Manufacturing device and manufacturing method for electronic device
WO2012127536A1 (en) * 2011-03-24 2012-09-27 富士通テレコムネットワークス株式会社 Method and device for detaching soldered component
JP6179287B2 (en) * 2013-09-09 2017-08-16 富士通株式会社 Manufacturing method of semiconductor device
US10520219B2 (en) 2016-05-18 2019-12-31 Hakko Corporation Hot air nozzle and its production method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204062A (en) * 2000-12-27 2002-07-19 Nec Corp Bga soldering apparatus
JP2002353610A (en) * 2001-05-22 2002-12-06 Nec Saitama Ltd Apparatus and method for repairing semiconductor device

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