CN109511229A - A kind of explosion-proof gluing method of cell phone mainboard maintenance - Google Patents
A kind of explosion-proof gluing method of cell phone mainboard maintenance Download PDFInfo
- Publication number
- CN109511229A CN109511229A CN201811495740.1A CN201811495740A CN109511229A CN 109511229 A CN109511229 A CN 109511229A CN 201811495740 A CN201811495740 A CN 201811495740A CN 109511229 A CN109511229 A CN 109511229A
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- CN
- China
- Prior art keywords
- cell phone
- phone mainboard
- explosion
- gluing method
- repairs
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The present invention relates to a kind of cell phone mainboards to repair explosion-proof gluing method, includes the following steps: that cell phone mainboard to be repaired is placed on maintaining device by a.；B. screening cover is removed, to heating at each sizing added on cell phone mainboard；C. after glue is molten, maintenance or replacement undesired component；D. cell phone mainboard is re-assemblied after detection is qualified.Method for maintaining of the present invention passes through special maintaining device, increase brass ingot at jig dispensing, the heat of die terminals is guided by heat exchange pattern, during ensuring continuous heating, chip tin ball is heated without departing from 217 degree, effectively avoids quick-fried glue phenomenon, and the cell phone mainboard and chip after guaranteeing maintenance are repeatable to be utilized, it economizes on resources, further decreases company cost.
Description
Technical field
The present invention relates to the fields SMT, and in particular to a kind of explosion-proof gluing method of cell phone mainboard maintenance.
Background technique
Smart phone will appear the blank screen of 0.1%-0.2% or so because of design problem in assembling process, need to remove dispensing member
Screening cover at part replaces internal element, or the other elements for the opposite face in face where dispensing element that needs repairing,
It requires to carry out heating repair to plank, but because cell phone mainboard is smaller, component closeness is high, and when heating repair is easy overheat
Lead to the quick-fried glue of back side original part, the chip (chips such as CPU/FLASH/ power supply) for removing quick-fried glue again is needed after quick-fried glue, plants tin ball again
After put in back plank, entire maintenance time needs 30 minutes or so, and also will cause 15% plank in the process and scrap object with 5%
Material is scrapped, and increases maintenance difficulty and time, generates severe attrition and quality hidden danger.
Summary of the invention
The purpose of the present invention is to provide a kind of efficient cell phone mainboards to repair explosion-proof gluing method and its used equipment.
A kind of explosion-proof gluing method of cell phone mainboard maintenance, which comprises the steps of:
A. cell phone mainboard to be repaired is placed on maintaining device；
B. screening cover is removed, to heating at each sizing added on cell phone mainboard；
C. after glue is molten, maintenance or replacement undesired component；
D. cell phone mainboard is re-assemblied after detection is qualified.
Further, b step heating temperature is 70-100 degrees Celsius.
Further, detection includes AOI test and X-ray test.
A kind of jig, which is characterized in that including jig body, jig body middle part hollow out, hollow part is equipped with heat radiating metal
Block is additionally provided with multiple grooves to match with cell phone components and supporting block in jig body.
Further, jig body is made of compound stone.
Further, heat radiating metal block is made of brass.
Further, heat radiating metal block is fixed in jig body by multiple rivets.
The glass transition temperature of the glue used when assembling cell phone mainboard is 61 degrees centigrades, and the solution temperature of tin cream is about
It is 217 degrees Celsius, method for maintaining of the present invention is increased brass ingot at jig dispensing, passed through by special maintaining device
Heat exchange pattern guides the heat of die terminals, it is ensured that during continuous heating, chip tin ball is heated without departing from 217 degree, effectively
Avoid quick-fried glue phenomenon, the cell phone mainboard and chip after guaranteeing maintenance are repeatable to be utilized, and is economized on resources, further decrease company at
This.
After being repaired using new method, every piece of plank of maintenance is only needed 3 minutes, shorten to before improving (every piece of plank maintenance time
30 minutes) 1/10th, efficiency greatly improves.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the jig of an embodiment.
Specific embodiment
It is further detailed that explosion-proof gluing method work is repaired to cell phone mainboard of the present invention below in conjunction with specific embodiments and drawings
Description.
As shown in Figure 1, cell phone mainboard of the invention repairs maintenance used in explosion-proof gluing method and controls in a preferred embodiment
Tool, including jig body 1,1 middle part hollow out of jig body, hollow part are equipped with T font heat radiating metal block 2, and heat radiating metal block 2 passes through
Multiple rivets 21 are fixed in jig body 1.The design of T font heat radiating metal block between jig body so that there is sky in it
Gap, rather than be full of the intermediate hollow part of jig body, be more convenient the conduction of heat and distribute.Be additionally provided in jig body 1 with
Two empty avoiding grooves 12 that cell phone components match.
Jig body 1 is made of the compound stone of perfect heat-dissipating, can also be made of individual stone material, stone material is used as folder
Have pedestal, there is preferable antistatic and heat-proof quality.
Heat radiating metal block 2 is made of brass, has preferable heat dissipation performance.
A kind of explosion-proof gluing method of cell phone mainboard maintenance, includes the following steps:
A. cell phone mainboard to be repaired is placed on maintaining device；
B. screening cover is removed, to heating at each sizing added on cell phone mainboard, heating temperature is 70-100 degrees Celsius；
C. after glue is molten, maintenance or replacement undesired component；
D. cell phone mainboard is re-assemblied after detection is qualified, detection includes AOI test and X-ray test, is ensured by AOI vision-based detection
Solder joint and presentation quality for dispensing glue after maintenance, after being repaired by X-ray check inside solder joint, it is ensured that do not caused because of heating repair
Solder joint interior void, rosin joint phenomena such as.
Because of heating repair, extra heat is conducted by maintaining device on cell phone mainboard, it is ensured that chip tin ball is heated not
Beyond 217 degrees Celsius, quick-fried glue is avoided to generate.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements based on the above contents, modifications and variations, be obvious.Therefore, all such substitutions,
Improvements and changes are included in the spirit and scope of appended claims.
Claims (10)
1. a kind of cell phone mainboard repairs explosion-proof gluing method, which comprises the steps of:
A., dedicated maintaining device is set, cell phone mainboard to be repaired is placed on maintaining device；
B. screening cover is removed, to heating at each sizing on cell phone mainboard to be repaired；
C. after glue is molten, maintenance or replacement undesired component；
D. it repairs and re-assemblies cell phone mainboard after detecting qualification；
Area of insulation is set on the maintaining device and thermal conductivity region, the position of the thermal conductivity region correspond to the chip on cell phone mainboard
Position is set, and in thermal conductivity region periphery, area of insulation is greater than cell phone mainboard size for the area of insulation setting.
2. cell phone mainboard according to claim 1 repairs explosion-proof gluing method, which is characterized in that the thermal conductivity region with it is heat-insulated
Empty avoiding heat dissipation region is equipped between region.
3. cell phone mainboard according to claim 2 repairs explosion-proof gluing method, which is characterized in that the area of insulation is using heat
Conductibility difference and antistatic material production；The thermal conductivity region material production excellent using heat conductivity.
4. cell phone mainboard according to claim 2 repairs explosion-proof gluing method, which is characterized in that the thermal conductivity region is using yellow
Copper is made.
5. cell phone mainboard according to claim 1 repairs explosion-proof gluing method, which is characterized in that the b step heating temperature
It is 70-100 degrees Celsius.
6. cell phone mainboard according to claim 1 repairs explosion-proof gluing method, which is characterized in that the detection in the Step d
Including AOI test and X-ray test.
7. jig described in a kind of claim 1-3 any one, which is characterized in that including jig body (1), jig body
(1) middle part hollow out, hollow part are equipped with heat radiating metal block (2), and heat radiating metal block (2) is other, and there are match with cell phone mainboard construction
Gap is additionally provided with multiple grooves (12) to match with cell phone mainboard construction and supporting block (13) in jig body (1).
8. jig according to claim 4, which is characterized in that the jig body (1) is made of compound stone.
9. jig according to claim 4, which is characterized in that the heat radiating metal block (2) is made of brass.
10. jig according to claim 4, which is characterized in that the heat radiating metal block (2) is fixed by rivet (21)
In on jig body (1).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811495740.1A CN109511229A (en) | 2018-12-07 | 2018-12-07 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
| PCT/CN2019/123055 WO2020114428A1 (en) | 2018-12-07 | 2019-12-04 | Adhesive explosion-proof method during mobile phone motherboard repair |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811495740.1A CN109511229A (en) | 2018-12-07 | 2018-12-07 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109511229A true CN109511229A (en) | 2019-03-22 |
Family
ID=65751880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811495740.1A Pending CN109511229A (en) | 2018-12-07 | 2018-12-07 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109511229A (en) |
| WO (1) | WO2020114428A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114428A1 (en) * | 2018-12-07 | 2020-06-11 | 惠州光弘科技股份有限公司 | Adhesive explosion-proof method during mobile phone motherboard repair |
| CN113630976A (en) * | 2021-08-02 | 2021-11-09 | 上海龙旗科技股份有限公司 | Mainboard maintenance jig and method |
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| CN201735922U (en) * | 2010-07-26 | 2011-02-09 | 上海华勤通讯技术有限公司 | Maintenance platform used to maintain AQFN mobile phone main board |
| CN206936562U (en) * | 2017-06-20 | 2018-01-30 | 深圳市阿毛电子商务有限公司 | A kind of cell phone mainboard maintenance fixture clip |
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| CN207460605U (en) * | 2017-05-17 | 2018-06-05 | 孙恒权 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
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| CN104808025A (en) * | 2015-05-06 | 2015-07-29 | 天津市中环通讯技术有限公司 | PCBA (printed circuit board assembly) repair bracket fixture and application method thereof |
| CN206364860U (en) * | 2017-01-10 | 2017-07-28 | 张志衡 | Cell phone mainboard fixing device |
| CN109511229A (en) * | 2018-12-07 | 2019-03-22 | 惠州光弘科技股份有限公司 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
| CN209140804U (en) * | 2018-12-07 | 2019-07-23 | 惠州光弘科技股份有限公司 | A kind of cell phone mainboard maintaining device |
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2018
- 2018-12-07 CN CN201811495740.1A patent/CN109511229A/en active Pending
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2019
- 2019-12-04 WO PCT/CN2019/123055 patent/WO2020114428A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003152329A (en) * | 2001-11-13 | 2003-05-23 | Fujitsu Ltd | Method and device for dismounting ball grid array mounted on printed wiring board |
| KR20050010130A (en) * | 2003-07-18 | 2005-01-27 | 삼성에스디아이 주식회사 | Integrated circuit device and display device having the same |
| CN201735922U (en) * | 2010-07-26 | 2011-02-09 | 上海华勤通讯技术有限公司 | Maintenance platform used to maintain AQFN mobile phone main board |
| CN207460605U (en) * | 2017-05-17 | 2018-06-05 | 孙恒权 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
| CN206936562U (en) * | 2017-06-20 | 2018-01-30 | 深圳市阿毛电子商务有限公司 | A kind of cell phone mainboard maintenance fixture clip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114428A1 (en) * | 2018-12-07 | 2020-06-11 | 惠州光弘科技股份有限公司 | Adhesive explosion-proof method during mobile phone motherboard repair |
| CN113630976A (en) * | 2021-08-02 | 2021-11-09 | 上海龙旗科技股份有限公司 | Mainboard maintenance jig and method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020114428A1 (en) | 2020-06-11 |
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