WO2019090858A1 - Pin-free positioning processing method - Google Patents
Pin-free positioning processing method Download PDFInfo
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- WO2019090858A1 WO2019090858A1 PCT/CN2017/112924 CN2017112924W WO2019090858A1 WO 2019090858 A1 WO2019090858 A1 WO 2019090858A1 CN 2017112924 W CN2017112924 W CN 2017112924W WO 2019090858 A1 WO2019090858 A1 WO 2019090858A1
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- circuit board
- circuit
- pin
- processing method
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Definitions
- the invention relates to the technical field of circuit board manufacturing, in particular to a PIN-free positioning processing method.
- the multi-layer circuit board is formed by pressing a plurality of core plates, which are small-sized production boards cut from large-sized copper-clad board raw materials, and the inner layer patterns of the PCB boards are prepared.
- the traditional multi-layer circuit board is processed by pressing a plurality of core plates into two sub-boards, and the laminated sub-boards are drilled through the milling and drilling target to drill three basic positioning holes, which are adopted according to three basic positioning holes.
- the drilling machine drills a plurality of pin positioning holes and function holes in the board at the edge of the board, and respectively performs two processes of sinking copper, thickening, mechanical degumming and the like on the two sub-boards, and positioning the two sub-boards through the pin positioning holes. Lamination.
- the existing positioning method in the processing process has the following disadvantages: after the core plate is pressed into the sub-board, it has to undergo more than ten processes such as sinking copper, thickening, mechanical degumming, etc., and there are many heating and cooling operations, and different plates will be Different shrinkage will result in a certain error in the positioning and pressing of the daughterboard; the pin positioning holes processed on the corresponding daughterboard will also undergo non-metallized holes to become metallized holes, and finally change from metallized holes. The process of returning to the non-metallized hole, the erosion of the hole wall by the multiple syrups is likely to cause damage to the hole wall, thereby affecting the accuracy of the pin positioning hole.
- a PIN-free positioning processing method comprising the following steps:
- Material preparation provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;
- hot-pressed copper foil layer two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;
- Substrate trimming The circuit board substrate is trimmed by a circuit board cutting machine and a circuit board sanding machine to form a fixed-size circuit board substrate, which is ready for use;
- Perforation connection a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils.
- a conductor of the layer the conductive paste is selected from a conductive copper paste, and is filled in a perforation of the circuit board substrate through a printing template having a glue injection hole;
- Circuit diagram molding mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film.
- a copper is formed in the place where the ions are deposited, and a metal layer is deposited on the inner surface layer of the through hole to obtain a circuit diagram;
- the thickness of the film formed after the turning is 0.01-0.075 mm;
- the ceramic powder is silica, oxidized a mixture of aluminum and titanium dioxide, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for 30%-40% of the total mass of ceramic powder and PTFE powder;
- insulating layer molding a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 ⁇ m, and then subjected to a lamination treatment to form an insulating layer;
- Edge trimming the board is polished again with a circuit board sander
- Circuit board detection connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board.
- the thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;
- In-stock storage Inspect the qualified circuit board for inventory storage, and dispose of the products that fail to pass the inspection.
- the step 5) the film forming pressure is 100-160 kg/cm 2 , the sintering temperature is 380-400 ° C, and the sintering time is 50-60 h; the turning, ion implantation, electroplating is used to obtain 2.2 ⁇ High frequency FPC with Dk ⁇ 6.5.
- the step 8) collecting the thermal image of the circuit board means: forming the brightness value and the saturation of each pixel point according to the heat loading circuit distribution area combined with the visible light image corresponding to the peripheral edge of the selected area.
- Different values generating a color image of the field of view; the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining each pixel of the field of view overlap region
- the brightness value of the infrared hotspot detection probe is 2-3 ⁇ m and the temperature resolution is 0.05-0.15 ° C; the infrared hot spot detection probe has a detection spatial resolution of 2.7 ⁇ m and a temperature resolution of 0.1°.
- the saturation value is determined according to a temperature quantization value of a corresponding pixel point of the respective pixel points of the field of view overlapping region in the thermographic image and/or a saturation degree of a corresponding pixel point in the visible light image, respectively.
- the saturation value of each pixel point of the field of view coincidence region is determined according to a temperature quantization value of a corresponding pixel point of the respective pixel points of the field of view overlapping region in the thermographic image and/or a saturation degree of a corresponding pixel point in the visible light image, respectively.
- the step 2) the hot pressing temperature of the hot press is 100-150 ° C
- the hot pressing pressure of the hot press is 300-500 MPa
- the hot pressing time of the hot press is 2-5 h. .
- the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades;
- the thickness of the stacked prepreg is 60% to 80% greater than the set thickness of the insulating layer.
- the step 4) the conductive adhesive is made of conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C. .
- the step 3) the speed of the circuit board sander is 310-450 r/min.
- the invention achieves the beneficial effects that in the prior art, each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency.
- the invention eliminates the need of PIN positioning holes for positioning, simplifies the work flow, effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board detecting process can be performed after molding The board is tested to ensure the quality of the product and effectively improve the convenience of use.
- Figure 1 is a flow chart of the processing method of the present invention
- a PIN-free positioning processing method including the following steps:
- Material preparation provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;
- hot-pressed copper foil layer two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;
- Substrate trimming The circuit board substrate is trimmed by a circuit board cutter and a circuit board sander to form a solid a fixed-size circuit board substrate, ready for use;
- Perforation connection a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils.
- the conductor of the layer, the conductive adhesive is selected from conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole;
- Circuit diagram molding mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film.
- the copper is formed in the place where the ions are deposited, and the copper is deposited on the inner surface layer of the through hole to obtain a circuit diagram;
- the thickness of the film formed after turning is 0.01-0.075 mm;
- the ceramic powder is silica, alumina, and titania Mixture, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica;
- the total mass of the ceramic powder accounts for the ceramic powder and the poly 4 30%-40% of the total mass of vinyl fluoride powder;
- Insulation layer molding a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 ⁇ m, and then subjected to a lamination process to form an insulating layer;
- Edge trimming the board is polished again with a circuit board sander
- Circuit board detection connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board.
- the thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;
- In-stock storage Inspect the qualified circuit board for inventory storage, and dispose of the products that fail to pass the inspection.
- step 5 film forming pressure 100-160kg/cm 2 , sintering temperature 380-400 ° C and sintering time 50-60h; using turning, ion implantation, electroplating to obtain a high 2.2 ⁇ Dk ⁇ 6.5 Frequency FPC.
- the step 8) collecting the thermal image of the circuit board means: forming different brightness values and saturation values of the respective pixel points according to the heat loading circuit distribution area and the visible light image corresponding to the peripheral edge of the selected area.
- Generating a color image of the field of view the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining the brightness value of each pixel of the field of view coincidence region; the detection of the infrared hot spot detection probe
- the spatial resolution is 2-3 ⁇ m, the temperature resolution is 0.05-0.15°C; the infrared hotspot detection probe has a detection spatial resolution of 2.7 ⁇ m and a temperature resolution of 0.1°; the saturation values are respectively according to the pixels of the field of view coincidence area.
- Thermal imaging image The temperature quantization value of the corresponding pixel in the corresponding pixel and/or the saturation of the corresponding pixel in the visible light image determines the saturation value of each pixel of the field of view coincidence region.
- the hot pressing temperature of the hot press is 100-150 ° C
- the hot pressing pressure of the hot press is 300-500 MPa
- the hot pressing time of the hot press is 2-5 h.
- the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades;
- the thickness of the prepreg is 60% to 80% greater than the set thickness of the insulating layer.
- the conductive adhesive of the step 4) is made of conductive copper glue and filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C.
- the rotation speed of the circuit board sander of step 3 is 310-450 r/min.
- each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency.
- the present invention eliminates the need for a PIN positioning hole for positioning, and simplifies the workflow. It effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board inspection process can detect the formed circuit board, effectively ensuring the quality of the product and effectively Increased ease of use.
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- Manufacturing Of Printed Wiring (AREA)
Abstract
Provided is a PIN-free positioning processing method. The PIN-free positioning processing method comprises the following steps: material preparation, copper foil layer hot-pressing, substrate trimming, threading hole connection, circuit pattern formation, insulation layer formation, edge trimming, circuit board detection and storage. In the step 5), the thin film formation pressure is (100-160) kg/cm2, a temperature during sintering is 380-400℃, thermal image acquisition of a circuit board in the step 8) means that a color image of a field of view region is generated according to different brightness values and saturation values of pixel points formed by combination of visual light images at a heat loading circuit distribution region and peripheral edges of a corresponding selected region, and the brightness values are used for determining a brightness value of each pixel point of a field of view overlapped region according to brightness of each pixel point of the field of view overlapped region at the corresponding pixel point in a visual light image. The PIN-free positioning processing method is simple in structure, and a PIN positioning buckle is not needed to fix, so that the processing technology flow is effectively simplified, the convenience of usage is improved, and the processing efficiency of the circuit board is improved.
Description
本发明涉及电路板制作技术领域,具体为无PIN定位加工方法。The invention relates to the technical field of circuit board manufacturing, in particular to a PIN-free positioning processing method.
随着科技的发展人们对电路板的性能要求越来越高,多层电路板的应用也越来越多。多层电路板由多张芯板压合而成,芯板是由大尺寸覆铜板原材料裁剪制成的小尺寸生产板,并制作好PCB板内层图形。传统的多层电路板的加工过程为:将多张芯板压合为两个子板,将层压后的子板通过铣边钻靶钻出三个基础定位孔,根据三个基础定位孔采用钻孔机在板边钻出多个销钉定位孔和板内的功能孔,分别对两个子板进行沉铜、加厚、机械除胶等多道工序后,通过销钉定位孔将两个子板定位压合。现有的加工过程中定位方法存在以下不足:芯板压合制成子板后要经历沉铜、加厚、机械除胶等十多道工序,有多次升温降温操作,不同的板件会形成不同的涨缩,会导致子板的定位压合存在一定的误差;相应的子板上所加工的销钉定位孔也要经历非金属化孔变为金属化孔,最后又从金属化孔变回非金属化孔的过程,多次药水对孔壁的侵蚀容易造成孔壁受损,进而影响销钉定位孔的精度。With the development of technology, people's performance requirements for circuit boards are getting higher and higher, and the application of multi-layer circuit boards is increasing. The multi-layer circuit board is formed by pressing a plurality of core plates, which are small-sized production boards cut from large-sized copper-clad board raw materials, and the inner layer patterns of the PCB boards are prepared. The traditional multi-layer circuit board is processed by pressing a plurality of core plates into two sub-boards, and the laminated sub-boards are drilled through the milling and drilling target to drill three basic positioning holes, which are adopted according to three basic positioning holes. The drilling machine drills a plurality of pin positioning holes and function holes in the board at the edge of the board, and respectively performs two processes of sinking copper, thickening, mechanical degumming and the like on the two sub-boards, and positioning the two sub-boards through the pin positioning holes. Lamination. The existing positioning method in the processing process has the following disadvantages: after the core plate is pressed into the sub-board, it has to undergo more than ten processes such as sinking copper, thickening, mechanical degumming, etc., and there are many heating and cooling operations, and different plates will be Different shrinkage will result in a certain error in the positioning and pressing of the daughterboard; the pin positioning holes processed on the corresponding daughterboard will also undergo non-metallized holes to become metallized holes, and finally change from metallized holes. The process of returning to the non-metallized hole, the erosion of the hole wall by the multiple syrups is likely to cause damage to the hole wall, thereby affecting the accuracy of the pin positioning hole.
现有的芯板连接时都需要采用PIN定位孔进行定位,使用起来极为麻烦,操作极为不便,严重影响工作效率,因此,设计一种无PIN定位加工方法是很有必要的。When the existing core board is connected, the PIN positioning hole is required for positioning, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. Therefore, it is necessary to design a PIN-free positioning processing method.
发明内容Summary of the invention
本发明的目的在于提供无PIN定位加工方法,以解决上述背景技术中提出的问题。It is an object of the present invention to provide a PINless positioning processing method to solve the problems set forth in the above background art.
为了解决上述技术问题,本发明提供如下技术方案:无PIN定位加工方法,包括如下步骤:In order to solve the above technical problem, the present invention provides the following technical solution: a PIN-free positioning processing method, comprising the following steps:
1)材料准备:提供多个电路板芯板、多个绝缘层和多个铜箔层,备用;1) Material preparation: provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;
2)热压铜箔层:将两层铜箔层分别摆放在电路板芯板的顶部和底部,通过热压机压合在一起,形成电路板基板;2) hot-pressed copper foil layer: two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;
3)基板修整:采用电路板切割机和电路板打磨机对电路板基板进行修整,使其形成固定大小的电路板基板,待用;
3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutting machine and a circuit board sanding machine to form a fixed-size circuit board substrate, which is ready for use;
4)穿孔连接:采用电路板打孔机在电路板基板的预定位置形成穿孔,以印刷手段在电路板基板的穿孔中填充导电胶,再予以加热烘干,使导电胶固化为连接上下铜箔层的导体,所述导电胶是选用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中;4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. a conductor of the layer, the conductive paste is selected from a conductive copper paste, and is filled in a perforation of the circuit board substrate through a printing template having a glue injection hole;
5)线路图成型:将氧化铝、二氧化钛、二氧化硅混合陶瓷粉料和聚四氟乙烯粉末混合后成型烧结形成坯料,再将坯料车削为薄膜;接着按照电路设计所需在上一步制得的薄膜上钻孔;最后采用先离子注入再电镀的方法,在上述步骤制得的薄膜双表面层注入铜离子,同时孔内表面层注入铜离子,再利用电镀方式在薄膜双表面层有铜离子的地方沉积铜形成线路图,同时通孔内表面层沉积金属铜,制得线路图;所述车削后形成的薄膜的厚度为0.01-0.075mm;所述陶瓷粉料为二氧化硅、氧化铝、二氧化钛三者的混合物,其中氧化铝质量为混合物总质量的30-40%、二氧化钛质量为混合物总质量的10-60%、余量为二氧化硅;所述陶瓷粉料的总质量占陶瓷粉料和聚四氟乙烯粉料总质量的30%-40%;5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. a copper is formed in the place where the ions are deposited, and a metal layer is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after the turning is 0.01-0.075 mm; the ceramic powder is silica, oxidized a mixture of aluminum and titanium dioxide, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for 30%-40% of the total mass of ceramic powder and PTFE powder;
6)绝缘层成型:在所述形成的线路图的两侧上依次叠放半固化片和离型膜,其中所述离型膜的厚度为200至500微米,随后进行层压处理以形成绝缘层;6) insulating layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination treatment to form an insulating layer;
7)边缘修整:再次采用电路板打磨机对电路板进行打磨;7) Edge trimming: the board is polished again with a circuit board sander;
8)电路板检测:将待测电路板的待测电路相关引脚与红外热点探测系统接通;接着采用红外加热装置对电路板的待测区域进行加热,并通过红外热点探测探头对电路板的热图像进行采集,并将热图像通过成像系统显示出来;最后成像系统同时显示出标准电路的热图像,操作人员将标准电路的热图像与待测电路的热图像进行对比,判断电路连接情况;8) Circuit board detection: connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board. The thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;
9)入库存储:对检测合格的电路板进行入库存储,对检测不合格的产品进行废品处理。9) In-stock storage: Inspect the qualified circuit board for inventory storage, and dispose of the products that fail to pass the inspection.
根据上述技术方案,所述步骤5)薄膜成型压力100-160kg/cm2、烧结时温度380-400°C和烧结时间50-60h;所述采用车削、离子注入、电镀的方式制得2.2≤Dk<6.5的高频FPC。According to the above technical solution, the step 5) the film forming pressure is 100-160 kg/cm 2 , the sintering temperature is 380-400 ° C, and the sintering time is 50-60 h; the turning, ion implantation, electroplating is used to obtain 2.2 ≤ High frequency FPC with Dk < 6.5.
根据上述技术方案,所述步骤8)对电路板的热图像进行采集是指:根据热加载电路分布区域与相应于所选区域外周边缘的可见光图像结合的形成各个像素点的亮度值和饱和度值不同,生成视场区域的彩色图像;所述亮度值分别根据所述视场重合区域的各个像素点在所述可见光图像中对应像素点的亮度,确定所述视场重合区域的各个像素点的亮度值;所述红外热点探测探头的探测空间分辨率为2-3μm,温度分辨率为0.05-0.15℃;所述红外热点探测探头的探测空间分辨率为2.7μm,温度分辨率为0.1°;所述饱和度值分别根据所述视场重合区域的各个像素点在所述热成像图像中的对应像素点的温度量化值和/或在所述可见光图像中对应像素点的饱和度,确定所述视场重合区域的各个像素点的饱和度值。
According to the above technical solution, the step 8) collecting the thermal image of the circuit board means: forming the brightness value and the saturation of each pixel point according to the heat loading circuit distribution area combined with the visible light image corresponding to the peripheral edge of the selected area. Different values, generating a color image of the field of view; the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining each pixel of the field of view overlap region The brightness value of the infrared hotspot detection probe is 2-3 μm and the temperature resolution is 0.05-0.15 ° C; the infrared hot spot detection probe has a detection spatial resolution of 2.7 μm and a temperature resolution of 0.1°. The saturation value is determined according to a temperature quantization value of a corresponding pixel point of the respective pixel points of the field of view overlapping region in the thermographic image and/or a saturation degree of a corresponding pixel point in the visible light image, respectively. The saturation value of each pixel point of the field of view coincidence region.
根据上述技术方案,所述步骤2)热压机的热压温度为100-150℃,所述热压机的热压压力为300-500MPa,所述热压机的热压时间为2-5h。According to the above technical solution, the step 2) the hot pressing temperature of the hot press is 100-150 ° C, the hot pressing pressure of the hot press is 300-500 MPa, and the hot pressing time of the hot press is 2-5 h. .
根据上述技术方案,所述步骤6)层压处理具体为在20℃-28℃的温度范围内、50%-60%的湿度范围内、至少10000级的洁净度要求下进行层压处理;所述叠放的半固化片的厚度比绝缘层的设定厚度大60%至80%。According to the above technical solution, the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades; The thickness of the stacked prepreg is 60% to 80% greater than the set thickness of the insulating layer.
根据上述技术方案,所述步骤4)导电胶采用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中,所述导电胶的烘干温度为60-80℃。According to the above technical solution, the step 4) the conductive adhesive is made of conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C. .
根据上述技术方案,所述步骤3)电路板打磨机的转速为310-450r/min。According to the above technical solution, the step 3) the speed of the circuit board sander is 310-450 r/min.
与现有技术相比,本发明所达到的有益效果是:现有技术中每张芯板连接时都需要采用PIN定位孔进行定位,使用起来极为麻烦,操作极为不便,严重影响工作效率,本发明,无需PIN定位孔进行定位,简化了工作流程,有效提升了使用的方便性,提升了电路板成型的效率,有效提升了使用的方便性;电路板检测工序的设置,可以对成型后的电路板进行检测,有效保证了产品的质量,有效提升了使用的方便性。Compared with the prior art, the invention achieves the beneficial effects that in the prior art, each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. The invention eliminates the need of PIN positioning holes for positioning, simplifies the work flow, effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board detecting process can be performed after molding The board is tested to ensure the quality of the product and effectively improve the convenience of use.
附图用来提供对本发明的进一步理解,并且构成说明书的一部分,与本发明的实施例一起用于解释本发明,并不构成对本发明的限制。在附图中:The drawings are intended to provide a further understanding of the invention, and are intended to be a In the drawing:
图1是本发明的加工方法流程图;Figure 1 is a flow chart of the processing method of the present invention;
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
请参阅图1,本发明提供技术方案:无PIN定位加工方法,包括如下步骤:Referring to FIG. 1 , the present invention provides a technical solution: a PIN-free positioning processing method, including the following steps:
1)材料准备:提供多个电路板芯板、多个绝缘层和多个铜箔层,备用;1) Material preparation: provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;
2)热压铜箔层:将两层铜箔层分别摆放在电路板芯板的顶部和底部,通过热压机压合在一起,形成电路板基板;2) hot-pressed copper foil layer: two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;
3)基板修整:采用电路板切割机和电路板打磨机对电路板基板进行修整,使其形成固
定大小的电路板基板,待用;3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutter and a circuit board sander to form a solid
a fixed-size circuit board substrate, ready for use;
4)穿孔连接:采用电路板打孔机在电路板基板的预定位置形成穿孔,以印刷手段在电路板基板的穿孔中填充导电胶,再予以加热烘干,使导电胶固化为连接上下铜箔层的导体,导电胶是选用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中;4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. The conductor of the layer, the conductive adhesive is selected from conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole;
5)线路图成型:将氧化铝、二氧化钛、二氧化硅混合陶瓷粉料和聚四氟乙烯粉末混合后成型烧结形成坯料,再将坯料车削为薄膜;接着按照电路设计所需在上一步制得的薄膜上钻孔;最后采用先离子注入再电镀的方法,在上述步骤制得的薄膜双表面层注入铜离子,同时孔内表面层注入铜离子,再利用电镀方式在薄膜双表面层有铜离子的地方沉积铜形成线路图,同时通孔内表面层沉积金属铜,制得线路图;车削后形成的薄膜的厚度为0.01-0.075mm;陶瓷粉料为二氧化硅、氧化铝、二氧化钛三者的混合物,其中氧化铝质量为混合物总质量的30-40%、二氧化钛质量为混合物总质量的10-60%、余量为二氧化硅;陶瓷粉料的总质量占陶瓷粉料和聚四氟乙烯粉料总质量的30%-40%;5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. The copper is formed in the place where the ions are deposited, and the copper is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after turning is 0.01-0.075 mm; the ceramic powder is silica, alumina, and titania Mixture, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for the ceramic powder and the poly 4 30%-40% of the total mass of vinyl fluoride powder;
6)绝缘层成型:在形成的线路图的两侧上依次叠放半固化片和离型膜,其中离型膜的厚度为200至500微米,随后进行层压处理以形成绝缘层;6) Insulation layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination process to form an insulating layer;
7)边缘修整:再次采用电路板打磨机对电路板进行打磨;7) Edge trimming: the board is polished again with a circuit board sander;
8)电路板检测:将待测电路板的待测电路相关引脚与红外热点探测系统接通;接着采用红外加热装置对电路板的待测区域进行加热,并通过红外热点探测探头对电路板的热图像进行采集,并将热图像通过成像系统显示出来;最后成像系统同时显示出标准电路的热图像,操作人员将标准电路的热图像与待测电路的热图像进行对比,判断电路连接情况;8) Circuit board detection: connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board. The thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;
9)入库存储:对检测合格的电路板进行入库存储,对检测不合格的产品进行废品处理。9) In-stock storage: Inspect the qualified circuit board for inventory storage, and dispose of the products that fail to pass the inspection.
根据上述技术方案,步骤5)薄膜成型压力100-160kg/cm2、烧结时温度380-400℃和烧结时间50-60h;采用车削、离子注入、电镀的方式制得2.2≤Dk<6.5的高频FPC。According to the above technical solution, step 5) film forming pressure 100-160kg/cm 2 , sintering temperature 380-400 ° C and sintering time 50-60h; using turning, ion implantation, electroplating to obtain a high 2.2 ≤ Dk < 6.5 Frequency FPC.
根据上述技术方案,步骤8)对电路板的热图像进行采集是指:根据热加载电路分布区域与相应于所选区域外周边缘的可见光图像结合的形成各个像素点的亮度值和饱和度值不同,生成视场区域的彩色图像;亮度值分别根据视场重合区域的各个像素点在可见光图像中对应像素点的亮度,确定视场重合区域的各个像素点的亮度值;红外热点探测探头的探测空间分辨率为2-3μm,温度分辨率为0.05-0.15℃;红外热点探测探头的探测空间分辨率为2.7μm,温度分辨率为0.1°;饱和度值分别根据视场重合区域的各个像素点在热成像图像
中的对应像素点的温度量化值和/或在可见光图像中对应像素点的饱和度,确定视场重合区域的各个像素点的饱和度值。According to the above technical solution, the step 8) collecting the thermal image of the circuit board means: forming different brightness values and saturation values of the respective pixel points according to the heat loading circuit distribution area and the visible light image corresponding to the peripheral edge of the selected area. Generating a color image of the field of view; the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining the brightness value of each pixel of the field of view coincidence region; the detection of the infrared hot spot detection probe The spatial resolution is 2-3μm, the temperature resolution is 0.05-0.15°C; the infrared hotspot detection probe has a detection spatial resolution of 2.7μm and a temperature resolution of 0.1°; the saturation values are respectively according to the pixels of the field of view coincidence area. Thermal imaging image
The temperature quantization value of the corresponding pixel in the corresponding pixel and/or the saturation of the corresponding pixel in the visible light image determines the saturation value of each pixel of the field of view coincidence region.
根据上述技术方案,步骤2)热压机的热压温度为100-150℃,热压机的热压压力为300-500MPa,热压机的热压时间为2-5h。According to the above technical solution, the hot pressing temperature of the hot press is 100-150 ° C, the hot pressing pressure of the hot press is 300-500 MPa, and the hot pressing time of the hot press is 2-5 h.
根据上述技术方案,步骤6)层压处理具体为在20℃-28℃的温度范围内、50%-60%的湿度范围内、至少10000级的洁净度要求下进行层压处理;叠放的半固化片的厚度比绝缘层的设定厚度大60%至80%。According to the above technical solution, the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades; The thickness of the prepreg is 60% to 80% greater than the set thickness of the insulating layer.
根据上述技术方案,步骤4)导电胶采用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中,导电胶的烘干温度为60-80℃。According to the above technical solution, the conductive adhesive of the step 4) is made of conductive copper glue and filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C.
根据上述技术方案,步骤3)电路板打磨机的转速为310-450r/min。According to the above technical solution, the rotation speed of the circuit board sander of step 3) is 310-450 r/min.
工作原理:现有技术中每张芯板连接时都需要采用PIN定位孔进行定位,使用起来极为麻烦,操作极为不便,严重影响工作效率,本发明,无需PIN定位孔进行定位,简化了工作流程,有效提升了使用的方便性,提升了电路板成型的效率,有效提升了使用的方便性;电路板检测工序的设置,可以对成型后的电路板进行检测,有效保证了产品的质量,有效提升了使用的方便性。Working principle: In the prior art, each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. The present invention eliminates the need for a PIN positioning hole for positioning, and simplifies the workflow. It effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board inspection process can detect the formed circuit board, effectively ensuring the quality of the product and effectively Increased ease of use.
最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
It should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, although the present invention has been described in detail with reference to the foregoing embodiments, Modifications may be made to the technical solutions described in the foregoing embodiments, or some of the technical features may be equivalently replaced. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.
Claims (7)
- 无PIN定位加工方法,其特征在于:包括如下步骤:The PIN-free positioning processing method is characterized in that it comprises the following steps:1)材料准备:提供多个电路板芯板、多个绝缘层和多个铜箔层,备用;1) Material preparation: provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;2)热压铜箔层:将两层铜箔层分别摆放在电路板芯板的顶部和底部,通过热压机压合在一起,形成电路板基板;2) hot-pressed copper foil layer: two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;3)基板修整:采用电路板切割机和电路板打磨机对电路板基板进行修整,使其形成固定大小的电路板基板,待用;3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutting machine and a circuit board sanding machine to form a fixed-size circuit board substrate, which is ready for use;4)穿孔连接:采用电路板打孔机在电路板基板的预定位置形成穿孔,以印刷手段在电路板基板的穿孔中填充导电胶,再予以加热烘干,使导电胶固化为连接上下铜箔层的导体,所述导电胶是选用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中;4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. a conductor of the layer, the conductive paste is selected from a conductive copper paste, and is filled in a perforation of the circuit board substrate through a printing template having a glue injection hole;5)线路图成型:将氧化铝、二氧化钛、二氧化硅混合陶瓷粉料和聚四氟乙烯粉末混合后成型烧结形成坯料,再将坯料车削为薄膜;接着按照电路设计所需在上一步制得的薄膜上钻孔;最后采用先离子注入再电镀的方法,在上述步骤制得的薄膜双表面层注入铜离子,同时孔内表面层注入铜离子,再利用电镀方式在薄膜双表面层有铜离子的地方沉积铜形成线路图,同时通孔内表面层沉积金属铜,制得线路图;所述车削后形成的薄膜的厚度为0.01-0.075mm;所述陶瓷粉料为二氧化硅、氧化铝、二氧化钛三者的混合物,其中氧化铝质量为混合物总质量的30-40%、二氧化钛质量为混合物总质量的10-60%、余量为二氧化硅;所述陶瓷粉料的总质量占陶瓷粉料和聚四氟乙烯粉料总质量的30%-40%;5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. a copper is formed in the place where the ions are deposited, and a metal layer is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after the turning is 0.01-0.075 mm; the ceramic powder is silica, oxidized a mixture of aluminum and titanium dioxide, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for 30%-40% of the total mass of ceramic powder and PTFE powder;6)绝缘层成型:在所述形成的线路图的两侧上依次叠放半固化片和离型膜,其中所述离型膜的厚度为200至500微米,随后进行层压处理以形成绝缘层;6) insulating layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination treatment to form an insulating layer;7)边缘修整:再次采用电路板打磨机对电路板进行打磨;7) Edge trimming: the board is polished again with a circuit board sander;8)电路板检测:将待测电路板的待测电路相关引脚与红外热点探测系统接通;接着采用红外加热装置对电路板的待测区域进行加热,并通过红外热点探测探头对电路板的热图像进行采集,并将热图像通过成像系统显示出来;最后成像系统同时显示出标准电路的热图像,操作人员将标准电路的热图像与待测电路的热图像进行对比,判断电路连接情况;8) Circuit board detection: connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board. The thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;9)入库存储:对检测合格的电路板进行入库存储,对检测不合格的产品进行废品处 理。9) Inventory storage: Inspect the qualified circuit board for inventory storage, and carry out waste inspection for unqualified products. Reason.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤5)薄膜成型压力100-160kg/cm2、烧结时温度380-400℃和烧结时间50-60h;所述采用车削、离子注入、电镀的方式制得2.2≤Dk<6.5的高频FPC。The PIN-free positioning processing method according to claim 1, wherein the step 5) the film forming pressure is 100-160 kg/cm 2 , the sintering temperature is 380-400 ° C, and the sintering time is 50-60 h; High-frequency FPC with 2.2 ≤ Dk < 6.5 was obtained by ion implantation or electroplating.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤8)对电路板的热图像进行采集是指:根据热加载电路分布区域与相应于所选区域外周边缘的可见光图像结合的形成各个像素点的亮度值和饱和度值不同,生成视场区域的彩色图像;所述亮度值分别根据所述视场重合区域的各个像素点在所述可见光图像中对应像素点的亮度,确定所述视场重合区域的各个像素点的亮度值;所述红外热点探测探头的探测空间分辨率为2-3μm,温度分辨率为0.05-0.15℃;所述红外热点探测探头的探测空间分辨率为2.7μm,温度分辨率为0.1°;所述饱和度值分别根据所述视场重合区域的各个像素点在所述热成像图像中的对应像素点的温度量化值和/或在所述可见光图像中对应像素点的饱和度,确定所述视场重合区域的各个像素点的饱和度值。The PIN-free positioning processing method according to claim 1, wherein the step 8) collecting the thermal image of the circuit board means: displaying the visible light image according to the thermal loading circuit distribution area and the peripheral edge corresponding to the selected area. Combining different brightness values and saturation values forming respective pixel points, generating a color image of the field of view region; wherein the brightness values are respectively according to brightness of corresponding pixel points in the visible light image of respective pixel points of the field of view overlapping region Determining a brightness value of each pixel of the field of view coincidence region; the spatial resolution of the infrared hotspot detection probe is 2-3 μm, and the temperature resolution is 0.05-0.15 ° C; the detection space of the infrared hot spot detection probe a resolution of 2.7 μm and a temperature resolution of 0.1°; the saturation values are respectively based on temperature Quantization Values of corresponding pixel points in the thermographic image of respective pixels of the field of view coincidence region and/or The saturation of the corresponding pixel in the visible light image is determined, and the saturation value of each pixel of the field of view coincidence region is determined.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤2)热压机的热压温度为100-150℃,所述热压机的热压压力为300-500MPa,所述热压机的热压时间为2-5h。The PIN-free positioning processing method according to claim 1, wherein the step 2) the hot pressing temperature of the hot press is 100-150 ° C, and the hot pressing pressure of the hot press is 300-500 MPa. The hot pressing time of the hot press is 2-5h.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤6)层压处理具体为在20℃-28℃的温度范围内、50%-60%的湿度范围内、至少10000级的洁净度要求下进行层压处理;所述叠放的半固化片的厚度比绝缘层的设定厚度大60%至80%。The PIN-free positioning processing method according to claim 1, wherein the step 6) laminating treatment is specifically in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, at least 10,000. The lamination treatment is carried out under the cleanliness requirements of the grade; the thickness of the stacked prepreg is 60% to 80% greater than the set thickness of the insulating layer.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤4)导电胶采用导电性铜胶,并通过具有注胶孔的印刷范本填充于电路板基材的穿孔中,所述导电胶的烘干温度为60-80℃。The PIN-free positioning processing method according to claim 1, wherein the step 4) the conductive adhesive is made of a conductive copper paste, and is filled in a perforation of the circuit board substrate by a printing template having a glue injection hole. The drying temperature of the conductive paste is 60-80 ° C.
- 根据权利要求1所述的无PIN定位加工方法,其特征在于:所述步骤3)电路板打磨机的转速为310-450r/min。 The PIN-free positioning processing method according to claim 1, wherein the step 3) the speed of the circuit board sander is 310-450 r/min.
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CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
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CN106872848A (en) * | 2017-02-17 | 2017-06-20 | 安徽国家铜铅锌及制品质量监督检验中心 | A kind of printed circuit board (PCB) thermal imaging testing method and device |
CN107172819A (en) * | 2017-06-22 | 2017-09-15 | 庐江县典扬电子材料有限公司 | The method that high frequency flexible print circuit board is made using ion implanting and plating mode |
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CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
CN102791086A (en) * | 2012-08-13 | 2012-11-21 | 广东生益科技股份有限公司 | Manufacturing method of rigid-flexible combined circuit board |
CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
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