CN110392480B - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

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Publication number
CN110392480B
CN110392480B CN201810343544.6A CN201810343544A CN110392480B CN 110392480 B CN110392480 B CN 110392480B CN 201810343544 A CN201810343544 A CN 201810343544A CN 110392480 B CN110392480 B CN 110392480B
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China
Prior art keywords
copper foil
foil layer
inner copper
layer
processed
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CN110392480A (en
Inventor
黄百弘
刘珂
张�浩
刘家禹
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Priority to CN201810343544.6A priority Critical patent/CN110392480B/en
Publication of CN110392480A publication Critical patent/CN110392480A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Abstract

A method of manufacturing a printed circuit board includes: providing a first inner copper foil layer and a second inner copper foil layer which both comprise a plurality of positions to be processed; marking an identification code at a position to be processed of the first inner copper foil layer, reserving another position to be processed as a copper pad area, etching other positions to be processed to form a windowing area, reserving a position to be processed corresponding to the identification code of the second inner copper foil layer as the copper pad area, and etching other positions to be processed to form the windowing area; copper foil layer forms copper foil base plate in the second in respectively in first, the second, copper foil base plate includes copper foil layer in two at least in the second to identification code mark, copper pad district remain and the district etching of windowing, make the dislocation set between the different identification codes, and each identification code only corresponds with a copper pad district on other interior copper foil layers.

Description

Printed circuit board and method for manufacturing the same
Technical Field
The present invention relates to the field of circuit board manufacturing, and in particular, to a printed circuit board and a method for manufacturing the printed circuit board.
Background
In order to realize the quality control of the PCB in the production process, identification codes such as characters, one-dimensional codes, two-dimensional codes and the like are usually marked on the PCB to record the identity information of the PCB for tracing, and the recording of the PCB processing information and the tracing of the quality need to be developed layer by layer from the inner layer to the outer layer. However, the identification technology (e.g., CCD vision identification technology) needs to be performed under the condition that the identification code is directly visible. For a Build-up High Density interconnection Board (Build-up multi-layer High Density interconnection Board), since the number of layers is increased by laminating a film and a copper foil layer from a core layer by a Build-up technology, after the film and the copper foil layer are covered, an identification code of an inner layer cannot be identified, so that information of the inner layer cannot be traced. Thus, it is difficult to achieve identity concatenation between the line layers.
Disclosure of Invention
In view of the above, it is desirable to provide a printed circuit board and a method for manufacturing the same, which can solve the above problems.
The embodiment of the invention provides a manufacturing method of a printed circuit board, which comprises the following steps:
providing a first inner copper foil substrate, wherein the first inner copper foil substrate comprises an insulating base layer, a first inner copper foil layer and a second inner copper foil layer, the first inner copper foil layer and the second inner copper foil layer are formed on two opposite surfaces of the base layer, and the first inner copper foil layer and the second inner copper foil layer respectively comprise a plurality of positions to be processed which are arranged at intervals and correspond to each other one by one;
marking an identification code at one to-be-processed position of the first inner copper foil layer, reserving the other to-be-processed position as a copper pad area, etching the other to-be-processed positions to form a windowing area, reserving one to-be-processed position of the second inner copper foil layer corresponding to the identification code as the copper pad area, and etching the other to-be-processed positions to form the windowing area; and
through adding the layer method in the first copper foil layer and copper foil layer in the second on form a copper foil base plate in the second, copper foil base plate includes two at least interior copper foil layers, interior copper foil layer all includes the position of treating of a plurality of intervals setting and one-to-ones identification code mark, copper pad district remain and open the window district etching step in interior copper foil layer for the dislocation set between the different identification codes, and each identification code only with one of them in copper foil layer district correspond, in other copper foil layers with other that the identification code corresponds treat that the processing position all is etched and form open the window district, thereby obtain printed circuit board.
An embodiment of the present invention further provides a printed circuit board, including:
the first inner copper foil substrate comprises an insulating base layer, and a first inner copper foil layer and a second inner copper foil layer which are formed on two opposite surfaces of the base layer, wherein the first inner copper foil layer and the second inner copper foil layer respectively comprise a plurality of positions to be processed which are arranged at intervals and correspond to each other one by one, one of the positions to be processed of the first inner copper foil layer is marked with an identification code, the other position to be processed is reserved as a copper pad area, other positions to be processed are etched to form a windowing area, one position to be processed, corresponding to the identification code, of the second inner copper foil layer is reserved as a copper pad area, and the other positions to be processed are etched to form a windowing area;
copper foil base plate in a second, copper foil base plate includes copper foil layer in two at least in the second, interior copper foil layer form respectively in first interior copper foil layer and on the copper foil layer in the second, interior copper foil layer all includes the pending position of processing of a plurality of intervals settings and one-to-ones, interior copper foil layer also is equipped with discernment sign indicating number, copper pad district and division window district, and dislocation set between the different discernment sign indicating number, and each discernment sign indicating number only corresponds with one of them interior copper foil layer's copper pad district, other interior copper foil layers with other that discernment sign indicating number corresponds wait the processing position all etched and formed division window district.
In the printed circuit board of the embodiment of the invention, the identification codes are arranged in a staggered manner, each identification code only corresponds to one copper pad area of one of the inner copper foil substrates along the Z direction, and other inner copper foil layers and other positions to be processed P corresponding to the identification codes are etched to form the windowing area, so that the identification code of any inner copper foil layer can be scanned by X-rays, and the metal density of the identification code of any inner copper foil substrate scanned by the X-rays is the same, therefore, the parameters of the X-rays are not required to be adjusted in the reading process, and the identification code information of any inner copper foil substrate of any layer can be read by the X-rays with the same energy.
Drawings
FIG. 1 is a schematic cross-sectional view of a first inner copper foil substrate according to a preferred embodiment of the invention.
Fig. 2 is a schematic perspective view of the first inner copper foil substrate shown in fig. 1 without a base layer.
Fig. 3 is a schematic perspective view of the first inner copper foil substrate shown in fig. 2 after marking an identification code and etching a windowing region.
Fig. 4 is a schematic perspective view of the first inner copper foil substrate shown in fig. 3 after etching to form a conductive circuit.
Fig. 5 is a schematic perspective view of the second inner copper clad laminate formed on the first inner copper clad laminate shown in fig. 4.
Fig. 6 is a schematic perspective view of the second inner copper foil substrate shown in fig. 5 after the identification code is marked and the window area is etched.
Fig. 7 is a schematic perspective view of the second inner copper foil substrate shown in fig. 6 after etching a conductive line.
Fig. 8 is a schematic perspective view of a third inner copper clad laminate formed on the second inner copper clad laminate shown in fig. 7.
Fig. 9 is a schematic perspective view of the third inner copper foil substrate shown in fig. 8 after identification codes are marked, a windowing region is etched, and conductive lines are etched.
Fig. 10 is a perspective view illustrating a structure of the third inner copper foil substrate shown in fig. 9 after an outer copper foil substrate is formed thereon.
Fig. 11 is a schematic perspective view of a printed circuit board formed by marking an identification code, etching a windowing region, and etching a conductive trace on the outer copper foil substrate shown in fig. 10.
Fig. 12 is a schematic cross-sectional view of the printed circuit board shown in fig. 11.
Description of the symbols
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Referring to fig. 1 to 12, a method for manufacturing a printed circuit board 100 according to a preferred embodiment of the invention is provided. The order of the steps of the method for manufacturing the printed circuit board 100 may be changed, and some steps may be omitted or combined according to different requirements. The method of manufacturing the printed circuit board 100 includes the steps of:
referring to fig. 1, a first inner copper foil substrate 10 is provided, where the first inner copper foil substrate 10 includes an insulating base layer 11 and first inner copper foil layers L formed on two opposite surfaces of the base layer 111And a second inner copper foil layer L2. The first inner copper foil layer L1And the second inner copper foil layer L2Each comprising at least a product area 12 (only one shown) and a non-product area 13 arranged around said product area 12. Referring to fig. 2, the first inner copper foil layer L1And the second inner copper foil layer L2The non-product areas 13 each comprise M spaced positions P to be processed. Establishing a three-dimensional coordinate system X-Y-Z by taking the plane of the first inner copper foil substrate 10 as an X-Y plane, wherein the first inner copper foil layer L1And the second inner copper foil layer L2Are in one-to-one correspondence in a direction perpendicular to the first inner copper foil base plate 10 (i.e., in the Z direction). Wherein, M is a natural number, and the number of M is equal to the number of identification codes to be formed on the printed circuit board 100.
In the present embodiment, the material of the base layer 11 may be selected from one of Polypropylene (PP), Polyimide (PI), Liquid Crystal Polymer (LCP), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like.
Step two, please refer to fig. 3, the first inner copper foil layer L is arranged according to a predetermined coding rule1One of the positions P to be processed is marked with an identification code C1The first inner copper foil layer L is reserved1As a copper pad region R, another to-be-processed position P of1And etching the other M-2 positions P to be processed to form M-2 window regions W1. Retaining the second inner copper foil layerL2And the identification code C1One position P to be processed corresponding to the Z direction is taken as a copper pad area R2And etching the other M-1 positions P to be processed to form M-1 window regions W2. Thus, the identification code C1One side of the second inner copper foil layer L along the Z direction2Copper pad region R2And (7) corresponding. The coding rule records the identity information of the inner copper foil base plate of the corresponding layer for each identification code to be traced, and each identification code is associated with the identification code of the inner copper foil base plate of the previous layer. I.e. the identification code C1The identity information of the first inner copper foil substrate 10 is recorded.
In this embodiment, the identification information includes a material number, a customer version number, a factory version number, a production date, a batch number, a layer, a board order, a printed circuit board serial number, and the like of the first inner copper clad laminate 10. The material number is related to the type of the printed circuit board 100 which is used for manufacturing the first inner copper foil substrate 10, and the material numbers of the first inner copper foil substrates 10 which are used for manufacturing the printed circuit boards 100 with the same type are the same; the batch number is a batch corresponding to the first inner copper foil substrate 10 when the printed circuit board 100 for manufacturing the same material number is divided into a plurality of batches for manufacturing; the layers respectively represent the layers of the first inner copper foil substrate 10 in the finally formed printed circuit board 100.
In this embodiment, the identification code C is marked using laser marking technology1I.e. applying a high energy density laser to the first inner copper foil layer L1Irradiating to melt the surface layer material to form code holes, thereby forming the identification code C1. More specifically, the identification code C1Can be a two-dimensional code graph. The identification code C1Can be set according to the size of the non-product area 13. Of course, the identification code C1The form of (1) is not limited to the two-dimensional code pattern, but may be a number, a letter, or a combination of at least two of the above, which contains information on the first inner copper foil substrate 10.
In this embodiment, the identification code C is formed1And the copper pad region R1、R2To be processed positionP is coated with a photoresist (not shown), exposure development is performed so that the photoresist is converted into a photoresist layer, and the to-be-processed position P not covered with the photoresist layer is etched by a developing solution to form the windowing region W1、W2
Step three, please refer to fig. 4, etch the first inner copper foil layer L1And the second inner copper foil layer L2To form conductive traces 14.
In the present embodiment, the conductive line 14 is formed by an exposure and development technique.
Fourthly, please refer to fig. 5, the first inner copper foil layer L is laminated by the lamination method1And the second inner copper foil layer L2Pressing a second inner copper foil substrate 20, 20' (shown in FIG. 12) respectively to make the identification code C1Are covered on both sides. Wherein the second inner copper foil substrate 20 includes a glue layer 21 (shown in fig. 12) and a third inner copper foil layer L3The second inner copper foil substrate 20 'includes a glue layer 21' (shown in fig. 12) and a fourth inner copper foil layer L4. The third inner copper foil layer L3And the fourth inner copper foil layer L4Also includes at least a product area 22 and a non-product area 23 disposed around the product area 22. The product area 22 and the non-product area 23 are respectively connected with the first inner copper foil layer L along the Z direction1And the second inner copper foil layer L2The product area 12 and the non-product area 13 correspond to each other. The third inner copper foil layer L3And the fourth inner copper foil layer L4The non-product areas 23 each comprise M to-be-processed positions P arranged at intervals, and the third inner copper foil layer L3And the fourth inner copper foil layer L4The position P to be processed is respectively connected with the first inner copper foil layer L along the Z direction1And the second inner copper foil layer L2Are in one-to-one correspondence with the positions P to be machined.
In the present embodiment, the material of the glue layers 21 and 21' is a viscous resin, and more specifically, the resin may be at least one selected from polypropylene, epoxy resin, polyurethane, phenol resin, urea resin, melamine-formaldehyde resin, polyimide, and the like.
Step five, please refer to fig. 6, reading the identification code C1According to the coding rule and the identification code C1In the third inner copper foil layer L3And the first inner copper foil layer L1Copper pad region R1Marking an identification code C on one corresponding position P to be processed3The third inner copper foil layer L is reserved3Removing the identification code C1Another position P to be processed other than the corresponding position P to be processed is used as a copper pad area R3And etching the other M-2 positions P to be processed to form M-2 window regions W3. Etching the fourth inner copper foil layer L4M to-be-processed positions P to form M window areas W4
Thus, the identification code C3And the identification code C1And the device is arranged along the Z direction in a staggered way. The identification code C1Is in the Z direction with the third inner copper foil layer L3One of the windowed areas W3Correspondingly, the other opposite side is along the Z direction with the second inner copper foil layer L2Copper pad region R2And the fourth inner copper foil layer L4One of the windowed areas W4And (7) corresponding. I.e. the identification code C1Along the Z direction with the second inner copper foil layer L only2A copper pad region R2Corresponding to the identification code C, the other inner copper foil layers1The corresponding other positions P to be processed are etched to form the window area W3、W4. The identification code C3The identity information of the second inner copper foil substrate 20 is recorded, and the identification code C3And the identification code C1And (4) associating.
Wherein, after the second inner copper foil substrate 20 is laminated by a layer-adding method, the identification code C1Covered and not directly visible, the identification code C is scanned by X-ray penetrating the second inner copper foil substrate 201The identification code C is used1And outputting and analyzing.
Step six, please refer to fig. 7, etch the third inner copper foil layer L3And the fourth inner copperFoil layer L4To form conductive traces 24.
In the present embodiment, before the conductive traces 24 are formed, interlayer conduction processing (i.e., drilling, plating to form via holes) is performed on the second inner copper foil substrates 20 and 20'.
Step seven, please refer to fig. 8-9, continue on the third inner copper foil layer L by the layer-adding method3And the fourth inner copper foil layer L4At least one third inner copper foil substrate (not shown) is pressed on the first inner copper foil substrate. Wherein, in the third inner copper foil layer L3At least one third inner copper foil substrate formed thereon includes at least one glue layer 31 (shown in fig. 12) and a fifth inner copper foil layer L5To the 2n-1 th inner copper foil layer L(2n-1)In the fourth inner copper foil layer L4At least one third inner copper foil substrate formed thereon includes at least one glue layer 31' (shown in FIG. 12) and a sixth inner copper foil layer L6To the 2n inner copper foil layer L2nThe fifth inner copper foil layer L5To the 2n inner copper foil layer L2nAlso includes at least a product area 32 and a non-product area 33 disposed around the product area 32. The product area 32 and the non-product area 33 are respectively connected with the third inner copper foil layer L along the Z direction3And the fourth inner copper foil layer L4The product area 22 and the non-product area 23 correspond to each other. The fifth inner copper foil layer L5To the 2n inner copper foil layer L2nThe non-product areas 33 each comprise M spaced positions P to be processed, the fifth inner copper foil layer L5To the 2n inner copper foil layer L2nThe position P to be processed is respectively connected with the third inner copper foil layer L along the Z direction3And the fourth inner copper foil layer L4Are in one-to-one correspondence with the positions P to be machined.
Wherein n is a natural number, and n is greater than or equal to 3. It is understood that the value of n can be set according to specific requirements to change the number of inner copper foil layers formed, of course, when the printed circuit board 100 does not need to form the fifth inner copper foil layer L on the inner layer5To the 2n inner copper foil layer L2nWhen so, the seventh step can be omitted.
One of the inner copper foils is added each timeReading the identification code of the previous layer of inner copper foil substrate after the substrate is processed, and arranging the identification code of the previous layer of inner copper foil substrate on the fifth inner copper foil layer L according to the coding rule and the identification code of the previous inner copper foil substrate5To the 2n inner copper foil layer L2nThe above-mentioned identification code marking step (e.g., identification code C shown in the figure) is repeated5、C(2n-1)) A copper pad region reserving step (e.g., a copper pad region R shown in the figure)(2n-1)) A window etching step (e.g., window W shown in the figure)5、W6、W(2n-1)、W2n) And a conductive circuit etching step (e.g., a conductive circuit 34 shown in the figure) for arranging the identification codes of different layers in a staggered manner along the Z direction, wherein each identification code corresponds to only one copper pad region of one of the inner copper foil layers along the Z direction, and other positions to be processed P of the other inner copper foil layers corresponding to the identification codes are etched to form the windowing region.
In this embodiment, before the conductive lines are formed, interlayer conduction processing is performed on each third inner copper foil substrate.
In the present embodiment, each identification code is a character set occupying a certain width. In the present embodiment, each identification code is a character set including at least 22-bit characters. For example, the characters from 1 st to 3 rd of each identification code represent the material number, the character from 4 th represents the customer version number, the character from 5 th represents the in-plant version number, the characters from 6 th to 9 th represent the production date (wherein, the characters from 6 th to 7 th represent the production year, the characters from 8 th to 9 th represent the production month), the characters from 10 th to 13 th represent the lot number, the characters from 14 th to 15 th represent the layer, the characters from 16 th to 18 th represent the board order, and the characters from 19 th to 22 th represent the printed circuit board serial number. In the present embodiment, for the printed circuit board 100 with the same material number and the same batch number, the material number, the customer version number, the factory version number, the batch number, etc. of the identification code of each inner copper foil layer are the same as the identification code of the previous inner copper foil layer, and the difference between the layer of the identification code of each inner copper foil layer and the layer of the identification code of the previous inner copper foil layer is 1, so as to realize the association between the identification codes. The characters represented by different digits of the identification code can be referred to as shown in the following table 1.
TABLE 1
Step eight, please refer to fig. 10, the copper foil layer L continues to be formed in the 2n-1 th inner copper foil layer by the layer-adding method(2n-1)And the 2n inner copper foil layer L2nAn outer copper foil substrate (not shown) is laminated thereon. Wherein the 2n-1 th inner copper foil layer L(2n-1)The upper outer copper foil substrate includes a glue layer 41 (shown in FIG. 12) and a first outer copper foil layer L0In the 2 n-th inner copper foil layer L2nThe upper outer copper foil substrate includes a glue layer 41' (shown in FIG. 12) and a second outer copper foil layer L0', the first outer copper foil layer L0And the second outer copper foil layer L0Also includes at least one product area 42 and a non-product area 43 disposed around the product area 42. The product zone 42 and the non-product zone 43 are respectively connected with the 2n-1 th inner copper foil layer L along the Z direction(2n-1)And the 2n inner copper foil layer L2nThe product area 32 and the non-product area 33 correspond to each other. The first outer copper foil layer L0And the second outer copper foil layer L0The non-product areas 43 of' each include M spaced locations P to be processed, the first outer copper foil layer L0And the second copper foil layer L0' the position P to be processed is respectively connected with the 2n-1 th inner copper foil layer L along the Z direction(2n-1)And the 2n inner copper foil layer L2nAre in one-to-one correspondence with the positions P to be machined.
Step nine, please refer to fig. 11, in which the first outer copper foil layer L0And the 2n-1 th inner copper foil layer L(2n-1)Copper pad region R(2n-1)Marking an identification code C on one corresponding position P to be processed0And etching the second outer copper foil layer L0' M to-be-processed positions P to form M windowing regions W0', then etching said first outer copper foil layer L0And the second outer copper foil layer L0' to form conductive traces 44, thereby obtaining the printed circuit board 100.
In the present embodiment, the first outer copper foil layer L is subjected to the formation of the conductive traces 440And the second outer copper foil layer L0' interlayer conduction treatment is performed. After the conductive traces 44 are formed, the first outer copper foil layer L is treated0And the second outer copper foil layer L0' performing solder mask treatment.
It can be understood that when each of the copper foil substrates includes a plurality of product areas, the product areas of the copper foil substrates correspond to each other. After the printed circuit board 100 is manufactured, a plurality of printed circuit board units are formed in the areas corresponding to the plurality of product areas. At this time, the printed circuit board 100 is further subjected to a molding process, thereby obtaining a plurality of printed circuit board units separated from each other.
As shown in fig. 12, in the present embodiment, the identification code C is marked0Then, the adhesive layer 41 is penetrated to expose the identification code C0Corresponding copper pad region R(2n-1)And etching the identification code C0The copper portion of the watch except the code hole.
Due to the identification code C0The visual effect is direct, and the reading can be directly realized through a CCD visual identification technology. Wherein, if the identification code C0Corresponding copper pad region R(2n-1)And the identification code C0Etching away the copper part except the code hole, and reading the identification code C by CCD visual identification technology0Then, the copper pad region R can be used(2n-1)The light source is reflected, so that obvious color difference is formed between the light source and the background, and the reading effect of the identification code is enhanced.
In the printed circuit board 100 manufactured as above, the identification code of any one of the inner copper clad laminates can be scanned by using X-rays. The identification codes are arranged in a staggered mode along the Z direction, each identification code only corresponds to one copper pad area of one of the inner copper foil layers along the Z direction, other inner copper foil layers and other positions to be processed P corresponding to the identification codes are etched to form the windowing area, and the copper pad area can improve the identification rate of X-rays to the identification codes. Therefore, the metal density passed by the identification code of any layer of the inner copper foil substrate scanned by X-ray is the same. Because the glue film is less to X ray loss influence, so, need not to adjust the parameter of X ray in the reading process, the X ray of accessible equal energy reads the discernment code information of arbitrary layer other interior copper foil base plate. And after one of the inner copper foil base plates is newly added each time, the newly added identification code is associated with the identification code of the previous inner copper foil base plate, so that the identification codes do not need to be inquired layer by layer, and the identification codes of the other copper foil base plates in any other layers can be calculated according to one of the identification codes, and the full-process serial identity and cross-layer tracing detection are realized.
Referring to fig. 11 to 12, a printed circuit board 100 according to a preferred embodiment of the present invention includes a first inner copper foil substrate 10. The first inner copper foil substrate 10 includes an insulating base layer 11 and a first inner copper foil layer L formed on opposite surfaces of the base layer 111And a second inner copper foil layer L2. The first inner copper foil layer L1And the second inner copper foil layer L2On which a second inner copper foil substrate 20, 20' is formed, the second inner copper foil substrate 20 includes an adhesive layer 21 and a third inner copper foil layer L3The second inner copper foil substrate 20 includes a glue layer 21' and a fourth inner copper foil layer L4. In the third inner copper foil layer L3And the fourth inner copper foil layer L4At least one third inner copper foil substrate (not shown) is formed thereon, respectively, and the third inner copper foil layer L is formed thereon3At least one third inner copper foil substrate formed thereon comprises at least one glue layer 31 and a fifth inner copper foil layer L5To the 2n-1 th inner copper foil layer L(2n-1)In the fourth inner copper foil layer L4At least one third inner copper foil substrate formed thereon comprises at least one glue layer 31' and a sixth inner copper foil layer L6To the 2n inner copper foil layer L2n. In the 2n-1 th inner copper foil layer and the 2n nd inner copper foil layer L2nAn outer copper foil substrate (not shown) is formed thereon, and the outer copper foil substrate formed on the 2n-1 th inner copper foil layer includes a glue layer 41 and a first outer copper foil layer L0In the 2 n-th inner copper foil layer L2nThe upper outer copper foil substrate comprises an adhesive layer 41 and a second outer copper foil layer L0'. Of course, thereinIn its embodiment, said fifth inner copper foil layer L5To the 2n inner copper foil layer L2nAnd may be omitted.
The first inner copper foil layer L1And the second inner copper foil layer L2Includes at least a product area 12 and a non-product area 13 disposed around the product area 12. The third inner copper foil layer L3And the fourth inner copper foil layer L4Also includes at least a product area 22 and a non-product area 23 disposed around the product area 22. The fifth inner copper foil layer L5To the 2n inner copper foil layer L2nAlso includes at least a product area 32 and a non-product area 33 disposed around the product area 32. The first outer copper foil layer L0And the second outer copper foil layer L0Also includes at least one product area 42 and a non-product area 43 disposed around the product area 42. The product areas 12, 22, 32, 42 correspond in the Z-direction and the non-product areas 13, 23, 33, 43 correspond in the Z-direction. The non-product areas 13, 23, 33, 43 each include M spaced locations P to be processed. The first inner copper foil layer L5To the 2n inner copper foil layer L2nAnd the first outer copper foil layer L0And the second outer copper foil layer L0The positions P to be processed of the' are in one-to-one correspondence along the Z direction. Conductive traces 14, 24, 34, 44 are formed within the product areas 12, 22, 32, 42, respectively.
The first inner copper foil layer L1One of the positions P to be processed is marked with an identification code C1The other to-be-processed position P is reserved as a copper pad region R1The other M-2 positions P to be processed are etched to form M-2 window regions W1. The second inner copper foil layer L2A position P to be processed corresponding to the identification code along the Z direction is reserved as a copper pad region R2The other M-1 locations P to be processed are etched to form M-1 windows W2. Conductive traces 14 are formed in the product area 12.
The third inner copper foil layer L3And the first inner copper foil layer L1Copper pad region R1One of the corresponding positions P to be processed is marked with an identificationCode C3The identification code C is removed1Another to-be-processed position P other than the corresponding to-be-processed position P is reserved as the copper pad region R3The other M-2 positions P to be processed are etched to form M-2 window regions W3. The fourth inner copper foil layer L4Is etched to form M window regions W4
The fifth inner copper foil layer L5To the 2n inner copper foil layer L2nThe same mark is marked with identification code, copper pad area is reserved, and window area is etched. Different identification codes are arranged in a staggered mode along the Z direction, each identification code only corresponds to one copper pad area of one inner copper foil layer along the Z direction, and other positions to be processed P, corresponding to the identification codes, of other inner copper foil layers are etched to form the windowing area.
The first outer copper foil layer L0And the 2n-1 th inner copper foil layer L(2n-1)Copper pad region R(2n-1)One of the corresponding positions P to be processed is marked with an identification code C0The second outer copper foil layer L0' M to-be-processed locations P are etched to form M windows W0’。
It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.

Claims (13)

1. A method of manufacturing a printed circuit board, comprising:
providing a first inner copper foil substrate, wherein the first inner copper foil substrate comprises an insulating base layer, a first inner copper foil layer and a second inner copper foil layer, the first inner copper foil layer and the second inner copper foil layer are formed on two opposite surfaces of the base layer, and the first inner copper foil layer and the second inner copper foil layer respectively comprise a plurality of positions to be processed which are arranged at intervals and correspond to each other one by one;
marking an identification code at one to-be-processed position of the first inner copper foil layer, reserving the other to-be-processed position as a copper pad area, etching the other to-be-processed positions to form a windowing area, reserving one to-be-processed position of the second inner copper foil layer corresponding to the identification code as the copper pad area, and etching the other to-be-processed positions to form the windowing area; and
through adding the layer method in the first copper foil layer and copper foil layer in the second on form a copper foil base plate in the second, copper foil base plate includes two at least interior copper foil layers, interior copper foil layer all includes the pending position of treating of a plurality of intervals setting and one-to-one carry out identification code mark, copper pad district and remain and open window district etching step in the interior copper foil layer, make the identification code of the first interior copper foil layer of copper foil base plate in the first with dislocation set between the identification code of the interior copper foil layer of copper foil base plate in the second, and each identification code only with one of them copper pad district of interior copper foil layer correspond, other interior copper foil layers with it all is etched and forms to wait to process the position other that identification code corresponds open window district, thereby obtain printed circuit board.
2. The method of claim 1, wherein a photoresist is applied to the locations to be processed where the identification codes and the copper pad regions are formed, exposure and development are performed such that the photoresist is converted into a photoresist layer, and the locations to be processed which are not covered by the photoresist layer are etched to form the open window regions.
3. The method of claim 1, wherein the at least two inner copper foil layers of the second inner copper foil substrate include a third inner copper foil layer on the first inner copper foil layer and a fourth inner copper foil layer on the second inner copper foil layer, wherein one of the to-be-processed position mark identifiers of the third inner copper foil layer corresponding to the copper pad region of the first inner copper foil layer is marked, the other to-be-processed position of the third inner copper foil layer except the to-be-processed position corresponding to the identifier of the first inner copper foil substrate is reserved as the copper pad region, and the other to-be-processed positions are etched to form the open window region, and all to-be-processed positions of the fourth inner copper foil layer are etched to form the open window region.
4. The method of manufacturing a printed circuit board according to claim 3, wherein the at least two inner copper foil layers of the second inner copper foil substrate further include fifth to 2n-1 inner copper foil layers on the third inner copper foil layer and sixth to 2n inner copper foil layers on the fourth inner copper foil layer, wherein n is a natural number and n is greater than or equal to 3, and the steps of identification code marking, copper pad area retaining and open window area etching are performed on the fifth to 2n inner copper foil layers.
5. The method of manufacturing a printed circuit board according to claim 4, further comprising:
continuously forming an outer copper foil substrate on the inner copper foil layer on the outermost side respectively through a layer adding method, wherein the outer copper foil substrate positioned on one side of the first inner copper foil layer comprises a first outer copper foil layer, the outer copper foil substrate positioned on one side of the second inner copper foil layer comprises a second outer copper foil layer, and the first outer copper foil layer and the second outer copper foil layer respectively comprise a plurality of positions to be processed which are arranged at intervals and correspond one to one; and
and marking an identification code at one to-be-processed position corresponding to the copper pad area of the first outer copper foil layer and the nearest inner copper foil layer, and etching all to-be-processed positions of the second outer copper foil layer to form a windowing area.
6. The method of manufacturing a printed circuit board of claim 5, wherein each identification code is formed using a laser marking technique.
7. The method of claim 5, wherein the first inner copper foil layer to the 2n inner copper foil layers, the first outer copper foil layer and the second outer copper foil layer each include at least a product area and a non-product area disposed around the product area, the site to be processed is located in the non-product area, and each product area is further etched to form conductive traces.
8. The method of claim 5, wherein the outer copper foil substrate further comprises a glue layer, and the glue layer is penetrated when the identification code of the first outer copper foil substrate is marked, thereby exposing the copper pad region corresponding to the identification code of the first outer copper foil substrate and etching the surface copper portion of the identification code of the first outer copper foil substrate except for the code hole.
9. A printed circuit board comprising:
the first inner copper foil substrate comprises an insulating base layer, and a first inner copper foil layer and a second inner copper foil layer which are formed on two opposite surfaces of the base layer, wherein the first inner copper foil layer and the second inner copper foil layer respectively comprise a plurality of positions to be processed which are arranged at intervals and correspond to each other one by one, one of the positions to be processed of the first inner copper foil layer is marked with an identification code, the other position to be processed is reserved as a copper pad area, other positions to be processed are etched to form a windowing area, one position to be processed, corresponding to the identification code, of the second inner copper foil layer is reserved as a copper pad area, and the other positions to be processed are etched to form a windowing area;
copper foil base plate in the second forms respectively in first interior copper foil layer and on the copper foil layer in the second, copper foil base plate includes two at least interior copper foil layers, interior copper foil layer all includes the position of treating of a plurality of interval settings and one-to-ones, interior copper foil layer also is equipped with discerns sign indicating number, copper pad district and division window district, the discerning sign indicating number of copper foil layer in the first of copper foil base plate in the first with dislocation set between the discerning sign indicating number of copper foil layer in the copper foil base plate in the second, and each discerns the sign indicating number and corresponds with a copper pad district of copper foil layer in one of them, other interior copper foil layers with discerning other positions of treating that the sign indicating number corresponds and all being etched and forming division window district.
10. The printed circuit board of claim 9, wherein the at least two inner copper foil layers of the second inner copper foil substrate include a third inner copper foil layer on the first inner copper foil layer and a fourth inner copper foil layer on the second inner copper foil layer, wherein one of the to-be-processed positions of the third inner copper foil layer corresponding to the copper pad area of the first inner copper foil layer is marked with an identification code, the other to-be-processed positions of the third inner copper foil layer except the to-be-processed position corresponding to the identification code of the first inner copper foil substrate are reserved as the copper pad area, the other to-be-processed positions are etched to form the open window area, and all of the to-be-processed positions of the fourth inner copper foil layer are etched to form the open window area.
11. The printed circuit board of claim 10, wherein the at least two inner copper foil layers of the second inner copper foil substrate further include fifth to 2n-1 inner copper foil layers on the third inner copper foil layer and sixth to 2n inner copper foil layers on the fourth inner copper foil layer, wherein n is a natural number, n is greater than or equal to 3, and identification codes are marked on the fifth to 2n inner copper foil layers.
12. The printed circuit board of claim 9, further comprising an outer copper foil substrate formed on the outermost inner copper foil layers, wherein the outer copper foil substrate on one side of the first inner copper foil layer comprises a first outer copper foil layer, the outer copper foil substrate on one side of the second inner copper foil layer comprises a second outer copper foil layer, the first outer copper foil layer and the second outer copper foil layer each comprise a plurality of to-be-processed locations spaced apart and in one-to-one correspondence, one of the to-be-processed locations of the first outer copper foil layer corresponding to the nearest copper pad area of the inner copper foil layer is marked with an identification code, and all of the to-be-processed locations of the second outer copper foil layer are etched to form the open window area.
13. The printed circuit board of claim 12, wherein each of the inner copper foil layer, the first outer copper foil layer and the second outer copper foil layer includes at least a product area and a non-product area disposed around the product area, the to-be-processed location being located in the non-product area, each product area having conductive traces formed therein.
CN201810343544.6A 2018-04-17 2018-04-17 Printed circuit board and method for manufacturing the same Active CN110392480B (en)

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JPH03250789A (en) * 1990-02-28 1991-11-08 Toshiba Corp Multilayer printed circuit board
JP2734367B2 (en) * 1994-02-28 1998-03-30 日本電気株式会社 Multilayer printed wiring board and method of manufacturing the same
CN102300413A (en) * 2010-06-25 2011-12-28 富葵精密组件(深圳)有限公司 Manufacturing method of circuit board with identification code
CN104640370A (en) * 2013-11-14 2015-05-20 台湾暹劲股份有限公司 Method of reading barcodes of multi-layer circuit board

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