TWI391052B - Method for tracing quality of printed circuit board - Google Patents

Description

Circuit board quality tracking method

The present invention relates to the field of circuit board technologies, and in particular, to a method for tracking quality of a circuit board.

With the advancement of science and technology, printed circuit boards are widely used in the field of electronics. For application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima,M.Res.Lab,High density multilayer printed circuit board for HITAC M-880,IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425.

In the actual production process of the circuit board, a large number of circuit board semi-finished products flow into and out of each production station, and it is difficult to record the time interval in which each completed circuit board product is processed at each station. When it is found that there is a problem in the processing of a certain station of the circuit board product during the detection process, it is difficult to trace the time of processing at the corresponding station, so that it is difficult to find the production status of the station when processing the problem product. It is difficult to find the flow of other products at the same time as the problem product. In this way, the quality of the board products is difficult to track. If manual tracking is performed and records are recorded, it takes a lot of time and wastes labor costs.

In view of this, it provides an ability to effectively track the quality of circuit board products. The tracking method of the board quality is really necessary.

A method of tracking the quality of a circuit board will be described below by way of example.

A method for tracking quality of a circuit board, comprising the steps of: providing a circuit board substrate for manufacturing a multi-layer circuit board, each of the circuit board substrates comprising a plurality of product areas and a surrounding product area and a non-product located between adjacent product areas And forming a first identification code in the non-product area of each of the circuit board substrates, the first identification code is used to distinguish different circuit board substrates; the conductive lines are formed in a plurality of product areas of the circuit board substrate; The plurality of circuit board substrates of the same multilayer circuit board are pressed together to obtain a multi-layer circuit board substrate, and the plurality of product areas and the non-product areas of the plurality of circuit board substrates that are pressed together correspond to each other, and each corresponding product area constitutes a circuit board. a unit, forming a second identification code on the surface of the multilayer circuit board substrate, the second identification code being associated with the first identification code of the plurality of circuit board substrates for fabricating the same multilayer circuit board substrate; forming on the surface of each circuit board unit a third identification code, a third identification code of the circuit board unit included in the same multilayer circuit board substrate and corresponding Second identification code associated with each other, on the multilayer circuit board substrate forming process, the circuit board unit to obtain a plurality of separated from each other.

Compared with the prior art, the method for tracking the quality of the circuit board provided by the embodiment can be realized by forming different identification codes in the process of obtaining the circuit board unit product, so that it can be realized before and after each process is performed. The first identification code, the second identification code or the third identification code is read to obtain a time interval processed by each station in the circuit board unit manufacturing process. When there is a problem in processing at a certain station of the circuit board unit, the time zone in the processing of the corresponding station can be inquired during the production process of the circuit board unit. By querying the situation of the corresponding station in the corresponding time interval, it is more convenient and accurate to determine the cause of the problem of the board product at the station. And when there is a problem in the processing of a certain station of one of the circuit board products, it is easy to conveniently find a product that is processed simultaneously with the problem product to prevent the outflow of the board product having the same problem. Therefore, the tracking method of the circuit board quality provided by the embodiment can conveniently track the quality of the circuit board.

The method for tracking the quality of the circuit board provided by the technical solution is further described below in conjunction with the multiple figures and embodiments.

The first embodiment of the present invention provides a method for tracking the quality of a circuit board. The following is an example of a multi-layer circuit board quality tracking method. The quality tracking method of the circuit board includes the following steps: Providing a circuit board substrate 10 for fabricating a multi-layer circuit board having a plurality of product regions 11 and a non-product region 12 surrounding the plurality of product regions 11 and adjacent product regions 11 on each of the circuit board substrates A first identification code 13 is formed on the non-product area 12 of 10.

The circuit board substrate 10 is a copper clad laminate for fabricating a circuit board. In this embodiment, the circuit board substrate 10 is a double-sided copper clad laminate having two layers of copper foil and a layer of glue. Of course, the circuit board substrate 10 can also be a single-sided copper clad laminate of a single layer of copper foil. The number of the plurality of circuit board substrates 10 corresponds to the number of layers in the fabricated multilayer circuit board. In this embodiment, two circuit board substrates 10 are used for fabricating the inner layers of the multilayer circuit board.

In this embodiment, each of the circuit board substrates 10 includes four product areas 11, each of which is equal in size. The first identification code 13 is formed in the non-product area 12, and the position where the first identification code 13 is formed can be set according to actual needs, so that it is easy to form and facilitate scanning. In this embodiment, the first identification code 13 is formed at an edge position of the non-product area 12 of the circuit board substrate 10. The first identification code 13 can be a two-dimensional code, and the information includes the material number of the circuit board substrate 10, the number of layers corresponding to the circuit board substrate 10 used in the multilayer circuit board for manufacturing, and the circuit The batch number of the board substrate 10 and the serial number of the board substrate 10. The material number is related to the type of the multi-layer circuit board used for the circuit board substrate 10, and the circuit board substrate for manufacturing the multi-layer circuit board of the same type has the same material number. The number of layers of the circuit board substrate 10 indicates the corresponding layers of the circuit board substrate 10 in the finally formed multilayer circuit board. The batch number of the circuit board substrate 10 is a batch corresponding to the circuit board substrate 10 when the multilayer circuit board in which the same material number is produced is divided into a plurality of batches. The serial number of the board substrate 10 is the sequence number of the board substrate having the same item number, the same batch number, and the same number of layers. Thus, the different circuit board substrates 10 have a first identification code 13 containing a two-dimensional code representation of different information content. Each of the first identification codes 13 corresponds to only one of the circuit board substrates 10.

In this embodiment, the first identification code 13 is formed by a laser marking machine or a pneumatic marking machine, and the first identification code 13 forms a depression formed by the two-dimensional code pattern on the non-product area 12 of the circuit board substrate 10 to It is avoided that the first identification code 13 is removed in the subsequent processing such as brushing and cannot be recognized. The first identification code 13 may extend through the entire circuit board substrate 10 or may only penetrate a layer of copper foil or a layer of copper foil and a layer of glue in the circuit board substrate 10. The first identification code 13 is large The small size can be set according to the size of the non-product area 12, and in order to save the energy required to form the first identification code 13, it is generally convenient to perform the scanning and identification with the first identification code 13. In this embodiment, the first identification code 13 is a square figure having a side length of 6 mm.

The form of the first identification code 13 is not limited to the two-dimensional code provided in the embodiment, and may be a digit, a letter, a letter or a combination thereof containing the information of the circuit board substrate 10 described above.

In the second step, referring to FIG. 2, the conductive line 14 is formed on the plurality of product areas 11 of the circuit board substrate 10, and when the circuit board substrate 10 enters each station and exits from the station, the server respectively pairs the circuit board substrate. The first identification code 13 of 10 is read to store the circuit board substrate 10 in the processing time interval of the corresponding station.

The conductive circuit 14 of the circuit board substrate 10 is formed by etching the copper foil layer of the circuit board substrate 10, and in the process, a plurality of processes such as pressing dry film, exposure, development, and etching are required to be performed on the circuit board. The plurality of product regions 11 of the substrate 10 form conductive traces 14. When each circuit board substrate 10 enters each station, the server needs to read the first identification code 13 of the circuit board substrate 10, and after processing in the corresponding process, the circuit board substrate 10 is further processed. An identification code 13 is read so that the server can obtain the processing time of each board substrate 10 at each station. The reading of the first identification code 13 may be performed by a scanner connected to the server, and the first identification code 13 is scanned by the scanner, and the scanning information is transmitted to the server for storage. Depending on the actual production needs, the scanner can be a handheld scanner or a stationary scanner.

Before the conductive circuit is formed, the circuit board substrate 10 may be subjected to a process such as micro-etching and brushing. When the process is performed in the corresponding station, the circuit board substrate 10 needs to enter or leave the corresponding station. The first identification code 13 of the circuit board substrate 10 is scanned and read and stored in the server.

In the third step, referring to FIG. 3, a plurality of circuit board substrates 10 for fabricating the same multilayer circuit board are pressed together to obtain a multilayer circuit board substrate 20, and a plurality of product areas 11 and non-products of the plurality of circuit board substrates 10 that are pressed together The regions 12 are respectively corresponding to each other, and each of the mutually corresponding product regions 11 constitutes a circuit board unit 30, and a second identification code 21 is formed on the surface of the multilayer circuit board substrate 20, and the second identification code 21 is used to make the same multilayer circuit board. The first identification code 13 of the plurality of circuit board substrates 10 of the substrate 20 is associated.

Before the plurality of circuit board substrates 10 for fabricating the same multilayer circuit board are pressed together, the servo reads the first identification code 13 of the plurality of circuit board substrates 10 for fabricating the same multilayer circuit board. In this step, the scanner is also connected to the server for reading, and the scanner can be a palm type or a fixed type.

When the pressing is performed, the plurality of product regions 11 of the adjacent circuit board substrates 10 are mutually corresponding, and the non-product regions 12 correspond to each other. A glue layer 40 is disposed between the adjacent two circuit board substrates 10, and is heated and pressurized, so that the plurality of circuit board substrates 10 and the adhesive layer 40 located between the adjacent circuit board substrates 10 are integrated, thereby obtaining a multilayer circuit. The board substrate 20, the area corresponding to the four product areas 11, forms four circuit board units 30.

The second identification code 21 is used to distinguish different multilayer circuit board substrates 20. Real In the embodiment, the second identification code 21 is also a two-dimensional code, and the information included therein includes the item number of the multilayer circuit board substrate 20, the batch number of the production, and the serial number. The information contained in the second identification code 21 corresponds to the material number, the serial number of the production, and the serial number of the circuit board substrate 10 for fabricating the first layer of the multilayer circuit board. The different multilayer circuit board substrates 20 have different second identification codes 21. The second identification code 21 is also formed in the area corresponding to the non-product area 12, and the second identification code 21 is also formed by a laser marking machine or a pneumatic marking machine, and the second identification code 21 formed is a depression having a certain depth. Graphics. The second identification code 21 is also not limited to the two-dimensional code provided in this embodiment, and may be in other forms, such as a combination of digits and letters.

After forming the second identification code 21, the server reads the second identification code 21 to share the second identification code 21 with the first identification code 13 of the plurality of circuit board substrates 10 for fabricating the same multilayer circuit board substrate 20. Associated.

In the fourth step, the multilayer circuit board substrate 20 is subjected to interlayer conduction processing so that the conductive lines in the multilayer circuit board substrate 20 are electrically connected to each other, and when the interlayer conduction processing is performed, the multilayer circuit board substrate 20 enters each station and leaves each. The second identification code 21 of the multilayer circuit board substrate 20 is read separately at each station to obtain a time interval in which the multilayer circuit board substrate 20 is processed by the corresponding station.

When the interlayer conduction process is performed, a plurality of processes such as drilling and plating are generally included, and when each of the multilayer circuit board substrates 20 enters and exits the station corresponding to each process, the second identification of each of the multilayer circuit board substrates 20 is read. Code 21, the server obtains a time interval for each multilayer circuit board substrate 20 to perform corresponding processing.

After the step, the step of forming a solder resist layer on the surface of the multilayer circuit board substrate 20 may be further included. The multilayer circuit board substrate 20 enters and exits the soldering station, and the multilayer circuit board substrate 20 is read. The identification code 21 is used to obtain a time interval in which the multilayer circuit board substrate 20 is processed by the corresponding station.

In the fifth step, referring to FIG. 4, a third identification code 31 is formed on the surface of each circuit board unit 30, so that the third identification code 31 of the circuit board unit 30 included in the same multilayer circuit board substrate 20 and the corresponding The two identification codes 21 are associated with each other.

A third identification code 31 is formed on the surface of each of the circuit board units 30 by an automatic transcoding printer. That is, the automatic transcoding printer scans the second identification code 21, processes the information of the second identification code 21, and correspondingly prints a third identification code 31 on each circuit board unit 30, the same multilayer circuit board. The third identification code 31 of the circuit board unit 30 included in the substrate 20 is associated with the corresponding second identification code 21. In this embodiment, the third identification code 31 is also a two-dimensional code, and the information included therein has the item number, the batch number, the serial number and the position number of each circuit board unit 30. among them. The material number, batch number and serial number of each circuit board unit 30 are the same as the material number, batch number and serial number of the second identification code 21 of the corresponding multilayer circuit board substrate 20, and the position numbers are used to indicate each The circuit board unit 30 is positioned in the multilayer circuit board substrate 20 to distinguish the plurality of circuit board units 30 included in the same multilayer circuit board substrate 20.

In the sixth step, referring to FIG. 5, the multilayer circuit board substrate 20 is subjected to a molding process to obtain a plurality of circuit board units 30 separated from each other.

The plurality of circuit board units 30 can be separated from the multilayer circuit board substrate 20 by a punching type to obtain a plurality of circuit board units 30 separated from each other.

After the plurality of circuit board units 30 are formed by molding, the processing, the electrical measurement, the product inspection, and the packaging are processed for each circuit board unit 30, and each pair of circuit board units 30 enters and leaves each process. At the station, it is necessary to read the third identification code 31 of each board unit 30 to obtain the time interval in which each board unit 30 performs the process.

The method for tracking the quality of the circuit board provided in this embodiment can also be used to track the quality of the single-sided or double-sided circuit board. When the method is used to track the quality of a single-sided or double-sided circuit board, after the second step processing, the processing of the third step and the fourth step is not performed, and the subsequent fifth step and subsequent steps are directly performed. That is, the circuit board quality tracking method includes the steps of: providing a circuit board substrate, the circuit board substrate comprising a plurality of product areas and a non-product area surrounding the plurality of product areas and the adjacent product areas, forming a first in the non-product area An identification code; forming a conductive line in a plurality of product areas of the circuit board substrate, each product area correspondingly forming a circuit board unit, and in the process of forming the conductive line, when the circuit board substrate enters and leaves each station, the server pair The first identification code of the circuit board substrate is read to store the circuit board substrate in the time interval for processing by the corresponding station to the server; a second identification code is formed on the surface of each circuit board unit, and the same circuit board substrate comprises The second identification code of the circuit board unit is associated with the first identification code; and the circuit board substrate is shaped to obtain a plurality of circuit boards separated from each other unit. Moreover, when performing processing detection after molding, when each circuit board unit enters or leaves each station, the server reads the second identification code of each circuit board unit to store the circuit in the server. The time interval in which the board unit is processed in the corresponding station.

The method for tracking the quality of the circuit board provided in this embodiment can form a different identification code in the process of obtaining the circuit board unit product, so that the corresponding first identification code can be realized before and after each process is performed. The second identification code or the third identification code is read to obtain a time interval for processing each workstation in the circuit board unit manufacturing process. When there is a problem in processing at a certain station of the circuit board unit, the time interval in the processing of the corresponding station can be inquired during the production process of the circuit board unit, and the situation of the corresponding station in the corresponding time interval can be queried, thereby being more convenient and Accurately determine the cause of the problem with the board product at the station. And when there is a problem in the processing of a certain station of one of the circuit board products, it is easy to conveniently find a product that is processed simultaneously with the problem product to prevent the outflow of the board product having the same problem. Therefore, the tracking method of the circuit board quality provided by the embodiment can conveniently track the quality of the circuit board.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Circuit board

11‧‧‧Product area

12‧‧‧Non-product area

13‧‧‧First identification code

14‧‧‧Electrical circuit

20‧‧‧Multilayer circuit board substrate

21‧‧‧Second identification code

30‧‧‧Circuit unit

31‧‧‧ Third identification code

40‧‧‧ glue layer

1 is a first identification of a circuit board substrate provided by an embodiment of the present technical solution. Schematic diagram after the code.

FIG. 2 is a schematic diagram of a circuit board substrate provided by an embodiment of the present technical solution after forming a conductive line.

FIG. 3 is a schematic diagram of a multi-layer circuit board substrate obtained by pressing and forming a second identification code according to an embodiment of the present technical solution.

FIG. 4 is a schematic plan view showing a third identification code formed by each circuit board unit according to an embodiment of the present technical solution.

FIG. 5 is a schematic diagram of a formed circuit board unit provided by an embodiment of the present technical solution.

21‧‧‧Second identification code

30‧‧‧Circuit unit

31‧‧‧ Third identification code

Claims (8)

A method for tracking quality of a circuit board, comprising the steps of: providing a circuit board substrate for manufacturing a multi-layer circuit board, each of the circuit board substrates comprising a plurality of product areas and a surrounding product area and a non-product located between adjacent product areas And forming a first identification code in the non-product area of each of the circuit board substrates, the first identification code is used to distinguish different circuit board substrates; the conductive lines are formed in a plurality of product areas of the circuit board substrate; The plurality of circuit board substrates of the same multilayer circuit board are pressed together to obtain a multi-layer circuit board substrate, and the plurality of product areas and the non-product areas of the plurality of circuit board substrates that are pressed together correspond to each other, and each corresponding product area constitutes a circuit board. a unit, forming a second identification code on the surface of the multilayer circuit board substrate, the second identification code being associated with the first identification code of the plurality of circuit board substrates for fabricating the same multilayer circuit board substrate; forming on the surface of each circuit board unit a third identification code, a third identification code of the circuit board unit included in the same multilayer circuit board substrate and corresponding The second identification code is associated with each other, and the third identification code is formed by printing on the circuit board unit by an automatic transcoding printer, and the automatic transcoding printer scans the second identification code to pass the second identification The information of the code is processed, and a third identification code is formed on each of the circuit board units corresponding to the second identification code; and the multi-layer circuit board substrate is subjected to molding processing, thereby obtaining a plurality of circuit board units separated from each other. The method for tracking the quality of a circuit board according to the first aspect of the invention, wherein the first identification code and the second identification code are formed by a laser marking machine or a pneumatic marking machine, and the first identification code is Non-product area in the board substrate The recessed pattern is formed, and the second identification code is a recessed pattern formed by the corresponding area of the non-product area in the multilayer circuit board substrate. The method for tracking the quality of a circuit board according to the first aspect of the invention, wherein the method for tracking the quality of the circuit board further comprises: when forming the conductive circuit, when the circuit board substrate enters and leaves each station, the server pair The first identification code of the circuit board substrate is read to store the circuit board substrate in the time interval of processing by the corresponding workstation to the server; after the second identification code is formed on the multilayer circuit board substrate, the multilayer circuit board substrate is Inter-layer conduction processing, respectively reading the second identification code of the multi-layer circuit board substrate when the multi-layer circuit board substrate enters each station and leaves each station, to obtain a time interval in which the multi-layer circuit board substrate is processed at the corresponding station; After forming the plurality of circuit board units, the processing, the electrical measurement, the finished product inspection, and the packaging process are performed for each circuit board unit. When each pair of circuit board units enters and leaves each station corresponding to each process, the servo The device reads the third identification code of each circuit board unit to obtain a time interval in which each circuit board unit performs the processing of the circuit. The method for tracking the quality of a circuit board according to claim 1, wherein the server reads the first identification code, the second identification code, and the third identification code by a scanner connected to the server. The scanner is a stationary scanner or a handheld scanner. The method for tracking the quality of a circuit board according to the first aspect of the invention, wherein the first identification code, the second identification code and the third identification code are both a two-dimensional code or a graphic composed of letters or digits. The method for tracking the quality of a circuit board according to the first aspect of the invention, wherein the information included in the first identification code comprises a material number of the circuit board substrate, and the circuit board substrate is used in the multilayer circuit board for manufacturing the same. Corresponding layers, The serial number of the circuit board substrate and the serial number of the circuit board substrate. The second identification code includes information including the material number of the multilayer circuit board substrate, the batch number of the multilayer circuit board substrate, and the serial number of the multilayer circuit board substrate. The information included in the third identification code includes the material number of the circuit board unit, the batch number of the circuit board unit, the serial number of the circuit board unit, and the position label of the circuit board unit in the multilayer circuit board substrate. The method for tracking the quality of a circuit board according to the sixth aspect of the invention, wherein the second identification code includes a material number of the multilayer circuit board substrate, a batch number of the multilayer circuit board substrate, and a multilayer circuit board substrate. The serial number corresponds to the material number of the circuit board substrate of the first circuit board substrate in the multilayer circuit board substrate, the batch number of the circuit board substrate, and the serial number of the circuit board substrate. The method for tracking the quality of a circuit board according to the sixth aspect of the invention, wherein the third identification code of the circuit board unit includes a material number of the circuit board unit, a batch number of the circuit board unit, and a circuit board unit. The serial number corresponds to the material number of the multilayer circuit board of the second identification code of the multilayer circuit board corresponding to the circuit board unit, the batch number of the multilayer circuit board substrate, and the serial number of the multilayer circuit board substrate.