CN203170663U - Wafer cleaning jig - Google Patents
Wafer cleaning jig Download PDFInfo
- Publication number
- CN203170663U CN203170663U CN 201320112085 CN201320112085U CN203170663U CN 203170663 U CN203170663 U CN 203170663U CN 201320112085 CN201320112085 CN 201320112085 CN 201320112085 U CN201320112085 U CN 201320112085U CN 203170663 U CN203170663 U CN 203170663U
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- China
- Prior art keywords
- plate
- hole
- wafer
- wafer cleaning
- cleaning
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Abstract
The utility model relates to a wafer cleaning jig which is characterized by comprising an upper fixing component and a lower fixing component. The upper fixing component comprises a positioning plate, the lower fixing component comprises an accommodating plate and a base plate fixed with the accommodating plate, the positioning plate and the base plate are arranged from top to bottom, a plurality of groups of protrusions are arranged on the front face of the positioning plate, first through holes are among each group of protrusions, placing holes which enable wafers to be placed are formed in the accommodating plate, the protrusions and the placing holes are arranged correspondingly, and second through holes corresponding to the placing holes are formed in the base plate. The wafer cleaning jig has the advantages that the wafers are placed into the placing holes in the accommodating plate one by one to be cleaned, cleaning water flows out of each through hole, a traditional cleaning way is changed, cleanliness degree of the wafer cleaning is greatly improved, secondary pollution is avoided, and cleaning efficiency is high.
Description
Technical field
The utility model relates to field of crystals, refers to a kind of wafer cleaning tool especially.
Background technology
Along with being growing more intense of crystal industry competition, how to increase work efficiency, reduce cost, improve product quality, to improve the competitiveness in the same industry, a difficult problem that has become each crystal enterprise to face.The conventional clean mode is that wafer stacks cleaning in the Teflon cup that is placed on special use, but because wafer stacks, namely using ultrasonic wave to surpass washes, the adsorptivity that wafer itself exists can make wafer stick together, reach the wafer come-up that tension force causes, cleaning process can not guarantee that 100% cleans up, and mostly is in the technological design to reduce wafer cleaning quantity to address this problem, but effect itself and not obvious, cleaning efficiency is lower.
The utility model content
At the deficiency that prior art exists, the purpose of this utility model be to provide a kind of can disposable cleaning multi-disc wafer and the higher wafer cleaning tool of cleaning efficiency.
The technical solution of the utility model is achieved in that a kind of wafer cleaning tool, comprise that top mounting subassembly reaches fixation kit down, top mounting subassembly comprises location-plate, following fixation kit comprises ccontaining plate and the base plate of fixing with ccontaining plate, location-plate, ccontaining plate and base plate from top to bottom arrange, the front of this location-plate is provided with some groups of projectioies, and respectively organize first through hole is set between the projection, and ccontaining plate is provided with the placed hole of placing for wafer, and the corresponding setting with placed hole of projection, and base plate is provided with second through hole corresponding with placed hole.
By adopting technique scheme, the wafer slices are furnished in the placed hole of ccontaining plate, clean, rinse water outflows in each through hole, has changed traditional cleaning way, has improved the cleanliness factor that wafer cleans greatly, prevented secondary pollution, and cleaning efficiency is higher.
When adopting this wafer cleaning tool to clean, changed original cleaning process (cleaning → screening → plating Mo), in this cleaning process, wafer can cause secondary pollution when the screening operation after cleaning, now change into screening → monolithic and clean → plate Mo, solve wafer because the screening operation has caused secondary pollution, avoided because the pollutant between wafer and the plating Mo layer causes the electrical characteristic of product bad the hidden danger of poor stability when having got rid of vibration, yield gets a promotion, and quality is improved.Greatly reduce material, every cost such as artificial simultaneously.
The utility model further is set to: the projection on the described location-plate is along laterally equidistant setting, the both sides of described projection are provided with fourth hole, the back side of described location-plate is fixedly connected with substrate, and this substrate is provided with the third through-hole suitable with first through hole.
By the employing technique scheme, corresponding setting, easy cleaned liquid is discharged, and topology layout is more reasonable, is easy to realize.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the utility model specific embodiment structural representation;
Fig. 2 is the structural representation of location-plate in the utility model specific embodiment;
Fig. 3 is the structural representation of substrate in the utility model specific embodiment;
Fig. 4 is the structural representation of ccontaining plate in the utility model specific embodiment;
Fig. 5 is the structural representation of base plate in the utility model specific embodiment;
Fig. 6 is the A portion enlarged drawing of Fig. 2.
The specific embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
As Fig. 1-shown in Figure 6, the utility model discloses a kind of wafer cleaning tool, in the utility model specific embodiment, comprise that top mounting subassembly reaches fixation kit down, top mounting subassembly comprises location-plate 1, following fixation kit comprises ccontaining plate 2 and the base plate of fixing with ccontaining plate 3, location-plate 1, ccontaining plate 2 and base plate 3 from top to bottom arrange, the front of this location-plate 1 is provided with some groups of projectioies 12, and between each group projection 12 first through hole 11 is set, and ccontaining plate 2 is provided with the placed hole of placing for wafer 21, and projection 12 and placed hole 21 corresponding settings, and base plate 3 is provided with second through hole 31 corresponding with placed hole 21, this second through hole is the through hole of strip, the wafer slices are furnished in the placed hole of ccontaining plate, clean, rinse water outflows in each through hole, changed traditional cleaning way, improved the cleanliness factor that wafer cleans greatly, prevented secondary pollution, and cleaning efficiency has been higher.
When adopting this wafer cleaning tool to clean, changed original cleaning process (cleaning → screening → plating Mo), in this cleaning process, wafer can cause secondary pollution when the screening operation after cleaning, now change into screening → monolithic and clean → plate Mo, solve wafer because the screening operation has caused secondary pollution, avoided because the pollutant between wafer and the plating Mo layer causes the electrical characteristic of product bad the hidden danger of poor stability when having got rid of vibration, yield gets a promotion, and quality is improved.Greatly reduce material, every cost such as artificial simultaneously.
In the utility model specific embodiment, projection 12 on the described location-plate 1 is along laterally equidistant setting, described protruding 12 both sides are provided with fourth hole 13, the back side of described location-plate 1 is fixedly connected with substrate 4, this substrate 4 is provided with the third through-hole 13 suitable with first through hole 11, easy cleaned liquid is discharged, and topology layout is more reasonable, is easy to realize.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.
Claims (4)
1. wafer cleaning tool, it is characterized in that: comprise that top mounting subassembly reaches fixation kit down, top mounting subassembly comprises location-plate, following fixation kit comprises ccontaining plate and the base plate of fixing with ccontaining plate, location-plate, ccontaining plate and base plate from top to bottom arrange, the front of this location-plate is provided with some groups of projectioies, and respectively organize first through hole is set between the projection, and ccontaining plate is provided with the placed hole of placing for wafer, and the corresponding setting with placed hole of projection, and base plate is provided with second through hole corresponding with placed hole.
2. wafer cleaning tool according to claim 1 is characterized in that: laterally equidistant setting of the projection edge on the described location-plate.
3. wafer cleaning tool according to claim 2, it is characterized in that: the both sides of described projection are provided with fourth hole.
4. according to claim 1 or 2 or 3 described wafer cleaning tools, it is characterized in that: the back side of described location-plate is fixedly connected with substrate, and this substrate is provided with the third through-hole suitable with first through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320112085 CN203170663U (en) | 2013-03-12 | 2013-03-12 | Wafer cleaning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320112085 CN203170663U (en) | 2013-03-12 | 2013-03-12 | Wafer cleaning jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203170663U true CN203170663U (en) | 2013-09-04 |
Family
ID=49067418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320112085 Expired - Fee Related CN203170663U (en) | 2013-03-12 | 2013-03-12 | Wafer cleaning jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203170663U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575861A (en) * | 2015-12-11 | 2016-05-11 | 北京无线电计量测试研究所 | Quartz wafer bearing tool |
-
2013
- 2013-03-12 CN CN 201320112085 patent/CN203170663U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575861A (en) * | 2015-12-11 | 2016-05-11 | 北京无线电计量测试研究所 | Quartz wafer bearing tool |
| CN105575861B (en) * | 2015-12-11 | 2018-03-06 | 北京无线电计量测试研究所 | A kind of quartz wafer bearing fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20160312 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |