JP2006228771A5 - - Google Patents
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- Publication number
- JP2006228771A5 JP2006228771A5 JP2005037133A JP2005037133A JP2006228771A5 JP 2006228771 A5 JP2006228771 A5 JP 2006228771A5 JP 2005037133 A JP2005037133 A JP 2005037133A JP 2005037133 A JP2005037133 A JP 2005037133A JP 2006228771 A5 JP2006228771 A5 JP 2006228771A5
- Authority
- JP
- Japan
- Prior art keywords
- side wall
- wall surface
- repair tool
- electronic component
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002456 HOTAIR Polymers 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 5
- 230000002265 prevention Effects 0.000 claims 4
- 238000007664 blowing Methods 0.000 claims 2
- 230000002093 peripheral Effects 0.000 claims 2
Claims (14)
前記電子部品を収容するための開口部が底面に形成された筒状本体を備え、
該筒状本体の前記開口部が、該開口部に前記電子部品を収容させた状態で、前記熱風を
前記筒状本体の一側壁面内側からのみ前記電子部品の下方に流入させ、該電子部品と前記
基板との間を経由させて、前記一側壁面に対向する第2の側壁面下から外部へ排出させる
ように構成されていることを特徴とするリペア用具。 The electronic components mounted on the substrate a repair tool for blowing hot air,
A cylindrical main body having an opening for accommodating the electronic component formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is allowed to flow downward from the inside of one side wall surface of the cylindrical body to the electronic component. A repair tool configured to be discharged to the outside from below the second side wall surface facing the one side wall surface through a space between the substrate and the substrate.
の第2の側壁面下端部内側と該第2の側壁面に隣接する両側壁面内側とに、前記電子部品
の側面を当接可能な形状になっていることを特徴とする請求項1記載のリペア用具。 In consideration of the size of the electronic component to be repaired, the opening of the cylindrical main body is arranged on the inner side of the lower end of the second side wall surface of the cylindrical main body and the inner side of both side walls adjacent to the second side wall surface. The repair tool according to claim 1, wherein the repair tool has a shape capable of contacting a side surface of the electronic component.
熱風がこれら側壁面側から前記電子部品の下方に流れ込まないようにするための熱風流入
防止手段が配設されていることを特徴とする請求項1記載のリペア用具。 Hot air inflow for preventing the hot air from flowing into the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface from the side of the side wall surface. 2. The repair tool according to claim 1, wherein a prevention means is provided.
面に隣接する両側壁面内側とを囲う形状をした板状体を備え、該板状体の下面に前記電子
部品の上面周縁部を当接させ得るように構成されていることを特徴とする請求項3記載の
リペア用具。 The hot air inflow prevention means includes a plate-like body having a shape surrounding at least a second side wall surface inside the cylindrical main body and both side wall inner surfaces adjacent to the second side wall surface, and a lower surface of the plate-like body The repair tool according to claim 3, wherein the electronic device is configured to be able to contact a peripheral edge portion of the upper surface of the electronic component.
内側とに沿って上下方向に移動可能に構成されていることを特徴とする請求項4記載のリ
ペア用具。 The plate-like body is configured to be movable in the vertical direction along the inner side of the second side wall surface of the cylindrical main body and the inner side surfaces of both side walls adjacent to the second side wall surface. Item 5. The repair tool according to Item 4.
段を備えていることを特徴とする請求項1〜5のいずれかの項に記載のリペア用具。 The repair tool according to any one of claims 1 to 5, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from below the second side wall surface of the cylindrical main body.
前記電子部品を収容するための開口部が底面に形成された筒状本体を備え、
該筒状本体の開口部が、該開口部に前記電子部品を収容させた状態で、前記熱風を前記
筒状本体の一側壁面を除く複数の側壁面内側から前記電子部品の下方に流入させ、該電子
部品と前記基板との間を経由させて、前記一側壁面下から外部へ排出させるように構成さ
れていることを特徴とするリペア用具。 The electronic components mounted on the substrate a repair tool for blowing hot air,
An opening for accommodating the electronic component includes a cylindrical main body formed on the bottom surface,
With the opening of the cylindrical body accommodating the electronic component in the opening, the hot air is caused to flow downward from the inside of a plurality of side wall surfaces excluding one side wall surface of the cylindrical body to the lower side of the electronic component. The repair tool is configured to be discharged from the bottom of the one side wall surface through between the electronic component and the substrate.
の一側壁面下端部内側にのみ前記電子部品の側面を当接可能な形状になっていることを特
徴とする請求項7記載のリペア用具。 In consideration of the size of the electronic component to be repaired, the opening of the cylindrical main body has a shape capable of contacting the side surface of the electronic component only inside the lower end portion of one side wall surface of the cylindrical main body. The repair tool according to claim 7.
流れ込まないようするための熱風流入防止手段が配設されていることを特徴とする請求項
7記載のリペア用具。 The hot air inflow prevention means for preventing the hot air from flowing into the lower side of the electronic component from the one side wall surface side is provided inside the one side wall surface of the cylindrical main body. The repair tool described.
状体を備え、該板状体の下面に前記電子部品の上面周縁部を当接させ得るように構成され
ていることを特徴とする請求項9記載のリペア用具。 The hot air inflow prevention means includes a plate-like body having a shape surrounding at least one inner side wall surface of the cylindrical main body, and is configured such that the upper peripheral edge of the electronic component can be brought into contact with the lower surface of the plate-like body The repair tool according to claim 9, wherein the repair tool is provided.
いることを特徴とする請求項10記載のリペア用具。 The repair tool according to claim 10, wherein the plate-like body is configured to be movable in a vertical direction along an inner side surface of the cylindrical main body.
備えていることを特徴とする請求項7〜11のいずれかの項に記載のリペア用具。 The repair tool according to any one of claims 7 to 11, further comprising discharge direction changing means for changing a discharge direction of hot air discharged from one side wall surface of the cylindrical main body.
いずれかの項に記載のリペア用具。 The repair tool according to claim 1, wherein the cylindrical main body includes a heat insulating member.
部品のリペア装置。 An apparatus for repairing an electronic component, to which the repair tool according to any one of claims 1 to 13 is mounted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005037133A JP4727249B2 (en) | 2005-02-15 | 2005-02-15 | Repair tool and electronic device repair device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005037133A JP4727249B2 (en) | 2005-02-15 | 2005-02-15 | Repair tool and electronic device repair device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006228771A JP2006228771A (en) | 2006-08-31 |
JP2006228771A5 true JP2006228771A5 (en) | 2008-04-03 |
JP4727249B2 JP4727249B2 (en) | 2011-07-20 |
Family
ID=36989906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005037133A Expired - Fee Related JP4727249B2 (en) | 2005-02-15 | 2005-02-15 | Repair tool and electronic device repair device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4727249B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100847109B1 (en) | 2006-11-14 | 2008-07-18 | 이종애 | apparatus for reparing of ball grid array |
WO2008120299A1 (en) * | 2007-03-28 | 2008-10-09 | Fujitsu Limited | Manufacturing device and manufacturing method for electronic device |
WO2012127536A1 (en) * | 2011-03-24 | 2012-09-27 | 富士通テレコムネットワークス株式会社 | Method and device for detaching soldered component |
JP6179287B2 (en) * | 2013-09-09 | 2017-08-16 | 富士通株式会社 | Manufacturing method of semiconductor device |
US10520219B2 (en) | 2016-05-18 | 2019-12-31 | Hakko Corporation | Hot air nozzle and its production method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204062A (en) * | 2000-12-27 | 2002-07-19 | Nec Corp | Bga soldering apparatus |
JP2002353610A (en) * | 2001-05-22 | 2002-12-06 | Nec Saitama Ltd | Apparatus and method for repairing semiconductor device |
-
2005
- 2005-02-15 JP JP2005037133A patent/JP4727249B2/en not_active Expired - Fee Related
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