CN102489817B - Apparatus for removing a half semiconductor chip - Google Patents
Apparatus for removing a half semiconductor chip Download PDFInfo
- Publication number
- CN102489817B CN102489817B CN201110402497.6A CN201110402497A CN102489817B CN 102489817 B CN102489817 B CN 102489817B CN 201110402497 A CN201110402497 A CN 201110402497A CN 102489817 B CN102489817 B CN 102489817B
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- CN
- China
- Prior art keywords
- pushing
- semiconductor chip
- pressing
- heating
- heating surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a device for removing half semiconductor chip, which comprises a heating part and a pushing part, wherein the heating part is provided with a heating surface; the pushing part extends from one end of the heating part downwards; one side of the pushing part close to the heating surface is provided with a pushing surface; and the pushing surface is approximately vertical to the heating surface. Due to the adoption of the heating device, an object which is originally fixed on a base material can be rapidly removed, and the object is effectively prevented from being damaged or broken.
Description
Technical field
The present invention relates to a kind of heater, particularly relate to a kind of object that effectively prevents and damage the heater broken.
background technology
Can use semiconductor chip in many electronic products, these semiconductor chips are fixed on a substrate by scolding tin or anisotropic conducting rubber film usually.When the electric connection of semiconductor chip and substrate is bad or semiconductor chip itself has defect, be necessary to remove the semiconductor chip be fixed on substrate.
In the prior art, there is no suitable device or the semiconductor chip be fixed on substrate removes by equipment.Normally by manual mode, utilize a firing equipment to carry out heating semiconductor chip, then with a fixture, semiconductor chip is pulled out.In aforesaid operations process, be easy to cause semiconductor chip to break damage, and subsequent analysis cannot be carried out or carry out heavy industry (rework).
On the other hand, in many electronic products, the surrounding of semiconductor chip is provided with other assembly.If removing semiconductor chip to manually, when usually there is removing semiconductor chip, damage other assembly of periphery.
In view of this, how designing a kind of brand-new equipment, remove the semiconductor chip be fixed on substrate, is that those skilled in the art need a problem of solution badly.
summary of the invention
For in prior art, the removing semiconductor chip to manually of existence, can damage the defect of other assembly of periphery, the invention provides a kind of heater.
A kind of heater is provided according to an aspect of the present invention, enablely removes the object be fixedly arranged on base material, and in the process removed, can effectively avoid object damage or break.This heater comprises a heating part and a pushing and pressing part.Heating part has a heating surface, in order to the object of heating for removing.Pushing and pressing part is by one end of heating part to downward-extension, and the side of the contiguous heating surface in pushing and pressing part has a pushing and pressing face, and the substantially vertical heating surface in pushing and pressing face.
Preferably, pushing and pressing face adjoins heating surface.
Preferably, heating surface and pushing and pressing face are essentially plane.
Preferably, heating part has multiple first pore, and more often the first pore has an opening and is positioned on heating surface.
Preferably, pushing and pressing part has multiple second pore, and more often the second pore has an opening and is positioned on pushing and pressing face.
Preferably, this heater more comprises a junction, and connecting portion entity connects heating part, and in order to transfer heat energy to heating part.
Preferably, a width of heating surface is 1mm to 5mm, and a length of heating surface is 0.5 centimeter to 3 centimeters.
Preferably, pushing and pressing part has a bottom surface and connects pushing and pressing face, and plane perpendicular pushing and pressing face.
Preferably, pushing and pressing part has an inclined-plane away from the side of heating surface, and the thickness bottom one of pushing and pressing part is 0.5mm to 3mm.
There is provided a kind of device in order to remove semiconductor chip according to another aspect of the present invention, semiconductor chip system is fixed on a base material by a conductive layer.This device comprises a heating part and a pushing and pressing part.Heating part has a heating surface, in order to contact and a upper surface of heating semiconductor chip, makes conductive layer melted by heat by this.Pushing and pressing part is by one end of heating part to downward-extension, and the side of the contiguous heating surface in pushing and pressing part has a pushing and pressing face, and the substantially vertical heating surface in pushing and pressing face, pushing and pressing part in order to bestow a contact force to semiconductor chip, with removing semiconductor chip.
Adopt the present invention promptly can remove the object be originally installed on base material, and effectively prevent object damage from breaking.
Accompanying drawing explanation
Reader, after having read the specific embodiment of the present invention with reference to accompanying drawing, will become apparent various aspects of the present invention.Wherein,
Fig. 1 illustrates the schematic perspective view of the heater of an embodiment of the present invention.
Fig. 2 illustrates the generalized section of the heater of another embodiment of the present invention.
Fig. 3 illustrates the generalized section of the heater of the another embodiment of the present invention.
Fig. 4 illustrates the generalized section of the present invention's heater of an embodiment again.
[primary clustering symbol description]
100: heater
110: heating part
110a: one end of heating part
112: heating surface
114: the first pores
114a: opening
120: pushing and pressing part
120a: bottom
122: pushing and pressing face
124: the second pores
124a: opening
126: bottom surface
128: inclined-plane
130: connecting portion
130a: top
132: groove
134: air supply channel
140: semiconductor chip
142: conductive layer
144: initiatively multiple substrate
146: colored filter
W: width
L: length
T: thickness
F: arrow
Detailed description of the invention
In order to make describing of this disclosure more detailed and complete, hereafter have been directed to embodiments of the present invention and specific embodiment proposes illustrative description; But this not implements or uses the unique forms of the specific embodiment of the invention.Each embodiment disclosed below, can mutually combine or replace, also can add other embodiment in one embodiment, and need not further record or illustrate useful when.
In the following description, following embodiment is fully understood describing many specific detail in detail to enable reader.But, can when putting into practice embodiments of the invention without when these specific detail.In other cases, be simplicity of illustration, the structure known and device are only schematically illustrated in figure.
With reference to the accompanying drawings, the specific embodiment of the present invention is described in further detail.Fig. 1 illustrates the schematic perspective view of the heater 100 of an embodiment of the present invention.With reference to Fig. 1, heater 100 comprises heating part 110 and pushing and pressing part 120.
Heating part 110 has heating surface 112, in order to heat an object.Heating part 110 can be such as made by the metal material such as stainless steel material or aluminium alloy, makes heating part have good heat-conductive characteristic.In one embodiment, heating surface 112 is essentially plane.The width W of heating surface 112 can be such as 1mm to 5mm, is in particular about 2mm.The length L of heating surface 112 can be such as 0.5 centimeter to 3 centimeters, be in particular 1 to 2 centimeter.Heating part 110 can make heating surface 112 produce the high temperature of more than 300 DEG C.
In one embodiment, heater 100 more comprises a junction 130.Connecting portion 130 entity connects heating part 110, and in order to transfer heat energy to heating part 110.For example, the top 130a of connecting portion 130 can in order to be connected to a thermal source, such as heat gun or flatiron.Therefore, heat can be passed to the heating surface 112 of heating part 110 via connecting portion 130.
Pushing and pressing part 120 by one end 110a of heating part 110 to downward-extension.The side of the contiguous heating surface 112 in pushing and pressing part 120 has a pushing and pressing face 122, and pushes against the substantially vertical heating surface 112 in face 122.In one embodiment, pushing and pressing face 122 is essentially plane, and pushes against face 122 and be adjacent to heating surface 112.In another embodiment, pushing and pressing part 120 has a bottom surface 126.Bottom surface 126 is in fact also a plane, and bottom surface 126 is adjacent and perpendicular to pushing and pressing face 122.In other words, bottom surface 126 is roughly parallel to heating surface 112.Vertical range between bottom surface 126 and heating surface 112 can be such as 1-3mm.The thickness T of pushing and pressing part 120 can be such as 0.5-3mm.
Fig. 2 illustrates the generalized section of the heater 100 of another embodiment of the present invention.In the present embodiment, have air feed channel 134 in heater 100, air feed channel 134 extends to the inside of heating part 110 and pushing and pressing part 120 by connecting portion 130 inside.Heating part 110 has multiple first pore 114, first pore 114 and has an opening 114a and be positioned on heating surface 112.Similarly, pushing and pressing part 120 has multiple second pore 124, second pore 124 and has an opening 124a and be positioned on pushing and pressing face 122.Air supply channel 134 is communicated with these the first pore 114 and the second pores 124.Therefore, high temperature air A to the first pore 114 and the second pore 124 can be supplied by air supply channel 134, high temperature air A be flowed out by opening 114a and opening 124a, and is able to heating one object.In one embodiment, only can configure the first pore 114 of heating part 110, and the second pore 124 of pushing and pressing part 120 is not set.
Fig. 3 illustrates the generalized section of the heater 100 of the another embodiment of the present invention.In the present embodiment, pushing and pressing part 120 has an inclined-plane 128 away from the side of heating surface 112.The thickness T of the bottom 120a of pushing and pressing part 120 can be such as 0.5mm to 3mm.
Heater 100 of the present invention is remove the object be installed on base material.In an embody rule, object is semiconductor chip 140, and semiconductor chip 140 is fixed on active multiple substrate 144 by conductive layer 142, as shown in Figure 3.Conductive layer 142 is such as anisotropic conducting rubber layer (ACF).Initiatively multiple substrate 144 is also configured with colored filter 146.When the needs in order to analyze or other reason must removing semiconductor chip 140 time, heater 100 just can be used to carry out removing semiconductor chip.Below in detail its operation principle will be described in detail.
First, heater 100 is moved to appropriate location, make the upper surface of the heating surface 112 contact semiconductor chip 140 of heating part 110, the side surface of the pushing and pressing face 122 contact semiconductor chip 140 of pushing and pressing part 120.Then, the heating surface 112 by heating part 110 carrys out heating semiconductor chip 140, and the temperature of semiconductor chip 140 is raised, and by heat-conduction principle, makes conductive layer 142 melted by heat below semiconductor chip 140.Now, mobile heating device 100 in the direction of arrow F, makes 122 pairs, the pushing and pressing face semiconductor chip 140 of pushing and pressing part 120 bestow a contact force, and is removed by active multiple substrate 144 by semiconductor chip 140.
In above-mentioned application, because the gap width between semiconductor chip 140 and colored filter 146 is conditional, such as, be 3mm.Therefore, according to an embodiment of the present invention, the thickness T of pushing and pressing part 120 is 0.5mm to 3mm.In addition, in the process at removing semiconductor chip 140, semiconductor chip 140 is damaged, the substantially vertical heating surface 112 in pushing and pressing face 122.So-called " substantially vertical " refers to that pushing and pressing face 122 is substantially perpendicular to heating surface 112, makes heating surface 112 and pushing and pressing face 122 can distinguish upper surface and the side surface of firmly contact semiconductor chip 140.Such as, between pushing and pressing face 122 and heating surface 112, shape has angle as 85-95 degree, is more clearly about 90 degree.
Fig. 4 illustrates the generalized section of the present invention's heater 100 of an embodiment again.In the present embodiment, push against face 122 directly do not adjoin or connect heating surface 112.Specifically, there is a groove 132 between pushing and pressing face 122 and heating surface 112.Groove 132, in order to the edge 144 of accommodating semiconductor chip 140, to avoid in the process of removing semiconductor chip 140, causes the edge 144 of semiconductor chip 140 to break.
From the invention described above embodiment, application the present invention promptly can remove the object be originally installed on base material, and effectively prevents object damage from breaking.According to the embodiment of the present invention, be applicable to the semiconductor chip removed on display floater, avoid semiconductor chip to break in the process removed.
Above, the specific embodiment of the present invention is described with reference to the accompanying drawings.But those skilled in the art can understand, when without departing from the spirit and scope of the present invention, various change and replacement can also be done to the specific embodiment of the present invention.These change and replacement all drops in the scope of claims of the present invention restriction.
Claims (11)
1. in order to remove a device for semiconductor chip, described semiconductor chip is fixed on a base material by a conductive layer, and it is characterized in that, described device comprises: a heater, moves and in order to remove an object, described heater comprises along a direction:
One heating part, has a heating surface, in order to contact and to heat a upper surface of described semiconductor chip, makes described conductive layer melted by heat by this, in order to heat described object; And
One pushing and pressing part, by one end of described heating part to downward-extension, the side of the contiguous described heating surface in described pushing and pressing part has a pushing and pressing face, and the substantially vertical described heating surface in described pushing and pressing face, described pushing and pressing part in order to bestow a contact force to described semiconductor chip, to remove described semiconductor chip, and, have a groove between described pushing and pressing face and described heating surface, described groove is in order to the edge of accommodating described semiconductor chip.
2. device as claimed in claim 1, it is characterized in that, described pushing and pressing face adjoins described heating surface.
3. device as claimed in claim 1, it is characterized in that, described heating surface and described pushing and pressing face are essentially plane.
4. device as claimed in claim 1, it is characterized in that, described heating part has multiple first pore, and the first pore described in each has an opening is positioned on described heating surface.
5. device as claimed in claim 1, it is characterized in that, described pushing and pressing part has multiple second pore, and the second pore described in each has an opening is positioned on described pushing and pressing face.
6. device as claimed in claim 1, it is characterized in that, more comprise a junction, this connecting portion entity connects this heating part, and in order to transfer heat energy to this heating part.
7. device as claimed in claim 1, it is characterized in that, described pushing and pressing part has a bottom surface and connects described pushing and pressing face, and pushes against face described in described plane perpendicular.
8. device as claimed in claim 1, it is characterized in that, described pushing and pressing part has an inclined-plane away from the side of described heating surface, and the thickness bottom one of described pushing and pressing part is 0.5mm to 3mm.
9. device as claimed in claim 1, it is characterized in that, described semiconductor chip is fixed on an active array substrate by a conductive layer, described active array substrate configures 1 colored filter, and has 1 gap between described colored filter and described semiconductor chip.
10. device as claimed in claim 9, it is characterized in that, described heater is to move away from the direction of described colored filter.
11. devices as claimed in claim 9, it is characterized in that, the thickness of described pushing and pressing part is less than or equal to the width in described gap, and described pushing and pressing part is inserted in described gap makes described pushing and pressing face contact the side surface of described semiconductor chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110402497.6A CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
| TW101102206A TWI473177B (en) | 2011-12-02 | 2012-01-19 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110402497.6A CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102489817A CN102489817A (en) | 2012-06-13 |
| CN102489817B true CN102489817B (en) | 2015-02-04 |
Family
ID=46181701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110402497.6A Expired - Fee Related CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102489817B (en) |
| TW (1) | TWI473177B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106292020A (en) * | 2015-05-27 | 2017-01-04 | 凌巨科技股份有限公司 | Heater body and heating unit |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| CN2189024Y (en) * | 1994-05-29 | 1995-02-08 | 孟凡寅 | Shovel shaped soldering iron |
| CN2329473Y (en) * | 1998-06-29 | 1999-07-21 | 周晓元 | Dual-purpose electric soldering iron for fast detaching integrated circuit chip |
| CN201397435Y (en) * | 2009-05-26 | 2010-02-03 | 上海晨兴希姆通电子科技有限公司 | IC removing device |
| CN102045953A (en) * | 2009-10-22 | 2011-05-04 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow soldering machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410696A (en) * | 1987-07-02 | 1989-01-13 | Fujitsu Ltd | Apparatus for removing flat-lead-type component |
| US5054681A (en) * | 1990-07-25 | 1991-10-08 | Kim Henry I | Component desoldering tool |
| US7168609B2 (en) * | 2002-09-03 | 2007-01-30 | International Business Machines Corporation | Method and apparatus for removing known good die |
| US6745932B2 (en) * | 2002-09-03 | 2004-06-08 | International Business Machines Corp. | Low strain chip removal apparatus |
-
2011
- 2011-12-02 CN CN201110402497.6A patent/CN102489817B/en not_active Expired - Fee Related
-
2012
- 2012-01-19 TW TW101102206A patent/TWI473177B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| CN2189024Y (en) * | 1994-05-29 | 1995-02-08 | 孟凡寅 | Shovel shaped soldering iron |
| CN2329473Y (en) * | 1998-06-29 | 1999-07-21 | 周晓元 | Dual-purpose electric soldering iron for fast detaching integrated circuit chip |
| CN201397435Y (en) * | 2009-05-26 | 2010-02-03 | 上海晨兴希姆通电子科技有限公司 | IC removing device |
| CN102045953A (en) * | 2009-10-22 | 2011-05-04 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow soldering machine |
Non-Patent Citations (1)
| Title |
|---|
| JP昭64-10696A 1989.01.13 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI473177B (en) | 2015-02-11 |
| TW201324630A (en) | 2013-06-16 |
| CN102489817A (en) | 2012-06-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20201202 |