CN104582328B - The pcb board production technology of anti-row's plate mistake - Google Patents
The pcb board production technology of anti-row's plate mistake Download PDFInfo
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- CN104582328B CN104582328B CN201410811273.4A CN201410811273A CN104582328B CN 104582328 B CN104582328 B CN 104582328B CN 201410811273 A CN201410811273 A CN 201410811273A CN 104582328 B CN104582328 B CN 104582328B
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- internal layer
- layer pcb
- pcb substrate
- copper
- lamination
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Abstract
A kind of pcb board production technology of anti-row's plate mistake, when losing Copper treatment, etch circuitous pattern and two-dimension code pattern simultaneously in layers of copper, the two-dimension code pattern contains the sequencing information difference that the two-dimension code pattern in the sequencing information of the lamination of the internal layer PCB substrate, different internal layer PCB substrates is represented；During lamination, according to the lamination order being pre-designed by each internal layer PCB substrate it is scanned after, multilayer laminate is carried out from the bottom up, passes through the two-dimension code pattern that one scan module irradiates each internal layer PCB substrate during scanning；Single pass is often completed, with regard to carrying out a lamination；By the information for reading two-dimension code pattern, judge that internal layer PCB substrate whether there is lamination mistake, can effectively the row's of solution plate error problem, quality of lot is avoided to scrap, whole production system automatization level is high, and practical, administrative staff can clearly inquire about the true efficiency of each employee and each equipment, the production automation is realized, work is done with no paper.
Description
Technical field
The present invention relates to a kind of pcb board production technology, more particularly to a kind of pcb board production technology of anti-row's plate mistake.
Background technology
With current electronic product continue and Rapid miniaturization, lighting, multifunction trend, highdensity installation skill
Higher requirement is increasingly proposed for the carrier as original paper and connector printed circuit board (PCB) in the development of art, industry, with
Just it can turn into can increase substantially the field of electronic components of packing density with high density, high accuracy, high reliability.
Pcb board mainly includes on the PP layers being distributed on not homogeneous and the layers of copper being fitted on different PP layers, different layers
Layers of copper is provided with circuitous pattern, it is necessary to be laminated according to row's plate order during design during pressing, when row's plate order is incorrect
When, the pcb board of mistake row's plate order still can flow directly into next process normal through electric-examination, form batch and scrap.
However, existing printed wiring board does not have preferable solution in terms of prevention row's plate error, therefore, row's plate is suitable
Sequence prevents error mainly by the initiative of operator, enthusiasm, therefore, can not tackle the problem at its root, once row's plate
Error fails discovery in time, just occurs that batch is scrapped, causes enterprises' loss, reduces the performance of enterprises, in addition, row's plate error
Client will certainly be caused seriously to complain again if pcb board flows into client, heavy losses not only be caused to company, and easily lose
Order and client's confidence are gone, is unfavorable for company's sustainable development.
The content of the invention
Therefore, it is an object of the invention to provide a kind of pcb board production technology for automating high anti-row's plate mistake.
A kind of pcb board production technology of anti-row's plate mistake, comprises the following steps：
Step (1)：Internal layer PCB substrate makes, and each internal layer PCB substrate includes flexible layers and is pressed on two above and below flexible layers
The layers of copper of side；
Step (2)：Blind hole and through hole are made in internal layer PCB substrate；
Step (3)：The heavy copper of plating, forms the layers of copper of two sides above and below copper facing, connection flexible layers on the hole wall of through hole；
Step (4)：Lose Copper treatment；Film pattern is pressed dry in layers of copper, and is etched by internal layer by the copper beyond dry film figure
Layer is etched away, so as to etch circuitous pattern and two-dimension code pattern simultaneously in layers of copper, it is interior that the two-dimension code pattern contains this
The sequencing information that two-dimension code pattern in the sequencing information of the lamination of layer PCB substrate, different internal layer PCB substrates is represented is different；
Step (5)：Lamination, according to be pre-designed lamination order by each internal layer PCB substrate it is scanned after, from the bottom up
Multilayer laminate is carried out, during scanning, the two-dimension code pattern of each internal layer PCB substrate is irradiated by one scan module；Often complete once
Scanning, with regard to carrying out placing a dielectric layer between a lamination, adjacent two internal layers PCB substrate, so as to pass through internal layer PCB substrate two dimension
Code information is monitored to lamination order；
Step (6)：Lamination, the dielectric layer by the internal layer PCB substrate folded and between adjacent inner layer PCB substrate is carried out
Pressing.
Further, the scanning module includes data collecting system, is manually entered system, bar code acquisition system and alarm
System, the bar code acquisition system is provided with a barcode reader and terminal handler, and the barcode reader reads internal layer PCB bases
The information of Quick Response Code and the 2 D code information collected is fed back into data collecting system on plate, often completed after once gathering, eventually
Processor is held to stop on-site data gathering, the data collecting system is logged in for employee to be judged with data comparison, data acquisition
System is completed after judging, issues instructions to warning system, when lamination order is correct, green light flicker；When lamination sequence error,
Red light dodges gravel, and sends corresponding auditory tone cues, while sending instruction to bar code acquisition system, stops on-site data gathering；Institute
Stating the system of being manually entered is used for the 2 D code information being manually entered in internal layer PCB substrate to data collecting system, when bar code collection
, can be manually defeated by manual mode when the barcode reader of system can not read the 2 D code information in internal layer PCB substrate
Enter；Before being manually entered, it is manually entered system and first sends instruction to bar code acquisition system, stop on-site data gathering.
Further, the position of the two-dimension code pattern of each internal layer PCB substrate and the two dimension of other internal layer PCB substrates
The position of code figure is identical.
Further, each layers of copper is distributed on four edges of boards of layers of copper, is distributed in provided with four two-dimension code patterns
Two-dimension code pattern on four edges of boards is in asymmetric design.
The beneficial effect of the pcb board production technology of the anti-row's plate mistake of the present invention is：Erosion copper is being carried out in internal layer PCB substrate
While processing makes circuitous pattern, etched simultaneously in the layers of copper of internal layer PCB substrate and make two-dimension code pattern, substrate pressing
Before, internal layer PCB substrate from inside to outside is put under scanning module one by one according to lamination order and is scanned, scanning module scanning
Two-dimension code pattern in each internal layer PCB substrate, reads the information of two-dimension code pattern, judges internal layer PCB substrate with the presence or absence of folded
Plate mistake, can the effective row's of solution plate error problem, it is to avoid quality of lot is scrapped, and whole production system automatization level is high, real
Strong with property, administrative staff can clearly inquire about the true efficiency of each employee and each equipment, realize the production automation, do
Work is with no paper.
Brief description of the drawings
Fig. 1 is the fundamental diagram of scanning module.
Embodiment
In order that technical scheme can more clearly show, further is made to the present invention below in conjunction with the accompanying drawings
Explanation.
As shown in figure 1, the present invention provides a kind of pcb board production technology of anti-row's plate mistake, for producing pcb board, the PCB
Plate is multi-layer sheet, is made up of some layers of copper and some dielectric layers, each dielectric layer is located between two layers of copper, the anti-pcb board
Row's plate mistake technique comprises the following steps：
Step (1)：Internal layer PCB substrate makes, and each internal layer PCB substrate includes flexible layers and is pressed on two above and below flexible layers
The layers of copper of side；
Step (2)：In internal layer PCB substrate by the way of machine drilling drilling blind hole and through hole；
Step (3)：The heavy copper of plating, forms the layers of copper of two sides above and below copper facing, connection flexible layers on the hole wall of through hole, makes
Electrically conducted between the layers of copper of different layers；
Step (4)：Lose Copper treatment；Film pattern is pressed dry in layers of copper, and is etched by internal layer by the copper beyond dry film figure
Layer is etched away, so as to etch circuitous pattern and two-dimension code pattern simultaneously in layers of copper, it is interior that the two-dimension code pattern contains this
The sequencing information that two-dimension code pattern in the sequencing information of the lamination of layer PCB substrate, different internal layer PCB substrates is represented is different, and two
Dimension code figure is not limited by design factors such as PCB line widths, spacing, copper thickness, it is ensured that in follow-up scanning book, can successfully be read
Get two-dimensional code graphical information；
It is preferred that each layers of copper is distributed on four edges of boards of layers of copper provided with four two-dimension code patterns, in addition, point
Two-dimension code pattern of the cloth on four edges of boards is in asymmetric design, when reversely row's plate, just can not obtain 2 D code information and cause nothing
Data inputting, reaches fool proof effect, prevents internal layer PCB substrate oppositely positioned in another layer of internal layer PCB substrate,
Step (5)：Lamination, after according to the lamination order being pre-designed, the scanned module of each internal layer PCB substrate is scanned,
Multilayer laminate is carried out from the bottom up, irradiates the two-dimension code pattern of each internal layer PCB substrate during scanning by one scan module；Per complete
Into single pass, with regard to carrying out placing a dielectric layer between a lamination, two internal layer PCB substrates, scanning system passes through internal layer PCB bases
Plate 2 D code information is monitored to lamination order, the row's of preventing plate sequence error.
Step (6)：Lamination, the dielectric layer by the internal layer PCB substrate folded and between adjacent inner layer PCB substrate is carried out
Pressing.
The scanning module includes data collecting system 10, is manually entered system 40, bar code acquisition system 20 and alarm system
System 30, the bar code acquisition system 20 is provided with a barcode reader and terminal handler, and the barcode reader reads internal layer PCB
The information of Quick Response Code and the 2 D code information collected is fed back into data collecting system 10 on substrate, often complete once to gather
Afterwards, terminal handler stops in on-site data gathering, the present embodiment, and the barcode reader uses COGNEX DataMan302
Bar code reading taking equipment, should and the blue industrial vision light sources of LED realize barcode data typing, the branch for supporting barcode reader
Frame selects DataMan300 supports, 360 degree of rotations can be achieved, to adapt to diverse location and working environment
The data collecting system 10 is logged in for employee to be judged with data comparison, and data collecting system 10 completes to judge
Afterwards, warning system 30 is issued instructions to, when lamination order is correct, green light flicker；When lamination sequence error, red light dodges gravel,
And corresponding auditory tone cues is sent, while sending instruction to bar code acquisition system 20, stop on-site data gathering.The manual record
Entering system 40 is used for the 2 D code information being manually entered in internal layer PCB substrate to data collecting system 10, when bar code acquisition system
When 20 barcode reader can not read the 2 D code information in internal layer PCB substrate, it can be manually entered by manual mode.
Before being manually entered, it is manually entered system 40 and first sends instruction to bar code acquisition system 20, stop on-site data gathering.
The beneficial effect of the pcb board production technology of the anti-row's plate mistake of the present invention is：Erosion copper is being carried out in internal layer PCB substrate
While processing makes circuitous pattern, two-dimension code pattern is made simultaneously in the layers of copper of internal layer PCB substrate, will before substrate pressing
Internal layer PCB substrate from inside to outside is put under scanning module and is scanned one by one according to lamination order, and scanning module scanning is each
Two-dimension code pattern in internal layer PCB substrate, reads the information of two-dimension code pattern, judges that internal layer PCB substrate is wrong with the presence or absence of lamination
By mistake, can the effective row of solution plate error problem, it is to avoid quality of lot is scrapped, whole production system automatization level height, practicality
By force, administrative staff can clearly inquire about the true efficiency of each employee and each equipment, realize the production automation, do work without
Paper.
Embodiment described above only expresses one embodiment of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (3)
1. a kind of pcb board production technology of anti-row's plate mistake, it is characterised in that comprise the following steps：
Step (1)：Internal layer PCB substrate makes, and each internal layer PCB substrate includes flexible layers and is pressed on two sides above and below flexible layers
Layers of copper；
Step (2)：Blind hole and through hole are made in internal layer PCB substrate；
Step (3)：The heavy copper of plating, forms the layers of copper of two sides above and below copper facing, connection flexible layers on the hole wall of through hole；
Step (4)：Lose Copper treatment；Film pattern is pressed dry in layers of copper, and is etched by internal layer by the layers of copper erosion beyond dry film figure
Quarter is fallen, so as to etch circuitous pattern and two-dimension code pattern simultaneously in layers of copper, the two-dimension code pattern contains internal layer PCB
The sequencing information that two-dimension code pattern in the sequencing information of the lamination of substrate, different internal layer PCB substrates is represented is different；
Step (5)：Lamination, according to be pre-designed lamination order by each internal layer PCB substrate it is scanned after, carry out from the bottom up
Multilayer laminate, during scanning, the two-dimension code pattern of each internal layer PCB substrate is irradiated by one scan module；Single pass is often completed,
With regard to carrying out placing a dielectric layer between a lamination, adjacent two internal layers PCB substrate, so as to be believed by internal layer PCB substrate Quick Response Code
Breath is monitored to lamination order；
Step (6)：Lamination, the internal layer PCB substrate folded and the dielectric layer between adjacent inner layer PCB substrate are pressed
Close；
The scanning module includes data collecting system, is manually entered system, bar code acquisition system and warning system, the bar code
Acquisition system is provided with a barcode reader and terminal handler, and the barcode reader reads Quick Response Code in internal layer PCB substrate
The 2 D code information collected is simultaneously fed back to data collecting system by information, is often completed after once gathering, and terminal handler stops
On-site data gathering, the data collecting system is logged in for employee to be judged with data comparison, and data collecting system completes to judge
Afterwards, warning system is issued instructions to, when lamination order is correct, green light flicker；When lamination sequence error, red light dodges gravel, and
Corresponding auditory tone cues is sent, while sending instruction to bar code acquisition system, stops on-site data gathering；Described be manually entered be
Unite for being manually entered the 2 D code information in internal layer PCB substrate to data collecting system, when the bar code of bar code acquisition system is read
When reading device can not read the 2 D code information in internal layer PCB substrate, it can be manually entered by manual mode；It is manually entered
Before, it is manually entered system and first sends instruction to bar code acquisition system, stops on-site data gathering.
2. the pcb board production technology of anti-row's plate mistake as claimed in claim 1, it is characterised in that：Each internal layer PCB bases
The position of the two-dimension code pattern of plate is identical with the position of the two-dimension code pattern of other internal layer PCB substrates.
3. the pcb board production technology of anti-row's plate mistake as claimed in claim 1, it is characterised in that：In each interior layers of copper
Provided with four two-dimension code patterns, it is distributed on four edges of boards of interior layers of copper, is distributed in the two-dimension code pattern on four edges of boards in asymmetric
Design.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410811273.4A CN104582328B (en) | 2014-12-22 | 2014-12-22 | The pcb board production technology of anti-row's plate mistake |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811273.4A CN104582328B (en) | 2014-12-22 | 2014-12-22 | The pcb board production technology of anti-row's plate mistake |
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| CN104582328A CN104582328A (en) | 2015-04-29 |
| CN104582328B true CN104582328B (en) | 2017-09-29 |
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| CN105228377B (en) * | 2015-08-28 | 2018-04-24 | 生益电子股份有限公司 | The sequence error-preventing method and device of a kind of multi-layer PCB lamination |
| CN105116864B (en) * | 2015-09-09 | 2018-02-06 | 佳运通电子科技（昆山）有限公司 | Press lamination fool proof system |
| CN105208803A (en) * | 2015-09-24 | 2015-12-30 | 高德（无锡）电子有限公司 | Fool-proof method for multi-layer plate misplacing |
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| CN107708288A (en) * | 2017-09-08 | 2018-02-16 | 江西景旺精密电路有限公司 | A kind of pcb board and its processing method |
| CN108012437B (en) * | 2017-11-22 | 2020-03-24 | 厦门弘信电子科技股份有限公司 | Flexible circuit board process tracing two-dimensional code etching manufacturing method |
| CN107846774A (en) * | 2017-11-22 | 2018-03-27 | 厦门弘信电子科技股份有限公司 | FPC processing procedure traces Quick Response Code laser carving preparation method |
| CN108260305A (en) * | 2018-01-11 | 2018-07-06 | 郑州云海信息技术有限公司 | A kind of automatic lamination oxide method of pcb board |
| CN108674944B (en) * | 2018-05-05 | 2021-03-23 | 临海市恒兴机械厂 | Decorative plate arranging method based on new identification technology |
| TWI699702B (en) * | 2019-01-24 | 2020-07-21 | 景碩科技股份有限公司 | Code processing system and method for production line |
| CN110881252B (en) * | 2019-11-26 | 2021-02-19 | 南通深南电路有限公司 | Control method of printed circuit board production equipment and printed circuit board production equipment |
| CN110996562B (en) * | 2019-12-27 | 2023-07-18 | 广州兴森快捷电路科技有限公司 | Automated bonding apparatus and method |
| CN113543528B (en) * | 2020-04-17 | 2023-03-24 | 无锡深南电路有限公司 | Substrate processing method and apparatus |
| CN112975141B (en) * | 2021-02-23 | 2023-01-20 | 奥士康科技股份有限公司 | Method for identifying lamination error prevention by adopting two-dimensional code |
| CN113099630B (en) * | 2021-03-04 | 2022-07-12 | 奥士康科技股份有限公司 | Method for avoiding lamination sequence error by adding two-dimensional code on board edge |
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| JPH10173313A (en) * | 1996-12-11 | 1998-06-26 | Hitachi Aic Inc | Superposed formation of copper clad laminating plate for through-hole |
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| CN102300413A (en) * | 2010-06-25 | 2011-12-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with identification code |
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