CN201735922U - Maintenance platform used to maintain AQFN mobile phone main board - Google Patents
Maintenance platform used to maintain AQFN mobile phone main board Download PDFInfo
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- CN201735922U CN201735922U CN2010202703297U CN201020270329U CN201735922U CN 201735922 U CN201735922 U CN 201735922U CN 2010202703297 U CN2010202703297 U CN 2010202703297U CN 201020270329 U CN201020270329 U CN 201020270329U CN 201735922 U CN201735922 U CN 201735922U
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- air pressure
- pressure gun
- fixed station
- mainboard
- maintenance
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Abstract
The utility model discloses a maintenance platform which is used to maintain an AQFN mobile phone main board. The maintenance platform comprises a base 1, a pillar 2, a lower air pressure gun fixing platform 3, a main board fixing platform 4, an upper air pressure gun fixing platform 5. The pillar 2 is fixed on the middle position of the base 1. The lower air pressure gun fixing platform 3, the main board fixing platform 4 and the upper air pressure gun fixing platform 5 are respectively sheathed on the pillar 2, each fixing platform is provided with an adjusting, locking and fixing structure 31/41/51 which is opposite to the pillar 2, in addition, according to the maintenance position, the axial height can be adjusted along the pillar or the radial angle can be adjusted around the pillar 2. The lower air pressure gun fixing platform and the upper air pressure gun fixing platform as well as the main board fixing platform are respectively provided with an air pressure gun locking and fixing structure 32/52 as well as the main board locking and fixing structure 42, and the lower air pressure gun fixing platform and the upper air pressure gun fixing platform are respectively provided with an air pressure gun laying structure. The cost of the maintenance platform is low, the occupied area is small, and the maintenance platform is applicable to be applied in the mobile phone production line. Using the maintenance platform to maintain the AQFN mobile phone main board, the maintenance efficiency is high.
Description
Technical field
The utility model relates to a kind of maintenance platform that is used to keep in repair the AQFN cell phone mainboard.
Background technology
QFN (Quad Flat No-lead Package, quad flat non-pin package) is that a kind of pad size is little, volume is little, with the surface mount chip encapsulation technology of plastics as encapsulant.Because the pad of bottom center big exposure is soldered on the heat radiation pad of PCB, make QFN with respect to bga chip encapsulation technology (Ball Grid Array Package, be the BGA Package technology) or TFBGA technology (Thin Fine-Pitch Ball Grid Array,), have splendid electricity and hot property.
AQFN (Advanced QFN) is a kind of improved QFN encapsulation technology.Differently with general QFN be, the pin of AQFN is stretched, and is concordant unlike the pin of traditional QFN with chip encapsulation (molding).From in appearance, AQFN and TFBGA have a few picture, but on actual package, itself and TFBGA are diverse two notions.
Compare with TFBGA, the advantage of AGFN is not need to plant ball, does not need substrate (substrate).With respect to QFN and TFBGA packaged type, the packaging height of AQFN is littler, and chip is thinner.
Can't be mid-when the shortcoming of AQFN is the SMT backflow, so paster is had relatively high expectations.At present there have been the MT6253 of MTK and MT6326 two chip to adopt this encapsulation.
Because AQFN is the new packaged type of industry, compare with TFBGA, its no obvious soldered ball in bottom, the SMT contraposition is than TFBGA difficulty.
AQFN is as technology and product in the up-to-date appearance of chip field.Because it just emerges on market,, on the method for maintaining and maintenance of equipment of mainboard, all there are not ripe know-how and equipment to use for this AQFN mobile phone products.To this, at present mobile phone manufacturing enterprise generally has two selections, is respectively: use for reference BGA cell phone mainboard method for maintaining; Using BGA computer main board maintenance platform keeps in repair.
A, reference BGA cell phone mainboard method for maintaining maintenance AQFN product.
General BGA mobile phone products method for maintaining in the industry, its mode of heating divides hot blast and infrared two big classes.
When using the hot blast mode of heating, the method for maintaining of general BGA cell phone mainboard is in the industry at present, with the fixing mainboard of an iron or aluminum fixture, manually holds heat gun, and heat gun is provided with 320～350 ℃; Heat and finished maintenance in about 4～6 minutes.And upper and lower air pressure gun does not heat simultaneously, reprocesses platform equipment computerized control system generally all is set.
Before the special equipment of maintenance AQFN product occurs, the BGA that uses above-mentioned hot blast heating reprocesses platform, use for reference above-mentioned BGA product method for maintaining, the alternative that the AQFN product is keeped in repair is: the heat gun temperature is provided with 360～390 ℃ of scopes, needs repairing 7～10 minutes time.
Yet the aforesaid BGA of using cell phone mainboard is reprocessed platform, reference BGA cell phone mainboard method for maintaining keeps in repair the problem that is caused to the AQFN product and is:
(1), air pressure gun temperature is set than higher, maintenance time is long especially.This be because:
37%～40% of the AQFN product chips gross area is a ground pad; In welding process, the chip ground pad forms good welds with the earth pad of pcb board; Be transmitted to the earth pad of pcb board when the temperature conduction of heat gun is to chip during maintenance once more by the ground pad of chip, the earth bonding pad area of pcb board is very big, so heat radiation is also very fast; Want molten tin to reach the purpose of dismounting maintenance, the heat of heat gun input must be transmitted to the heat that the earth pad of pcb board distributes greater than chip, on chip, accumulate stack but also need a part of after-heat, when being able to fuse the heat of tin cream on the chip, can finish maintenance.
For above-mentioned reasons, in order to finish maintenance, the heat gun temperature is provided with need be very high, reaches 360～390 ℃, and maintenance heat time heating time need be very long, needs 7～10 minutes.
(2), long-time high temperature maintenance causes producing large batch of waste product.This be because:
High-temperature temperature that pcb board, chip and other components and parts can bear and time are within certain scope.Yet the above-mentioned AQFN product mobile phone single face of can realizing adds the high-temperature temperature of hot maintenance and the time scope that can normally bear of pcb board, chip and other components and parts head and shoulders above.Because pcb board and other element can't satisfy the demand of the maintenance condition of this long-time high temperature, cause large quantities of waste products.
Undoubtedly, it is not special, proper A QFN product maintenance of equipment that this class BGA cell phone mainboard is reprocessed platform, operates the method that this class BGA reprocesses platform and should not be directly used in maintenance AQFN product.
B, use BGA computer main board maintenance platform and keep in repair.
Usually, the mode of heating that BGA reprocesses platform specifically comprises: last hot blast+following infrared, infrared up and down, hot blast up and down.
Have a kind of BGA computer main board to reprocess platform in the market, take mode of heating up and down, be provided with top heating system and vacuum pressure system, the mainboard fixed support is established in the centre, and the bottom is provided with bottom heating system and bottom system.During work, fix mainboard after, the bottom mainboard at first slowly heats, the top heating system heats then, and mainboard is keeped in repair.
When using this BGA computer main board maintenance platform when the AGFN cell phone mainboard is keeped in repair, fraction defective can be controlled preferably.But use this platform of reprocessing, maintenance efficiency is too low, and need 8～10 minutes the maintenance time of monolithic; Calculated in 20 hours according to working every day, it is 120 mainboards that every equipment keeps in repair production capacity every day.And this platform system complex of reprocessing is equipped with computerized control system, and cost is higher, and every at RMB more than 100,000 yuan.In addition, this floor space of reprocessing platform that is used for the computer main board maintenance is bigger, is 1.5 square metres, is not suitable for it being configured on the handset production line morely, only is suitable for scrappy maintenance.
Therefore, this class BGA computer main board reprocess platform be not on suitable, the handset production line AQFN product maintenance of equipment.
The utility model content
Technical problem to be solved in the utility model provides a kind of high efficiency method for maintaining special-purpose maintenance platform employed, with low cost, simple in structure of the AQFN of being used for cell phone mainboard.
The technical solution of the utility model is: the employed maintenance platform of a kind of maintenance AQFN cell phone mainboard method; Comprise base 1, important actor 2, following air pressure gun fixed station 3, mainboard fixed station 4, go up air pressure gun fixed station 5; Described important actor 2 is fixed on the centre position of base 1; Described following air pressure gun fixed station 3, mainboard fixed station 4, last air pressure gun fixed station 5 are set on the important actor 2, each fixed station is respectively arranged with respect to the adjusting of important actor 2 and the structure 31,41,51 that is locked, and all can be according to the maintenance position needs, adjust axial height along important actor, also can adjust radial angle around important actor 2; Described upper and lower air pressure gun fixed station 3,5 and mainboard fixed station 4 are respectively arranged with air pressure gun structure 32,52 and the mainboard structure 42 that is locked that is locked; And upper and lower air pressure gun fixed station is respectively arranged with air pressure gun placing structure 33,53.
Described maintenance platform, its air pressure gun placing structure 33,53 is respectively cylindrical hole or the round taper hole that adapts with the air pressure gun profile;
Described maintenance platform on the mainboard maintenance position of its described mainboard fixed station 4 supports, is provided with the rectangular opening 43 more bigger than mainboard area;
Described maintenance platform, its base 1 usefulness common bakelite plastics are made, and the higher steel of its important actor 2 usefulness rigidity are made;
Described maintenance platform, the support of its following air pressure gun fixed station 3, mainboard fixed station 4, last air pressure gun fixed station 5 is made with aluminium alloy respectively.
The beneficial effects of the utility model are: the characteristics of, rapid heat dissipation big at AQFN cell phone mainboard bonding pad area, and that the utility model provides, as to be used to keep in repair the type cell phone mainboard maintenance platform, upper and lower air pressure gun heats simultaneously to the mainboard upper and lower surface respectively; Heat time heating time is short, and the set heating-up temperature of upper and lower air pressure gun can reduce.Therefore, when using this maintenance platform to keep in repair, efficient is higher, calculates in 20 hours according to working every day, and every can be keeped in repair 400 mainboards; Pcb board, chip and other element can normally bear this maintenance temperature conditions and heat time heating time fully, maintenance yield rate height.
In addition, the employed maintenance platform of the aforementioned method for maintaining of confession provided by the utility model, owing to there is not computerized control system, simple in structure, so with low cost, every cost is about 3000 yuan of RMB; Floor space is little, only needs 0.5 square metre, is fit to be configured on the cell phone mainboard production line.Therefore the AQFN cell phone mainboard maintenance platform that provides of the utility model, defective such as overcome that the type cell phone mainboard uses that BGA computer main board maintenance platform keeps in repair that the maintenance efficiency that is brought is low, maintenance platform cost height, floor space are big.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the schematic perspective view that is used to keep in repair the maintenance platform of AQFN cell phone mainboard in the utility model;
In the accompanying drawing, each Reference numeral is respectively:
1, base;
2, important actor
3, following air pressure gun fixed station;
31, the adjusting and the structure that is locked of following air pressure gun fixed station;
32, the following air pressure gun structure that is locked;
33, following air pressure gun placing structure;
4, mainboard fixed station;
41, the adjusting of mainboard fixed station and the structure that is locked;
42, the mainboard structure that is locked;
43, rectangular opening;
5, go up the air pressure gun fixed station;
51, go up the adjusting and the structure that is locked of air pressure gun fixed station;
52, go up the air pressure gun structure that is locked;
53, go up the air pressure gun placing structure;
The specific embodiment
Below in conjunction with accompanying drawing, the maintenance platform of the utility model indication is made further case description.
At present embodiment the employed maintenance platform of a kind of maintenance AQFN cell phone mainboard method is proposed.
This maintenance platform mainly is a mechanical positioner, comprises base 1, important actor 2, following air pressure gun fixed station 3, mainboard fixed station 4, goes up air pressure gun fixed station 5; Described important actor 2 is fixed on the centre position of base 1; Described following air pressure gun fixed station 3, mainboard fixed station 4, last air pressure gun fixed station 5 are set on the important actor 2, and each fixed station is respectively arranged with respect to the adjusting of important actor 2 and the structure 31,41,51 that is locked; These adjustings and the structure that is locked make corresponding fixed station to adjust axial height along important actor according to the maintenance position needs, also can adjust radial angle around important actor 2;
Simultaneously, described upper and lower air pressure gun fixed station 3,5 and mainboard fixed station 4 are respectively arranged with upper and lower air pressure gun structure 32,52 and the mainboard structure 42 that is locked that is locked; And upper and lower air pressure gun fixed station is respectively arranged with down air pressure gun placing structure 33 and last air pressure gun placing structure 53;
In order better to place air pressure gun, the air pressure gun placing structure 33,53 of maintenance platform is respectively cylindrical hole or the round taper hole that adapts with the air pressure gun profile;
In addition, described maintenance platform on the mainboard maintenance position of its described mainboard fixed station 4 supports, is provided with the rectangular opening 43 more bigger than mainboard area.When making maintenance, upper and lower air pressure gun can be unobstructedly respectively facing to the heating of mainboard upper and lower faces.
The base 1 usefulness common bakelite plastics of maintenance platform are made, and the higher steel of its important actor 2 usefulness rigidity are made;
The support of the following air pressure gun fixed station 3 of maintenance platform, mainboard fixed station 4, last air pressure gun fixed station 5 is made with aluminium alloy respectively.
Each air pressure gun fixed station is with respect to the structure that respectively is locked of important actor 2, that is, the structure 51 that is locked of the structure 31 that is locked of following air pressure gun fixed station 3, the structure 41 that is locked of mainboard fixed station 4, last air pressure gun fixed station 5 all adopts the mechanical interlocking structure;
Following air pressure gun on the following air pressure gun fixed station is locked, and the mainboard of structure 32, mainboard fixed station is locked structure 42, the last air pressure gun of going up the air pressure gun fixed station is locked structure 52, also all adopts the mechanical interlocking structure;
When using above-mentioned maintenance platform that the AQFN product is keeped in repair, must dispose heater, promptly go up air pressure gun and following air pressure gun, this air pressure gun can adopt normally used in the industry heat gun.Described going up on the following air pressure gun placing structure 33 that air pressure gun and following air pressure gun be placed on the last air pressure gun placing structure 53 of the rifle fixed station 5 of being in the wind and following air pressure gun fixed station 3 respectively, the air outlet of air pressure gun is operated the upper and lower air pressure gun structure 32,52 that is locked then upper and lower air pressure gun is locked relative to each other; Then, behind the mainboard location,, open heat gun simultaneously, mainboard is keeped in repair according to method for maintaining.
Claims (5)
1. maintenance platform that is used to keep in repair the AQFN cell phone mainboard is characterized in that: described maintenance platform comprise base (1), important actor (2), down air pressure gun fixed station (3), mainboard fixed station (4), go up air pressure gun fixed station (5); Described important actor (2) is fixed on the centre position of base (1); Described following air pressure gun fixed station (3), mainboard fixed station (4), last air pressure gun fixed station (5) are set on the important actor (2), each fixed station is respectively arranged with respect to the adjusting of important actor (2) and the structure that is locked (31), (41), (51), and all can be according to the maintenance position needs, adjust axial height along important actor, also can center on important actor (2) and adjust radial angle; Described upper and lower air pressure gun fixed station (3), (5) and mainboard fixed station (4) are respectively arranged with air pressure gun structure (32), (52) and the mainboard structure (42) that is locked that is locked, and upper and lower air pressure gun fixed station is respectively arranged with air pressure gun placing structure (33), (53).
2. maintenance platform according to claim 1 is characterized in that: described air pressure gun placing structure (33), (53) are respectively cylindrical hole or the round taper hole that adapts with the air pressure gun profile.
3. maintenance platform according to claim 1 and 2 is characterized in that: on the mainboard maintenance position of described mainboard fixed station (4) support, be provided with the rectangular opening more bigger than mainboard area (43).
4. maintenance platform according to claim 1 and 2 is characterized in that: described base (1) is made with the common bakelite plastics, and described important actor (2) is made with the higher steel of rigidity.
5. maintenance platform according to claim 1 and 2 is characterized in that: the support of described following air pressure gun fixed station (3), mainboard fixed station (4), last air pressure gun fixed station (5) is made with aluminium alloy respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202703297U CN201735922U (en) | 2010-07-26 | 2010-07-26 | Maintenance platform used to maintain AQFN mobile phone main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202703297U CN201735922U (en) | 2010-07-26 | 2010-07-26 | Maintenance platform used to maintain AQFN mobile phone main board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201735922U true CN201735922U (en) | 2011-02-09 |
Family
ID=43551204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202703297U Expired - Lifetime CN201735922U (en) | 2010-07-26 | 2010-07-26 | Maintenance platform used to maintain AQFN mobile phone main board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201735922U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102335790A (en) * | 2010-07-26 | 2012-02-01 | 上海华勤通讯技术有限公司 | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table |
| CN103752985A (en) * | 2013-12-27 | 2014-04-30 | 昆山迈致治具科技有限公司 | PCB (printed circuit board) heat gun holder |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN109511229A (en) * | 2018-12-07 | 2019-03-22 | 惠州光弘科技股份有限公司 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
-
2010
- 2010-07-26 CN CN2010202703297U patent/CN201735922U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102335790A (en) * | 2010-07-26 | 2012-02-01 | 上海华勤通讯技术有限公司 | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table |
| CN103752985A (en) * | 2013-12-27 | 2014-04-30 | 昆山迈致治具科技有限公司 | PCB (printed circuit board) heat gun holder |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN107911955B (en) * | 2017-12-13 | 2020-08-04 | 晶晨半导体(上海)股份有限公司 | Chip replacement method |
| CN109511229A (en) * | 2018-12-07 | 2019-03-22 | 惠州光弘科技股份有限公司 | A kind of explosion-proof gluing method of cell phone mainboard maintenance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110209 Effective date of abandoning: 20140730 |
|
| RGAV | Abandon patent right to avoid regrant |