CN203778451U - Quartz crystal polished section oscillator cleaning jig - Google Patents
Quartz crystal polished section oscillator cleaning jig Download PDFInfo
- Publication number
- CN203778451U CN203778451U CN201420093054.2U CN201420093054U CN203778451U CN 203778451 U CN203778451 U CN 203778451U CN 201420093054 U CN201420093054 U CN 201420093054U CN 203778451 U CN203778451 U CN 203778451U
- Authority
- CN
- China
- Prior art keywords
- wafer
- base plate
- groove
- upper cover
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 239000013078 crystal Substances 0.000 title claims abstract description 18
- 239000010453 quartz Substances 0.000 title claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims abstract description 97
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000005406 washing Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 4
- 238000012216 screening Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model belongs to the field of quartz crystal component jigs, and particularly relates to a quartz crystal polished section oscillator cleaning jig. A wafer fixing frame is arranged on a fixing plate; a bottom plate and the fixing plate are provided with multiple clamping grooves and a plurality of positioning holes; a plurality of wafer placing grooves are arranged in the middles of the bottom plate and the fixing plate; the fixing plate is also provided with the wafer fixing frame; gaps exist in the middles of the wafer placing grooves; through holes are formed in four corners of the grooves; the clamping grooves at the periphery of the bottom plate and fixing clamping bulges at the periphery of an upper cover plate correspond one to one; the bottom plate wafer placing grooves in the middle part and wafer clamping bulges on the upper cover plate correspond one to one; the wafer clamping bulges of the upper cover plate, the wafer placing grooves of the bottom plate and the wafer fixing frame of the fixing plate are tightly matched and are fixed by fixing screws. The in place rate of placing of wafers is improved, artificial manual correction is reduced, silver scrap pollution is reduced in the post-cleaning process, escaped wafers are reduced, and the use rate of the wafers and the stability of electrical features of the products are greatly improved.
Description
Technical field
The utility model belongs to quartz crystal components and parts technical field, specifically a kind of quartz crystal polished silicon wafer oscillator cleaning tool.
Background technology
Along with quartz oscillator is constantly to high band, high accuracy, high stability future development, the quartz crystal wafer of high band develops toward polished silicon wafer.There is following defect in existing quartz crystal polished silicon wafer oscillator cleaning tool: the first, directly use cleaning fluid to wash for the first time (front washing) cleaning performance difficulty and strengthen, and the wafer not wash clean that sticks together, loss is serious.The second, directly the silver-plated tool difficulty of screening is large, and it is poor that wafer is aligned to bit rate, and the wafer being scattered can stick together, and causes wafer contamination and breakage.The 3rd, wafer in silver-plated location-plate, then carries out secondary cleaning together with silver-plated tool at silver-plated front row, and this step operation is called " washing afterwards ".After need to carry out centrifuge dripping after washing, wafer is easily escaped sheet in magnetic tool, causes the rising of silver-plated rear electrode bad (electrode skew) rate.The 4th, because the repeatedly sputter of silver-plated tool uses, its surface can produce silver bits after shake and wash through ultrasonic wave in washing process, silver bits have and come off unavoidably, but cause the pollution of cleaning fluid and wafer, wafer is affected in silver-plated rear electrical characteristic (as higher in impedance, RLD2 variation etc.), thereby has reduced crystal qualification rate and stability.
Summary of the invention
The purpose of this utility model is to overcome the existing above-mentioned defect of prior art, provide one can effectively solve that wafer does not wash clean, screening arrival rate is low, bad, the rear contaminate of silver-coated electrode dyes and causes the unsettled quartz crystal polished silicon wafer of electrical characteristic oscillator cleaning tool.
The utility model is realized by the following technical solutions:
A kind of quartz crystal polished silicon wafer oscillator cleaning tool, comprise base plate, fixed head, upper cover plate, it is characterized in that: the shape of base plate, upper cover plate is identical with actual silver-plated tool with size, on base plate, fixed head, there are multiple retaining grooves and several locating holes, the middle part of base plate has several wafers to place groove, has wafer fixed frame on fixed head, and wafer leaves gap in the middle of placing groove, on four angles, leave through hole, the station that wafer is placed groove is identical with actual silver-plated tool with quantity.The retaining groove of base plate surrounding is corresponding one by one with the fixing screens projection of upper cover plate surrounding, the locating hole of base plate surrounding is corresponding one by one with the locating hole of upper cover plate surrounding, the base plate wafers of middle part is placed the wafer screens projection correspondence one by one of groove and upper cover plate, and the wafer fixed frame of fixed head is identical with the wafer screens of upper cover plate projection station.Wafer is placed in the wafer fixed frame of fixed head, and the wafer fixed frame that the wafer screens projection of upper cover plate, the wafer of base plate are placed groove and fixed head closely cooperates, and fixes with fixed screw, makes wafer be difficult for skidding off in the wafer fixed frame of fixed head.
Base plate of the present utility model is together with fixed head extruding welding.
The utility model is owing to adopting technique scheme, front wash with after while washing, cleaning fluid can be placed all through holes on intermediate gap and the tool of groove by wafer and carry out ultrasonic wave and shake and wash, to reach the effect of cleaning; The utility model can improve wafer screening and be placed into bit rate, reduce manually and revise, after wash and in process, can also reduce silver bits and pollute, reduce wafer and escape sheet, greatly improved the stability of wafer utilization rate and product electrical characteristic.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model base plate and fixed head.
Fig. 2 is the structural representation of the utility model upper cover plate.
Detailed description of the invention
With reference to the accompanying drawings, embodiment of the present utility model is described further.
As shown in Figure 1, 2, a kind of quartz crystal polished silicon wafer oscillator cleaning tool, is made up of base plate 1, fixed head 2, upper cover plate 3, fixed screw 4; The shape that it is characterized in that base plate 1, upper cover plate 3 is identical with actual silver-plated tool with size, on fixed head 2 with wafer fixed frame 7, described base plate 1 has 16 retaining grooves 6 and three locating holes 9, the middle part of base plate 1 is provided with several wafers and places groove 5, wafer leaves gap in the middle of placing groove 5, on four angles, leave through hole, the station that wafer is placed groove 5 is identical with actual silver-plated tool with quantity, is also provided with ten screwed screw fixing holes 8 on base plate 1; Wafer fixed frame 7 shapes on described fixed head 2 are identical with actual silver-plated tool, described fixed head 2 has 16 retaining grooves 6 and three locating holes 9, middle part is provided with the wafer fixed frame 7 and wafer placement groove 5 that identical several wafer is placed, and base plate 1 is together with fixed head 2 extruding welding.The retaining groove 6 of base plate 1 surrounding is corresponding one by one with the fixing screens projection 11 of upper cover plate 3 surroundings, the locating hole 9 of base plate 1 surrounding is corresponding one by one with the locating hole 9 of upper cover plate 3 surroundings, the wafer of middle part is placed wafer screens projection 10 correspondence one by one of groove 5 and upper cover plate 3, the wafer fixed frame 7 of fixed head is identical with the wafer screens of upper cover plate 3 projection 10 stations, is also provided with ten threadless screw fixing holes 12 on upper cover plate 3.When operation, wafer is placed in the wafer fixed frame 7 of fixed head, the wafer screens projection 10 of upper cover plate just can be closely linked with the wafer fixed frame 7 that the wafer of base plate is placed groove 5 and fixed head, then use described fixed screw 4 to lock, make wafer be difficult for skidding off at the wafer fixed frame 7 of fixed head 2.Before wash with after while washing, cleaning fluid can be placed all through holes on intermediate gap and the tool of groove by wafer and carry out ultrasonic wave and shake and wash, to reach the effect of cleaning.The station of the wafer fixed frame of wafer placement groove described in the utility model, fixed head is identical with actual silver-plated tool with quantity; Wafer described in the utility model is placed the length and width size of groove 5 than all large 0.2mm ± 0.02mm of the size of silver-plated tool mask groove, the large 0.3mm of size of the silver-plated tool mask of depth ratio groove ± 0.02mm left and right; The wafer screens projection 10 length and width sizes of described upper cover plate are placed all little 0.30 ± 0.02mm of groove 5 size than base plate wafers, and depth ratio base plate wafers is placed the little 0.20 ± 0.02mm of groove 5 degree of depth; The fixing screens projection 11 length and width sizes of described upper cover plate surrounding are than all little 0.25 ± 0.02mm of base plate retaining groove 6 size, the little 0.25 ± 0.02mm of the depth ratio base plate retaining groove degree of depth.
Base plate 1 described in the utility model, fixed head 2, upper cover plate 3, fixed screw 4 all adopt stainless steel material.
Claims (6)
1. a quartz crystal polished silicon wafer oscillator cleaning tool, comprise base plate, fixed head, upper cover plate, it is characterized in that: the shape of base plate, upper cover plate is identical with actual silver-plated tool with size, on base plate, fixed head, there are multiple retaining grooves and several locating holes, the middle part of base plate has several wafers to place groove, has wafer fixed frame on fixed head; Wafer leaves gap in the middle of placing groove, and groove leaves through hole on four angles, and the station that wafer is placed groove is identical with actual silver-plated tool with quantity; The retaining groove of base plate surrounding is corresponding one by one with the fixing screens projection of upper cover plate surrounding, the locating hole of base plate surrounding is corresponding one by one with the locating hole of upper cover plate surrounding, the base plate wafers of middle part is placed the wafer screens projection correspondence one by one of groove and upper cover plate, the wafer fixed frame of fixed head is identical with the wafer screens of upper cover plate projection station, wafer is placed in the wafer fixed frame of fixed head, the wafer screens projection of upper cover plate closely cooperates with the wafer fixed frame that the wafer of base plate is placed groove and fixed head, and fixes with fixed screw.
2. quartz crystal polished silicon wafer oscillator cleaning tool according to claim 1, is characterized in that: base plate is together with fixed head extruding welding.
3. a kind of quartz crystal polished silicon wafer oscillator cleaning tool according to claim 1 and 2, it is characterized in that: described wafer is placed the length and width size of groove than all large 0.2 ± 0.02mm of the size of silver-plated tool mask groove, the large 0.3 ± 0.02mm of size of the silver-plated tool mask of depth ratio groove.
4. a kind of quartz crystal polished silicon wafer oscillator cleaning tool according to claim 1 and 2, it is characterized in that: the wafer screens projection of described upper cover plate, its length and width size is placed all little 0.30 ± 0.02mm of groove size than base plate wafers, and depth ratio base plate wafers is placed the little 0.20 ± 0.02mm of depth of groove.
5. a kind of quartz crystal polished silicon wafer oscillator cleaning tool according to claim 1, it is characterized in that: the fixing screens projection length and width size of described upper cover plate surrounding is than all little 0.25 ± 0.02mm of base plate retaining groove size the little 0.25 ± 0.02mm of the depth ratio base plate retaining groove degree of depth.
6. a kind of quartz crystal polished silicon wafer oscillator cleaning tool according to claim 1, is characterized in that: described base plate, fixed head, upper cover plate, fixed screw all adopt stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420093054.2U CN203778451U (en) | 2014-03-03 | 2014-03-03 | Quartz crystal polished section oscillator cleaning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420093054.2U CN203778451U (en) | 2014-03-03 | 2014-03-03 | Quartz crystal polished section oscillator cleaning jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203778451U true CN203778451U (en) | 2014-08-20 |
Family
ID=51314679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420093054.2U Expired - Lifetime CN203778451U (en) | 2014-03-03 | 2014-03-03 | Quartz crystal polished section oscillator cleaning jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203778451U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104289461A (en) * | 2014-09-30 | 2015-01-21 | 苏州速腾电子科技有限公司 | Jig for cleaning chip |
| CN105575861A (en) * | 2015-12-11 | 2016-05-11 | 北京无线电计量测试研究所 | Quartz wafer bearing tool |
-
2014
- 2014-03-03 CN CN201420093054.2U patent/CN203778451U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104289461A (en) * | 2014-09-30 | 2015-01-21 | 苏州速腾电子科技有限公司 | Jig for cleaning chip |
| CN105575861A (en) * | 2015-12-11 | 2016-05-11 | 北京无线电计量测试研究所 | Quartz wafer bearing tool |
| CN105575861B (en) * | 2015-12-11 | 2018-03-06 | 北京无线电计量测试研究所 | A kind of quartz wafer bearing fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170522 Address after: 321000 Zhejiang, Jinhua, Hong Hong West Road, No. 555 Patentee after: EAST CRYSTAL ELECTRONIC JINHUA Co.,Ltd. Address before: 321000 Zhejiang, Jinhua, Hong Hong West Road, No. 555 Patentee before: ZHEJIANG EAST CRYSTAL ELECTRONIC CO.,LTD. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140820 |