CN209140804U - A kind of cell phone mainboard maintaining device - Google Patents
A kind of cell phone mainboard maintaining device Download PDFInfo
- Publication number
- CN209140804U CN209140804U CN201822051992.7U CN201822051992U CN209140804U CN 209140804 U CN209140804 U CN 209140804U CN 201822051992 U CN201822051992 U CN 201822051992U CN 209140804 U CN209140804 U CN 209140804U
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- cell phone
- insulation
- area
- phone mainboard
- thermal conductivity
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Abstract
The utility model relates to a kind of cell phone mainboard maintaining devices, including area of insulation and thermal conductivity region, the position of the thermal conductivity region corresponds to the setting of the chip on cell phone mainboard position, and in thermal conductivity region periphery, area of insulation is greater than cell phone mainboard size for the area of insulation setting；Empty avoiding heat dissipation region is equipped between the thermal conductivity region and area of insulation.Specifically, the area of insulation is synthesis stone, middle part hollow out, thermal conductivity region is heat radiating metal block, and the heat radiating metal block is set to hollow part in the middle part of area of insulation.Maintaining device described in the utility model, increase brass ingot at jig dispensing, the heat of die terminals is guided by heat exchange pattern, ensure that chip tin ball is heated without departing from 217 degree, effectively avoid quick-fried glue phenomenon, cell phone mainboard and chip after guaranteeing maintenance, which repeat, to be utilized, and is economized on resources, is further decreased company cost.
Description
Technical field
The utility model relates to mobile phone process techniques, and in particular to a kind of cell phone mainboard breakdown maintenance jig.
Background technique
Smart phone will appear the blank screen of 0.1%-0.2% or so because of design problem in assembling process, need to remove dispensing member
Screening cover at part replaces internal element, or the other elements for the opposite face in face where dispensing element that needs repairing,
It requires to carry out heating repair to plank, but because cell phone mainboard is smaller, component closeness is high, and when heating repair is easy overheat
Lead to the quick-fried glue of back side original part, the chip (chips such as CPU/FLASH/ power supply) for removing quick-fried glue again is needed after quick-fried glue, plants tin ball again
After put in back plank, entire maintenance time needs 30 minutes or so, and also will cause 15% plank in the process and scrap object with 5%
Material is scrapped, and increases maintenance difficulty and time, generates severe attrition and quality hidden danger.
Utility model content
The purpose of this utility model is to provide a kind of efficient cell phone mainboard maintaining devices.
A kind of cell phone mainboard maintaining device, including area of insulation and thermal conductivity region, the position of the thermal conductivity region correspond to hand
Position is arranged in chip in mainboard, and in thermal conductivity region periphery, area of insulation is greater than cell phone mainboard ruler for the area of insulation setting
It is very little；Empty avoiding heat dissipation region is equipped between the thermal conductivity region and area of insulation.
The area of insulation is synthesis stone, and middle part hollow out, thermal conductivity region is heat radiating metal block, the heat radiating metal block
It is set to hollow part in the middle part of area of insulation.
The heat radiating metal block of the area of insulation is brass ingot.
The heat radiating metal block is fixed on synthesis stone by rivet.
The area of insulation is additionally provided with multiple evacuation grooves to match with cell phone mainboard construction.
The heat radiating metal block is T font.
Chip-wide setting on the T font transverse arm and the width adequate cell phone mainboard of vertical arms.
The glass transition temperature of the glue used when assembling cell phone mainboard is 61 degrees centigrades, and the solution temperature of tin cream is about
It is 217 degrees Celsius, maintaining device described in the utility model increases brass ingot at jig dispensing, by heat exchange pattern by core
The heat of bit end guides, it is ensured that chip tin ball is heated without departing from 217 degree, effectively avoids quick-fried glue phenomenon, the mobile phone after guaranteeing maintenance
Mainboard and chip, which repeat, to be utilized, and is economized on resources, is further decreased company cost.
Detailed description of the invention
Fig. 1 is an example structure schematic diagram of the cell phone mainboard maintaining device.
Specific embodiment
The utility model cell phone mainboard maintaining device work is further retouched in detail below in conjunction with specific embodiments and drawings
It states.
As shown in Figure 1, in a preferred embodiment, maintaining device used in the cell phone mainboard maintaining device of the utility model,
Including jig body 1(, that is, area of insulation), 1 middle part hollow out of jig body, hollow part is equipped with heat radiating metal block 2(, that is, thermal conductive zone
Domain), heat radiating metal block 2 is fixed in jig body 1 by multiple rivets 21, by heat radiating metal block 2 there are with cell phone mainboard structure
The gap (forming empty avoiding heat dissipation region) to match is made, is additionally provided with two grooves to match with cell phone components in jig body 1
12。
Jig body 1 is made of compound stone, is used as fixture base, has preferable antistatic and heat-proof quality.
Heat radiating metal block 2 is made of brass, has preferable heat dissipation performance.
The cell phone mainboard maintaining device is in use, cell phone mainboard to be repaired is placed on maintaining device, by mobile phone
Chip contraposition on mainboard is placed on T font heat radiating metal block, screening cover is removed, to adding at each sizing on cell phone mainboard
Heat, heating temperature are 70-100 degrees Celsius；After glue is molten, maintenance or replacement undesired component.Repairing need to be to re-assemblying mobile phone master
Plate is detected, including AOI equipment detect inside detection and X-ray butt welding point to appearance, it is ensured that cell phone mainboard
Quality.
Because of heating repair, extra heat is conducted by maintaining device on cell phone mainboard, especially chip part
Heat can distribute in time, avoid the accumulation of heat, it is ensured that chip tin ball is heated without departing from 217 during heating repair
Degree Celsius, avoid quick-fried glue from generating.
Although the description combination embodiments above to the utility model carries out, it is familiar with the art
Personnel can carry out many replacements based on the above contents, modifications and variations, be obvious.Therefore, all such
Substitution, improvements and changes are included in the spirit and scope of appended claims.
Claims (7)
1. a kind of cell phone mainboard maintaining device, which is characterized in that including area of insulation and thermal conductivity region, the position of the thermal conductivity region
The chip setting position on corresponding cell phone mainboard is set, in thermal conductivity region periphery, area of insulation is greater than hand for the area of insulation setting
Owner's board size；Empty avoiding heat dissipation region is equipped between the thermal conductivity region and area of insulation.
2. cell phone mainboard maintaining device according to claim 1, which is characterized in that the area of insulation is synthesis stone,
Its middle part hollow out, thermal conductivity region are heat radiating metal block, and the heat radiating metal block is set to hollow part in the middle part of area of insulation.
3. cell phone mainboard maintaining device according to claim 2, which is characterized in that the heat radiating metal block of the area of insulation
For brass ingot.
4. cell phone mainboard maintaining device according to claim 2, which is characterized in that the heat radiating metal block passes through rivet
It is fixed on synthesis stone.
5. cell phone mainboard maintaining device according to claim 2, which is characterized in that the area of insulation be additionally provided with it is multiple with
Cell phone mainboard constructs the evacuation groove to match.
6. cell phone mainboard maintaining device according to claim 2, which is characterized in that the heat radiating metal block is T font.
7. cell phone mainboard maintaining device according to claim 6, which is characterized in that the T font transverse arm and vertical arms
Width adequate cell phone mainboard on Chip-wide setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822051992.7U CN209140804U (en) | 2018-12-07 | 2018-12-07 | A kind of cell phone mainboard maintaining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822051992.7U CN209140804U (en) | 2018-12-07 | 2018-12-07 | A kind of cell phone mainboard maintaining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209140804U true CN209140804U (en) | 2019-07-23 |
Family
ID=67289491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822051992.7U Active CN209140804U (en) | 2018-12-07 | 2018-12-07 | A kind of cell phone mainboard maintaining device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209140804U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114428A1 (en) * | 2018-12-07 | 2020-06-11 | 惠州光弘科技股份有限公司 | Adhesive explosion-proof method during mobile phone motherboard repair |
| CN113873775A (en) * | 2021-12-01 | 2021-12-31 | 江苏金晓电子信息股份有限公司 | High-density display screen maintenance enclosure jig and maintenance method |
-
2018
- 2018-12-07 CN CN201822051992.7U patent/CN209140804U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114428A1 (en) * | 2018-12-07 | 2020-06-11 | 惠州光弘科技股份有限公司 | Adhesive explosion-proof method during mobile phone motherboard repair |
| CN113873775A (en) * | 2021-12-01 | 2021-12-31 | 江苏金晓电子信息股份有限公司 | High-density display screen maintenance enclosure jig and maintenance method |
| CN113873775B (en) * | 2021-12-01 | 2022-04-01 | 江苏金晓电子信息股份有限公司 | High-density display screen PCB maintenance enclosure jig and maintenance method |
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