CN102489817A - Heating device - Google Patents
Heating device Download PDFInfo
- Publication number
- CN102489817A CN102489817A CN2011104024976A CN201110402497A CN102489817A CN 102489817 A CN102489817 A CN 102489817A CN 2011104024976 A CN2011104024976 A CN 2011104024976A CN 201110402497 A CN201110402497 A CN 201110402497A CN 102489817 A CN102489817 A CN 102489817A
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- CN
- China
- Prior art keywords
- pushing
- heating
- pressing
- heater
- heating surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a heating device, which comprises a heating part and a pushing part, wherein the heating part is provided with a heating surface; the pushing part extends from one end of the heating part downwards; one side of the pushing part close to the heating surface is provided with a pushing surface; and the pushing surface is approximately vertical to the heating surface. Due to the adoption of the heating device, an object which is originally fixed on a base material can be rapidly removed, and the object is effectively prevented from being damaged or broken.
Description
Technical field
The present invention relates to a kind of heater, relate in particular to a kind of heater that prevents that effectively the object damage from breaking.
Background technology
In many electronic products, can use semiconductor chip, these semiconductor chips are fixed on the substrate by scolding tin or anisotropic conducting rubber film usually.When bad or semiconductor chip itself has defective when the electric connection of semiconductor chip and substrate, be necessary to remove the semiconductor chip that has been fixed on the substrate.
In the prior art, not having the semiconductor chip that proper device or equipment will be fixed on the substrate removes.Normally, utilize a firing equipment to heat semiconductor chip, with anchor clamps semiconductor chip is pulled out again through manual mode.In the aforesaid operations process, be easy to cause the semiconductor chip damage of breaking, and can't carry out subsequent analysis or carry out heavy industry (rework).
On the other hand, in many electronic products, be provided with other assembly around the semiconductor chip.If remove semiconductor chip, when usually removing semiconductor chip, damage other assembly of periphery with manual mode.
In view of this, how designing a kind of brand-new equipment, remove the semiconductor chip that is fixed on the substrate, is the problem that those skilled in the art need solution badly.
Summary of the invention
In prior art, existence remove semiconductor chip with manual mode, can damage the defective of other assembly of periphery, the invention provides a kind of heater.
A kind of heater is provided according to an aspect of the present invention, enables to remove an object that is fixedly arranged on the base material, and in the process that removes, can avoid the object damage effectively or break.This heater comprises a heating part and a pushing and pressing part.The heating part has a heating surface, the object of desiring to remove in order to heating.To extending below, a side of the contiguous heating surface in pushing and pressing part has a pushing and pressing face by an end of heating part in the pushing and pressing part, and pushing and pressing face approximate vertical heating surface.
Preferably, pushing and pressing face is in abutting connection with heating surface.
Preferably, heating surface and pushing and pressing face are essentially the plane.
Preferably, the heating part has a plurality of first pores, and each a little first pore has an opening and is positioned on the heating surface.
Preferably, the pushing and pressing part has a plurality of second pores, and each a little second pore has an opening and is positioned on the pushing and pressing face.
Preferably, this heater more comprises a junction, and the connecting portion entity connects the heating part, and in order to transfer heat energy to the heating part.
Preferably, a width of heating surface is 1mm to 5mm, and a length of heating surface is 0.5 centimeter to 3 centimeters.
Preferably, the pushing and pressing part has a bottom surface and connects pushing and pressing face, and the bottom surface vertically pushes against face.
Preferably, the pushing and pressing part has an inclined-plane away from a side of heating surface, and the thickness of a bottom of pushing and pressing part is 0.5mm to 3mm.
Provide a kind of in order to remove the device of semiconductor chip according to another aspect of the present invention, semiconductor chip system is fixed on the base material through a conductive layer.This device comprises a heating part and a pushing and pressing part.The heating part has a heating surface, and the upper surface in order to contact and heating semiconductor chip makes the conductive layer melted by heat by this.To extending below, a side of the contiguous heating surface in pushing and pressing part has a pushing and pressing face by an end of heating part in the pushing and pressing part, and pushing and pressing face approximate vertical heating surface, and the pushing and pressing part is in order to semiconductor chip is bestowed a contact force, to remove semiconductor chip.
Adopt the present invention promptly to remove and originally be installed in the object on the base material, and prevent that effectively the object damage from breaking.
Description of drawings
The reader with reference to advantages after the specific embodiment of the present invention, will become apparent various aspects of the present invention.Wherein,
Fig. 1 illustrates the schematic perspective view of the heater of an embodiment of the present invention.
Fig. 2 illustrates the generalized section of the heater of another embodiment of the present invention.
Fig. 3 illustrates the generalized section of the heater of the another embodiment of the present invention.
Fig. 4 illustrates the present invention's generalized section of the heater of an embodiment again.
[primary clustering symbol description]
100: heater
110: the heating part
110a a: end of heating part
112: heating surface
114: the first pores
114a: opening
120: the pushing and pressing part
120a: bottom
122: pushing and pressing face
124: the second pores
124a: opening
126: the bottom surface
128: the inclined-plane
130: connecting portion
130a: top
132: groove
134: air supply channel
140: semiconductor chip
142: conductive layer
144: the active multiple substrate
146: colored filter
W: width
L: length
T: thickness
F: arrow
The specific embodiment
More detailed and complete for the narration that makes this disclosure, hereinafter has been directed against embodiment of the present invention and specific embodiment has proposed illustrative description; But this is not unique form of implementing or using the specific embodiment of the invention.Following each embodiment that discloses can make up or replace under useful situation each other, also can add other embodiment in one embodiment, and need not further put down in writing or explain.
In the following description, with being described in detail many specific detail so that the reader can make much of following embodiment.Yet, can under the situation of not having these specific detail, put into practice embodiments of the invention.In other cases, be simplicity of illustration, the structure of knowing only schematically is illustrated among the figure with device.
With reference to the accompanying drawings, specific embodiments of the invention is done further to describe in detail.Fig. 1 illustrates the schematic perspective view of the heater 100 of an embodiment of the present invention.With reference to Fig. 1, heater 100 comprises heating part 110 and pushing and pressing part 120.
In one embodiment, heater 100 more comprises a junction 130.Connecting portion 130 entities connect heating part 110, and in order to transfer heat energy to heating part 110.For example, the top 130a of connecting portion 130 can be in order to be connected to a thermal source, for example heat gun or flatiron.Therefore, heat can be passed to the heating surface 112 of heating part 110 via connecting portion 130.
Pushing and pressing part 120 by an end 110a of heating part 110 to extending below.One side of pushing and pressing part 120 contiguous heating surfaces 112 has a pushing and pressing face 122, and pushing and pressing face 122 approximate vertical heating surfaces 112.In one embodiment, pushing and pressing face 122 is essentially the plane, and pushing and pressing face 122 is adjacent to heating surface 112.In another embodiment, pushing and pressing part 120 has a bottom surface 126.Bottom surface 126 in fact also is a plane, bottom surface 126 in abutting connection with and perpendicular to pushing and pressing face 122.In other words, bottom surface 126 is roughly parallel to heating surface 112.Vertical range between bottom surface 126 and the heating surface 112 can for example be 1-3mm.The thickness T of pushing and pressing part 120 can for example be 0.5-3mm.
Fig. 2 illustrates the generalized section of the heater 100 of another embodiment of the present invention.In this embodiment, have air feed channel 134 in the heater 100, air feed channel 134 is extended to the inside of heating part 110 and pushing and pressing part 120 by connecting portion 130 inside.Heating part 110 has a plurality of first pore, 114, the first pores 114 and has an opening 114a and be positioned on the heating surface 112.Similarly, pushing and pressing part 120 has a plurality of second pore, 124, the second pores 124 and has an opening 124a and be positioned on the pushing and pressing face 122.Air supply channel 134 is communicated with these first pores 114 and second pore 124.Therefore, can supply with high temperature air A to the first pore 114 and second pore 124, high temperature air A flowed out by opening 114a and opening 124a, and be able to heat an object by air supply channel 134.In one embodiment, can only dispose first pore 114 of heating part 110, and second pore 124 of pushing and pressing part 120 is not set.
Fig. 3 illustrates the generalized section of the heater 100 of the another embodiment of the present invention.In this embodiment, pushing and pressing part 120 has an inclined-plane 128 away from a side of heating surface 112.The thickness T of the bottom 120a of pushing and pressing part 120 can for example be 0.5mm to 3mm.
At first, heater 100 is moved to the appropriate location, make the upper surface of the heating surface 112 contact semiconductor chips 140 of heating part 110, the side surface of the pushing and pressing face 122 contact semiconductor chips 140 of pushing and pressing part 120.Then, heat semiconductor chip 140, the temperature of semiconductor chip 140 is raise, and, make conductive layer 142 melted by heat of semiconductor chip 140 belows through heat-conduction principle by the heating surface 112 of heating part 110.At this moment, mobile heating device 100 in the direction of arrow F, make 122 pairs of semiconductor chips 140 of pushing and pressing face of pushing and pressing part 120 bestow a contact force, and with semiconductor chip 140 by removing on the active multiple substrate 144.
In above-mentioned application,, for example be 3mm because the gap width between semiconductor chip 140 and the colored filter 146 is conditional.Therefore, according to an embodiment of the present invention, the thickness T of pushing and pressing part 120 is 0.5mm to 3mm.In addition, for fear of infringement semiconductor chip 140 in the process that removes semiconductor chip 140, pushing and pressing face 122 approximate vertical heating surfaces 112.So-called " approximate vertical " is meant pushing and pressing face 122 in fact perpendicular to heating surface 112, makes heating surface 112 and pushing and pressing face 122 can distinguish the firmly upper surface and the side surface of contact semiconductor chip 140.For example, forming an angle between pushing and pressing face 122 and the heating surface 112 is the 85-95 degree, more clearly is about 90 degree.
Fig. 4 illustrates the present invention's generalized section of the heater 100 of an embodiment again.In this embodiment, direct adjacency of pushing and pressing face 122 or connection heating surface 112.Particularly, has a groove 132 between pushing and pressing face 122 and the heating surface 112.Groove 132 to avoid in the process that removes semiconductor chip 140, causes the edge 144 of semiconductor chip 140 to break in order to the edge 144 of ccontaining semiconductor chip 140.
Can know by the invention described above embodiment, use the present invention and can promptly remove and originally be installed in the object on the base material, and prevent that effectively the object damage from breaking.According to the embodiment of the present invention, applicable to the semiconductor chip that removes on the display floater, avoid semiconductor chip in the process that removes, to break.
In the preceding text, illustrate and describe the specific embodiment of the present invention.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also specific embodiments of the invention do various changes and replacement.These changes and replacement all drop in claims restricted portion of the present invention.
Claims (10)
1. a heater in order to remove an object, is characterized in that, comprises:
One heating part has a heating surface, in order to heat said object; And
One pushing and pressing part, to extending below, a side of the contiguous said heating surface in said pushing and pressing part has a pushing and pressing face, and the said heating surface of said pushing and pressing face approximate vertical by an end of said heating part.
2. heater as claimed in claim 1 is characterized in that, said pushing and pressing face is in abutting connection with said heating surface.
3. heater as claimed in claim 1 is characterized in that, said heating surface and said pushing and pressing face are essentially the plane.
4. heater as claimed in claim 1 is characterized in that, said heating part has a plurality of first pores, and each said first pore has an opening and is positioned on the said heating surface.
5. heater as claimed in claim 1 is characterized in that, said pushing and pressing part has a plurality of second pores, and each said second pore has an opening and is positioned on the said pushing and pressing face.
6. heater as claimed in claim 1 is characterized in that, the color of said light-shielding structure is grey or black.
7. heater as claimed in claim 1 is characterized in that, a width of said heating surface is 1mm to 5mm, and a length of said heating surface is 0.5 centimeter to 3 centimeters.
8. heater as claimed in claim 1 is characterized in that, said pushing and pressing part has a bottom surface and connects said pushing and pressing face, and the vertical said pushing and pressing face in said bottom surface.
9. heater as claimed in claim 1 is characterized in that, said pushing and pressing part has an inclined-plane away from a side of said heating surface, and the thickness of a bottom of said pushing and pressing part is 0.5mm to 3mm.
10. one kind in order to removing the device of semiconductor chip, and said semiconductor chip system is fixed on the base material through a conductive layer, it is characterized in that said device comprises:
One heating part has a heating surface, in order to contact and to heat a upper surface of said semiconductor chip, makes said conductive layer melted by heat by this; And
One pushing and pressing part; To extending below, a side of the contiguous said heating surface in said pushing and pressing part has a pushing and pressing face, and the said heating surface of said pushing and pressing face approximate vertical by an end of said heating part; Said pushing and pressing part is in order to bestow a contact force to said semiconductor chip, to remove said semiconductor chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110402497.6A CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
| TW101102206A TWI473177B (en) | 2011-12-02 | 2012-01-19 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110402497.6A CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102489817A true CN102489817A (en) | 2012-06-13 |
| CN102489817B CN102489817B (en) | 2015-02-04 |
Family
ID=46181701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110402497.6A Expired - Fee Related CN102489817B (en) | 2011-12-02 | 2011-12-02 | Apparatus for removing a half semiconductor chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102489817B (en) |
| TW (1) | TWI473177B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106292020A (en) * | 2015-05-27 | 2017-01-04 | 凌巨科技股份有限公司 | Heater body and heating unit |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410696A (en) * | 1987-07-02 | 1989-01-13 | Fujitsu Ltd | Apparatus for removing flat-lead-type component |
| US5054681A (en) * | 1990-07-25 | 1991-10-08 | Kim Henry I | Component desoldering tool |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| CN2189024Y (en) * | 1994-05-29 | 1995-02-08 | 孟凡寅 | Shovel shaped soldering iron |
| CN2329473Y (en) * | 1998-06-29 | 1999-07-21 | 周晓元 | Dual-purpose electric soldering iron for fast detaching integrated circuit chip |
| US20040041011A1 (en) * | 2002-09-03 | 2004-03-04 | International Business Machines Corporation | Method and apparatus for removing known good die |
| US20040041012A1 (en) * | 2002-09-03 | 2004-03-04 | International Business Machines Corporation | Low strain chip removal apparatus |
| CN201397435Y (en) * | 2009-05-26 | 2010-02-03 | 上海晨兴希姆通电子科技有限公司 | IC removing device |
| CN102045953A (en) * | 2009-10-22 | 2011-05-04 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow soldering machine |
-
2011
- 2011-12-02 CN CN201110402497.6A patent/CN102489817B/en not_active Expired - Fee Related
-
2012
- 2012-01-19 TW TW101102206A patent/TWI473177B/en not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410696A (en) * | 1987-07-02 | 1989-01-13 | Fujitsu Ltd | Apparatus for removing flat-lead-type component |
| US5054681A (en) * | 1990-07-25 | 1991-10-08 | Kim Henry I | Component desoldering tool |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| CN2189024Y (en) * | 1994-05-29 | 1995-02-08 | 孟凡寅 | Shovel shaped soldering iron |
| CN2329473Y (en) * | 1998-06-29 | 1999-07-21 | 周晓元 | Dual-purpose electric soldering iron for fast detaching integrated circuit chip |
| US20040041011A1 (en) * | 2002-09-03 | 2004-03-04 | International Business Machines Corporation | Method and apparatus for removing known good die |
| US20040041012A1 (en) * | 2002-09-03 | 2004-03-04 | International Business Machines Corporation | Low strain chip removal apparatus |
| CN201397435Y (en) * | 2009-05-26 | 2010-02-03 | 上海晨兴希姆通电子科技有限公司 | IC removing device |
| CN102045953A (en) * | 2009-10-22 | 2011-05-04 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow soldering machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106292020A (en) * | 2015-05-27 | 2017-01-04 | 凌巨科技股份有限公司 | Heater body and heating unit |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI473177B (en) | 2015-02-11 |
| TW201324630A (en) | 2013-06-16 |
| CN102489817B (en) | 2015-02-04 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20201202 |
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| CF01 | Termination of patent right due to non-payment of annual fee |