CN102922477A - Tool for extraction of BGA (ball grid array) in dye test and use method of tool - Google Patents

Tool for extraction of BGA (ball grid array) in dye test and use method of tool Download PDF

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Publication number
CN102922477A
CN102922477A CN2012104604868A CN201210460486A CN102922477A CN 102922477 A CN102922477 A CN 102922477A CN 2012104604868 A CN2012104604868 A CN 2012104604868A CN 201210460486 A CN201210460486 A CN 201210460486A CN 102922477 A CN102922477 A CN 102922477A
Authority
CN
China
Prior art keywords
bga
tool
dye test
frock
cross bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104604868A
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Chinese (zh)
Inventor
康燕荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Failure Analysis Laboratory Co., Ltd.
Original Assignee
SUZHOU FALAB FAILURE ANALYSIS LABORATORY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU FALAB FAILURE ANALYSIS LABORATORY Co Ltd filed Critical SUZHOU FALAB FAILURE ANALYSIS LABORATORY Co Ltd
Priority to CN2012104604868A priority Critical patent/CN102922477A/en
Publication of CN102922477A publication Critical patent/CN102922477A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the field of failure analysis, in particular to a dye test. The invention provides a tool for the extraction of a BGA (Ball Grid Array) in the dye test. The tool adopts an I-shaped structure and comprises a cross rod and handles fixed at the end parts of the cross rod. The invention further provides a use method of the tool for the extraction of the BGA in the dye test. The use method comprises the following steps: A, roughing the surface of the dyed BGA by using a lettering pen; B, smearing a layer of super glue on the surface of the BGA; C, pressing the middle part of the cross rod of the tool onto the super glue on the surface of the BGA; and D, after the super glue is solidified, fixing a PCB (Printed Circuit Board), and clenching and upwardly extracting the handles at the two ends of the cross rod to extract the BGA. The tool has the advantages of simple structure, convenience in assembly, low cost, good rigidity and convenience in use; and the method is simple, convenient and quick to operate, no damage to a welding point of the BGA exists, and the efficiency of the dye test and the accuracy of test result judgment are greatly improved.

Description

A kind of frock and using method thereof of pulling out for dye test BGA
Technical field
The present invention relates to the failure analysis field, particularly a kind of dye test method.
Background technology
Dye test has another name called the red ink test, is called " dyeing and perk " on the specialty.Its method is to utilize the red ink of suitable viscosity to be expelled to suspect have under the BGA of failure welding, red ink to be confirmed enters under the BGA fully, after treating that Deng a period of time or baking red ink has been done, BGA is levered up from pcb board with instrument, by observe BGA solder joint and PCB pad the dyeing situation, determine the welding effect of BGA.The instruments such as BGA levers up that normally used instrument is that a word rises, tweezers and vice lever up BGA by actions such as sticking up, dig, pull out, and lever up in the process without fixing working specification, fully by virtue of experience operate.The method that use that a word rises, the work such as tweezers and vice levers up BGA is easy to damage the solder joint of BGA periphery, and speed is slow, and the length that expends time in has a strong impact on judgement and the operating efficiency of experimental result.
Therefore, BGA in the dye test is levered up how fast, efficient, safely, judge in order to carry out rapidly and accurately the result, become failure analysis field problem demanding prompt solution.
Summary of the invention
Dye test BGA pulls out the problem that speed is slow, efficient is low and easily damage solder joint in the prior art in order to solve, and the invention provides following technical scheme:
A kind of frock of pulling out for dye test BGA, this frock is I-shaped structure, comprises cross bar and is fixed in the handle of described crossbar end.
As a preferred embodiment of the present invention, described cross bar has rectangular structure.
As another kind of preferred version of the present invention, the material of described cross bar and described handle is iron and steel.
A kind of using method of the frock of pulling out for dye test BGA, the method may further comprise the steps:
A, use Lettering pen will be beaten rough through hyperchromatic BGA surface;
B, smear one deck seccotine on the BGA surface;
Be pressed on the seccotine on BGA surface in the middle part of C, the cross bar with described frock;
D, after seccotine solidifies, fix pcb board, the handle at the described cross bar two ends of holding with a firm grip upwards pulls up, and BGA is pulled out.
As a preferred embodiment of the present invention, the seccotine among the described step B is quick steel.
The present invention has the following advantages: tool structure of the present invention is simple, and is easy to assembly, and cost is low, and good rigidly is easy to use; The inventive method is easy and simple to handle, and is quick, harmless to the BGA solder joint, greatly improved efficient and the result of the test Accuracy of Judgement of dye test.
Description of drawings
Fig. 1 tool structure schematic diagram of the present invention;
Fig. 2 frock occupation mode of the present invention A schematic diagram;
Fig. 3 frock occupation mode of the present invention B schematic diagram.
Number in the figure is:
1-cross bar, 2-handle, 3-BGA
4—PCB
The specific embodiment
The below elaborates this process implementing example, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Shown in Fig. 1 tool structure schematic diagram of the present invention, a kind of frock of pulling out for dye test BGA, this frock is I-shaped structure, comprises cross bar 1 and is fixed in the handle 2 of cross bar 1 end.Cross bar 1 is rectangular structure.Cross bar 1 can also be semicylinder structure or triangulo column structure or other similar structures, as long as length direction has one side for the plane, can carry out bonding getting final product with the BGA surface easily.The material of cross bar 1 and handle 2 is iron and steel, just can bear enough pulling force like this when BGA pulls out.
Shown in Fig. 2 frock occupation mode of the present invention A schematic diagram and Fig. 3 frock occupation mode of the present invention B schematic diagram, a kind of using method of the frock of pulling out for dye test BGA, the method may further comprise the steps:
A, use Lettering pen will be beaten rough through hyperchromatic BGA surface;
B, smear one deck seccotine on the BGA surface, the seccotine that uses in the present embodiment is quick steel;
C, cross bar 1 middle part of frock is pressed on the seccotine on BGA surface, the modes of emplacement of frock can be placed according to the mode such as Fig. 2, also can place according to the mode such as Fig. 3;
D, after the quick steel of seccotine solidifies, fix pcb board, the handle 2 at cross bar 1 two ends of holding with a firm grip upwards pulls up, and BGA is pulled out.
The above; it only is the part of the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.

Claims (5)

1. one kind is used for the frock that dye test BGA pulls out, and it is characterized in that: this frock is I-shaped structure, comprises cross bar (1) and is fixed in the handle (2) of described cross bar (1) end.
2. a kind of frock of pulling out for dye test BGA according to claim 1, it is characterized in that: described cross bar (1) has rectangular structure.
3. a kind of frock of pulling out for dye test BGA according to claim 1, it is characterized in that: the material of described cross bar (1) and described handle (2) is iron and steel.
4. the using method of a kind of frock of pulling out for dye test BGA according to claim 1, it is characterized in that: the method may further comprise the steps:
A, use Lettering pen will be beaten rough through hyperchromatic BGA surface;
B, smear one deck seccotine on the BGA surface;
Be pressed on the seccotine on BGA surface in the middle part of C, the cross bar (1) with described frock;
D, after seccotine solidifies, fix pcb board, the handle (2) at described cross bar (1) two ends of holding with a firm grip upwards pulls up, and BGA is pulled out.
5. the using method of a kind of frock of pulling out for dye test BGA according to claim 4, it is characterized in that: the seccotine among the described step B is quick steel.
CN2012104604868A 2012-11-15 2012-11-15 Tool for extraction of BGA (ball grid array) in dye test and use method of tool Pending CN102922477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012104604868A CN102922477A (en) 2012-11-15 2012-11-15 Tool for extraction of BGA (ball grid array) in dye test and use method of tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012104604868A CN102922477A (en) 2012-11-15 2012-11-15 Tool for extraction of BGA (ball grid array) in dye test and use method of tool

Publications (1)

Publication Number Publication Date
CN102922477A true CN102922477A (en) 2013-02-13

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CN2012104604868A Pending CN102922477A (en) 2012-11-15 2012-11-15 Tool for extraction of BGA (ball grid array) in dye test and use method of tool

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108152298A (en) * 2017-12-21 2018-06-12 京信通信系统(中国)有限公司 A kind of detection method and device of solder joint
US11166401B2 (en) 2019-04-30 2021-11-02 International Business Machines Corporation Dye and pry process for surface mount technology dual in-line memory module
CN114279953A (en) * 2021-11-29 2022-04-05 苏州浪潮智能科技有限公司 Separation method for dyeing test of surface mounting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253744A (en) * 2003-02-21 2004-09-09 Seiko Epson Corp Device of detaching semiconductor chips and method of detaching semiconductor chips
KR20080043451A (en) * 2006-11-14 2008-05-19 이종애 Apparatus for reparing of ball grid array
CN101391413A (en) * 2007-09-21 2009-03-25 鸿富锦精密工业(深圳)有限公司 Pulling tool
CN201514372U (en) * 2009-09-24 2010-06-23 佛山市顺德区顺达电脑厂有限公司 Component separating jig
CN102441865A (en) * 2011-09-19 2012-05-09 工业和信息化部电子第五研究所 Method and device for prizing up BGA (ball grid array) in staining test

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253744A (en) * 2003-02-21 2004-09-09 Seiko Epson Corp Device of detaching semiconductor chips and method of detaching semiconductor chips
KR20080043451A (en) * 2006-11-14 2008-05-19 이종애 Apparatus for reparing of ball grid array
CN101391413A (en) * 2007-09-21 2009-03-25 鸿富锦精密工业(深圳)有限公司 Pulling tool
CN201514372U (en) * 2009-09-24 2010-06-23 佛山市顺德区顺达电脑厂有限公司 Component separating jig
CN102441865A (en) * 2011-09-19 2012-05-09 工业和信息化部电子第五研究所 Method and device for prizing up BGA (ball grid array) in staining test

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108152298A (en) * 2017-12-21 2018-06-12 京信通信系统(中国)有限公司 A kind of detection method and device of solder joint
US11166401B2 (en) 2019-04-30 2021-11-02 International Business Machines Corporation Dye and pry process for surface mount technology dual in-line memory module
CN114279953A (en) * 2021-11-29 2022-04-05 苏州浪潮智能科技有限公司 Separation method for dyeing test of surface mounting device
CN114279953B (en) * 2021-11-29 2024-01-19 苏州浪潮智能科技有限公司 Separation method for surface mount device dyeing test

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SHANGHAI FAILURE ANALYSIS LABORATORY CO., LTD.

Free format text: FORMER OWNER: SUZHOU FALAB FAILURE ANALYSIS LAB CO., LTD.

Effective date: 20131025

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 215024 SUZHOU, JIANGSU PROVINCE TO: 200433 YANGPU, SHANGHAI

TA01 Transfer of patent application right

Effective date of registration: 20131025

Address after: 200433, room 3, building 300, No. 105 East National Road, Shanghai, Yangpu District

Applicant after: Shanghai Failure Analysis Laboratory Co., Ltd.

Address before: Gangtian Road Industrial Park in Suzhou city of Jiangsu Province, No. 99 215024

Applicant before: Suzhou Falab Failure Analysis Laboratory Co., Ltd.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130213