TWI699702B - Code processing system and method for production line - Google Patents

Abstract

The invention relates to a code processing system and method for production line. The code processing system for production line includes a reading module, a positioning module, and a marking module. The reading module generates code reading data. The reading module is for reading an internal code of a multilayer board and generating the code reading data according to the internal code. The positioning module generates code positioning data. The code positioning data corresponds to the code reading data. The positioning module is for capturing a board image of the multilayer board and analyzing the board image to generate the code positioning data. The code positioning data corresponds to a predetermined position of an external surface of the multilayer board. The marking module marks an external code. The external code corresponds to the internal code. The marking module marks the external code on the predetermined position according to the code positioning data.

Description

Production line coding processing system and method

The invention relates to a production line system, and more particularly to a production line coding processing system and a production line coding processing method.

Existing electronic devices may have multilayer substrates, and the multilayer substrates are used to carry various circuits, electronic components, and functional modules. In the production process of electronic devices, in order for the manufacturing execution system (MES) to identify and record the substrates, electronic components or functional modules produced at each site, a code is set in a specific area of the produced part, such as a one-dimensional barcode or Two-dimensional coding. When the production process reaches a specific process or site, the manufacturing execution system can identify the corresponding production part by reading the code and record it in the production history. Generally speaking, the way to read the code is through an optical code reader. For example, the first layer of the multi-layer substrate will be provided with the first layer of code. The operator can scan the first layer of code through an optical code reader, and the manufacturing execution system will recognize the first layer of code to confirm the first layer of code. Relevant information is recorded, and in the subsequent production process, one or more other substrates may be stacked on the first layer of substrate. In other words, the first layer of code will be sandwiched on the inner layer of the multilayer substrate, and can no longer be read by the optical code reader.

In view of this, the purpose of the present invention is to propose a production line coding processing system and a production line coding processing method, in order to effectively confirm the relevant information of the production parts covered by the codes even when the codes of the production parts are covered in the production process. , To facilitate the tracking and recording of production parts.

In an embodiment of the present invention, a production line encoding processing system includes a reading module, a positioning module, and a printing module. The reading module generates coded reading data, wherein the reading module is used for reading the inner code of the multilayer substrate and generating the coded reading data according to the inner code. The positioning module generates coded positioning data, and the coded positioning data corresponds to the coded read data. The positioning module is used to capture the substrate image of the multilayer substrate and analyze the substrate image to generate the coded positioning data, and the coded positioning data corresponds to the multilayer A predetermined position on the outer surface of the substrate. The printing module prints the outer code, and the outer code corresponds to the inner code, wherein the printing module prints the outer code at a predetermined position according to the code positioning data.

In an embodiment of the present invention, the positioning module analyzes the substrate image to generate substrate profile data or substrate position offset data. The substrate profile data corresponds to the outline and size of the multilayer substrate, and the substrate position offset data corresponds to the position of the multilayer substrate. Offset direction and offset amount, and the positioning module generates coded positioning data according to substrate profile data or substrate position offset data.

In an embodiment of the present invention, a production line coding processing method includes: providing a multilayer substrate; reading the inner code of the multilayer substrate; generating code reading data according to the inner code; capturing the substrate image of the multilayer substrate; Generating coded positioning data; and printing an outer layer code at a predetermined position on the outer surface of the multilayer substrate according to the coded positioning data. Among them, the outer code corresponds to the inner code.

In summary, the production line encoding processing system and production line encoding processing method according to the embodiments of the present invention can read the covered codes through the reading module when the codes of the production parts are covered in the production process. In order to facilitate the tracking and recording of production parts, and the covered code can be printed on the surface area of the production correspondingly, so that the operator can use an optical code reader to read the code, making the production operation more convenient.

The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with the relevant technology can easily understand the related purpose and advantages of the present invention.

Please refer to FIG. 1, which is a block diagram of a production line encoding processing system 100 according to an embodiment of the present invention. In this embodiment, the production line coding processing system 100 is, for example, but not limited to, a part of a manufacturing execution system (MES), and the production line coding processing system 100 (or manufacturing execution system) can be applied to any production line to control, manage, track, and Record each production component and related production process on the production line. For example, the production line to which the production line encoding processing system 100 is applied can be used to produce a specific electronic device and its various components, such as but not limited to a multilayer substrate of an electronic device.

As shown in FIG. 1, in this embodiment, the production line encoding processing system 100 includes a reading module 110, a positioning module 120 and a printing module 130. The reading module 110, the positioning module 120 and the printing module 130 may be located at the same site on the production line; or the reading module 110, the positioning module 120 and the printing module 130 may also be located at different stations on the production line For example, the reading module 110 may be located at a certain site, the positioning module 120 may be located at a subsequent site of the site where the reading module 110 is located, and the printing module 130 may be located at the site where the positioning module 120 is located. Follow-up site.

In this embodiment, the reading module 110 can generate coded reading data. For example, the reading module 110 is used to read the inner code of the multilayer substrate, and the reading module 110 generates the code reading data according to the inner code. The positioning module 120 can generate coded positioning data, and the coded positioning data corresponds to the coded read data. For example, the positioning module 120 is used to capture the substrate image of the multilayer substrate, and the positioning module 120 is used to analyze the substrate image to generate the coded positioning data, and the coded positioning data corresponds to the outer surface of the multilayer substrate The predetermined location. The printing module 130 can print an outer layer code, and the outer layer code corresponds to the inner layer code. For example, the printing module 130 prints an outer layer code at a predetermined position on the outer surface of the multilayer substrate according to the code positioning data. The outer surface refers to the outermost surface of the multilayer substrate visible to the naked eye, and the predetermined position is located on the outermost surface of the multilayer substrate.

Please refer to FIG. 2, which is a schematic diagram of a reading operation performed by the reading module 110 according to an embodiment of the present invention. As shown in FIGS. 1 and 2, in this embodiment, the reading module 110 includes a code reading unit 111, a radiation emitter 112 and a radiation sensor 113. Figure 2 shows a part of the production line to which the production line encoding processing system 100 is applied. This part involves the reading module 110, which includes a radiation emitter 112 and a radiation sensor 113, and the radiation emitter 112 and radiation sensor The devices 113 are arranged opposite to each other. In this production line, the multilayer substrate 200 will be manufactured in the previous production process, and the multilayer substrate 200 can be used as a mother board of an electronic device in the subsequent production process. In other words, in the subsequent production process, each functional module of the electronic device (such as a camera module, a wireless signal transceiver module, a display module, or a battery module, etc.) can be disposed on the multilayer substrate 200, and the multilayer substrate 200 can be moved between different stations on the production line through a conveyor belt. In this embodiment, the radiation transmitter 112 is a transmitter for emitting X-rays, and the radiation sensor 113 is a sensor for sensing X-rays, but it is not limited thereto.

As shown in FIG. 2, in this embodiment, the multilayer substrate 200 includes a first layer substrate 210, a second layer substrate 220, a third layer substrate 230 and an inner layer code 240. The first layer substrate 210 and the second layer substrate 220 It is stacked in sequence with the third layer substrate 230, and the inner layer code 240 is located between the first layer substrate 210 and the second layer substrate 220. For example, the first layer substrate 210 will be fabricated before a certain site on the production line, and the inner layer code 240 is set on the surface of the first layer substrate 210. The inner code 240 is, for example, but not limited to, provided on the first substrate 210 by etching, laser engraving, or coating, and the inner code 240 is, for example, but not limited to, a one-dimensional barcode (such as Barcode) or a two-dimensional code (such as QR code). During the preparation, delivery and subsequent production process of the first layer substrate 210, the production line code processing system 100 can identify the first layer substrate 210 and its related information according to the inner layer code 240, and record the production status of the first layer substrate 210 to Production history. The second layer substrate 220 will be manufactured in a subsequent production process or a subsequent site, and the second layer substrate 220 is stacked on the first layer substrate 210, so the inner code 240 will be covered by the second layer substrate 220. Then, the third layer substrate 230 will be fabricated in a subsequent production process or a subsequent site, and the third layer substrate 230 is stacked on the second layer substrate 220. In this embodiment, the third layer substrate 230 is the topmost layer of the multilayer substrate 200, but it is not limited thereto.

In addition, the multilayer substrate 200 can be moved to a subsequent site or a subsequent production process can be performed at the same site. However, when the inner code 240 is covered, the inner code 240 can no longer be scanned and read by a general optical code reader. Therefore, the inner code 240 of the multilayer substrate 200 is read through the reading module 110. As shown in FIG. 2, in this embodiment, when the first layer substrate 210, the second layer substrate 220, and the third layer substrate 230 of the multilayer substrate 200 are all finished, the multilayer substrate 200 will be moved to the radiation emitter 112 And the radiation sensor 113 for reading operations. For example, the radiation emitter 112 emits radiation to the multilayer substrate 200 and the radiation passes through the multilayer substrate 200, and the radiation sensor 113 senses the radiation passing through the multilayer substrate 200 to generate an inner-layer coded image. In this embodiment, since the inner code 240 may be formed of a material that can block radiation, the radiation passing through the multilayer substrate 200 will be blocked by the inner code 240 and form a specific pattern. This specific pattern is made by the radiation sensor. 113 is sensed to generate an inner coded image. The code reading unit 111 analyzes the inner coded image. For example, the code reading unit 111 separates a specific pattern in the inner coded image to restore the original pattern of the inner code 240, thereby reading the inner code 240.

As shown in FIG. 1, in this embodiment, the reading module 110 further includes an intensity adjustment unit 114, and the intensity adjustment unit 114 is used to adjust the radiation intensity of the radiation emitter 112. For example, the intensity adjustment unit 114 is a voltage and current regulator connected to or built in the radiation emitter 112. The intensity adjustment unit 114 can adjust the voltage and current used by the radiation emitter 112 to emit radiation according to requirements, so that the radiation is emitted. The radiation intensity of the device 112 changes.

As shown in FIG. 1, in this embodiment, the production line encoding processing system 100 further includes a control module 140. The control module 140 is connected to the reading module 110 by a signal, and the control module 140 is based on the definition of the inner coded image. The intensity adjustment unit 114 is controlled to correspondingly adjust the radiation intensity of the radiation emitter 112. For example, after the radiation sensor 113 generates the inner coded image, the control module 140 receives and analyzes the inner coded image to determine whether the definition of the inner coded image is sufficient. If the definition is not enough, the control module 140 controls the intensity adjustment unit 114 to increase the voltage and current of the radiation emitter 112 to increase the radiation intensity of the radiation emitter 112, so that the radiation sensor 113 can regain a clearer inner code image. In this way, in addition to facilitating the reading of the inner code 240 of the multilayer substrate 200 as shown in FIG. 2, it is also conducive to the reading of the inner code 240 of the multilayer substrate 200 of the same type later.

As shown in FIGS. 1 and 2, in this embodiment, the production line coding processing system 100 further includes a production database 150, and the control module 140 is connected to the production database 150 by signals. In some embodiments, the control module 140 does not adjust the radiation intensity of the radiation emitter 112 according to the definition of the inner coded image, but adjusts the radiation intensity of the radiation emitter 112 according to the thickness T1 of the multilayer substrate 200. For example, when the control module 140 receives the inner code 240, the control module 140 automatically queries the production database 150 for related information about the multilayer substrate 200 according to the inner code 240. If the control module 140 inquires about the relevant information of the multilayer substrate 200 from the production database 150 and obtains the thickness data of the multilayer substrate 200, the control module 140 will confirm that the multilayer substrate 200 has a thickness T1 based on the thickness data, and the control module 140 will The intensity adjustment unit 114 is controlled according to the thickness T1 to correspondingly adjust the radiation intensity of the radiation emitter 112. For example, the production database 150 records appropriate radiation intensity corresponding to different substrate thicknesses, and the control module 140 adjusts the voltage and current of the radiation emitter 112 according to the appropriate radiation intensity corresponding to the thickness T1.

In different embodiments, the control module 140 may receive the inner code 240 read from the optical code reader before forming the second layer substrate 220, and according to the inner code 240 from the production database 150 Obtain the thickness data of the multilayer substrate 200, and then adjust the radiation intensity of the radiation emitter 112 in advance; or, the control module 140 may also receive the inner code 240 read from the reading module 110. The radiation intensity of the radiation emitter 112 of the module 110 is not optimized for the multi-layer substrate 200 produced, so the control module 140 will use the internal code 240 of the initial multi-layer substrate 200 on this production line from the production data The library 150 obtains the thickness data of the multilayer substrate 200, and then adjusts the voltage and current of the radiation emitter 112 to optimize the radiation intensity. This facilitates the reading module 110 to read the subsequent production of the same type of multilayer substrate 200 Inner code 240.

Please refer to FIG. 3, which is a schematic diagram of the positioning module 120 performing positioning operations according to an embodiment of the present invention. As shown in FIGS. 1 and 3, in this embodiment, the positioning module 120 includes an optical sensor 121 and an image positioning unit 122, and the optical sensor 121 is signally connected to the image positioning unit 122. The optical sensor 121 generates a substrate image, and the image positioning unit 122 analyzes the substrate image to generate substrate profile data. The substrate profile data corresponds to the profile and size of the multilayer substrate 200, and the image positioning unit 122 generates the coded positioning data according to the substrate profile data. The optical sensor 121 is, for example, but not limited to, a photographing device having a photosensitive element such as a charge coupler (CCD) or a complementary metal oxide semiconductor (CMOS), which is aligned with the top of the multilayer substrate 200 (as shown in FIG. 2 The outer surface 201) is photographed to obtain the substrate image of the multilayer substrate 200 at the top view angle.

For example, FIG. 3 shows the substrate image captured by the optical sensor 121 of FIG. 1 under the top view angle of the multilayer substrate 200. The image positioning unit 122 analyzes the substrate image and confirms the contour and the top view angle of the multilayer substrate 200. The size and image positioning unit 122 can also combine the XY coordinate system with the substrate image to generate substrate profile data. In addition, the image positioning unit 122 will position the predetermined position 202 for printing the outer layer code according to the substrate profile data. For example, as shown in FIG. 3, the image positioning unit 122 uses the lower left corner of the outer surface 201 of the multilayer substrate 200 in FIG. 3 as the origin of the XY coordinate system, and positions the coordinates (X1, Y1) for printing The predetermined position 202 of the outer code. In different embodiments, the predetermined position 202 may also be a range defined by multiple coordinates.

Since the multilayer substrate 200 may be offset during the production process, in this case, even if the positioning module 120 positions the predetermined position 202 according to the above-mentioned substrate profile data, the outer layer code printed according to the positioning coordinates may not be It is printed on the correct position of the multilayer substrate 200. In some embodiments, the image positioning unit 122 may also analyze the substrate image to generate substrate position offset data, the substrate position offset data corresponding to the offset direction and offset amount of the position of the multilayer substrate 200, and the image positioning unit 122 can also generate the encoded positioning data according to the substrate position offset data. For example, after the image positioning unit 122 analyzes the substrate image and confirms the contour and size of the multilayer substrate 200 at a top view angle, and combines the XY coordinate system with the substrate image to generate substrate contour data, the image positioning unit 122 also analyzes and compares The offset direction and offset amount between the actual position of the multilayer substrate 200 and the predetermined position 202. In addition, the code positioning data can also correspond to the substrate position offset data, so that the predetermined position 202 can be offset according to the substrate position offset data to print the outer layer code at the correct predetermined position 202.

As shown in FIG. 1, in this embodiment, the control module 140 is further connected to the positioning module 120 by a signal, wherein the control module 140 obtains relevant information of the multilayer substrate 200 from the production database 150 according to the inner code 240. The relevant information may include the positions of the inner code 240 and the outer code of the multilayer substrate 200. The control module 140 transmits the relevant information of the multilayer substrate 200 to the image positioning unit 122, and the image positioning unit 122 can generate the Coding positioning data. That is to say, the predetermined position 202 (as shown in FIG. 3) for printing the outer layer code on the multilayer substrate 200 may be from the pre-stored information in the production database 150. The image positioning unit 122 further positions the coordinates of the predetermined position 202 for printing the outer layer code according to the outline and size of the multilayer substrate 200. In some embodiments, the coordinates are corrected coordinates based on the aforementioned offset compensation. In different embodiments, the image positioning unit 122 may be software or hardware integrated in the optical sensor 121; or, the image positioning unit 122 may also be software or hardware integrated in the control module 140.

Please refer to FIGS. 4 and 5. FIG. 4 is a schematic diagram of the printing module 130 according to an embodiment of the present invention, and FIG. 5 is an outer layer code 250 printed on the outside of the multilayer substrate 200 according to an embodiment of the present invention. Schematic view of surface 201. In this embodiment, when the positioning module 120 has completed the positioning of the coordinates of the predetermined position 202 used to print the outer code 250, the multilayer substrate 200 will move to the site where the printing module 130 is located, and the printing module 130 will The outer layer code 250 is printed on a predetermined position 202 of the multilayer substrate 200. In different embodiments, the positioning module 120 and the printing module 130 can also be integrated at the same site, so that the printing process will continue at the same site after the positioning process is completed. As shown in FIGS. 1 and 4, the printing module 130 includes a laser marking unit 131. The laser marking unit 131 uses a laser to mark the outer surface 201 of the multilayer substrate 200 to form an outer layer code 250. As shown in FIGS. 4 and 5, after the laser marking unit 131 finishes marking, the predetermined position 202 on the outer surface 201 of the multilayer substrate 200 will have an outer layer code 250.

In this embodiment, the outer code 250 corresponds to the inner code 240, and the pattern of the outer code 250 is the same as the pattern of the inner code 240, but it is not limited thereto. In different embodiments, the pattern of the outer code 250 may also be different from the pattern of the inner code 240. In this case, the control module 140 will record relevant information in the production database 150 to map the outer code 250 to the inner code 240. As shown in Figure 4, in this embodiment, the outer code 250 and the inner code 240 overlap each other in the direction of the thickness T1 of the multilayer substrate 200; in different embodiments, the outer code 250 and the inner code 240 are in a multilayer The thickness T1 of the substrate 200 does not overlap with each other, and the printing position of the outer layer code 250 can be adjusted according to the predetermined position of each functional block of the electronic device on the multilayer substrate 200.

Please refer to FIG. 6, which is a flowchart of a production line encoding processing method according to an embodiment of the present invention. In this embodiment, the production line encoding processing method is corresponding to the production line encoding processing system 100 of the foregoing embodiment, but is not limited to this. As shown in FIGS. 1 to 6, in step S101, a multilayer substrate 200 is provided. At this time, the multilayer substrate 200 has an inner code 240, but the outer code 250 has not been printed yet. In step S103, the inner code 240 is read by the reading module 110. At this time, the radiation emitter 112 emits radiation, and the radiation sensor 113 senses the radiation passing through the multilayer substrate 200 to generate an inner coded image, and the code reading unit 111 analyzes the inner coded image to read the inner coded image. Layer code 240. In different embodiments, the reading module 110 can adjust the intensity of radiation according to the definition of the inner coded image; or the reading module 110 can adjust the intensity of radiation according to the thickness of the multilayer substrate 200. In step S105, the reading module 110 generates coded reading data according to the inner code 240. In step S107, the optical sensor 121 of the positioning module 120 captures the substrate image of the multilayer substrate 200. In step S109, the image positioning unit 122 analyzes the substrate image, reads the data according to the code, and locates the predetermined position 202 on the outer surface 201 for printing the outer code 250, and the image positioning unit 122 generates coded positioning data. In different embodiments, the image positioning unit 122 also analyzes the substrate image to obtain the outline and size of the multilayer substrate 200, and generates coded positioning data according to the outline and size of the multilayer substrate 200. In step S111, the printing module 130 prints the outer code 250 at a predetermined position 202 on the outer surface 201 of the multilayer substrate 200 according to the code positioning data, and the outer code 250 corresponds to the inner code 240.

In summary, the production line encoding processing system and production line encoding processing method according to the embodiments of the present invention can read the covered codes through the reading module when the codes of the production parts are covered in the production process. In order to facilitate the tracking and recording of production parts, and the covered code can be correspondingly printed on the surface area of the production, so that the operator can use an optical code reader to read the code, making the production operation more convenient. In addition, the reading module can be installed in an unmanned and automated site on the production line to automatically read the covered code through radiation, and then use the positioning module and the printing module to read the module The read inner code is printed on the outer surface of the multilayer substrate with the same or corresponding pattern. The operator can continue the production process of the multilayer substrate at the subsequent site of the production line, and the site where the operator is located is completely isolated from the site where the reading module is located, so the operator is not at risk of radiation infection. This design It can protect the health and life safety of workers.

Although the technical content of the present invention has been disclosed in the preferred embodiments as above, it is not intended to limit the present invention. Anyone who is familiar with this technology and makes slight changes and modifications without departing from the spirit of the present invention should be covered by the present invention Therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.

100: Production line coding processing system

110: read module

111: Code reading unit

112: Radiation Emitter

113: Radiation Sensor

114: Strength adjustment unit

120: positioning module

121: Optical Sensor

122: image positioning unit

130: printed module

131: Laser marking unit

140: control module

150: production database

200: Multilayer substrate

201: Outer surface

202: scheduled location

210: The first layer of substrate

220: second layer substrate

230: third layer substrate

240: inner coding

250: outer coding

S101: Provide multilayer substrate

S103: Read the inner code of the multilayer substrate

S105: Generate coded read data according to the inner code

S107: Capture the substrate image of the multilayer substrate

S109: Analyze the substrate image to generate coded positioning data

S111: Print outer code

T1: thickness

X1: X axis coordinates

Y1: Y-axis coordinates

[Figure 1] shows a block diagram of a production line encoding processing system according to an embodiment of the present invention; [Fig. 2] is a schematic diagram showing the reading operation performed by the reading module according to an embodiment of the present invention; [Fig. 3] is a schematic diagram showing the positioning operation performed by the positioning module according to an embodiment of the present invention; [Fig. 4] is a schematic diagram showing the printing process of the printing module according to an embodiment of the present invention; [Fig. 5] is a schematic diagram showing the outer layer code printed on the outer surface of the multilayer substrate according to an embodiment of the present invention; and [Fig. 6] shows a flowchart of a production line encoding processing method according to an embodiment of the present invention.

100: Production line coding processing system

110: read module

111: Code reading unit

112: Radiation Emitter

113: Radiation Sensor

114: Strength adjustment unit

120: positioning module

121: Optical Sensor

122: image positioning unit

130: printed module

131: Laser marking unit

140: control module

150: production database

Claims (8)

A production line encoding processing system, comprising: a reading module that generates a code reading data, wherein the reading module is used to read an inner code of a multilayer substrate and generate the code according to the inner code For reading data, the reading module includes a code reading unit, a radiation emitter and a radiation sensor, the radiation emitter and the radiation sensor are arranged opposite to each other, and the radiation emitter is used for the multilayer substrate Emits radiation, the radiation sensor is used to sense the radiation passing through the multilayer substrate to generate an inner coded image, and the code reading unit analyzes the inner coded image to read the inner code; a positioning module , Generate a coded positioning data corresponding to the coded read data, wherein the positioning module is used to capture a substrate image of the multilayer substrate and analyze the substrate image to generate the coded positioning data, and The code positioning data corresponds to a predetermined position on an outer surface of the multilayer substrate; and a printing module that prints an outer layer code, the outer layer code corresponds to the inner layer code, wherein the printing module is based on the code The positioning data prints the outer code at the predetermined position. According to the production line encoding processing system described in claim 1, wherein the reading module further includes an intensity adjustment unit, and the intensity adjustment unit is used to adjust the radiation intensity of the radiation emitter. For example, the production line encoding processing system described in item 2 of the scope of patent application further includes a control module, the control module signal is connected to the reading module, wherein the control module is based on the The definition of the inner coded image controls the intensity adjustment unit to adjust the radiation intensity of the radiation emitter. For example, the production line encoding processing system described in item 2 of the scope of patent application further includes a control module and a production database, the control module signal is connected to the production database and the reading module, wherein the control module The inner code is received and a thickness data of the multilayer substrate is obtained from the production database according to the inner code, and the control module controls the intensity adjustment unit according to the thickness data to adjust the radiation intensity of the radiation emitter. For the production line encoding processing system described in claim 1, wherein the positioning module includes an optical sensor and an image positioning unit, the optical sensor generates an image of the substrate, and the image positioning unit analyzes the substrate Image to generate a substrate profile data or a substrate position offset data, the substrate profile data corresponding to the outline and size of the multilayer substrate, and the substrate position offset data corresponding to the offset direction and offset amount of the position of the multilayer substrate And the image positioning unit generates the coded positioning data according to the substrate profile data or the substrate position offset data. For example, the production line coding processing system described in item 5 of the scope of patent application further includes a control module and a production database. The control module signal connects the production database and the positioning module, wherein the control module is based on The inner code obtains the predetermined position of the multilayer substrate from the production database to generate the coded positioning data. A production line encoding processing method includes: providing a multilayer substrate; reading an inner layer code of the multilayer substrate, including: emitting a radiation to the multilayer substrate; Sensing the radiation passing through the multilayer substrate to generate an inner coded image; and analyzing the inner coded image to read the inner code, wherein the intensity of the radiation is based on the clarity or The thickness of the multilayer substrate is adjusted correspondingly; a coded read data is generated according to the inner code; a substrate image of the multilayer substrate is captured; the substrate image is parsed to generate a coded positioning data; and the coded positioning data is positioned on the multilayer An outer layer code is printed at a predetermined position on an outer surface of the substrate, wherein the outer layer code corresponds to the inner layer code. For the production line encoding processing method described in item 7 of the scope of patent application, wherein parsing the substrate image to generate the encoded positioning data further includes: analyzing the substrate image to obtain the outline and size of the multilayer substrate or the position of the multilayer substrate Offset direction and offset; and generate the encoded positioning data according to the outline and size of the multilayer substrate or the offset direction and offset of the position of the multilayer substrate.

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