CN108012437B - Flexible circuit board process tracing two-dimensional code etching manufacturing method - Google Patents
Flexible circuit board process tracing two-dimensional code etching manufacturing method Download PDFInfo
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- CN108012437B CN108012437B CN201711173256.2A CN201711173256A CN108012437B CN 108012437 B CN108012437 B CN 108012437B CN 201711173256 A CN201711173256 A CN 201711173256A CN 108012437 B CN108012437 B CN 108012437B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible circuit board process tracing two-dimensional code etching manufacturing method, which comprises the following steps: the method comprises the steps of FPC pre-processing, dry film pasting, LDI exposure circuit and two-dimensional code pasting, DES, FPC intermediate processing, cover film pasting on FPC, FPC subsequent processing and the like.
Description
Technical Field
The invention relates to the technical field of flexible circuit board production, in particular to a flexible circuit board process tracing two-dimensional code etching manufacturing method.
Background
In the manufacturing industry, particularly in which the flexible circuit type (FPC for short) is large in product type and production quantity, the process flow is tedious, and the type of production equipment and the manpower demand are intensive, system software management such as MES (manufacturing enterprise production process execution system) or SFIS (field information integration system) needs to be introduced, so that all production processes from raw material entering a factory to product warehousing can be monitored, and information such as materials, equipment, data and results of product detection and the production time and personnel of the product in each process in the production process can be recorded. The system report can be used for displaying the production progress, the target achievement condition and the product quality condition of the production site in real time and the utilization condition of people, machines and materials of the production line, so that the whole production site is completely transparent. In order to achieve the purpose, the production process information of the flexible circuit board is in butt joint with a system, each product is required to be provided with an independent identity identification mark, the input system can be identified in a scanning mode to reduce manual operation, and a two-dimensional code which can contain process serial number information needs to be manufactured on each product. At present, code spraying can be realized in one process before SMT of the flexible circuit board, but the code spraying ink cannot resist liquid medicine, high temperature and high pressure, and cannot be manufactured in the process before FPC, so that the process before SMT of FPC cannot be butted with an MES system or an SFIS system. Therefore, in order to realize that more FPC manufacturing processes are brought into the automatic management and control of the system, the invention researches the flexible circuit board manufacturing process tracing two-dimensional code etching manufacturing method.
Disclosure of Invention
The invention aims to provide a flexible circuit board processing procedure tracing two-dimensional code etching manufacturing method capable of bringing an FPC manufacturing procedure into system automatic control.
In order to achieve the purpose, the technical solution of the invention is as follows:
the invention discloses a flexible circuit board process tracing two-dimensional code etching manufacturing method, which comprises the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: the LDI exposure circuit and the two-dimensional code are exposed by adopting an LDI exposure machine, and the LDI exposure machine sequentially exposes and transfers a circuit graph and a two-dimensional code graph containing serial number information generated in sequence to a dry film layer of each plate;
step four: developing, etching and stripping, wherein the circuit on each plate and the unique two-dimensional code of each plate are etched out through a developing, etching and stripping line;
step five: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step six: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step seven: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
The invention discloses a flexible circuit board process tracing two-dimensional code etching manufacturing method, which comprises the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step four: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposed film is black;
step five: developing, etching and stripping, and etching and forming the circuit on each plate and the unique two-dimensional code of each plate through DES (data encryption standard) lines;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
The invention discloses a flexible circuit board process tracing two-dimensional code etching manufacturing method, which comprises the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposed film is black;
step four: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step five: developing, etching and stripping, wherein the circuit on each plate and the unique two-dimensional code of each plate are etched and formed through a developing, etching and stripping line;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
After the scheme is adopted, the two-dimension code is set in the designated area on the flexible circuit board, the two-dimension code function software is developed on the LDI exposure machine equipment, the two-dimension code is automatically generated by the equipment software, the process serial number information contained in the two-dimension code is automatically generated by the equipment software or is extracted from the system through networking, the two-dimension code graph containing the process serial number information is sequentially transferred to each product and is manufactured by etching and forming by adopting the LDI technology, so that each product has the independent identity identification two-dimension code, and the subsequent processes from the DES process of the FPC manufacturing flow can be brought into the system for automatic control.
The invention is further described with reference to the following figures and specific embodiments.
Drawings
FIG. 1 is an exemplary etched two-dimensional code pattern of the present invention I (DM two-dimensional code forward pattern);
FIG. 2 is an exemplary etched two-dimensional code pattern of the present invention two (DM two-dimensional code negative going pattern);
FIG. 3 is an exemplary three etched two-dimensional code pattern of the present invention (QR two-dimensional code forward pattern);
FIG. 4 is an exemplary four etched two-dimensional code pattern of the present invention (QR two-dimensional code negative going pattern);
FIG. 5 is a process flow diagram of a first embodiment of the invention;
FIG. 6 is a process flow diagram of a second embodiment of the present invention;
FIG. 7 is a process flow diagram of a third embodiment of the invention.
Detailed Description
As shown in fig. 5, the present invention is a first embodiment of a flexible circuit board process tracing two-dimensional code etching manufacturing method, including the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: the LDI exposure circuit and the two-dimensional code are exposed by adopting an LDI exposure machine, and the LDI exposure machine sequentially exposes and transfers a circuit graph and a two-dimensional code graph containing serial number information generated in sequence to a dry film layer of each plate;
step four: developing, etching and stripping (DES), and etching out the lines on each plate and the unique two-dimensional code of each plate through DES lines;
step five: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step six: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step seven: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
As shown in fig. 6, the present invention is a second embodiment of a flexible circuit board process tracing two-dimensional code etching manufacturing method, including the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step four: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposure film is black so as to prevent the two-dimensional code from being exposed again;
step five: developing, etching and stripping, and etching and forming the circuit on each plate and the unique two-dimensional code of each plate through DES (data encryption standard) lines;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
As shown in fig. 7, the present invention is a third embodiment of a flexible circuit board process tracing two-dimensional code etching manufacturing method, including the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposure film is black so as to prevent the two-dimensional code from being exposed;
step four: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step five: developing, etching and stripping, and etching and forming the circuit on each plate and the unique two-dimensional code of each plate through DES (data encryption standard) lines;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
The etched two-dimensional code types are as follows:
fig. 1 is a forward graphic of a two-dimensional code type DM code of the present invention, including forward pattern points 1A and space points 2A;
fig. 2 is a negative direction graph of a two-dimensional code type DM code of the present invention, including negative direction pattern points 1B and lattice points 2B;
FIG. 3 is a diagram of a two-dimensional code of the present invention, which is a forward graph of a QR code, and includes forward pattern points 1C and space points 2C;
fig. 4 is a negative direction graph of a QR code of the two-dimensional code type of the present invention, which includes negative direction pattern points 1D and lattice points 2D;
after the scheme is adopted, the two-dimensional code containing the processing procedure serial number information is automatically generated by LDI exposure machine equipment software or is extracted from a system through networking and is etched and formed, and the two-dimensional code can be identified and read by a scanning tool, so that the functions of butt joint with the system and tracing of each subsequent processing procedure from the DES procedure of the FPC manufacturing process flow can be realized.
The two-dimensional code contains process serial number tracing information, and is different in two-dimensional code graphs according to different contained information, namely, the dot matrixes and arrangement layouts of pattern points and blank points are different, so that the two-dimensional code can be used as an identity of each board product.
Two-dimensional codes are set in a designated area on the flexible circuit board, the position is set according to specific products, 1-3 two-dimensional codes with the same information content are arranged on each board, so that one two-dimensional code cannot be identified and other same two-dimensional codes can be identified for individual reasons, and the butt joint of the processing information of each board and a system is ensured.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (2)
1. A flexible circuit board process tracing two-dimensional code etching manufacturing method is characterized in that: the method comprises the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step four: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposed film is black;
step five: developing, etching and stripping, and etching and forming the circuit on each plate and the unique two-dimensional code of each plate through DES (data encryption standard) lines;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
2. A flexible circuit board process tracing two-dimensional code etching manufacturing method is characterized in that: the method comprises the following steps:
the method comprises the following steps: a FPC (flexible printed circuit) pre-processing procedure, namely a conventional manufacturing flow before a dry film is pasted on the FPC;
step two: pasting a dry film, and pasting the dry film on the FPC;
step three: exposing the circuit, namely, adopting a conventional exposure machine to expose the circuit on a whole plate, wherein the two-dimensional code area on the exposed film is black;
step four: the two-dimension code LDI exposure is carried out, an LDI exposure machine is adopted to expose the two-dimension code, and the LDI exposure machine sequentially exposes and transfers the two-dimension code graphs containing serial number information generated in sequence to the dry film layer of the two-dimension code designated area of each plate;
step five: developing, etching and stripping, and etching and forming the circuit on each plate and the unique two-dimensional code of each plate through DES (data encryption standard) lines;
step six: the intermediate process of FPC, the routine preparation process after FPC etches, before pasting the cover film;
step seven: attaching a cover film on the FPC, wherein the cover film in the two-dimensional code area can be designed to be not windowed or windowed;
step eight: and (4) subsequent manufacture procedure of the FPC, namely manufacture according to the subsequent conventional manufacture procedure of the FPC attaching cover film.
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| CN201711173256.2A CN108012437B (en) | 2017-11-22 | 2017-11-22 | Flexible circuit board process tracing two-dimensional code etching manufacturing method |
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| CN201711173256.2A CN108012437B (en) | 2017-11-22 | 2017-11-22 | Flexible circuit board process tracing two-dimensional code etching manufacturing method |
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| CN108012437A CN108012437A (en) | 2018-05-08 |
| CN108012437B true CN108012437B (en) | 2020-03-24 |
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| CN113260161B (en) * | 2021-06-29 | 2021-09-21 | 惠州市大亚湾科翔科技电路板有限公司 | Traceable circuit board manufacturing method |
| CN116193726A (en) * | 2022-12-30 | 2023-05-30 | 深圳市蓝特电路板有限公司 | FPC (Flexible printed Circuit) identification printing method |
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| CN101426330A (en) * | 2007-10-29 | 2009-05-06 | 英业达股份有限公司 | Circuit board having bar code and manufacturing method thereof |
| CN102300413A (en) * | 2010-06-25 | 2011-12-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with identification code |
| CN104582328B (en) * | 2014-12-22 | 2017-09-29 | 东莞美维电路有限公司 | The pcb board production technology of anti-row's plate mistake |
| CN106373904B (en) * | 2016-09-29 | 2019-07-12 | 广州兴森快捷电路科技有限公司 | IC support plate production mark method |
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Address after: 361000 2nd floor, No.19, Xianghai Road, industrial zone (Xiang'an), torch high tech Zone, Xiamen City, Fujian Province Patentee after: Xiamen Hongxin Electronic Technology Group Co., Ltd Address before: 361000, No. 19, No. 1, building No. 2, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province Patentee before: XIAMEN HONGXIN ELECTRON-TECH Co.,Ltd. |
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