CN201514372U - Component separating jig - Google Patents
Component separating jig Download PDFInfo
- Publication number
- CN201514372U CN201514372U CN200920311293XU CN200920311293U CN201514372U CN 201514372 U CN201514372 U CN 201514372U CN 200920311293X U CN200920311293X U CN 200920311293XU CN 200920311293 U CN200920311293 U CN 200920311293U CN 201514372 U CN201514372 U CN 201514372U
- Authority
- CN
- China
- Prior art keywords
- bga
- fixed block
- printed circuit
- circuit board
- bga component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a component separating jig which is applicable to a BGA component. The jig mainly consists of a printed circuit board, a fixed block and a force application device, wherein the BGA component is arranged on the printed circuit board; one end of the fixed block is fixed above the BGA component; the force application device is used for vertically applying force on the fixed block and disengaging the BGA component and the fixed block with the printed circuit board, and is connected with the other end of the fixed block; the fixed block is fixed on the BGA component through fixing glue after heated, and is vertically forced by the force application device; and the BGA component and the fixed block are together vertically pulled up and are disengaged with the printed circuit board. The component separating jig not only effectively avoids the solder ball damage in manually prying the BGA component or the local rupture of the BGA component in prying, but also avoids the solder ball breakage in breaking the board.
Description
Technical field
The utility model relates to a kind of tool of separation assembly, relates in particular to a kind of tool that BGA and PCB are separated.
Background technology
Carry out Dye﹠amp; In the Pry test, classic method is manually four corner perks of BGA element and breaking board to be separated.This manual sled BGA element splits with the tin ball damage in corner or with the local sled of BGA element easily, and breaking board may cause the damage of tin ball, causes the BGA element to pry open back rupture surface difference.
Summary of the invention
In view of the above problems, the utility model provides a kind of element to separate tool, and it mainly is applicable to Dye﹠amp; In the Pry test BGA element is separated with mainboard.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of element separates tool, and it is applicable to that in the BGA element, this tool mainly comprises a printed circuit board (PCB), which is provided with the BGA element; One fixture, one end are fixed in this BGA element top; And one vertically force in this fixture and this BGA element and fixture broken away from the force application apparatus of printed circuit board (PCB) in the lump, and this force application apparatus is connected with this fixture other end.
Preferable, the utility model provides a kind of element to separate tool, and wherein, described fixture utilizes fixing glue to be fixed on the BGA element after heating, vertically force in this fixture via force application apparatus again, then with the vertical in the lump pull-up of this BGA element and fixture and break away from printed circuit board (PCB).
Compared to prior art, the utility model provides a kind of element to separate tool, has not only effectively avoided manual sled BGA element and the tin ball damage that produces or the local sled of BGA element split, and causes the tin ball fractured when avoiding breaking board.
Description of drawings
Fig. 1 is a synoptic diagram of the present utility model
Embodiment
Please refer to shown in Figure 1ly, be synoptic diagram of the present utility model.Element described in the utility model separates tool and mainly is applicable in the BGA element, in order at Dye﹠amp; In the Pry test, the BGA element is separated from printed circuit board (PCB).
Wherein, element described in the utility model separates tool and mainly comprises printed circuit board (PCB) 101, BGA element 102, force application apparatus 103 and fixture 104, described BGA element 102 is arranged on this printed circuit board (PCB) 101, in present embodiment, this fixture 104 can be nut, fixing glue can be industry AB glue commonly used, this nut one end utilizes AB glue to be fixed in this BGA element top, again, described force application apparatus 103 can be the pulling experiment machine, and these force application apparatus 103 1 ends are provided with the screw rod 1031 that can screw togather mutually with above-mentioned nut.
Carrying out Dye﹠amp; In the Pry test, be fixed in the center of the BGA element 102 on the printed circuit board (PCB) 101 after at first fixture 104 (being nut) being utilized AB glue by baking, utilize the screw rod 1031 of pulling experiment machine one end and the nut on the BGA element 102 to screw togather fixing mutually again, start this pulling experiment machine then, vertically force on this nut, and this nut and this BGA element 102 broken away from printed circuit board (PCB) 101 in the lump, so, this BGA element 102 can be separated from printed circuit board (PCB) 101.
The mode of above-mentioned dismounting BGA element 102 has not only effectively been avoided manual sled BGA element 102 and the tin ball damage that produces or the part sled of BGA element 102 split, and causes the tin ball fractured when avoiding breaking board.
Claims (2)
1. an element separates tool, and it is applicable to that in the BGA element, this tool mainly comprises a printed circuit board (PCB), which is provided with the BGA element; It is characterized in that this tool also comprises:
One fixture, one end are fixed in this BGA element top; And
One vertically forces in this fixture and this BGA element and fixture is broken away from the force application apparatus of printed circuit board (PCB) in the lump, and this force application apparatus is connected with this fixture other end.
2. element according to claim 1 separates tool, it is characterized in that, described fixture is to utilize fixing glue to be fixed in fixture on the BGA element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920311293XU CN201514372U (en) | 2009-09-24 | 2009-09-24 | Component separating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920311293XU CN201514372U (en) | 2009-09-24 | 2009-09-24 | Component separating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201514372U true CN201514372U (en) | 2010-06-23 |
Family
ID=42485784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920311293XU Expired - Fee Related CN201514372U (en) | 2009-09-24 | 2009-09-24 | Component separating jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201514372U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102441865A (en) * | 2011-09-19 | 2012-05-09 | 工业和信息化部电子第五研究所 | Method and device for prizing up BGA (ball grid array) in staining test |
| CN102922477A (en) * | 2012-11-15 | 2013-02-13 | 苏州华碧微科检测技术有限公司 | Tool for extraction of BGA (ball grid array) in dye test and use method of tool |
| CN111613524A (en) * | 2020-05-21 | 2020-09-01 | 深圳宜特检测技术有限公司 | Grinding structure and grinding method for packaging wafer back |
-
2009
- 2009-09-24 CN CN200920311293XU patent/CN201514372U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102441865A (en) * | 2011-09-19 | 2012-05-09 | 工业和信息化部电子第五研究所 | Method and device for prizing up BGA (ball grid array) in staining test |
| CN102441865B (en) * | 2011-09-19 | 2016-03-23 | 工业和信息化部电子第五研究所 | Method and the device of BGA is levered up in a kind of dye test |
| CN102922477A (en) * | 2012-11-15 | 2013-02-13 | 苏州华碧微科检测技术有限公司 | Tool for extraction of BGA (ball grid array) in dye test and use method of tool |
| CN111613524A (en) * | 2020-05-21 | 2020-09-01 | 深圳宜特检测技术有限公司 | Grinding structure and grinding method for packaging wafer back |
| CN111613524B (en) * | 2020-05-21 | 2024-05-24 | 苏试宜特(深圳)检测技术有限公司 | Packaging wafer back grinding structure and grinding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100623 Termination date: 20130924 |