CN101600299A - Rapid subtractive manufacturing process of circuit boards - Google Patents
Rapid subtractive manufacturing process of circuit boards Download PDFInfo
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- CN101600299A CN101600299A CNA2009100694666A CN200910069466A CN101600299A CN 101600299 A CN101600299 A CN 101600299A CN A2009100694666 A CNA2009100694666 A CN A2009100694666A CN 200910069466 A CN200910069466 A CN 200910069466A CN 101600299 A CN101600299 A CN 101600299A
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Abstract
The present invention relates to a kind of rapid subtractive manufacturing process of circuit boards, adopt inkjet technology, with shower nozzle figure by ink transfer to circuit board, its operation is as follows: punching-deburring, Cleaning and Passivation-heavy copper-cleaning-positive and negative coating-positive and negative printing curve-figure curing-etching-Cleaning and Passivation-quality inspection-positive and negative printing ultraviolet curing welding resistance oil-ultraviolet curing-positive and negative printing ultraviolet curing literal oil-ultraviolet curing-spray tin and surface treatment-moulding-electrical measurement-quality inspection-and pack-dispatch from the factory, about 5 hours of production time.Advantage is: simple and convenient, and once-forming, pattern edge is sharp keen, the precision height of circuitous pattern, its live width is brought up to less than 1/1000 by 3/1000 inch; Materials are simple, and figure transfer mainly by ink, has reduced production cost, has shortened the production time, has improved economic benefit; Owing to reduced the plating link, significantly reduced the discharging of energy consumption and industrial wastewater, so effects of energy conservation and environmental protection is good, cost is low.
Description
Technical field
The present invention relates to a kind of board production technology, particularly relate to a kind of technology simple, save time, efficient height and the low rapid subtractive manufacturing process of circuit boards of cost.
Background technology
As everyone knows, the gesture that the demand of circuit board is growth year by year both at home and abroad, and board production technology is still taked to expose with the film mostly at present, then, the conventional method of corrosion after the erosion-resisting metal of re-plating, traditional film exposure technology needs master slice of photoetching, covered the circuit board of light-sensitive surface by irradiate light, light exposes to the light-sensitive surface on the circuit board by the transparent part that does not have figure on the master slice so, after development is cleaned, the figure that does not need to keep has covered the film that has developed, and the copper of the circuit part that needs will expose out.The circuit board that has developed is carried out graphic plating, will adhere to the erosion-resisting metal level of one deck on the figure that needs to keep, just can carry out chemical corrosion after this step.Because of this process has the multiple tracks pilot process, so the problem that master slice can occur expanding with heat and contract with cold, exposure aligning also can produce certain deviation, and variety of problems such as diffraction of light can appear in exposure process, and cause pattern edge sharp keen inadequately, and precision can't further improve; In addition, external inkjet technology is produced circuit board and is also only rested on research and experimental stage, does not have actual application.Though some document is also mentioned with the air brushing technology and printed to method on the photosensitive material, in fact also promote away.The fast circuit plate manufacture craft of Germany has been used icking tool and laser means, and this process loss is big and cost is high, only is adapted at limited interior popularizations of scope such as laboratory, is not suitable for being generalized to and goes in the industrial equipment; In traditional circuit-board production, need 28 procedures such as multiexposure, multiple exposure, development and graphic plating, so technology is numerous and diverse, makes a circuit board and need 16 to 24 hours, efficient is low, the cost height, environmental pollution is serious.
Summary of the invention:
Main purpose of the present invention be to overcome above deficiency and provide a kind of simple in structure, save time, efficient height and the low rapid subtractive manufacturing process of circuit boards of cost.
The technical solution adopted for the present invention to solve the technical problems is: adopt 1200 points/inch inkjet technology, substitute the method for the operation carry circuit figure of the original film, by using ink and shower nozzle, figure transfer to circuit board, its operation process is as follows: punching-deburring, Cleaning and Passivation-heavy copper-Cleaning and Passivation-positive and negative coating-positive and negative printing curve-figure curing-etching-cleaning-quality inspection-positive and negative printing ultraviolet curing welding resistance oil-ultraviolet curing-positive and negative is printed ultraviolet curing literal oil-ultraviolet curing-spray tin and surface treatment-moulding-electrical measurement-quality inspection-packing-shipment, about 5 hours whole of production time.
The present invention can also adopt following technical measures:
Described ink is the common ink or the ink of resist chemical;
Described shower nozzle is the shower nozzle that industry is used for air brushing;
It is that heating, drying solidifies or ultraviolet curing that described figure solidifies.
Advantage and good effect that the present invention has are: use the technology of directly printing, and simple and convenient, once-forming, and make pattern edge sharper keen, and having improved the precision of circuitous pattern, its live width is brought up to less than 1/1000 by 3/1000 inch; Materials are simple, saved the consumptive material film of former technology and light-sensitive surface etc., only use ink, reduced production cost, and the time that shortened advanced 11 hours, and made things convenient for re-packing fast of small lot, had improved economic benefit; Because links such as the graphic plating nickel in the middle of having reduced or other metal have significantly reduced the discharging of energy consumption and industrial wastewater, so effects of energy conservation and environmental protection is good.
Embodiment
For can further understand summary of the invention characteristics of the present invention and effect now for example following examples be described in detail as follows.
The present invention uses subtractive process promptly on the copper sheet of full wafer, the circuit pattern that needs are kept protects by a kind of special coating (such as light-sensitive surface or printing ink), mode by chemical etching etches away the copper sheet that does not have protection then, wash the coating of protection at last, just obtained the circuitous pattern that needs; The present invention adopts 1200 points/inch inkjet technology, substitute the method for the operation carry circuit figure of the original film, be used for the air brushing shower nozzle by ink and the industry of using common ink or resist chemical, figure transfer to circuit board, by the technology of alternative original silk-screen welding resistance oil of ink-jetting process and literal oil, its operation process is as follows:
1.. circuit board surface preliminary treatment, punching-deburring, Cleaning and Passivation;
2.. circuit board positive and negative coating: by special material being coated on the copper face to improve the adhesive force of ink; 10.
3.. by inkjet technology at circuit board positive and negative print pattern: use special marking ink, the characteristics of this kind ink are fast doing, and plug not, and water-insoluble cleans easily by organic solvent;
4.. heating, drying solidifies or uses ultraviolet curing: with thorough solidified ink;
5.. chemical etching is also cleaned;
6.. quality inspection;
7.. print welding resistance green oil and literal white oil and ultraviolet curing respectively: positive and negative printing ultraviolet curing welding resistance oil-ultraviolet curing-positive and negative printing character-ultraviolet curing;
8.. spray tin and surface treatment and according to the profile of customer requirement to circuit board molding;
9.. electrical measurement, quality inspection;
10.. pack, dispatch from the factory.About 5 hours whole of the production time.
Its advantage is: use the technology of directly printing, and simple and convenient, once-forming, and make pattern edge more Add sharp keenly, improved the precision of circuitous pattern, its live width is brought up to less than 1/1000 by 3/1000 inch; Materials are simple, saved the consumptive material film of former technology and light-sensitive surface etc., only use ink, reduced producing This, the time that shortened is advanced 11 hours, and makes things convenient for re-packing fast of small lot, has improved economic benefit; By Plating link in the middle of having reduced reduced electroplating device, significantly reduced energy consumption and industrial wastewater Discharging and cost, effects of energy conservation and environmental protection is good simultaneously.
Claims (4)
1. rapid subtractive manufacturing process of circuit boards, it comprises punching, deburring, clean, heavy copper, baking, spray tin and surface treatment, moulding, electrical measurement and packaging process, it is characterized in that: adopt 1200 points/inch inkjet technology, substitute the method for the operation carry circuit figure of the original film, by using ink and shower nozzle, figure transfer to circuit board, its operation process is as follows: punching-deburring, Cleaning and Passivation-heavy copper-Cleaning and Passivation-positive and negative coating-positive and negative printing curve-figure curing-etching-cleaning-quality inspection-positive and negative printing ultraviolet curing welding resistance oil-ultraviolet curing-positive and negative is printed ultraviolet curing literal oil-ultraviolet curing-spray tin and surface treatment-moulding-electrical measurement-quality inspection-packing-shipment, about 5 hours whole of production time.
2. rapid subtractive manufacturing process of circuit boards according to claim 1 is characterized in that: described ink is the common ink or the ink of resist chemical.
3. rapid subtractive manufacturing process of circuit boards according to claim 1 is characterized in that: described shower nozzle is the shower nozzle that industry is used for air brushing.
4. rapid subtractive manufacturing process of circuit boards according to claim 1 is characterized in that: it is that heating, drying solidifies or ultraviolet curing that described figure solidifies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100694666A CN101600299B (en) | 2009-06-26 | 2009-06-26 | Rapid subtractive manufacturing process of circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100694666A CN101600299B (en) | 2009-06-26 | 2009-06-26 | Rapid subtractive manufacturing process of circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101600299A true CN101600299A (en) | 2009-12-09 |
| CN101600299B CN101600299B (en) | 2011-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100694666A Expired - Fee Related CN101600299B (en) | 2009-06-26 | 2009-06-26 | Rapid subtractive manufacturing process of circuit boards |
Country Status (1)
| Country | Link |
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| CN (1) | CN101600299B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185033A (en) * | 2011-04-19 | 2011-09-14 | 润峰电力有限公司 | Manufacturing process of high-efficiency crystalline silicon solar battery with selective emitting electrode |
| CN103533783A (en) * | 2013-10-24 | 2014-01-22 | 东莞康源电子有限公司 | Manufacturing method of multi-layer PCB (printed circuit board) |
| CN103568612A (en) * | 2013-11-06 | 2014-02-12 | 复旦大学 | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology |
| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| CN108207081A (en) * | 2016-12-20 | 2018-06-26 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacturing method of printed circuit board circuitry |
| CN110366323A (en) * | 2019-07-03 | 2019-10-22 | 深圳明阳电路科技股份有限公司 | A kind of production method of wiring board soldermask layer |
| CN110497701A (en) * | 2018-05-18 | 2019-11-26 | 富泰华工业（深圳）有限公司 | Vertical circuit board printer and its Method of printing |
| CN110856358A (en) * | 2019-11-19 | 2020-02-28 | 江苏上达电子有限公司 | Method for forming COF circuit |
| CN111065206A (en) * | 2019-12-18 | 2020-04-24 | 惠州市金百泽电路科技有限公司 | Processing method for printing characters on surface of PCB substrate |
Family Cites Families (4)
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|---|---|---|---|---|
| CN1224989A (en) * | 1997-11-10 | 1999-08-04 | 通用电气公司 | Process for promoting chemical adhesion of legend inks using ultra-violet light |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN100531527C (en) * | 2007-01-23 | 2009-08-19 | 李东明 | Printed circuit board mask hole electroplating molding process |
| DE102007014700A1 (en) * | 2007-03-27 | 2008-10-02 | Yung-Shun Chen | Conductive antenna i.e. radio frequency antenna, manufacturing method, involves washing plastic foil substrate, such that aqueous printing ink is removed from substrate and conductive layer lies only on printed antenna pattern |
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2009
- 2009-06-26 CN CN2009100694666A patent/CN101600299B/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185033A (en) * | 2011-04-19 | 2011-09-14 | 润峰电力有限公司 | Manufacturing process of high-efficiency crystalline silicon solar battery with selective emitting electrode |
| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
| CN103533783A (en) * | 2013-10-24 | 2014-01-22 | 东莞康源电子有限公司 | Manufacturing method of multi-layer PCB (printed circuit board) |
| CN103533783B (en) * | 2013-10-24 | 2016-08-17 | 东莞康源电子有限公司 | PCB multilayer board manufacture method |
| CN103568612A (en) * | 2013-11-06 | 2014-02-12 | 复旦大学 | Method for preparing printed electronic resistance welding material based on household piezoelectric inkjet printing technology |
| US10342139B2 (en) | 2015-11-13 | 2019-07-02 | Fu Tai Hua Industry (Shenzhen) Co., Ltd. | Printer and printing method for printing of printed circuit boards |
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| CN106696475B (en) * | 2015-11-13 | 2019-06-18 | 富泰华工业（深圳）有限公司 | Printer and the method for utilizing printer printed circuit board |
| CN108207081A (en) * | 2016-12-20 | 2018-06-26 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacturing method of printed circuit board circuitry |
| CN110497701A (en) * | 2018-05-18 | 2019-11-26 | 富泰华工业（深圳）有限公司 | Vertical circuit board printer and its Method of printing |
| CN110497701B (en) * | 2018-05-18 | 2021-01-29 | 富泰华工业（深圳）有限公司 | Vertical circuit board printer and printing method thereof |
| CN110366323A (en) * | 2019-07-03 | 2019-10-22 | 深圳明阳电路科技股份有限公司 | A kind of production method of wiring board soldermask layer |
| CN110856358A (en) * | 2019-11-19 | 2020-02-28 | 江苏上达电子有限公司 | Method for forming COF circuit |
| CN111065206A (en) * | 2019-12-18 | 2020-04-24 | 惠州市金百泽电路科技有限公司 | Processing method for printing characters on surface of PCB substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101600299B (en) | 2011-03-09 |
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