CN111065206A - Processing method for printing characters on surface of PCB substrate - Google Patents
Processing method for printing characters on surface of PCB substrate Download PDFInfo
- Publication number
- CN111065206A CN111065206A CN201911312349.8A CN201911312349A CN111065206A CN 111065206 A CN111065206 A CN 111065206A CN 201911312349 A CN201911312349 A CN 201911312349A CN 111065206 A CN111065206 A CN 111065206A
- Authority
- CN
- China
- Prior art keywords
- printing
- characters
- plasma
- pcb substrate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
The invention belongs to the technical field of PCB processing, and provides a processing method for printing characters on the surface of a PCB substrate, which comprises the following steps: outer layer line inspection, surface treatment, plate baking, plasma, plate washing, character spray printing, solidification, forming and final inspection; the jet printing of characters includes: and calling character data of the material number according to the processing flow card, attaching a layer of transparent adhesive tape paper on the first board for testing the first board, printing after the debugging position is qualified, checking that the characters are clear and recognizable, and after the quality requirement is met, printing in batch in an account-opening mass production mode until all products are printed in a spray mode. The invention starts from the process technology, applies the plasma technology to modify the surface of the PCB light panel, increases the binding force of the character printing ink and the substrate by a method of cleaning the residual glue on the surface of the metal substrate, designs the special metal substrate and the light panel printed circuit board character processing flow without resistance welding, ensures that the metal substrate and the PCB without resistance welding can be produced smoothly, and solves the technical problem that the produced products have the defect of character defect.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a processing method for printing characters on the surface of a PCB substrate.
Background
In the communication field that power module, intelligent photoelectricity, digital system constitute, partial product surface is for technologies such as full board gilding, silver sinking sink tin, and partial product full board is the base plate of no resistance welding layer, because of the installation component makes the needs of the convenient later stage maintenance of permanent sign or change, still need print the character on its surface.
In the processing of PCB characters, there are usually three forms of etching characters, screen printing characters and jet printing characters. The character etching process has higher requirements on the font and larger font height, otherwise, the incomplete phenomenon can occur and the mark of the component can not be adapted; the silk-screen characters are mainly batch boards, the cost of screen printing is high, the environmental pollution caused by screen washing water is serious, and wastewater needs to be treated independently; for a small amount of templates, a conventional character spray printing mode is adopted in order to save screen printing plate cost and clean production; the printing ink formed by silk-screen character deposition is thick, lines of characters are thick, and a small part of characters fall off when being printed on the surface of a metal base material or a plate; the ink is deposited on the surface of the PCB solder mask layer in a dot-jet mode, and the ink often falls off in a large area because the ink is thin and uniform and the silk-screen characters are not good. For a sample plate product which requires a client to process characters on the surfaces of a metal material and an epoxy resin plate, the prior art can only adopt a mode of screen printing for many times, thereby not only wasting screen printing plate cost and causing environmental pollution, but also having a long production period.
Disclosure of Invention
In view of the above, the invention provides a processing method for printing characters on the surface of a PCB substrate, which starts with a process technology, applies a plasma technology to modify the surface of a PCB light panel, and a method for cleaning residual glue on the surface of a metal substrate increases the bonding force between character ink and the substrate.
The technical scheme of the invention is as follows:
a processing method for printing characters on the surface of a PCB substrate is characterized by comprising the following steps: outer layer line inspection, surface treatment, plate baking, plasma, plate washing, character spray printing, solidification, forming and final inspection;
the jet printing of characters includes: and calling character data of the material number according to the processing flow card, attaching a layer of transparent adhesive tape paper on the first board for testing the first board, printing after the debugging position is qualified, checking that the characters are clear and recognizable, and after the quality requirement is met, printing in batch in an account-opening mass production mode until all products are printed in a spray mode.
Further, after the characters are jet printed, the characters need to be cured according to the product type.
Further, the surface treatment comprises removing water from the board, so that the plasma treatment can achieve the best effect.
Furthermore, the baking plate adopts a plasma processing baking plate mode.
Furthermore, the processing temperature of the baking plate is 120-150 ℃, and the baking time is 20-40 minutes.
Furthermore, the gas adopted by the baking plate is any one or more of nitrogen, oxygen, carbon tetrafluoride and hydrogen.
Further, the specific manner of the plasma treatment is as follows: placing the plate to be processed into the cavity, wherein the plate can not be stacked or touch the blocking wall of the inner cavity of the machine, and fastening the door catch; after the power supply of the equipment is started, a vacuum pump, an air release valve, gas, plasma and cold cutting water are sequentially started, and the equipment is waited to finish an automatic starting program.
Further, the introduced gas comprises hydrogen, oxygen and carbon tetrafluoride in sequence.
Furthermore, the temperature of the plasma processing is 30-100 ℃, and the plasma power is 4 KW-10 KW.
Further, the plate washing and cleaning comprises the steps of cleaning residual dust on the surface after the plasma glue removal by using a plate washing machine according to conventional parameters and drying.
Further, the storage time of the product from the plasma treatment to the spray printing is controlled within 4 hours.
Furthermore, the appearance inspection and the force-bearing detection comprise that wave soldering experiments are firstly carried out on products which are qualified after the appearance inspection is finished, and then 3M glue tension tests are carried out, so that characters are ensured to be free of character falling or being incomplete after components are welded by customers, and the quality requirements are met.
The invention has the beneficial effects that:
1. for sample plate products of metal materials and resin base materials without any solder mask layers, the quality problems of character falling or character incomplete deficiency exist for a long time by adopting a character spray printing technology in the industry. The processing technology of plasma surface activation for modifying materials and removing residual glue on the surface of a metal substrate by biting to increase the bonding force between character lines and the materials can improve the quality hidden danger of the drop of spray printed characters of the products, ensure that the products can be produced in batch, quickly and safely, and reduce the customer complaints of winning more orders of customers.
2. According to the technical scheme of the plasma processing and cleaning process, the bonding force between the PCB product substrate and the characters is improved, the characters are ensured not to have defects or fall off after the processes of acid-base immersion cleaning, wave soldering and the like, the production rework process is avoided, and the cost is saved for enterprises.
3. Characters printed on metal materials and resin base materials without any solder mask layers belong to 5G and subsequent market high-added-value processing projects, the processing profit of conventional products is very low, autonomous production is realized by adopting a new technology to preempt market first-time, and high processing profit can be obtained for foreign generation processing.
5. The novel process is a technical innovation of the existing process, has strong operability, can meet the requirements of batch production and safe production of conventional products and special products of printed boards simultaneously, and can become a new profit increasing point of enterprises. On the premise that the technology is not limited by people, enterprises must use the high, fine and sharp technology as the latest profit increasing point to obtain more product orders and higher profit return.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Examples
A processing method for printing characters on the surface of a PCB substrate is characterized by comprising the following steps: outer layer line inspection, surface treatment, plate baking, plasma, plate washing, character spray printing, solidification, forming and final inspection;
the jet printing of characters includes: and calling character data of the material number according to the processing flow card, attaching a layer of transparent adhesive tape paper on the first board for testing the first board, printing after the debugging position is qualified, checking that the characters are clear and recognizable, and after the quality requirement is met, printing in batch in an account-opening mass production mode until all products are printed in a spray mode.
Further, after the characters are jet printed, the characters need to be cured according to the product type.
Further, the surface treatment comprises removing water from the board, so that the plasma treatment can achieve the best effect.
Furthermore, the baking plate adopts a plasma processing baking plate mode.
Furthermore, the processing temperature of the baking plate is 120-150 ℃, and the baking time is 20-40 minutes.
Furthermore, the gas adopted by the baking plate is any one or more of nitrogen, oxygen, carbon tetrafluoride and hydrogen.
Further, the specific manner of the plasma treatment is as follows: placing the plate to be processed into the cavity, wherein the plate can not be stacked or touch the blocking wall of the inner cavity of the machine, and fastening the door catch; after the power supply of the equipment is started, a vacuum pump, an air release valve, gas, plasma and cold cutting water are sequentially started, and the equipment is waited to finish an automatic starting program.
Further, the introduced gas comprises hydrogen, oxygen and carbon tetrafluoride in sequence.
Furthermore, the temperature of the plasma processing is 30-100 ℃, and the plasma power is 4 KW-10 KW.
Further, the plate washing and cleaning comprises the steps of cleaning residual dust on the surface after the plasma glue removal by using a plate washing machine according to conventional parameters and drying.
Further, the storage time of the product from the plasma treatment to the spray printing is controlled within 4 hours.
Furthermore, the appearance inspection and the force-bearing detection comprise that wave soldering experiments are firstly carried out on products which are qualified after the appearance inspection is finished, and then 3M glue tension tests are carried out, so that characters are ensured to be free of character falling or being incomplete after components are welded by customers, and the quality requirements are met.
The invention also provides a specific embodiment of the following table processing parameter setting.
The invention relates to a novel character manufacturing method for PCB character printing, which adopts a plasma technology to modify the smooth surface of a PCB substrate, erodes the surface of a metal substrate to clean residual glue, increases the contact surface of character lines and the substrate and enhances the adhesive force between characters and the substrate. The invention designs the procedures and methods of baking the plate, plasma etching, modifying, removing glue and washing the plate according to the technical characteristics of the interaction and decomposition and cleaning of residual glue of nitrogen, oxygen, carbon tetrafluoride or hydrogen under the specific plasma condition. When the smooth surface of the base material adopts the jet printing characters, the plasma treatment is firstly carried out, which is a brand new character production process technology.
The invention has simple production flow and controllable operation, improves the character processing quality through the plasma technology, has low batch processing cost and is suitable for the requirement of large-scale automatic production of enterprises. Characters processed by the new technology have the quality defects of no defect, no falling and the like, and the quality requirements of customers are met.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A processing method for printing characters on the surface of a PCB substrate is characterized by comprising the following steps: outer layer line inspection, surface treatment, plate baking, plasma, plate washing, character spray printing, solidification, forming and final inspection;
the jet printing of characters includes: and calling character data of the material number according to the processing flow card, attaching a layer of transparent adhesive tape paper on the first board for testing the first board, printing after the debugging position is qualified, checking that the characters are clear and recognizable, and after the quality requirement is met, printing in batch in an account-opening mass production mode until all products are printed in a spray mode.
2. The process of printing characters on the surface of a PCB substrate as recited in claim 1, wherein the characters are cured according to the product type after the characters are printed by spraying.
3. The process of claim 1, wherein the surface treatment comprises removing water from the PCB substrate.
4. The processing method for printing characters on the surface of a PCB substrate as recited in claim 1, wherein the baking plate is a plasma-treated baking plate.
5. The method as claimed in claim 4, wherein the baking temperature is 120 ℃ to 150 ℃, and the baking time is 20-40 minutes.
6. The processing method for printing characters on the surface of a PCB substrate according to claim 4, wherein the gas adopted by the baking plate is any one or more of nitrogen, oxygen, carbon tetrafluoride and hydrogen.
7. The processing method for printing characters on the surface of the PCB substrate according to claim 6, wherein the plasma treatment is carried out in a specific manner as follows: placing the plate to be processed into the cavity, wherein the plate can not be stacked or touch the blocking wall of the inner cavity of the machine, and fastening the door catch; after the power supply of the equipment is started, a vacuum pump, an air release valve, gas, plasma and cold cutting water are sequentially started, and the equipment is waited to finish an automatic starting program.
8. The processing method for printing characters on the surface of a PCB substrate as recited in claim 7, wherein the introduced gas is hydrogen, oxygen, and carbon tetrafluoride sequentially.
9. The process of claim 5, wherein the plasma process temperature is 30-100 ℃ and the plasma power is 4-10 KW.
10. The processing method of printing characters on the surface of a PCB substrate as claimed in claim 1, wherein the appearance inspection and the force-complying inspection comprise performing a wave soldering experiment on a product which is qualified after the appearance inspection is completed, and then performing a 3M glue tension test to ensure that the characters do not fall off or are incomplete after components are soldered by a customer to meet quality requirements.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911312349.8A CN111065206A (en) | 2019-12-18 | 2019-12-18 | Processing method for printing characters on surface of PCB substrate |
| PCT/CN2020/106996 WO2021120638A1 (en) | 2019-12-18 | 2020-08-05 | Processing method for spraying character on surface of pcb substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911312349.8A CN111065206A (en) | 2019-12-18 | 2019-12-18 | Processing method for printing characters on surface of PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111065206A true CN111065206A (en) | 2020-04-24 |
Family
ID=70301024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911312349.8A Pending CN111065206A (en) | 2019-12-18 | 2019-12-18 | Processing method for printing characters on surface of PCB substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111065206A (en) |
| WO (1) | WO2021120638A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112131821A (en) * | 2020-09-23 | 2020-12-25 | 惠州市金百泽电路科技有限公司 | Word processing method applied to PCB processing |
| WO2021120638A1 (en) * | 2019-12-18 | 2021-06-24 | 惠州市金百泽电路科技有限公司 | Processing method for spraying character on surface of pcb substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0386459A1 (en) * | 1989-03-04 | 1990-09-12 | Oerlikon-Contraves AG | Method for producing thin-film circuits |
| WO1999067321A2 (en) * | 1998-06-19 | 1999-12-29 | Miba Gleitlager Aktiengesellschaft | Method for depositing a metallic layer on a polymer surface of a workpiece |
| CN101600299A (en) * | 2009-06-26 | 2009-12-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7581549B2 (en) * | 2004-07-23 | 2009-09-01 | Air Products And Chemicals, Inc. | Method for removing carbon-containing residues from a substrate |
| CN105344663A (en) * | 2015-09-30 | 2016-02-24 | 景旺电子科技(龙川)有限公司 | Plasma cleaning method for flexible printed circuit (FPC) board |
| CN108045119A (en) * | 2017-12-23 | 2018-05-18 | 惠州市金百泽电路科技有限公司 | A kind of method quickly positioned for printed circuit board silk-screen character |
| CN111065206A (en) * | 2019-12-18 | 2020-04-24 | 惠州市金百泽电路科技有限公司 | Processing method for printing characters on surface of PCB substrate |
-
2019
- 2019-12-18 CN CN201911312349.8A patent/CN111065206A/en active Pending
-
2020
- 2020-08-05 WO PCT/CN2020/106996 patent/WO2021120638A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0386459A1 (en) * | 1989-03-04 | 1990-09-12 | Oerlikon-Contraves AG | Method for producing thin-film circuits |
| WO1999067321A2 (en) * | 1998-06-19 | 1999-12-29 | Miba Gleitlager Aktiengesellschaft | Method for depositing a metallic layer on a polymer surface of a workpiece |
| CN101600299A (en) * | 2009-06-26 | 2009-12-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021120638A1 (en) * | 2019-12-18 | 2021-06-24 | 惠州市金百泽电路科技有限公司 | Processing method for spraying character on surface of pcb substrate |
| CN112131821A (en) * | 2020-09-23 | 2020-12-25 | 惠州市金百泽电路科技有限公司 | Word processing method applied to PCB processing |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021120638A1 (en) | 2021-06-24 |
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Application publication date: 20200424 |