WO2019090858A1

WO2019090858A1 - Pin-free positioning processing method

Info

Publication number: WO2019090858A1
Application number: PCT/CN2017/112924
Authority: WO
Inventors: 邹奎; 饶西含
Original assignee: 建业科技电子（惠州）有限公司
Priority date: 2017-11-09
Filing date: 2017-11-24
Publication date: 2019-05-16
Also published as: CN107864575A

Abstract

Provided is a PIN-free positioning processing method. The PIN-free positioning processing method comprises the following steps: material preparation, copper foil layer hot-pressing, substrate trimming, threading hole connection, circuit pattern formation, insulation layer formation, edge trimming, circuit board detection and storage. In the step 5), the thin film formation pressure is (100-160) kg/cm², a temperature during sintering is 380-400℃, thermal image acquisition of a circuit board in the step 8) means that a color image of a field of view region is generated according to different brightness values and saturation values of pixel points formed by combination of visual light images at a heat loading circuit distribution region and peripheral edges of a corresponding selected region, and the brightness values are used for determining a brightness value of each pixel point of a field of view overlapped region according to brightness of each pixel point of the field of view overlapped region at the corresponding pixel point in a visual light image. The PIN-free positioning processing method is simple in structure, and a PIN positioning buckle is not needed to fix, so that the processing technology flow is effectively simplified, the convenience of usage is improved, and the processing efficiency of the circuit board is improved.

Description

No PIN positioning processing method

Technical field

The invention relates to the technical field of circuit board manufacturing, in particular to a PIN-free positioning processing method.

Background technique

With the development of technology, people's performance requirements for circuit boards are getting higher and higher, and the application of multi-layer circuit boards is increasing. The multi-layer circuit board is formed by pressing a plurality of core plates, which are small-sized production boards cut from large-sized copper-clad board raw materials, and the inner layer patterns of the PCB boards are prepared. The traditional multi-layer circuit board is processed by pressing a plurality of core plates into two sub-boards, and the laminated sub-boards are drilled through the milling and drilling target to drill three basic positioning holes, which are adopted according to three basic positioning holes. The drilling machine drills a plurality of pin positioning holes and function holes in the board at the edge of the board, and respectively performs two processes of sinking copper, thickening, mechanical degumming and the like on the two sub-boards, and positioning the two sub-boards through the pin positioning holes. Lamination. The existing positioning method in the processing process has the following disadvantages: after the core plate is pressed into the sub-board, it has to undergo more than ten processes such as sinking copper, thickening, mechanical degumming, etc., and there are many heating and cooling operations, and different plates will be Different shrinkage will result in a certain error in the positioning and pressing of the daughterboard; the pin positioning holes processed on the corresponding daughterboard will also undergo non-metallized holes to become metallized holes, and finally change from metallized holes. The process of returning to the non-metallized hole, the erosion of the hole wall by the multiple syrups is likely to cause damage to the hole wall, thereby affecting the accuracy of the pin positioning hole.

When the existing core board is connected, the PIN positioning hole is required for positioning, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. Therefore, it is necessary to design a PIN-free positioning processing method.

Summary of the invention

It is an object of the present invention to provide a PINless positioning processing method to solve the problems set forth in the above background art.

In order to solve the above technical problem, the present invention provides the following technical solution: a PIN-free positioning processing method, comprising the following steps:

1) Material preparation: provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;

2) hot-pressed copper foil layer: two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;

3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutting machine and a circuit board sanding machine to form a fixed-size circuit board substrate, which is ready for use;

4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. a conductor of the layer, the conductive paste is selected from a conductive copper paste, and is filled in a perforation of the circuit board substrate through a printing template having a glue injection hole;

5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. a copper is formed in the place where the ions are deposited, and a metal layer is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after the turning is 0.01-0.075 mm; the ceramic powder is silica, oxidized a mixture of aluminum and titanium dioxide, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for 30%-40% of the total mass of ceramic powder and PTFE powder;

6) insulating layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination treatment to form an insulating layer;

7) Edge trimming: the board is polished again with a circuit board sander;

8) Circuit board detection: connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board. The thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;

9) In-stock storage: Inspect the qualified circuit board for inventory storage, and dispose of the products that fail to pass the inspection.

According to the above technical solution, the step 5) the film forming pressure is 100-160 kg/cm ² , the sintering temperature is 380-400 ° C, and the sintering time is 50-60 h; the turning, ion implantation, electroplating is used to obtain 2.2 ≤ High frequency FPC with Dk < 6.5.

According to the above technical solution, the step 8) collecting the thermal image of the circuit board means: forming the brightness value and the saturation of each pixel point according to the heat loading circuit distribution area combined with the visible light image corresponding to the peripheral edge of the selected area. Different values, generating a color image of the field of view; the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining each pixel of the field of view overlap region The brightness value of the infrared hotspot detection probe is 2-3 μm and the temperature resolution is 0.05-0.15 ° C; the infrared hot spot detection probe has a detection spatial resolution of 2.7 μm and a temperature resolution of 0.1°. The saturation value is determined according to a temperature quantization value of a corresponding pixel point of the respective pixel points of the field of view overlapping region in the thermographic image and/or a saturation degree of a corresponding pixel point in the visible light image, respectively. The saturation value of each pixel point of the field of view coincidence region.

According to the above technical solution, the step 2) the hot pressing temperature of the hot press is 100-150 ° C, the hot pressing pressure of the hot press is 300-500 MPa, and the hot pressing time of the hot press is 2-5 h. .

According to the above technical solution, the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades; The thickness of the stacked prepreg is 60% to 80% greater than the set thickness of the insulating layer.

According to the above technical solution, the step 4) the conductive adhesive is made of conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C. .

According to the above technical solution, the step 3) the speed of the circuit board sander is 310-450 r/min.

Compared with the prior art, the invention achieves the beneficial effects that in the prior art, each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. The invention eliminates the need of PIN positioning holes for positioning, simplifies the work flow, effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board detecting process can be performed after molding The board is tested to ensure the quality of the product and effectively improve the convenience of use.

DRAWINGS

The drawings are intended to provide a further understanding of the invention, and are intended to be a In the drawing:

Figure 1 is a flow chart of the processing method of the present invention;

Detailed ways

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Referring to FIG. 1 , the present invention provides a technical solution: a PIN-free positioning processing method, including the following steps:

3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutter and a circuit board sander to form a solid a fixed-size circuit board substrate, ready for use;

4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. The conductor of the layer, the conductive adhesive is selected from conductive copper glue, and is filled in the perforation of the circuit board substrate through a printing template having a glue injection hole;

5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. The copper is formed in the place where the ions are deposited, and the copper is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after turning is 0.01-0.075 mm; the ceramic powder is silica, alumina, and titania Mixture, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for the ceramic powder and the poly 4 30%-40% of the total mass of vinyl fluoride powder;

6) Insulation layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination process to form an insulating layer;

7) Edge trimming: the board is polished again with a circuit board sander;

According to the above technical solution, step 5) film forming pressure 100-160kg/cm ² , sintering temperature 380-400 ° C and sintering time 50-60h; using turning, ion implantation, electroplating to obtain a high 2.2 ≤ Dk < 6.5 Frequency FPC.

According to the above technical solution, the step 8) collecting the thermal image of the circuit board means: forming different brightness values and saturation values of the respective pixel points according to the heat loading circuit distribution area and the visible light image corresponding to the peripheral edge of the selected area. Generating a color image of the field of view; the brightness value is determined according to the brightness of the corresponding pixel in the visible light image of each pixel of the field of view overlap region, and determining the brightness value of each pixel of the field of view coincidence region; the detection of the infrared hot spot detection probe The spatial resolution is 2-3μm, the temperature resolution is 0.05-0.15°C; the infrared hotspot detection probe has a detection spatial resolution of 2.7μm and a temperature resolution of 0.1°; the saturation values are respectively according to the pixels of the field of view coincidence area. Thermal imaging image The temperature quantization value of the corresponding pixel in the corresponding pixel and/or the saturation of the corresponding pixel in the visible light image determines the saturation value of each pixel of the field of view coincidence region.

According to the above technical solution, the hot pressing temperature of the hot press is 100-150 ° C, the hot pressing pressure of the hot press is 300-500 MPa, and the hot pressing time of the hot press is 2-5 h.

According to the above technical solution, the step 6) lamination treatment is specifically carried out in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, and a cleanliness requirement of at least 10,000 grades; The thickness of the prepreg is 60% to 80% greater than the set thickness of the insulating layer.

According to the above technical solution, the conductive adhesive of the step 4) is made of conductive copper glue and filled in the perforation of the circuit board substrate through a printing template having a glue injection hole, and the drying temperature of the conductive adhesive is 60-80 ° C.

According to the above technical solution, the rotation speed of the circuit board sander of step 3) is 310-450 r/min.

Working principle: In the prior art, each PIN board needs to be positioned by using a PIN positioning hole, which is extremely troublesome to use, extremely inconvenient to operate, and seriously affects work efficiency. The present invention eliminates the need for a PIN positioning hole for positioning, and simplifies the workflow. It effectively improves the convenience of use, improves the efficiency of circuit board forming, and effectively improves the convenience of use; the setting of the circuit board inspection process can detect the formed circuit board, effectively ensuring the quality of the product and effectively Increased ease of use.

It should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, although the present invention has been described in detail with reference to the foregoing embodiments, Modifications may be made to the technical solutions described in the foregoing embodiments, or some of the technical features may be equivalently replaced. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

The PIN-free positioning processing method is characterized in that it comprises the following steps:

1) Material preparation: provide multiple circuit board core boards, multiple insulation layers and multiple copper foil layers for use;

2) hot-pressed copper foil layer: two layers of copper foil are respectively placed on the top and bottom of the core board of the circuit board, and pressed together by a hot press to form a circuit board substrate;

3) Substrate trimming: The circuit board substrate is trimmed by a circuit board cutting machine and a circuit board sanding machine to form a fixed-size circuit board substrate, which is ready for use;

4) Perforation connection: a perforation is formed at a predetermined position of the circuit board substrate by using a circuit board punching machine, and the conductive adhesive is filled in the perforation of the circuit board substrate by printing means, and then heated and dried to solidify the conductive adhesive to connect the upper and lower copper foils. a conductor of the layer, the conductive paste is selected from a conductive copper paste, and is filled in a perforation of the circuit board substrate through a printing template having a glue injection hole;

5) Circuit diagram molding: mixing alumina, titanium dioxide, silica mixed ceramic powder and polytetrafluoroethylene powder, forming and forming a blank, and then turning the blank into a film; then, according to the circuit design, it is prepared in the previous step. Drilling the film; finally, using the method of ion implantation and electroplating, injecting copper ions into the double surface layer of the film prepared in the above step, and injecting copper ions into the inner surface layer of the hole, and then using copper plating to form copper on the double surface layer of the film. a copper is formed in the place where the ions are deposited, and a metal layer is deposited on the inner surface layer of the through hole to obtain a circuit diagram; the thickness of the film formed after the turning is 0.01-0.075 mm; the ceramic powder is silica, oxidized a mixture of aluminum and titanium dioxide, wherein the mass of alumina is 30-40% of the total mass of the mixture, the mass of titanium dioxide is 10-60% of the total mass of the mixture, and the balance is silica; the total mass of the ceramic powder accounts for 30%-40% of the total mass of ceramic powder and PTFE powder;

6) insulating layer molding: a prepreg and a release film are sequentially stacked on both sides of the formed wiring pattern, wherein the release film has a thickness of 200 to 500 μm, and then subjected to a lamination treatment to form an insulating layer;

7) Edge trimming: the board is polished again with a circuit board sander;

8) Circuit board detection: connect the relevant circuit of the circuit under test to the infrared hot spot detection system; then use infrared heating device to heat the area to be tested of the circuit board, and pass the infrared hot spot detection probe to the circuit board. The thermal image is collected and the thermal image is displayed through the imaging system; finally, the imaging system simultaneously displays the thermal image of the standard circuit, and the operator compares the thermal image of the standard circuit with the thermal image of the circuit to be tested to determine the connection of the circuit. ;

9) Inventory storage: Inspect the qualified circuit board for inventory storage, and carry out waste inspection for unqualified products. Reason.
The PIN-free positioning processing method according to claim 1, wherein the step 5) the film forming pressure is 100-160 kg/cm 2 , the sintering temperature is 380-400 ° C, and the sintering time is 50-60 h; High-frequency FPC with 2.2 ≤ Dk < 6.5 was obtained by ion implantation or electroplating.
The PIN-free positioning processing method according to claim 1, wherein the step 8) collecting the thermal image of the circuit board means: displaying the visible light image according to the thermal loading circuit distribution area and the peripheral edge corresponding to the selected area. Combining different brightness values and saturation values forming respective pixel points, generating a color image of the field of view region; wherein the brightness values are respectively according to brightness of corresponding pixel points in the visible light image of respective pixel points of the field of view overlapping region Determining a brightness value of each pixel of the field of view coincidence region; the spatial resolution of the infrared hotspot detection probe is 2-3 μm, and the temperature resolution is 0.05-0.15 ° C; the detection space of the infrared hot spot detection probe a resolution of 2.7 μm and a temperature resolution of 0.1°; the saturation values are respectively based on temperature Quantization Values of corresponding pixel points in the thermographic image of respective pixels of the field of view coincidence region and/or The saturation of the corresponding pixel in the visible light image is determined, and the saturation value of each pixel of the field of view coincidence region is determined.
The PIN-free positioning processing method according to claim 1, wherein the step 2) the hot pressing temperature of the hot press is 100-150 ° C, and the hot pressing pressure of the hot press is 300-500 MPa. The hot pressing time of the hot press is 2-5h.
The PIN-free positioning processing method according to claim 1, wherein the step 6) laminating treatment is specifically in a temperature range of 20 ° C to 28 ° C, a humidity range of 50% - 60%, at least 10,000. The lamination treatment is carried out under the cleanliness requirements of the grade; the thickness of the stacked prepreg is 60% to 80% greater than the set thickness of the insulating layer.
The PIN-free positioning processing method according to claim 1, wherein the step 4) the conductive adhesive is made of a conductive copper paste, and is filled in a perforation of the circuit board substrate by a printing template having a glue injection hole. The drying temperature of the conductive paste is 60-80 ° C.
The PIN-free positioning processing method according to claim 1, wherein the step 3) the speed of the circuit board sander is 310-450 r/min.