CN110349887A - The system of the single IC condition of production of retrospect based on two dimensional code - Google Patents

The system of the single IC condition of production of retrospect based on two dimensional code Download PDF

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Publication number
CN110349887A
CN110349887A CN201910640320.6A CN201910640320A CN110349887A CN 110349887 A CN110349887 A CN 110349887A CN 201910640320 A CN201910640320 A CN 201910640320A CN 110349887 A CN110349887 A CN 110349887A
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China
Prior art keywords
dimensional code
production
wafer
substrate
map
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Pending
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CN201910640320.6A
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Chinese (zh)
Inventor
栗甲婿
邵云兵
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Peyton Technology (shenzhen) Co Ltd
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Peyton Technology (shenzhen) Co Ltd
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Priority to CN201910640320.6A priority Critical patent/CN110349887A/en
Publication of CN110349887A publication Critical patent/CN110349887A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/29—Geographical information databases
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G06K17/0022—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisions for transferring data to distant stations, e.g. from a sensing device
    • G06K17/0029—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisions for transferring data to distant stations, e.g. from a sensing device the arrangement being specially adapted for wireless interrogation of grouped or bundled articles tagged with wireless record carriers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00—Commerce
    • G06Q30/018—Certifying business or products
    • G06Q30/0185—Product, service or business identity fraud
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Databases & Information Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Accounting & Taxation (AREA)
  • Remote Sensing (AREA)
  • Marketing (AREA)
  • Strategic Management (AREA)
  • General Business, Economics & Management (AREA)
  • Development Economics (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Finance (AREA)
  • Data Mining & Analysis (AREA)
  • Economics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

The invention discloses the systems of the single IC condition of production of retrospect based on two dimensional code, impress two dimensional code in naked substrate edges, so that the two dimensional code of every substrate is unique；Substrate generates the blank map of fixed format according to ranks number in SMS system；In patch station, map is produced automatically；When patch station pastes wafer, wafer information is connected to 2 D code system and generated a data report, is uploaded in the map of SMS；In map in SMS system, each IC has the unique content in preceding station record, and board impresses string content in the form of two dimensional code；It can read the two dimensional code of substrate edges before subsequent each station production, then the data of every substrate production are uploaded to corresponding position in SMS system production map, after singulation, there is a unique two dimensional code on every surface IC, which is used to trace the condition of production of single IC.

Description

The system of the single IC condition of production of retrospect based on two dimensional code
Technical field
The invention belongs to the retroactive method to single IC, be related to single IC condition of production of retrospect based on two dimensional code is System.
Background technique
In IC industry, the product of different clients has set rule of impressing, but is all based on wafer batch or abundant For production batch as impressing what information was impressed, i.e., the content of impressing of the IC of each batch is identical.
Using the prior art, position of the single product on substrate or wafer, specific wafer number can not be inquired Etc. information；For the retrospective that IC impresses, the front and back (MK) station of impressing that may only trace entire batch according to content of impressing is raw The information such as board number, production time, institute's spent material, cannot trace back to the specific condition of production of single IC used in producing, So that retrospect has limitation.
Summary of the invention
Aiming at the problem that background technique is previously mentioned, the technical problem to be solved in the present invention is to provide the retrospects based on two dimensional code The system of the single IC condition of production can trace single IC, and position of the chip in wafer, substrate strip number number, base can be traced The information such as Board position and the wafer number of plies, improve the depth of retrospect.
The system of the single IC condition of production of retrospect based on two dimensional code of the invention, this method are directed on wafer and carry out not With IC impress content use, include the following steps:
P1. it impresses two dimensional code in naked substrate edges, so that the two dimensional code of every substrate is unique；
P2. substrate generates the blank map of fixed format according to ranks number in SMS system；
P3. in patch station, this substrate edges two dimensional code and encapsulation batch number are bound together and put interior SMS system by patch system In system, and map is produced automatically；
P4. when patch station pastes wafer, wafer information is connected to 2 D code system and generated a data report, is uploaded To the map of SMS；
P5. in the map in SMS system, each IC has the unique content in preceding station record, and the content is in MK station meeting By identifying that the edge two dimensional code of material strip recalls, downloaded automatically by board later, board is by string content with the shape of two dimensional code Formula is impressed；
P6. the two dimensional code that can read substrate edges before subsequent each station production, then uploads the data of every substrate production To corresponding position in SMS system production map, after singulation, there are a unique two dimensional code, the two dimensional code in every surface IC For tracing the condition of production of single IC.
Wherein, the wafer information described in step P4 includes but is not limited to wafer batch number, wafer the piece number, chip in crystalline substance Round position, substrate strip number number, substrate position and the wafer number of plies.
Advantages of the present invention: position, specific wafer number etc. of the single IC on substrate or wafer can be inquired, is had Chip traces limitation, improves the product control ability to IC, to provide instruction to optimization production line.
Detailed description of the invention
Detailed description will be given by the following detailed implementation and drawings by the present invention for ease of explanation,.
Fig. 1 is that naked substrate edges play two dimensional code schematic diagram.
Fig. 2 is the map schematic diagram in SMS system.
Fig. 3 is that wafer information is uploaded to SMS system schematic.
Fig. 4 is that the data in SMS system are impressed schematic diagram in the form of two dimensional code.
Fig. 5 impresses single IC schematic diagram of two dimensional code.
Specific embodiment
As Figure 1-Figure 5, the system of the single IC condition of production of retrospect based on two dimensional code, carries out not on wafer With IC impress content use, include the following steps:
It impresses two dimensional code in naked substrate edges, so that the two dimensional code of every substrate is unique, two dimensional code is generated by 2 D code system, Contain information substrate；Substrate generates the blank map of fixed format, the map in SMS system according to ranks number in SMS system In, product are represented with " 1 ", " 2 " represent substrate supplied materials bad product；In patch station, patch system is by this substrate edges two dimensional code It binds together and puts in interior SMS system with encapsulation batch number, and produce map automatically, substrate and chip are generated in SMS system Dot chart；When patch station pastes wafer, wafer information is connected to 2 D code system and generated a data report, is uploaded to In the map of SMS, wafer information includes but is not limited to position in wafer of wafer batch number, wafer the piece number, chip, substrate strip number Number, substrate position and the wafer number of plies；In map in SMS system, each IC has the unique content in preceding station record, The content can be recalled in MK station by identifying the edge two dimensional code of material strip, be downloaded automatically by board later, board is by character string Content is impressed in the form of two dimensional code；The two dimensional code that can read substrate edges before subsequent each station production, then will be every The data of substrate production are uploaded to corresponding position in SMS system production map, after singulation, every surface IC have one only One two dimensional code, the two dimensional code are used to trace the condition of production of single IC, to realize the traceability system based on two dimensional code.
The above-described embodiments are merely illustrative of preferred embodiments of the present invention, not to structure of the invention Think and range is defined.Without departing from the design concept of the invention, ordinary people in the field is to technology of the invention The all variations and modifications that scheme is made, should all drop into protection scope of the present invention, the claimed technology contents of the present invention, It is all described in the claims.

Claims (2)

1. the system of the single IC condition of production of retrospect based on two dimensional code, it is characterised in that: to single IC can not be inquired in base The method of position and specific wafer number on plate or wafer is as follows:
P1. it impresses two dimensional code in naked substrate edges, so that the two dimensional code of every substrate is unique；
P2. substrate generates the blank map of fixed format according to ranks number in SMS system；
P3. in patch station, this substrate edges two dimensional code and encapsulation batch number are bound together and put interior SMS system by patch system In system, and map is produced automatically；
P4. when patch station pastes wafer, wafer information is connected to 2 D code system and generated a data report, is uploaded To the map of SMS；
P5. in the map in SMS system, each IC has the unique content in preceding station record, and the content is in MK station meeting By identifying that the edge two dimensional code of material strip recalls, downloaded automatically by board later, board is by string content with the shape of two dimensional code Formula is impressed；
P6. the two dimensional code that can read substrate edges before subsequent each station production, then uploads the data of every substrate production To corresponding position in SMS system production map, after singulation, there are a unique two dimensional code, the two dimensional code in every surface IC For tracing the condition of production of single IC.
2. the system of the retrospect single IC condition of production according to claim 1 based on two dimensional code, it is characterised in that: in step Wafer information described in rapid P4 includes but is not limited to position in wafer of wafer batch number, wafer the piece number, chip, substrate strip number Number, substrate position and the wafer number of plies.
CN201910640320.6A 2019-07-16 2019-07-16 The system of the single IC condition of production of retrospect based on two dimensional code Pending CN110349887A (en)

Priority Applications (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111653505A (en) * 2020-05-27 2020-09-11 南京泰治自动化技术有限公司 Frame state management method and system in IC packaging chip mounting process
CN113178399A (en) * 2020-01-24 2021-07-27 株式会社迪思科 Processing device
CN113962713A (en) * 2021-11-04 2022-01-21 无锡唯因特数据技术有限公司 Tracing method and device for solar cell and storage medium
CN114266585A (en) * 2021-12-30 2022-04-01 华天科技（西安）有限公司 Method for realizing retrospective seal laser

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118327A (en) * 1997-06-16 1999-01-12 Sony Corp Method for providing semiconductor chip identification code and method for managing semiconductor chip
JP3360733B2 (en) * 1997-03-24 2002-12-24 マイクロン テクノロジー インコーポレイテッド Method of manufacturing continuous, non-lot based integrated circuits
US20040030517A1 (en) * 2000-08-30 2004-02-12 Rumsey Brad D. Descriptor for identifying a defective die site and methods of formation
TW201118628A (en) * 2009-11-18 2011-06-01 Powertech Technology Inc System for asynchronously treating die-attached data from substrate strips
CN102640253A (en) * 2010-10-04 2012-08-15 晟碟半导体（上海）有限公司 Discrete component backward traceability and semiconductor device forward traceability
CN103165405A (en) * 2011-01-27 2013-06-19 北京确安科技股份有限公司 Mutli-dimensional variable code real-time generation method through general purpose interface bus (GPIB) interface
CN105654160A (en) * 2016-01-08 2016-06-08 沛顿科技（深圳）有限公司 Method for preparing unique identification code of memory chip
CN107451628A (en) * 2017-07-04 2017-12-08 全讯射频科技(无锡)有限公司 The method of production information and the system with this method are traced by Quick Response Code
CN107808831A (en) * 2017-11-10 2018-03-16 上海华岭集成电路技术股份有限公司 Whole process can trace to the source semiconductor test data record method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360733B2 (en) * 1997-03-24 2002-12-24 マイクロン テクノロジー インコーポレイテッド Method of manufacturing continuous, non-lot based integrated circuits
JPH118327A (en) * 1997-06-16 1999-01-12 Sony Corp Method for providing semiconductor chip identification code and method for managing semiconductor chip
US20040030517A1 (en) * 2000-08-30 2004-02-12 Rumsey Brad D. Descriptor for identifying a defective die site and methods of formation
TW201118628A (en) * 2009-11-18 2011-06-01 Powertech Technology Inc System for asynchronously treating die-attached data from substrate strips
CN102640253A (en) * 2010-10-04 2012-08-15 晟碟半导体（上海）有限公司 Discrete component backward traceability and semiconductor device forward traceability
CN103165405A (en) * 2011-01-27 2013-06-19 北京确安科技股份有限公司 Mutli-dimensional variable code real-time generation method through general purpose interface bus (GPIB) interface
CN105654160A (en) * 2016-01-08 2016-06-08 沛顿科技（深圳）有限公司 Method for preparing unique identification code of memory chip
CN107451628A (en) * 2017-07-04 2017-12-08 全讯射频科技(无锡)有限公司 The method of production information and the system with this method are traced by Quick Response Code
CN107808831A (en) * 2017-11-10 2018-03-16 上海华岭集成电路技术股份有限公司 Whole process can trace to the source semiconductor test data record method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113178399A (en) * 2020-01-24 2021-07-27 株式会社迪思科 Processing device
CN111653505A (en) * 2020-05-27 2020-09-11 南京泰治自动化技术有限公司 Frame state management method and system in IC packaging chip mounting process
CN113962713A (en) * 2021-11-04 2022-01-21 无锡唯因特数据技术有限公司 Tracing method and device for solar cell and storage medium
CN114266585A (en) * 2021-12-30 2022-04-01 华天科技（西安）有限公司 Method for realizing retrospective seal laser

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Application publication date: 20191018