CN107708288A - A kind of pcb board and its processing method - Google Patents

A kind of pcb board and its processing method Download PDF

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Publication number
CN107708288A
CN107708288A CN201710805190.8A CN201710805190A CN107708288A CN 107708288 A CN107708288 A CN 107708288A CN 201710805190 A CN201710805190 A CN 201710805190A CN 107708288 A CN107708288 A CN 107708288A
Authority
CN
China
Prior art keywords
lot
pcb
pcb substrate
processing methods
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710805190.8A
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Chinese (zh)
Inventor
段绍华
管术春
周锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Original Assignee
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd filed Critical JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority to CN201710805190.8A priority Critical patent/CN107708288A/en
Publication of CN107708288A publication Critical patent/CN107708288A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927Machine readable code, e.g. bar code

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Factory Administration (AREA)

Abstract

The present invention discloses a kind of pcb board and its processing method, by setting up lot printing step in each manufacturing procedure of pcb board, lot is set in PCB substrate after the processing of each process, management and control is carried out to the PCB by the lot, solved the problems, such as in existing PCB process using work card to mixing plate and mixed card caused by pcb board progress management and control.That is, in the step S2, before the PCB substrate processed by this process enters next process, the lot for the batch information for carrying the pcb board determined according to work order is set in PCB substrate, the batch identification of the process can be completed, without manually filling in, solve the problems, such as because artificial carelessness and caused by mix plate or mixed card.

Description

A kind of pcb board and its processing method
Technical field
The present invention relates to PCB fields, more particularly to a kind of pcb board and its processing method.
Background technology
At present, it is necessary to record the raw material needed for pcb board production, historically allotment by hand in pcb board production process Material starts to produce.PCB substrate to be processed on each production line is designed with recording list, and worker needs after the completion of each process Job number and element number manually are filled in, to record the production process of each pcb board, so on the one hand easily causes mixed plate and mixed card Phenomenon, on the other hand also waste substantial amounts of man power and material.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of pcb board and its processing method, it is intended to Solve the problems, such as to mix plate and mixed card present in existing PCB production processes.
Technical scheme is as follows:
A kind of PCB processing methods, it includes:
The batch information of pcb board to be processed is determined according to work order, and lot, Yi Ji are generated according to the batch information The lot is set in the PCB substrate after sawing sheet;
When the PCB substrate enters each process, the lot that PCB substrate carries is identified and verified;
Enter the process when being proved to be successful to be processed to PCB substrate, and in PCB substrate after processing described in setting Lot, to carry out batch management and control to PCB by the lot.
The PCB processing methods, wherein, the process comprises at least:Internal layer etching work procedure, pressing working procedure and anti-welder Sequence.
The PCB processing methods, wherein, in internal layer etching work procedure, in the PCB substrate after processing described in setting Lot specifically includes:
Read the PCB substrate and carry lot, and in by liquid medicine etching mode, the lot is etched in In PCB substrate after layer etching.
The PCB processing methods, wherein, the lot set after the sawing sheet and the batch set after internal layer etching Identification code is shifted to install in the edge of the PCB substrate.
The PCB processing methods, wherein, in the pressing working procedure, in the PCB substrate after processing described in setting Lot specifically includes:
After pressing processing, code reader is transmitted by X-RAY and reads the lot for pressing obtained PCB substrate and carrying, its In, the lot is what internal layer etching work procedure was set;
The lot is printed in the PCB substrate after pressing using Laser Jet.
The PCB processing methods, wherein, it is described when the PCB substrate enters each process, identify and verify described criticize Secondary identification code specifically includes:
When the PCB substrate enters each process, read what the PCB substrate carried by the CCD code readers of preset configuration Lot;
The first batch information that the lot carries is obtained, and the first batch information and the work order are included Batch information is compared, to be verified to the lot.
The PCB processing methods, it also includes:
When the lot authentication failed, control PCB production systems produce alarm.
Described PCB processing methods, wherein, the lot is Quick Response Code or bar code.
A kind of pcb board, it is to process obtained PCB substrate using as above any described PCB processing methods.
Beneficial effect:The present invention carries batch letter by setting up to set in PCB substrate in PCB each production process The lot identification codes of breath, and batch management and control is carried out to pcb board by lot identification codes, avoid by being mixed existing for work card management and control The phenomenon of plate and mixed card.Meanwhile the efficiency to human resources is decreased, reduce PCB production cost.
Brief description of the drawings
Fig. 1 is a kind of flow chart of PCB processing methods preferred embodiment of the present invention.
Embodiment
The present invention provides a kind of pcb board and its processing method, to make the purpose of the present invention, technical scheme and effect more clear Chu, clearly, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only solving The present invention is released, is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of PCB processing methods preferred embodiment of the present invention, as illustrated, it is wrapped Include step:
S1, the batch information for determining according to work order pcb board to be processed, and lot is generated according to the batch information, with And the lot is set in the PCB substrate after sawing sheet;
S2, when the PCB substrate enters each process, identify and verify PCB substrate carry lot;
S3, enter the process to be processed to PCB substrate when being proved to be successful, and set in PCB substrate after processing The lot, to carry out batch management and control to PCB by the lot.
The present invention is added by setting up lot printing step in each manufacturing procedure of pcb board in each process Lot is set in PCB substrate after work, management and control is carried out to the PCB by the lot, solved existing Using work card to mixing the problem of plate is with card is mixed caused by pcb board progress management and control in PCB process.That is, described In step S2, before the PCB substrate processed by this process enters next process, set in PCB substrate and carry basis The lot of the batch information for the pcb board that work order determines, you can to complete the batch identification of the process, without artificial Fill in manually, solve the problems, such as because artificial carelessness and caused by mix plate or mixed card.
Specifically, in the step S1, the work order is machined parameters information table corresponding to PCB to be processed.The work order Record parameter request of PCB to be processed batch information, manufacturing procedure and each manufacturing procedure etc..The batch information can be with For batch number, the batch number can be set of number or character and digit, for identifying the product information.For example, at this Invent in a preferred embodiment, the batch information is given birth to for date each two digits composition of production time plus user-defined identification Into, and pcb board described in unique mark.
, can be with due to the unique mark that the batch information is the PCB, and for the ease of the identification of the batch information The batch information is converted into lot so that the lot carries the batch information.The batch mark It can be Quick Response Code and bar code etc. to know code.For example, a preferable example is that lot is bar code.
Further, in the step S2, when the PCB substrate enters each process, a process is provided with thereon The lot of setting, and the batch information that the lot of each process setting carries is identical.For example, when production plate When the PCB substrate obtained by sawing sheet process enters next process, the PCB substrate carries batch that sawing sheet process is set Secondary identification code.Certainly, the lot that each process is set is identical, and it is to ensure to be respectively provided with each process The PCB substrate carries out the processing of all process steps needed for it, improves the qualification rate of pcb board.
It is described to identify and verify that the lot identification codes refer to identifying the first batch information in the lot identification codes, And to being verified using the batch information stored in work order to it, to ensure that the batch into the PCB substrate of each process is believed Breath is correct.Exemplary, it is described when the PCB substrate enters each process, identify and verify that the lot is specific Including:
S21, when the PCB substrate enters each process, the PCB substrate is read by the CCD code readers of preset configuration and taken The lot of band;
S22, obtain the first batch information that the lot carries, and by the first batch information and the work order bag The batch information contained is compared, to be verified to the lot.
In addition, in verification process is carried out to the lot, there may also be the situation of authentication failed.Namely Say, after the step S2, can also include when failing the authentication, control PCB production systems produce alarm, to remind The batch of pcb board and pcb board to be processed that the producer enters the manufacturing procedure is not inconsistent, the problem of avoiding mixed plate.
Further, in the step S3, each process can be all process steps needed for PCB to be processed, also may be used Think that what is pre-set needs to set some processes of lot.For example, in the preferred embodiment of the present invention, institute Stating process includes internal layer etching work procedure, lamination process and anti-welding process.
Exemplary, in internal layer etching work procedure, set the lot to have in the PCB substrate after processing Body can include:
Read the PCB substrate and carry lot, and in by liquid medicine etching mode, the lot is etched in In PCB substrate after layer etching.
Specifically, it is described to refer to etching by liquid medicine in the PCB substrate after internal layer etches by liquid medicine etching mode The upper lot, after such multi-layer PCB substrate pressing plate, transmittance code reader can be passed through and obtain internal layer etching work procedure The lot of setting.For example, in a preferred embodiment of the invention, the liquid medicine is acid etching liquid medicine, its composition Including HCl, CuCl2 etc., etchant is used as by the acid etching liquid medicine, and use etching mode by the lot It is arranged on pcb board, to cause after pressing working procedure, the batch identification in internal layer PCB substrate can be read by X-RAY Code.
In addition, the batch identification that the lot that the internal layer etching work procedure is set is set with sawing sheet process shifts to install In the edge of pcb board, it can so avoid two lots overlapping and influence the definition of lot.Meanwhile it is worth It must illustrate, the batch that the lot that the lot and internal layer etching work procedure that the sawing sheet process is set are set carries Information is identical, but set-up mode can be difference, for example, the lot that sawing sheet process is set is carved for laser baked and formed, The lot of internal layer etching is formed by liquid medicine etching.
Exemplary, in the pressing working procedure, set the lot to have in the PCB substrate after processing Body includes:
After pressing processing, code reader is transmitted by X-RAY and reads the lot for pressing obtained PCB substrate and carrying, its In, the lot is what internal layer etching work procedure was set;
The lot is printed in the PCB substrate after pressing using Laser Jet.
Specifically, the X-RAY transmissions code reader can be read is lost in PCB substrate after internal layer etching work procedure by liquid medicine The lot identification codes at quarter, and validation batches are carried out by the lot identification codes, and after being proved to be successful, the batch is identified Code is printed in the PCB substrate after pressing.
Exemplary, in the anti-welding process, set the lot to have in the PCB substrate after processing Body is:After anti-welding covering plate face, carried out on anti-solder ink per set stamps to generate lot.
For a further understanding of PCB processing methods provided by the present invention, said with reference to a specific embodiment It is bright.
Embodiment 1
A kind of PCB processing methods are present embodiments provided, it is specifically included:
S101, the PCB substrate that PCB substrate is cut into according to PCB to be processed size corresponding size, and set in PCB substrate Put sawing sheet lot;
S102, PCB substrate progress internal layer is etched to obtain PCB substrate, and internal layer lot is set in PCB substrate;
S103, the internal layer lot carried according to PCB substrate are chosen PCB substrate to be laminated and are laminated, and read The internal layer lot that PCB substrate carries;
S104, the batch information generation lamination identification code carried according to the internal layer lot, and by the lamination batch Identification code is arranged on multi-layer PCB substrate;
S105, anti-welding covering is carried out to multi-layer PCB substrate, and the lamination lot is respectively arranged on anti-solder ink, So that PCB substrate to be identified according to the lamination lot.
The present invention also provides a kind of pcb board preferred embodiment, and it uses the processing method described in as above any one to be added Work.
In summary, the present invention in each manufacturing procedure of pcb board by setting up lot printing step, every Lot is set in PCB substrate after individual process processing, management and control is carried out to the PCB by the lot, it is real Now with no paper processing.Meanwhile it can avoid mixing plate problem because personnel are inputted caused by information errors;And product be present in PCB It can be traced during matter exception according to the lot of its carrying with regard to those, realizing quality abnormal can trace.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention Protect scope.

Claims (9)

1. a kind of PCB processing methods, it is characterised in that it includes:
The batch information of pcb board to be processed is determined according to work order, and lot, Yi Ji are generated according to the batch information The lot is set in the PCB substrate after sawing sheet;
When the PCB substrate enters each process, the lot that PCB substrate carries is identified and verified;
Enter the process when being proved to be successful to be processed to PCB substrate, and in PCB substrate after processing described in setting Lot, to carry out batch management and control to PCB by the lot.
2. the 1 PCB processing methods are required according to power, it is characterised in that the process comprises at least:Internal layer etching work procedure, pressure Close process and anti-welding process.
3. PCB processing methods according to claim 2, it is characterised in that in the internal layer etching work procedure, it is described after processing The lot is set to specifically include in PCB substrate:
Read the PCB substrate and carry lot, and in by liquid medicine etching mode, the lot is etched in In PCB substrate after layer etching.
4. PCB processing methods according to claim 3, it is characterised in that the lot set after the sawing sheet with it is interior The lot set after layer etching is shifted to install in the edge of the PCB substrate.
5. PCB processing methods according to claim 3, it is characterised in that in the pressing working procedure, it is described after processing The lot is set to specifically include in PCB substrate:
After pressing processing, code reader is transmitted by X-RAY and reads the lot for pressing obtained PCB substrate and carrying, its In, the lot is what internal layer etching work procedure was set;
The lot is printed in the PCB substrate after pressing using Laser Jet.
6. PCB processing methods according to claim 1, it is characterised in that described to enter each process in the PCB substrate When, identify and verify that the lot specifically includes:
When the PCB substrate enters each process, read what the PCB substrate carried by the CCD code readers of preset configuration Lot;
The first batch information that the lot carries is obtained, and the first batch information and the work order are included Batch information is compared, to be verified to the lot.
7. PCB processing methods according to claim 1, it is characterised in that it also includes:
When the lot authentication failed, control PCB production systems produce alarm.
8. according to any described PCB processing methods of claim 1-7, it is characterised in that the lot is Quick Response Code Or bar code.
9. a kind of pcb board, it is characterised in that it is to process to obtain using the PCB processing methods as described in claim 1-8 is any PCB substrate.
CN201710805190.8A 2017-09-08 2017-09-08 A kind of pcb board and its processing method Pending CN107708288A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108959995A (en) * 2018-08-17 2018-12-07 张家港康得新光电材料有限公司 A kind of information substrate management method, device, electronic equipment and storage medium
CN109041441A (en) * 2018-09-14 2018-12-18 东莞市多普光电设备有限公司 A kind of pcb board batch management exposure method and its exposure sources
CN109587952A (en) * 2018-12-07 2019-04-05 景旺电子科技(龙川)有限公司 A kind of method and system for preventing from mixing plate in PCB production process
CN109583526A (en) * 2018-10-26 2019-04-05 南通深南电路有限公司 Two dimensional code application method, device and the storage medium of pcb board
CN109685524A (en) * 2018-11-28 2019-04-26 惠州中京电子科技有限公司 A kind of trace mode of PCB production board quality
CN112399719A (en) * 2020-11-06 2021-02-23 金禄电子科技股份有限公司 PCB production is with preventing mixing board
CN112561258A (en) * 2020-12-02 2021-03-26 鼎勤科技(深圳)有限公司 Intelligent production management system applied to PCB processing
CN115344010A (en) * 2021-05-13 2022-11-15 深南电路股份有限公司 Management control system

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CN107027247A (en) * 2016-01-29 2017-08-08 无锡深南电路有限公司 A kind of printed circuit board (PCB) lamination method and device
CN107041063A (en) * 2017-06-09 2017-08-11 东莞市威力固电路板设备有限公司 The processing method and multi-layer PCB of a kind of multi-layer PCB
CN107135618A (en) * 2017-06-09 2017-09-05 东莞市五株电子科技有限公司 The control method and system of mixed batch are prevented in a kind of PCB production processes

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CN101613876A (en) * 2009-07-24 2009-12-30 深圳崇达多层线路板有限公司 Electroplating parameter error detecting system of circuit board and method
CN104182855A (en) * 2014-06-06 2014-12-03 胜宏科技(惠州)股份有限公司 Printed circuit board (PCB) quality tracing method
CN104582328A (en) * 2014-12-22 2015-04-29 东莞美维电路有限公司 PCB manufacturing technology capable of preventing board arrangement errors
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108959995A (en) * 2018-08-17 2018-12-07 张家港康得新光电材料有限公司 A kind of information substrate management method, device, electronic equipment and storage medium
CN108959995B (en) * 2018-08-17 2022-10-14 张家港康得新光电材料有限公司 Substrate information management method and device, electronic equipment and storage medium
CN109041441A (en) * 2018-09-14 2018-12-18 东莞市多普光电设备有限公司 A kind of pcb board batch management exposure method and its exposure sources
CN109583526A (en) * 2018-10-26 2019-04-05 南通深南电路有限公司 Two dimensional code application method, device and the storage medium of pcb board
CN109685524A (en) * 2018-11-28 2019-04-26 惠州中京电子科技有限公司 A kind of trace mode of PCB production board quality
CN109587952A (en) * 2018-12-07 2019-04-05 景旺电子科技(龙川)有限公司 A kind of method and system for preventing from mixing plate in PCB production process
CN112399719A (en) * 2020-11-06 2021-02-23 金禄电子科技股份有限公司 PCB production is with preventing mixing board
CN112561258A (en) * 2020-12-02 2021-03-26 鼎勤科技(深圳)有限公司 Intelligent production management system applied to PCB processing
CN115344010A (en) * 2021-05-13 2022-11-15 深南电路股份有限公司 Management control system

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