CN103533783A - Manufacturing method of multi-layer PCB (printed circuit board) - Google Patents
Manufacturing method of multi-layer PCB (printed circuit board) Download PDFInfo
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- CN103533783A CN103533783A CN201310512474.XA CN201310512474A CN103533783A CN 103533783 A CN103533783 A CN 103533783A CN 201310512474 A CN201310512474 A CN 201310512474A CN 103533783 A CN103533783 A CN 103533783A
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Abstract
A manufacturing method of a multi-layer PCB comprises the steps as follows: 1), board cutting is performed, so that a jointed board is formed; 2), an inner-layer image is transferred; 3), inner-layer press fit is performed; 4), a target point is manufactured: a part of an exposed inner-layer copper foil of an inner-layer circuit image is manufactured into a special image, so that the target point is manufactured; 5), lamination is performed; 6), the inner-layer image is captured: a CCD (charge coupled device) image sensor is used for capturing the target point on the inner-layer copper coil, and position information of the target point is stored in a computer; 7), an outer-layer image is transferred: the target point on the inner-layer copper foil is captured through the CCD image sensor and taken as a reference, and an outer-layer circuit image is formed; 8), drilling is performed; and 9), chemical copper deposition is performed, and the inner-layer circuit image and the outer-layer circuit image are conducted. The target point is manufactured on a part of the copper foil of the inner-layer circuit image, and when the outer-layer image is transferred, the target point on the inner-layer copper foil is taken as a reference, so that the accuracy of the outer-layer circuit image and the inner-layer circuit image is guaranteed.
Description
Technical field
The present invention relates to a kind of method for producing multi-layer board, be specifically related to a kind of PCB method for producing multi-layer board.
Background technology
At present in industry, during the multiple-plate outer image making of PCB, outer image transfer adopts outer hole location conventionally, aiming at generally between 4-5mil between its internal layer circuit figure layer and outer circuit figure layer, in the boring step of postorder, there is hole and the inclined to one side problem of inner figure in the method.It can meet the demands for mill run, but for the very little product of unit (about 2mm), it can not meet the demands, and easily causes PCB multi-layer sheet cisco unity malfunction.
Summary of the invention
Based on this, be necessary for deficiency of the prior art, a kind of PCB method for producing multi-layer board is provided.
The present invention is achieved in the following ways: a kind of PCB method for producing multi-layer board, and it comprises the following steps: (1) sawing sheet, form jigsaw, this jigsaw comprises internal substrate and invests the internal layer Copper Foil of internal substrate upper and lower surface; (2) internal layer image transfer, the inner line figure of formation internal layer Copper Foil; (3) internal layer pressing, coincides internal substrate, PP, Copper Foil together in order, forms core material; (4) make target spot, the outer exposed part internal layer Copper Foil of inner line figure is made to special graph, form target spot; (5) lamination, by core material, PP and outer central layer pressing, forms multi-layer sheet, and the upper and lower surface of its ectomesoderm central layer is provided with outer copper foil; (6) internal layer image-capture, adopts ccd image sensor to capture the target spot on internal layer Copper Foil, and the positional information of target spot is stored up in computer; (7) outer image transfer, the target spot capturing on internal layer Copper Foil according to ccd image sensor is benchmark, makes outer-layer circuit figure; (8) boring; (9) electroless copper plating, conducting inner line figure and outer-layer circuit figure.
Further, in step (2), on the Copper Foil of internal substrate upper and lower surface, be coated with one deck ink, utilize the irradiation of ultraviolet light, circuitry shapes transition diagram, to the ink on the internal layer Copper Foil of jigsaw, is removed the ink not hardened by chemical reaction, formed the line pattern of ink; Then exposed internal layer Copper Foil is removed by chemical reaction; Again ink is removed by chemical reaction, exposed the line pattern of copper, thereby circuitry shapes is transferred on the Copper Foil of jigsaw, then carry out brown processing, internal substrate and circuit layer are cleaned before pressing, remove surperficial foreign material.
Further, in step (6), adopt DI exposure machine to capture target spot.
In sum, PCB method for producing multi-layer board of the present invention is by being manufactured with target spot on part Copper Foil exposed outside inner line figure, during outer image transfer, the target spot of take on internal layer Copper Foil is benchmark, guarantee the accuracy of outer-layer circuit figure and inner line figure, prevent in the drilling operation of postorder, between the passage after boring, outer-layer circuit figure and inner line figure, be offset, cause the phenomenon of PCB multi-layer sheet cisco unity malfunction to occur.
Accompanying drawing explanation
Fig. 1 is the flow chart of PCB method for producing multi-layer board of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
As shown in Figure 1, it is PCB method for producing multi-layer board of the present invention, for the multiple-plate making of PCB, and preserves the alignment precision between plate, and it has comprised the following steps the multiple-plate making of PCB:
Step 1: sawing sheet, select suitable jigsaw and cutting plate mode, improve to greatest extent availability ratio of the armor plate, this jigsaw comprises internal substrate and invests the internal layer Copper Foil of internal substrate upper and lower surface.
Step 2: internal layer image transfer, on the Copper Foil of internal substrate upper and lower surface, be coated with one deck ink, utilize the irradiation of ultraviolet light, by circuitry shapes transition diagram to the ink on the internal layer Copper Foil of jigsaw, the ink not hardened is removed by chemical reaction, formed the line pattern of ink; Then exposed internal layer Copper Foil is removed by chemical reaction; Again ink is removed by chemical reaction, exposed the line pattern of copper, thereby circuitry shapes is transferred on the Copper Foil of jigsaw, form the inner line figure of internal layer Copper Foil; Carry out again brown processing, internal substrate and circuit layer cleaned before pressing, remove surperficial foreign material, improve internal substrate and PP(prepreg, prepreg) adhesion between layer, avoid lamination to occur, improve the reliability of product.
Step 3: internal layer pressing, internal substrate, PP, Copper Foil are coincided together in order, and internal substrate, PP layer and internal layer Copper Foil after coinciding are combined under HTHP, form core material.
Step 4: make target spot, the outer exposed part Copper Foil of inner line figure is carried out to etching by chemical reaction, make special graph, form target spot, this target spot is generally circular, certainly, can be also that its other shape that is different from circuitous pattern is as annular, star.
Step 5: lamination, by core material, PP and outer central layer by coinciding in order together, and core material, PP and outer central layer after coinciding are combined under HTHP, forming multi-layer sheet, the upper and lower surface of its ectomesoderm central layer is provided with outer copper foil.
Step 6: internal layer image-capture, because internal layer target spot is directly visible by natural daylight, adopts the ccd image sensor of contraposition equipment DI exposure machine (direct imaging exposure machine) to capture the target spot on internal layer Copper Foil, and the positional information of target spot is stored up in computer.
Step 7: outer image transfer, read the positional information of the target spot in computer, the target spot capturing on internal layer Copper Foil according to ccd image sensor is benchmark, the exposed Copper Foil of outer central layer upper and lower surface is removed by chemical reaction, make the outer-layer circuit figure of Copper Foil, guarantee the accuracy of outer-layer circuit figure and inner line figure.
Step 8: boring, on multi-layer sheet, get out required hole, form the passage that connects many plates plate electric conductivity between layers.
Step 9: electroless copper plating, deposits copper layer, conducting inner line figure and outer-layer circuit figure that one deck conducts electricity on the hole wall of the passage insulating at multi-layer sheet.
In sum, PCB method for producing multi-layer board of the present invention is by being manufactured with target spot on part Copper Foil exposed outside inner line figure, during outer image transfer, the target spot of take on internal layer Copper Foil is benchmark, guarantee the accuracy of outer-layer circuit figure and inner line figure, prevent in the drilling operation of postorder, between the passage after boring, outer-layer circuit figure and inner line figure, be offset, cause the phenomenon of PCB multi-layer sheet cisco unity malfunction to occur.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. a PCB method for producing multi-layer board, it comprises the following steps:
(1) sawing sheet, forms jigsaw, and this jigsaw comprises internal substrate and invests the internal layer Copper Foil of internal substrate upper and lower surface;
(2) internal layer image transfer, the inner line figure of formation internal layer Copper Foil;
(3) internal layer pressing, coincides internal substrate, PP, Copper Foil together in order, forms core material;
(4) make target spot, the outer exposed part internal layer Copper Foil of inner line figure is made to special graph, form target spot;
(5) lamination, by core material, PP and outer central layer pressing, forms multi-layer sheet, and the upper and lower surface of its ectomesoderm central layer is provided with outer copper foil;
(6) internal layer image-capture, adopts ccd image sensor to capture the target spot on internal layer Copper Foil, and the positional information of target spot is stored up in computer;
(7) outer image transfer, the target spot capturing on internal layer Copper Foil according to ccd image sensor is benchmark, makes outer-layer circuit figure;
(8) boring; And
(9) electroless copper plating, conducting inner line figure and outer-layer circuit figure.
2. PCB method for producing multi-layer board according to claim 1, it is characterized in that: in step (2), on the Copper Foil of internal substrate upper and lower surface, be coated with one deck ink, utilize the irradiation of ultraviolet light, by circuitry shapes transition diagram to the ink on the internal layer Copper Foil of jigsaw, the ink not hardened is removed by chemical reaction, formed the line pattern of ink; Then exposed internal layer Copper Foil is removed by chemical reaction; Again ink is removed by chemical reaction, is exposed the line pattern of copper, thereby circuitry shapes is transferred on the Copper Foil of jigsaw; Carry out again brown processing, internal substrate and circuit layer are cleaned before pressing, remove surperficial foreign material.
3. PCB method for producing multi-layer board according to claim 1, is characterized in that: in step (6), adopt DI exposure machine to capture target spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310512474.XA CN103533783B (en) | 2013-10-24 | 2013-10-24 | PCB multilayer board manufacture method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310512474.XA CN103533783B (en) | 2013-10-24 | 2013-10-24 | PCB multilayer board manufacture method |
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| CN103533783A true CN103533783A (en) | 2014-01-22 |
| CN103533783B CN103533783B (en) | 2016-08-17 |
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| CN201310512474.XA Active CN103533783B (en) | 2013-10-24 | 2013-10-24 | PCB multilayer board manufacture method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792530A (en) * | 2016-04-25 | 2016-07-20 | 苏州市王氏电路板有限公司 | PCB processing technology |
| CN107072079A (en) * | 2017-05-05 | 2017-08-18 | 柏承科技(昆山)股份有限公司 | High thickness PCB increasing layer methods |
| WO2019090858A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Pin-free positioning processing method |
| CN110896598A (en) * | 2019-10-10 | 2020-03-20 | 信丰福昌发电子有限公司 | Multilayer circuit board processing technology |
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|---|---|---|---|---|
| US20040109627A1 (en) * | 2002-12-05 | 2004-06-10 | Young-Woo Kim | Multi-layer PCB and method for coupling block type multichannel optical signals |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN101472405A (en) * | 2007-12-26 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN101600299A (en) * | 2009-06-26 | 2009-12-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
-
2013
- 2013-10-24 CN CN201310512474.XA patent/CN103533783B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040109627A1 (en) * | 2002-12-05 | 2004-06-10 | Young-Woo Kim | Multi-layer PCB and method for coupling block type multichannel optical signals |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN101472405A (en) * | 2007-12-26 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN101600299A (en) * | 2009-06-26 | 2009-12-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792530A (en) * | 2016-04-25 | 2016-07-20 | 苏州市王氏电路板有限公司 | PCB processing technology |
| CN105792530B (en) * | 2016-04-25 | 2019-01-29 | 苏州市王氏电路板有限公司 | A kind of processing technology of pcb board |
| CN107072079A (en) * | 2017-05-05 | 2017-08-18 | 柏承科技(昆山)股份有限公司 | High thickness PCB increasing layer methods |
| WO2019090858A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Pin-free positioning processing method |
| CN110896598A (en) * | 2019-10-10 | 2020-03-20 | 信丰福昌发电子有限公司 | Multilayer circuit board processing technology |
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| Publication number | Publication date |
|---|---|
| CN103533783B (en) | 2016-08-17 |
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