.200838375 九、發明說明： 【發明所屬之技術領域】 本發明係有關於堆疊複數層樹脂絶緣層而具有配置外 層金屬層於其表層的構造，被區劃爲應成爲製品之部分的 製品形成區域、與包圍該製品形成區域的外框部分之積層 基板及其製造方法。 【先前技術】 近年來，已熟知有被稱爲所謂多數個取出的方法，作 爲用於效率佳地製造配線基板等製品之一方法（例如參照 專利文獻1 )。在該方法中，如例如第1 8圖所示，針對貼 著於成爲矩形狀之內核層1 0 1雙面上的銅箔進行鈾刻，在 製品形成區域104之表面上形成內層導體層105，同時在 外框部分1 08之表面上形成篩網狀導體層1 06。其次，在 內核層1 0 1的上面及下面堆疊預浸漬層以形成外部中芯層 102，在二層外部中芯層102的表層（製品形成區域104 ) 上進行各別配置堆疊層1 0 3等，以製造配線基板的中間製 品1 00。再者，沿著製品形成區域1 04的邊界線（圖示略） 分割該中間製品1 00，而得到複數個製品。 但是，在該種中間製品1 00中，在包圍製品形成區域 1 04的外框部分1 〇 8，附加用於辨別製品種類的標誌（文字 等）。一般使用分散器或麥克筆並在外框部分表面進行油墨 的塗布，作爲該附加標誌的方法。但是，在塗布油墨的情 況下，在之後的步驟中標誌被消除的可能性高。因此，爲 了解決該問題，較佳爲例如一方面形成刻印部分1 0 9於外 200838375 框部分表面（參照第1 8圖）。 【專利文獻1】特開2 0 0 2 - 1 8 7 9 5號公報（第1圖等） 【發明內容】 但是’如第1 8圖所示，在內核層1 〇 1的外框部分1 〇 8 的表面上，存在篩網狀導體層106存在的區域與不存在的 區域。其在刻印部分1 0 9之正下方的位置亦相同。在該情 況下，在刻印部分1 09的形成時受到衝撞時，應力集中於 篩網狀導體層1 0 6的邊緣（例如參照A 1 )等，在篩網狀導 體層106與外部中芯層102的邊界部分變得容易產生破裂 110° 還有，若在破裂1 1 0產生時點切離外框部分1 〇 8，在 製品形成區域1 04中破裂1 1 0之影響擴及的可能性小。然 而通常爲了必須確保形成堆疊層1 0 3時的作業性，外框部 分1 〇 8則在堆疊層1 0 3形成後被切離。該結果爲有在堆疊 層1 03形成時破裂1 1 〇在製品形成區域1 04中進行的可能 性。又，在堆疊層1 0 3形成時進行重複電鍍步驟時，經由 破裂1 1 0而使電鍍液浸入內部，再者亦有該電鍍液沿著篩 網狀導體層1 〇 6流入製品形成區域1 0 4的可能性。在該等 情況下，位於刻印部分1 09附近之製品（即，位於製品形 成區域104之最外周圍部分的製品）的外部中芯層102或 內層導體層1 〇 5變得容易剝離。所以，內核層1 〇丨及外部 中芯層1 0 2的信頼性降低，進而連帶使成爲製品之配線基 板的信頼性降低。 本發明係鑑於上述課題者，其第1目的在於藉由防止 200838375 產生於樹脂絶緣層的破裂或樹脂絶緣層的剝離，提供可賦 予高信頼性的積層基板。又，第2目的在於提供上述適當 之積層基板的製造方法。 然後用於解決上述課題的手段（手段1 )方面，有一 種積層基板，其特徵爲堆疊複數層樹脂絶緣層而具有配置 外層金屬層於其表層的構造，區劃爲沿著基板平面方向複 數配置應成爲製品之部分的製品形成區域、與包圍該製品 形成區域的外框部分，在前述外框部分之前述複數層樹脂 絶緣層彼此之間形成篩網狀導體層或散點狀導體層，在前 述外框部分之前述外層金屬層設置刻印部分的積層基板 上，在前述篩網狀導體層或前述散點狀導體層中成爲前述 刻印部分之正下方的位置上，設定前述篩網狀導體層或前 述散點狀導體層均不存在的空白區域。 又，用於解決上述課題的其他手段（手段2 )方面， 其要旨爲有一種積層基板，其特徵爲在堆疊複數層樹脂絶 緣層而具有配置外層金屬層於其表層的構造，區劃爲沿著 基板平面方向複數配置應成爲製品之部分的製品形成區 域、與包圍該製品形成區域的外框部分，在前述外框部分 中之前述複數層樹脂絶緣層彼此之間形成篩網狀導體層或 散點狀導體層，在前述外框部分之前述外層金屬層設置刻 印部分的積層基板上，在前述篩網狀導體層或前述散點狀 導體層中成爲前述刻印部分之正下方的位置，設定不具有 沖壓圖案的平面狀導體區域。 因此，由於在手段1、2的積層基板上，在刻印部分之 200838375 正下方設定篩網狀導體層或散點狀導體層不存在的部分 (即，空白區域或平面狀導體區域），故應力集中容易的凹 凸構造根本不存在，在樹脂絶緣層變得難以產生破裂。因 此’防止破裂在製品形成區域進行，或經由破裂所浸入的 液體沿著篩網狀導體層或散點狀導體層流入製品形成區 域，可防止在製品形成區域之樹脂絶緣層的剝離。所以， 可防止積層基板良率的降低，同時賦予高信賴信於積層基 板。 又，在藉由塗布油墨等來附加標誌的情況下，在標誌 形成後經過使用酸性或鹼性藥液的步驟時，標誌消滅了。 另外，在手段1、2中，則藉由形成刻印部分以附加標誌。 由於該刻印部分係藉由機械變形外層金屬層的一部分而形 成者，即使在刻印部分形成後經過使用上述藥液的步驟， 亦保持刻印部分的形狀而未消滅。因此，在使用刻印部分 作爲例如辨別製品種類之標誌的情況下，可確實地辨別製 品的種類。 還有，外層金屬層方面，舉出有藉由針對樹脂絶緣層 的表層實施電鍍所形成的電鍍層、貼著於樹脂絶緣層之表 層的金屬箔、藉由塗布或印刷金屬糊而形成的金屬層等。 其中，所謂前述製品形成區域，係指沿著基板平面方 向縱橫地複數配置應成爲製品之的區域。一般而言’前述 樹脂絶緣層、製品形成區域及應成爲製品的部分’任一者 均形成爲平視約略矩形狀。又’應成爲製品之部分的面積 則被設定爲比製品形成區域的面積小很多。因此，在製品 200838375 形成區域內，配置例如數個至數百個應成爲製品的部分。 另外，外框部分係與製品不只在製造時從製品形成區域分 離、除去的部分，並包圍著製品形成區域。 還有，所謂前述刻印部分，係指藉由在外層金屬層之 一部分賦予凹凸而形成的識別符號。刻印部分方面，舉出 有文字、記號、繪圖等。刻印部分的深度隨著積層基板形 成時之外層金屬層的厚度而定，較佳爲例如1 0 V m以上8 0 // m以下，例如較佳爲3 0 // m。假設刻印部份的深度低於 ^ 1 0 // m時，之後有刻印部份被消除的可能性。另外，刻印 部份的深度超過8 0 // m時，則因在刻印部份形成時所施加 的衝撃而使在外層絶緣層變得容易產生破裂，進而連帶使 在樹脂絶緣層上亦變得容易產生破裂。 又所謂「篩網狀導體層」係表示具有例如格子狀或鋸 齒狀之沖壓圖案的導體層。「篩網狀導體層」係可藉由配置 帶狀圖案成爲格子狀而形成。還有，相鄰的帶狀圖案被配 置成約略固定間隔。因此，在前述外框部分中並在篩網狀 導體層存在之區域的表面上，存在由帶狀圖案存在的區域 與帶狀圖案不存在的區域所構成的凹凸。所謂「散點狀導 體層」係表示由分隔成散點狀（例如格子狀或鋸齒狀等） 所配置之複數個小面積導體圖案所構成的導體層。各個小 面積導體圖案的形狀爲任意的，例如，有三角形、四角形、 六角形、圓形等。另外，所謂「空白區域」係在外框部分 的表面上，上述篩網狀導體層或散點狀導體層均不存在的 區域（但是，除了形成位置決定孔的區域以外）。因此，由 -10- 200838375 於在空白區域的表面如上述的凹凸不存在，故無因在刻印 部之形成時所施加的衝撞而集中應力於空白區域的一部 分。又，所謂「不具有沖壓圖案的平面狀導體區域」，係表 示由於在外框部分的表面上篩網狀或散點狀均無的導體 層、總之不具有沖壓圖案，故在表面無凹凸的更佳形狀導 體。因此，由於該平面狀導體區域的表面上亦不存在如上 述的凹凸，故無因在刻印部分之形成時所施加的衝撞而集 中應力於平面狀導體區域的一部分。 還有，空白區域（或平面狀導體區域）的面積，較佳 爲至少與刻印部分之形成區域的面積相等，特佳爲比刻印 部分之形成區域的面積大。假設，空白區域（或平面狀導 體區域）的面積比刻印部分之形成區域的面積小時，由於 變成在刻印部分正下方的一部分存在篩網狀導體層（或散 點狀導體層），因在刻印部分之形成時所施加的衝撞而集中 應力於篩網狀導體層（或散點狀導體層），變得容易在樹脂 絶緣層產生破裂。 其中，前述空白區域亦可被擋板狀導體包圍。無擋板 狀導體時，則有在積層配線基板的製造過程中電鍍液等液 體侵入空白區域而使該部分的密著性降低的可能性。相對 於此，若以擋板狀 導體包圍空白區域’隔開空白區域與在其周圍的篩網 狀導體層（或散點狀導體層）’確實地阻止對於空白區域內 之液體的侵入。因此，可確實防止在空白區域之密著性的 降低，進而連帶變得容易達成信頼性的提升。 -11- 200838375 又，在手段1或2中的前述積層基板，較佳爲被使用 作爲在積層基板主面及積層基板內面中至少一者具備絶緣 層與導體層交互積層所構成的堆疊層的堆疊多層配線基板 中的中芯層基板用。若如此一來，由於在堆疊層亦可形成 電路，可謀求積層基板的高機能化。還有，雖然堆疊層亦 可僅形成於積層基板主面及積層基板內面中任一者，但較 佳爲形成於積層基板主面及積層基板內面二者。若爲如此 之構成，由於在形成於積層基板主面的堆疊層與形成於積 層基板內面的堆疊層二者上可形成電路，可謀求積層基板 之更進一步高機能化。 然後用於解決上述課題之另一其他手段（手段3 )方 面，爲記載於上述手段1或2的積層基板製造方法，其要 旨爲一種基層基板的製造方法，其特徵爲包含在前述外框 部分之表面上形成前述篩網狀導體層或散點狀導體層，準 備在形成前述篩網狀導體層或散點狀導體層的區域內設定 前述空白區域或前述平面狀導體區域之內層用的樹脂絕緣 層之準備步驟；堆疊前述內層用之樹脂絶緣層、外層用之 樹脂絶緣層及金屬箔，並進行一體化，以形成積層基板本 體之積層步驟；在前述製品形成區域形成貫通前述積層基 板本體之貫穿孔導體之貫穿孔導體形成步驟；與在包含前 述金屬箔所構成之前述外層金屬層中，藉由刻印成爲前述 空白區域或前述平面狀導體區域之正下方處，設置前述刻 印部分於前述外層金屬層之刻印步驟。 因此’根據手段3的製造方法，在刻印步驟中，在成 -12- 200838375 爲空白區域或平面狀導體區域之正上方處設置刻印部分。 因此，即使在刻印部分之形成時施加衝撞，由於該衝撞的 大部分傳達至凹凸構造不存在的空白區域或平面狀導體區 域，故難以在樹脂絕緣層產生起因於應力集中的破裂。因 而，防止在製品形成區域進行破裂，或經由破裂而使所浸 入之液體沿著篩網狀導體層或散點狀導體層流入製品形成 區域，可防止在製品形成區域之樹脂絶緣層的剝離。所以， 可防止積層基板的良率降低，同時可賦予高信賴性於積層 基板。 以下，說明相關於手段3之積層基板的製造方法。 首先，在準備步驟中，在前述外框部分的表面上形成 前述篩網狀導體層或散點狀導體層，並在形成前述篩網狀 導體層或散點狀導體層之區域內，準備設定前述空白區域 或前述平面狀導體區域之內層用樹脂絶緣層。其中，形成 內層用樹脂絶緣層之基材的材料方面並無特別限定，較佳 的內層用樹脂絶緣層係以聚合物材料爲主體所形成。用於 形成內層用樹脂絶緣層之聚合物材料的具體範例方面，例 如有EP樹脂（環氧樹脂）、Pi樹脂（聚醯亞胺樹脂）、BT 樹脂（雙順丁烯醯亞胺•三肼樹脂）、p p E樹脂（聚苯醚樹 脂）等。此外，亦可使用彼等樹脂與玻璃纖維（玻璃織布 或玻璃不織布）或聚醯胺纖維等有機纖維的複合材料。 還有’在前述準備步驟中，較佳爲於預備在其表面具 有內層導體層形成用金屬層之內層用的樹脂絶緣層後，鈾 刻其內層導體層形成用金屬層，並在前述製品形成區域的 -13· 200838375 表面形成內層導體層，而且形成在外框部分表面設定前述 空白區域或前述平面狀導體區域的前述篩網狀導體層或前 述散點狀導體層。若如此一來，由於在形成篩網狀導體層 或散點狀導體層之時點亦形成成爲製品之一部份的內層導 體層’可效率佳地製造製品。還有，在前述準備步驟中， 亦可形成包圍前述空白區域的擋板狀導體。 再者’在前述準備步驟中，較佳爲進行在預備在其表 面具有內層導體層形成用金屬層之內層用的樹脂絶緣層 後’在其內層導體層形成用金屬層上設置賦予感光性之抗 蝕劑材料的步驟；在前述抗蝕劑材料上配置形成既定遮罩 圖案之曝光用遮罩的步驟；經由前述曝光用遮罩並曝光前 述抗鈾劑材料的步驟；顯像前述抗蝕劑材料以形成抗蝕劑 的步驟；以及，蝕刻前述內層導體層形成用金屬層，並在 前述製品形成區域的表面形成內層導體層，而且在前述外 框部之表面形成設定前述空白區域或前述平面狀導體區域 之前述篩網狀導體層或散點狀導體層的步驟。若如此一 來，使用與習知相同的方法並僅變更曝光用遮罩的遮罩圖 案，可形成設定空白區域或平面狀導體區域的篩網狀導體 層或散點狀導體層。因此，可防止在積層基板的製造中必 要之步驟數目的增加，可防止積層基板之製造成本的上升。 接著在積層步驟中，藉由堆疊前述內層用的樹脂絶緣 層、外層用的樹脂絶緣層與金屬箔並進行一體化，以形成 積層基板本體。還有，外層用的樹脂絶緣層方面並無特別 的限定，較佳爲例如預浸漬層。其中，所謂「預浸漬層」 -14- 200838375 % 係表示在玻璃纖維（玻璃織布或玻璃不織布）或紙等的基 材上，含浸已調整之樹脂清漆並乾燥處理的半硬化狀態板 材。壓著預浸漬層時的溫度方面，較佳爲例如10(TC以上 2 3 (TC以下，壓著預浸漬層時的壓力方面，較佳爲例如 0.5MPa以上5MPa以下。 接著在貫穿孔導體形成步驟中，在前述製品形成區域 形成貫通前述積層基板本體之貫穿孔導體。又，在刻印步 驟中，在包含前述金屬箔所構成之前述外層金屬層，藉由 ‘ 刻印成爲前述空白區域或前述平面狀導體區域之正上方 處，設置前述刻印部分於前述外層金屬層。還有，在進行 貫穿孔導體形成步驟後進行刻印步驟，或進行刻印步驟後 進行貫穿孔導體形成步驟均可。然後，在貫穿孔導體形成 步驟及刻印步驟兩者結束的時點，完成積層基板。 還有，在積層基板的完成後，亦可在積層基板主面及 積層基板內面、或既已形成之絶緣層上實施形成絶緣層的 _ 絶緣層形成步驟，與形成既定圖案之導體層的導體層形成 k 步驟。其中，若交互實施絶緣層形成步驟與導體層形成步 驟’可形成交互積層導體層與絶緣層所構成的堆疊層於積 層基板上，並可形成製品。還有，在絶緣層上，爲了形成 用於層間連接的連接導體，亦可預先形成連接孔（盲孔’ b 1 i n d h ο 1 e ) ° 然後，若從製品之中間製品的製品形成區域除去外框 部分，同時沿著在製品形成區域的裁斷預定線裁斷以分割 製品彼此，則得到複數件的製品。還有，所謂製品之中間 -15- .200838375 製品係相對於製品之完成品的槪念，具體而言係指出製品 彼此的分割未結束之狀態的製品。 【實施方式】 實施發明之最佳形態 以下，基於圖式詳細說明具體化本發明之一實施樣態。 如第1圖所示，本實施樣態之配線基板的中間製品 1 〇，係由平視約略矩形板狀的中芯層基板11 (積層基板）、 在中芯層基板11之積層基板主面12(在第1圖上爲上面） 上所形成之第1堆疊層層31、與在中芯層基板11之積層 基板內面13(在第1圖中爲下面）上所形成之第2堆疊層 3 2所構成。即，中芯層基板1 1係被用作爲堆疊多層配線 基板中的中芯層基板用。 如第1圖、第2圖所示，中芯層基板1 1係被區劃成沿 著基板平面方向複數配置應成爲製品之部分1 4的製品形 成區域1 5、與包圍該製品形成區域1 5的外框部分1 6 (製 品外區域）。應成爲製品之部分1 4成爲任何平視約略矩形 ( 狀，而在製品形成區域1 5內縱橫地平均配置複數個。因 此，製品形成區域1 5亦成爲平視約略矩形狀。又如第2圖 所示，在外框部分1 6所相對向的2邊上，個別設置著用於 決定中芯層基板1 1位置的位置決定孔5 1、5 2。 如第1圖所示，中芯層基板11具有堆疊其爲內層用樹 脂絶緣層的內核層1 7與其爲外層用樹脂絶緣層的外部中 芯層2 0而一體化的構造。在本實施樣態中，內核層1 7爲 由玻璃環氧樹脂所構成之平視約略矩形狀的基板。另外， -16- .200838375 外部中芯層2 0係各別形成於內核層上面1 8及內核層下面 1 9、並含浸環氧樹脂等有機材料於玻璃布等無機材料中所 構成之平視約略矩形狀的基板。 又，在中芯層基板Π上形成貫穿孔24，並在該貫穿 孔24的內緣表面上形成用於謀求前述堆疊層31、32彼等 之電氣連接的貫穿孔導體25。在貫穿孔導體25中的空洞 部分塡充塡充材料26。 如第1圖所示，在製品形成區域1 5的內核層上面1 8 ^ 上及內核層下面19上，個別配置由銅所構成的內層導體層 2 1。再者，在製品形成區域1 5中，在形成於內核層上面 18之外部中芯層20上面（即前述積層基板主面12)、及形 成於內核層下面19之外部中芯層20下面（即前述積層基 板內面1 3 )上，個別設置導體圖案2 3。 前述第1堆疊層31具有交互積層由環氧樹脂所構成之 絶緣層3 3、3 4、3 5與由銅所構成之導體層3 6的構造。在 絶緣層33、34、35內的複數位置上形成連接導體37，導 體層3 6係電氣連接於連接導體3 7等。又，在最上層的絶 緣層3 5表面上而成爲各連接導體3 7上端的位置上，使端 子襯墊3 8形成陣列狀。再者，絶緣層3 5的表面係以抗焊 劑3 9約略全體地覆蓋。還有，端子襯墊3 8成爲暴露狀態， 在端子襯墊3 8的表面上配設複數個焊料泵（圖示略）。 如第1圖所示，前述第2堆疊層32具有與上述第1堆 疊層31大約相同的構造。即，第2堆疊層32具有交互積 層由環氧樹脂所構成之絶緣層40、41、42與導體層36的 -17- 200838375 構造。在絶緣層40、41、42內的複數位置上形成連接導體 37，而導體層36則電氣連接於連接導體37等。又’在最 下層之絶緣層42下面而成爲各連接導體37之下端的位置 上，使端子襯墊4 3形成爲格子狀。再者，絶緣層4 2的下 面係以抗焊劑4 4約略全體地覆蓋。還有，端子襯墊4 3成 爲暴露的狀態，在端子襯墊4 3的表面上，配設無圖示之用 於謀求與主板之電氣連接的複數個焊料泵（圖式略）。然 後，藉由各焊料泵，將中間製品1 〇封裝於主板。 r 還有，如第2圖所示，該配線基板的中間製品1 〇則沿 著應成爲製品之部分1 4的外形線裁斷。將沿著該等外形線 的線定義爲裁斷預定線45。 如第1圖、第2圖、第7圖所示，在前述外框部分1 6 之前述內核層1 7與前述外部中芯層20之間、即在外框部 16的前述內核層上面18上及前述內核層下面19上，形成 由銅所構成的篩網狀導體層22。詳細而言，篩網狀導體層 22係藉由配置帶狀圖案成格子狀而形成的導體層。然後， " 篩網狀導體層22係形成矩形外框狀成爲包圍前述製品形 成區域1 5。篩網狀導體層22的外緣係與內核層1 7的外緣 一致，而篩網狀導體層2 2的內緣則位於外框部分1 6與製 品形成區域1 5的邊界線上。還有在本實施樣態中，篩網狀 導體層22係g又疋其厚度爲35// m。再者’在形成於內核層 上面1 8上的篩網狀導體層2 2上，則設定相同篩網狀導體 層22不存在的空白區域27。空白區域27成爲長8111111><寬 4 0mm的平視矩形狀，並在外框部份丨6之具有前述位置決 -1 8 - 200838375 定孔5 1、5 2的邊上，避開位置決定孔5 1、5 2而配置著。 又，空白區域27係配置於篩網狀導體層22之外緣與內緣 的中間部分。 如第1圖、第2圖、第12圖所示，在外部中芯層20 的表層、即在外框部分16之前述積層基板主面12上及前 述積層基板內面13上，配置外層金屬層61。外層金屬層 6 1係形成矩形外框狀成爲包圍製品形成區域1 5的平面狀 導體，還有外層金屬層6 1的外緣係與外部中芯層20的外 r 、緣一致，外層金屬層6 1的內緣則位於外框部分1 6與製品 形成區域1 5的邊界線上。又，外層金屬層6 1係設定成構 成前述第1堆疊層31之前述導體層36厚度的大約4倍。 在本實施樣態中，設定導體層3 6的厚度爲2 5 // m，並設定 外層金屬層61的厚度爲約l〇〇#m。 又，在外框部分1 6而配置於積層基板主面1 2上的外 層金屬層6 1上，設置著刻印部分62。刻印部分62係由顯 f 示批號或物品編號等的文字（在本實施樣態中爲「ABCDE」 的文字）所構成。刻印部分62係在具有外框部分1 6之前 述位置決定孔5 1、5 2的邊上，避開位置決定孔5 1、5 2而 配置著。又，刻印部分6 2係配置在外層金屬層6 1之外緣 與內緣的中間部分。本實施樣態的刻印部分6,2爲長6mmx 寬6mm左右的文字，刻印部62的深度係設定爲30 // m左 右。還有，前述空白區域27係設定於在前述篩網狀導體層 2 2中成爲刻印部份6 2之正下方的位置。空白區域2 7的面 積係設定約略大於刻印部份62之形成區域的面積。因而， -19- .200838375 在刻印部份62的正下方，成爲空白區域27的位置。 其次，說明配線基板之中間製品1 〇的製造方法。 其中首先製造中芯層基板Π。在準備步驟中，在長 410mmx寬43 0mmx厚0.8mm的基材雙面上，準備貼著由厚 3 5 // m銅箔所構成之內層導體層形成用金屬層7 1(參照第 3圖）的鍍銅積層板（內核層1 7 )。 接著在ί几鈾劑材料配置步驟中，在內層導體層形成用 金屬層7 1上設置賦予感光性的抗鈾劑材料72 (參照第4 ( 圖）。再者在曝光用遮罩配置步驟中，配置形成既定遮罩圖 案73的曝光用遮罩74於抗蝕劑材料72上。然後，在曝光 步驟中，經由曝光用遮罩74以曝光抗蝕劑材料72，接著 在顯像步驟中，顯像抗蝕劑材料72而形成抗蝕劑75 (參 照第5圖）。其次在蝕刻步驟中，則進行內層導體層形成用 金屬層7 1的蝕刻，並部分地溶解除去內層導體層形成用金 屬層7 1。該結果爲在製品形成區域1 5的表面上形成內層 導體層。在此同時，在外框部分1 6的表面上使篩網狀導體 ί 層22形成圖案，並在篩網狀導體層22的區域內設定空白 區域27(參照第6圖、第7圖）。 接著在積層步驟中，堆疊內核層17、外部中芯層20 及銅箔7 6而一體化，以形成積層基板本體7 8。詳細而言， 首先在內核層17的內核層上面18上及內核層下面19上， 個別配置單面貼著銅箔 76 (金屬箔）的預浸漬層 (pre-preg)77(參照第8圖）。還有，在本實施樣態中，預 浸漬層77的厚度爲銅箔76厚度爲28//m或33 -20 - 200838375 // m。然後，其次進行加熱成爲1 8 0 °C以上的溫度並且在積 層方向（接合方向）施加擠壓力（2MPa)(熱壓著）。隨之 而來，沿著積層方向擠壓內核層1 7、預浸漬層7 7及銅箔 7 6，同時因熱而使預浸漬層7 7中的有機材料黏性變大。該 結果爲個別接著（熱壓著）預浸漬層77及銅箔76於內核 層上面18上及內核層下面19上，預浸漬層成爲外部中芯 層20而完成積層基板本體78。 接著在貫穿孔導體形成步驟中，則形成貫通積層基板 ^ 本體7 8之貫穿孔導體2 5於製品形成區域1 5。詳細而言， 首先針對積層基板本體7 8使用鑽孔機以進行鑽孔加工，預 先形成用於形成貫穿孔導體25的貫穿孔24於既定位置（參 照第9圖）。然後，針對上述積層體的全面實施無電解鍍 銅，在各貫穿孔24的內周面上形成貫穿孔導體25 (參照 第1 0圖）。 接著在刻印步驟中，在積層基板主面1 2上所形成的銅 箔76上，藉由刻印成爲空白區域27之正上方的位置，在 1,- _ 銅箔7 6 g受置刻印部分6 2。具體而言，以下模具8 1支撐中 芯層基板1 1的積層基板內面1 3側的狀態，載置上模具82 於中芯層基板Π的積層基板主面1 2側（參照第1 〇圖）。 還有，上述上模具8 2係在下面側具有刻印形成用凸出部份 8 3。又，本實施樣態的上模具8 2係爲了可替換複數種的凸 出部分8 3，可在每個中芯層基板1 1上形成顯示不同批號 或物品編號的刻印部分62。 然後，其次在積層方向施加擠押壓力（4MPa )。隨之 -21 - .200838375 而來，銅箔76之一部份擠押壓入凸部83而凹下的結果’ 形成刻印部分6 2 (參照第1 1圖、第12圖）。此時，至少 在外部中芯層2 0之刻印部分6 2下側的部分成爲凹下。 其次，印刷塡充樹脂糊於該貫穿孔導體2 5內，並加熱 硬化，而形成塡充材料2 6。再者，進行覆蓋電鍍後，進行 中芯層基板1 1之積層基板主面1 2側及積層基板內面1 3側 的硏磨。該結果係爲了提高中芯層基板1 1的平坦性，可在 之後步驟（絶緣層形成步驟及導體層形成步驟）中精度佳 地形成堆疊層31、32。然後，使導體圖案23與外層金屬 層6 1形成圖案（參照第1 1圖）。還有，在此時點完成中芯 層基板1 1。 在中芯層基板1 1完成後，交互實施形成絶緣層3 3〜 35、40〜42的絶緣層形成步驟、與形成既定圖案之導體層 36的導體層形成步驟，在中芯層基板11的積層基板主面 1 2上及積層基板內面1 3上形成堆疊層3卜3 2。詳細而言， 首先在中芯層基板11的積層基板主面12及積層基板內面 1 3上積層板狀的熱硬化性環氧樹脂，形成在未硬化狀態的 第1層絶緣層33、40。其次，加熱至17(TC並使絶緣層33、 40半硬化。再者，藉由雷射加工機，在應形成連接導體37 的位置上形成肓孔。然後，加熱至1 8 0 °C以硬化絶緣層3 3、 40。其次，依照習知公認的方法（例如半添加劑法）以進 行電解鍍銅，在前述盲孔的內部形成連接導體3 7，同時在 絶緣層3 3、4 0上形成導體層3 6。此時，由於在外層金屬 層61上亦實施電解鍍銅，外層金屬層61變厚成爲相當於 -22- .200838375 導體層36的厚度。 然後，在第1層的絶緣層3 3、4 0上積層板狀的熱硬化 性環氧樹脂，而形成在未硬化狀態的第2層絶緣層3 4、4 1。 其次，加熱至170 °C並使絶緣層34、41半硬化。再者，藉 由雷射加工機，在應形成連接導體3 7的位置上形成盲孔。 然後，加熱至1 8 0 °C以硬化絶緣層3 4、4 1。再者，依照習 知公認的方法來進行電解鍍銅，在前述盲孔的內部形成連 接導體3 7，同時在絶緣層3 4、4 1上形成導體層3 6。此時， ' 由於在外層金屬層6 1上亦實施電解鍍銅，外層金屬層6 1 變厚成爲相當於導體層3 6的厚度。 再者，在第2層絶緣層3 4、4 1上積層板狀的熱硬化性 環氧樹脂，形成在未硬化狀態的第3層絶緣層3 5、42。其 次，加熱至1 7 0 °C並使絶緣層3 5、4 2半硬化。再者，藉由 雷射加工機，在應形成連接導體3 7的位置上形成盲孔。然 後，加熱至180 °C以硬化絶緣層35、42。再者，依照習知 公認的方法進行電解鍍銅，在前述盲孔的內部形成連接導 1 體3 7，同時在絶緣層3 5、42上形成端子襯墊3 8、43。此 時，由於在外層金屬層6 1上亦實施電解鍍銅，外層金屬層 61進一步變厚成爲相當於端子襯墊38、43的厚度。還有， 在此階段完成堆疊層3 1、3 2。 其次，藉由在第3層絶緣層3 5、42上塗布感光性環氧 樹脂並硬化，而形成抗焊劑3 9、44。其次，以配置既定遮 罩的狀態進行曝光及顯像，蝕刻抗焊劑3 9、44而使端子襯 墊3 8、4 3暴露。該結果爲得到示於第1圖之配線基板的中 -23 - 200838375 間製品1 〇。 之後，使用以往眾所周知的裁斷裝置等以從製品形成 區域1 5裁斷除去外框部分1 6，同時沿著在製品形成區域 1 5之裁斷預定線4 5以裁斷。藉此，分割製品彼等而得到 複數件製品（配線基板）。 因此，根據本實施樣態則可得到以下效果。 (1 )根據本實施樣態的中芯層基板 Π，由於在刻印 部62之正下方設置篩網狀導體層22不存在的空白區域 f 27，根本不存在應力集中容易的凹凸構造，在外部中芯層 2 0變得不易產生破裂（參照第1 8圖）。因此，防止破裂在 製品形成區域1 5進行、或經由破裂所浸入之電鍍液等液體 沿著篩網狀導體層22而流入製品形成區域1 5，可防止在 製品形成區域1 5的外部中芯層20或內層導體層21的剝 離。所以，可防止因破裂或剝離所導致之中芯層基板1 1良 率的降低，同時可賦予高的信頼性於基板1 1。 (2 )由於本實施樣態的空白區域27在導體層等之金 I / 屬部分不存在的區域，內核層1 7與外部中芯層2 0的密著 強度比其他部分高。因此，在刻印部分62的形成時衝撞傳 導容易的空白區域27，變得不易產生破裂或剝離。又，在 空白區域27內存在任何金屬部分時，在破裂產生時，電鍍 液等之液體傳送金屬部分而有浸漬於內核層i 7與外部中 芯層2 0之間，由於在本實施樣態的空白區域2 7內係金屬 部分不存在’防止如上述之液體的浸漬。還有本實施樣態 的篩網狀導體層22亦具有作爲堵塞經由破裂而浸入之液 -24- ♦200838375 體的機能。 (3)可是，在曝光用遮罩配置步驟（參照第4圖）所 用的曝光用遮罩方面，則認爲是在曝光用的原版（玻璃遮 罩等）上貼著遮光膠帶等者。然而，正確地貼著遮光膠帶 則爲困難的。又，使用遮光膠帶時，一方面因遮光膠帶的 剝除、劣化、黏著物而在遮光膠帶內產生針孔，一方面產 生灰塵。另外，在本實施樣態中，由於無貼著遮光膠帶的 曝光用遮罩，並使用形成既定遮罩圖案73之曝光用遮罩 f 74，而消除上述問題。 還有，本發明的實施樣態亦可如下地變更。 在上述實施樣態中，在篩網狀導體層22中成爲刻印部 分62之正下方的位置上，設定空白區域27。然而，如第 1 3圖、第1 4圖所示，在篩網狀導體層22中成爲刻印部62 之正下方的位置上，亦可設定不具有沖壓圖案的平面狀導 體區域91。還有，在上述平面狀導體區域91上，存在著 長8 mmx寬4 0mm之平視矩形狀的平面狀導體92。平面狀 C i ^ 導體92係與例如篩網導體層22和同時形成。 即使如此，由於可防止對於在篩網狀導體層22附近之 起因於刻印部分62形成時所施加之衝撞的應力集中，可防 止在外部中芯層20之破裂（參照第18圖）的產生。隨之 而來，防止在製品形成區域1 5進行破裂、或經由破裂所浸 入之電鍍液等液體沿著篩網狀導體層22的帶狀圖案而流 入製品形成區域1 5。因此，可防止起因於所進行之破裂或 所浸入之液體之在製品形成區域1 5的外部中芯層2 0或內 -25 - 200838375 層導體層2 1的剝離。所以，可防止因破裂或剝離所 中芯層基板1 1的良率降低，同時賦予高的信頼性於 基板1 1。 在上述實施樣態中，僅在內核層上面1 8上的篩 體層22中成爲刻印部分62之正下方的位置上，設 區域27。然而，亦在內核層下面19上之篩網狀導彳 中成爲刻印部分62正下方的位置上，亦可設定空 2 7。若如此一來，由於在內核層下面1 9側，在刻 f 6 2形成時之衝撞容易傳導的部分亦變得篩網狀導骨 不存在，較可確實防止破裂的產生。 在上述實施形態中，在刻印部分6 2形成後進行 印部分62形成前進行塡充材料26的形成、覆蓋電 體圖案23及外層金屬層61的圖案形成等均可°又 實施樣態中，在進行覆蓋電鍍後進行導體圖案23及 屬層61的圖案形成、或在進行外層金屬層61之圖 後進行覆蓋電鍍並圖案形成導體圖案2 3均可。 C j ^ 在述實施樣態中在外框部分1 6之表面圖案形 狀導體層22，而在形成篩網狀導體層22之區域內 白區域2 7，如示於第1 5圖、第1 6圖之其他實施樣 可合倂形成包圍空白區域27之擋板狀導體95°藉 成時，隔開空白區域27與在其周圍的篩網狀導體） 確實阻止對於空白區域2 7內之電鍍液的侵入。因此 實防止在空白區域2 7之密著性的降低，進而連帶變 達成信頼性的提升。還有，擋板狀導體95可與周圍 導致之 中芯層 網狀導 定空白 匮層22 白區域 印部分 I層 22 或在刻 鍍、導 在上述 外層金 案形成 成篩網 設定空 態，亦 由該構 f 22 > ，可確 得容易 之篩網 -26 - 200838375 狀導體層22同時被形成。 在上述實施樣態中，形成篩網狀導體層2 2，如示 1 7圖之其他實施樣態，亦可形成如例如水滴圖案狀導 22A的散點狀導體層。 其次，以下列舉藉由前述之實施樣態所掌握的技 想。 (1 ) 一種積層基板的製造方法，其係具有堆疊複 樹脂絶緣層而在其表層配置外層金屬層的構造，區劃 ^ 著基板平面方面複數配置應成爲製品之部分的製品形 域、包圍該製品形成區域的外框部分，在前述外框部 前述複數層樹脂絶緣層彼此之間形成篩網狀導體層或 狀導體層，在前述外框部分之前述外層金屬層設置刻 分，在前述篩網狀導體層或前述散點狀導體層中成爲 刻印部分正下方的位置，而設定前述篩網狀導體層或 散點狀導體層均不存在的空白區域、或不具有沖壓圖 平面狀導體區域之積層基板的製造方法，其特徵爲包 I 備在其表面具有內層導體層形成用金屬層之內層用的 絶緣層後，鈾刻該內層導體層形成用金屬層，以在前 品形成區域之表面上形成內層導體層，而且在前述外 之表面形成前述篩網狀導體層或前述散點狀導體層的 步驟；堆疊前述內層用的樹脂絶緣層、外層用的樹脂 層及金屬箔而一體化，以形成積層基板本體的積層步 形成貫通前述積層基板本體之貫穿孔導體於前述製品 區域的貫穿孔導體形成步驟；與藉由刻印在包含前述 於第 體層 術思 數層 成沿 成區 分之 散點 印部 前述 前述 案的 含預 樹脂 述製 框部 ，準備 絶緣 驟； 形成 金屬 -27- .200838375 箔所構成之前述外層金屬層而成爲前述空白區域或前述平 面狀導體區域正上方的位置，在前述外層金屬層設置前述 刻印部分的刻印步驟。 (2 ) —種積層基板的製造方法，其係具有堆疊複數層 樹脂絶緣層而在其表層配置外層金屬層的構造，區劃成沿 著基板平面方面複數配置應成爲製品之部分的製品形成區 域、與包圍該製品形成區域的外框部分，在前述外框部分 之前述複數層樹脂絶緣層彼此之間形成篩網狀導體層或散 ^ 點狀導體層，在前述外框部分之前述外層金屬層設置刻印 部分，在前述篩網狀導體層或前述散點狀導體層中成爲前 述刻印部分正下方的位置，以設定前述篩網狀導體層或前 述散點狀導體層均不存在的空白區域、或不具有沖壓圖案 的平面狀導體區域之積層基板的製造方法，其特徵爲包含 預備在其表面具有內層導體層形成用金屬層之內層用的樹 脂絶緣層後，設置賦予感光性之蝕刻阻劑材料於該內層導 體層形成用金屬層上的步驟；配置形成既定遮罩圖案之曝 光用遮罩於前述蝕刻阻劑材料上的步驟；經由前述曝光用 遮罩曝光前述蝕刻阻劑材料的步驟；顯像前述蝕刻阻劑以 形成蝕刻阻劑的步驟；以及蝕刻前述內層導體層形成用金 屬層而在前述製品形成區域之表面上形成內層導體層，而 且在前述外框部之表面上形成前述篩網狀導體層或前述散 點狀導體層的準備步驟；堆疊前述內層用的樹脂絶緣層、 外層用的樹脂絶緣層及金屬箔而一體化，以形成積層基板 本體的積層步驟；形成貫通前述積層基板本體之貫穿孔導 -28 - 200838375 體於前述製品形成區域的貫穿孔導體形成步驟；與藉由刻 印在包含前述金屬箔所構成之前述外層金屬層中成爲前述 空白區域或前述平面狀導體區域正上方的位置，在前述外 層金屬層設置前述刻印部分的刻印步驟。 (3 ) —種配線基板的中間製品，其特徵爲由交互積層 具有堆疊複數層樹脂絶緣層而在其表層配置外層金屬層的 構造，區劃爲沿著基板平面方向複數配置應成爲製品之部 分的製品形成區域、與包圍該製品形成區域的外框部分， Γ 1 在前述外框部分之前述複數層樹脂絶緣層彼此之間形成篩 網狀導體層或散點狀導體層，在前述外框部分之前述外層 金屬層設置刻印部分的積層基板，與設置於前述積層基板 之積層基板主面及積層基板內面中至少一者的絶緣層，與 導體層所構成堆疊層所構成的配線基板中間製品中，在前 述篩網狀導體層或前述散點狀導體層中成爲前述刻印部正 下方的位置上，設定前述篩網狀導體層或前述散點狀導體 層均不存在的空白區域。 【圖式簡單說明】 第1圖係顯示本實施樣態中之配線基板的中間製品的 重要部分槪略截面圖。 第2圖係顯示配線基板的中間製品的槪略平面圖。 第3圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第4圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 -29- 200838375 第5圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第6圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第7圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略平面圖。 第8圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第9圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第1 〇圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第1 1圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略截面圖。 第1 2圖係顯示配線基板（中芯層基板）的製造方法的 重要部分槪略平面圖配。 第1 3圖係顯示其他實施樣態中之配線基板的製造方 法的重要部分槪略截面圖。 第1 4圖係顯示其他實施樣態中之配線基板的製造方 法的重要部分槪略平面圖。 第1 5圖係顯示其他實施樣態中之配線基板的製造方 法的重要部分槪略平面圖。 第1 6圖係顯示其他實施樣態中之配線基板的製造方 法的重分槪略截面圖。 -30- ^ 200838375 第1 7圖係顯不其他實施樣態中之配線基板的製造方 法的重要部 分 槪 略 平 面 圖 〇 第18 圖 係 顯 示 習 知 技 :術 f ΐ 1之配線基板的製 重要部分槪 略 平 面 圖 〇 【主要元件 符 號 說 明 I 10 中 間 製 品 11 作 爲 積 層 基 板 的 中 心、 層 基 板 12 積 層 基 板 主 面 13 積 層 基 板 內 面 14 Jft J/IU\ 成 爲 製 品 的 部 分 15 製 品 形 成 域 16 外 框 部 分 17 作 爲 內 層 用 之 樹 脂 絶 緣 層 的 內 核 層 18 內 核 層 上 面 19 內 核 層 下 面 20 作 爲 外 層 用 之 樹 脂 絶 緣 層 的 外 部 中芯層 2 1 內 層 導 體 層 22 篩 網 狀 導 體 層 22A 作 爲 散 點 狀 導 體 層 之 水 滴 圖 案 狀 導體層 23 導 體 圖 案 24 貫 穿 孔 25 貝 穿 孔 導 體 26 塡 充 材 料 27 空 白 域 200838375 3 1 32 33 、 34 、 35 、 40 、 4 36 37 38 39 43 r 《 44 45 5 1 52 6 1 62 7 1 72 l 73 74 75 76 77 78 8 1 82 作爲堆疊層之第1堆疊層 作爲堆疊層之第2堆疊層 1、42 絶緣層 導體層 連接導體 端子襯墊 抗焊劑 端子襯墊 抗焊劑 裁斷預定線 位置決定孔 位置決定孔 外層金屬層 刻印部分 內層導體層形成用金屬層 抗蝕劑材料 遮罩圖案 遮罩 抗鈾劑 作爲金屬箔的銅箔 預浸漬層 積層基板本體 下模具 上模具 -32 - 200838375 83 凸 出 部 份 91 平 面 狀 導 體 區域 92 平 面 狀 導 體 95 擋 板 狀 導 體 100 中 間 製 品 101 內 核 層 102 外 部 中 心 層 103 堆 疊 層 104 製 品 形 成 1¾ 域 1 0 5 內 層 導 am 體 層 106 篩 網 狀 導 體 層 108 外 框 部 分 109 刻 印 部 分 110 破 裂 -33 -1987. The invention relates to a structure in which a plurality of layers of a resin insulating layer are stacked and a layer of an outer layer of metal is disposed on a surface layer thereof, and is divided into a product forming region which is to be a part of the product, A laminated substrate and an outer frame portion surrounding the product forming region and a method of manufacturing the same. [Prior Art] In recent years, a method called "many pick-up" has been known as a method for efficiently manufacturing a product such as a wiring board (see, for example, Patent Document 1). In this method, as shown in, for example, Fig. 18, the inner layer conductor layer is formed on the surface of the product forming region 104 by uranium engraving on the copper foil which is adhered to both sides of the rectangular core layer 10 1 . 105, at the same time, a mesh-like conductor layer 106 is formed on the surface of the outer frame portion 108. Next, a pre-dip layer is stacked on the upper and lower sides of the core layer 110 to form an outer core layer 102, and a separate layer 1 0 3 is disposed on the surface layer (product formation region 104) of the core layer 102 of the outer layer of the second layer. Etc., to manufacture the intermediate product 100 of the wiring substrate. Further, the intermediate product 100 is divided along the boundary line (not shown) of the product forming region 104 to obtain a plurality of articles. However, in the intermediate product 100, a flag (character or the like) for discriminating the type of the product is attached to the outer frame portion 1 〇 8 surrounding the product forming region 104. The use of a diffuser or a stylus pen and the application of ink on the surface of the outer frame portion is generally used as a method of attaching the mark. However, in the case of applying the ink, there is a high possibility that the mark is eliminated in the subsequent steps. Therefore, in order to solve the problem, it is preferable to form, for example, the surface of the frame portion of the engraved portion 1 0 9 on the other hand (refer to Fig. 18). [Patent Document 1] Japanese Patent Laid-Open Publication No. 2 0 0 2 - 1 8 7 9 5 (Fig. 1 and the like) [Description of the Invention] However, as shown in Fig. 18, the outer frame portion 1 of the inner core layer 1 〇 1 On the surface of the crucible 8, there is a region where the mesh conductor layer 106 exists and a region where it does not exist. The position directly below the imprinted portion 109 is also the same. In this case, when the impact is formed at the time of formation of the imprinting portion 109, the stress concentrates on the edge of the mesh-like conductor layer 106 (for example, referring to A1), etc., in the mesh-like conductor layer 106 and the outer core layer. The boundary portion of 102 becomes susceptible to cracking 110°. Also, if the point is cut away from the outer frame portion 1 〇8 when the crack 1 1 0 is generated, the possibility of cracking 1 10 in the product forming region 104 is small. . However, in general, in order to ensure the workability when the stacked layer 103 is formed, the outer frame portion 1 〇 8 is cut away after the stacked layer 101 is formed. This result is the possibility that the crack 1 1 〇 is formed in the article forming region 104 when the stacked layer 103 is formed. Further, when the repeated plating step is performed at the time of formation of the stacked layer 101, the plating solution is immersed inside through the rupture of 110, and the plating solution also flows into the product forming region 1 along the mesh conductor layer 1? 0 4 possibilities. In such a case, the outer core layer 102 or the inner layer conductor layer 1 〇 5 of the article located near the imprinted portion 109 (i.e., the article located at the outermost peripheral portion of the article forming region 104) becomes easily peeled off. Therefore, the reliability of the core layer 1 and the external core layer 102 is lowered, which in turn reduces the reliability of the wiring board which becomes a product. The present invention has been made in view of the above problems, and a first object thereof is to provide a laminated substrate which can impart high reliability by preventing cracks in the resin insulating layer or peeling of the resin insulating layer from 200838375. Further, a second object is to provide a method for producing the above-mentioned appropriate laminated substrate. Then, in the means for solving the above problems (means 1), there is a laminated substrate characterized in that a plurality of resin insulating layers are stacked and a structure in which an outer metal layer is disposed on a surface layer thereof is partitioned so as to be plurally arranged along a plane direction of the substrate. a product forming region which is a part of the product, and an outer frame portion surrounding the product forming region, and a mesh-shaped conductor layer or a scatter-like conductor layer is formed between the plurality of resin insulating layers of the outer frame portion, a layered substrate on which the outer metal layer of the outer frame portion is provided with an imprinted portion, and the mesh-shaped conductor layer or the position of the mesh-shaped conductor layer or the scatter-like conductor layer directly below the imprinted portion A blank area in which none of the scatter-like conductor layers exist. Further, another means (means 2) for solving the above problems is to provide a laminated substrate characterized in that a plurality of layers of a resin insulating layer are stacked and a structure in which an outer layer metal layer is disposed on a surface layer thereof is partitioned along a structure. The substrate plane direction is a plurality of product forming regions which are part of the product, and an outer frame portion surrounding the product forming region, and the plurality of resin insulating layers in the outer frame portion form a mesh-like conductor layer or a point-shaped conductor layer on a laminated substrate provided with an imprinted portion on the outer metal layer of the outer frame portion, and a position immediately below the imprinted portion in the mesh-shaped conductor layer or the scatter-like conductor layer is set not A planar conductor region having a stamped pattern. Therefore, since the mesh-shaped conductor layer or the portion where the scatter-like conductor layer does not exist (ie, a blank region or a planar conductor region) is set directly under the 200838375 of the marking portion on the laminated substrate of the means 1, 2, the stress The uneven structure which is easy to concentrate is not present at all, and it becomes difficult to cause cracking in the resin insulating layer. Therefore, the prevention of cracking in the product forming region, or the liquid immersed in the rupture, flows into the product forming region along the mesh conductor layer or the scatter conductor layer, and peeling of the resin insulating layer in the product forming region can be prevented. Therefore, the yield of the laminated substrate can be prevented from being lowered, and a high reliability signal can be imparted to the laminated substrate. Further, when a mark is added by applying ink or the like, when the step of using an acidic or alkaline chemical liquid is passed after the formation of the mark, the mark is extinguished. Further, in the means 1, 2, the mark is added by forming the mark. Since the imprinted portion is formed by mechanically deforming a part of the outer metal layer, even if the step of using the above-mentioned chemical liquid is formed after the formation of the imprinted portion, the shape of the imprinted portion is maintained without being eliminated. Therefore, in the case where the imprinted portion is used as a mark for identifying the type of the product, for example, the kind of the product can be surely discriminated. Further, as the outer metal layer, there are a plating layer formed by plating the surface layer of the resin insulating layer, a metal foil adhered to the surface layer of the resin insulating layer, and a metal formed by coating or printing a metal paste. Layers, etc. Here, the term "product formation region" refers to a region in which a product to be formed is disposed in a plurality of directions vertically and horizontally along the plane of the substrate. In general, any of the above-mentioned resin insulating layer, product forming region, and portion to be a product is formed in a substantially rectangular shape in a plan view. Further, the area which should be part of the product is set to be much smaller than the area of the product forming area. Therefore, in the formation area of the product 200838375, for example, several to several hundreds of parts to be articles are disposed. Further, the outer frame portion is a portion which is separated from and removed from the product forming region at the time of manufacture, and surrounds the product forming region. Further, the imprinting portion refers to an identification code formed by imparting irregularities to a part of the outer metal layer. In terms of engraving, there are words, symbols, drawings, etc. The depth of the imprinted portion depends on the thickness of the outer metal layer when the laminated substrate is formed, and is preferably, for example, 10 V m or more and 80 0 // m or less, for example, preferably 3 0 // m. Assuming that the depth of the engraved portion is lower than ^ 1 0 // m, there is a possibility that the engraved portion is eliminated. In addition, when the depth of the imprinted portion exceeds 80 // m, the outer insulating layer is liable to be broken due to the punch applied during the formation of the imprinted portion, and the band is made on the resin insulating layer. It is prone to rupture. The "mesh-shaped conductor layer" is a conductor layer having a stamping pattern such as a lattice shape or a saw-tooth shape. The "mesh-shaped conductor layer" can be formed by arranging a strip pattern into a lattice shape. Also, adjacent strip patterns are arranged at approximately fixed intervals. Therefore, in the outer frame portion and on the surface of the region where the mesh-shaped conductor layer exists, there are irregularities formed by the region where the strip-shaped pattern exists and the region where the strip-shaped pattern does not exist. The "scattered conductor layer" means a conductor layer composed of a plurality of small-area conductor patterns arranged in a scatter (for example, a lattice shape or a zigzag shape). The shape of each of the small-area conductor patterns is arbitrary, for example, a triangle, a quadrangle, a hexagon, a circle, or the like. Further, the "blank area" is a region where the mesh-shaped conductor layer or the scatter-like conductor layer does not exist on the surface of the outer frame portion (however, except for the region where the position determining hole is formed). Therefore, from -10- 200838375, the above-mentioned irregularities are not present on the surface of the blank region, so that there is no stress concentrated on a part of the blank region due to the collision applied at the time of formation of the imprinting portion. In addition, the "planar conductor region having no stamping pattern" means that the conductor layer which is not meshed or scattered on the surface of the outer frame portion does not have a stamping pattern at all, so that there is no unevenness on the surface. Good shape conductor. Therefore, since the unevenness as described above does not exist on the surface of the planar conductor region, no stress is concentrated on a part of the planar conductor region due to the collision applied during the formation of the imprinted portion. Further, the area of the blank region (or the planar conductor region) is preferably at least equal to the area of the region where the imprinted portion is formed, and particularly preferably larger than the area of the region where the imprinted portion is formed. It is assumed that the area of the blank area (or the planar conductor area) is smaller than the area of the formation area of the imprinted portion, and since the mesh-shaped conductor layer (or the scatter-like conductor layer) is present in a portion directly under the imprinted portion, The collision applied by the partial formation concentrates the stress on the mesh conductor layer (or the scatter conductor layer), and it is easy to cause cracking in the resin insulating layer. The blank area may be surrounded by a baffle conductor. In the case of a baffle-free conductor, there is a possibility that a liquid such as a plating solution enters a blank region during the manufacturing process of the laminated wiring substrate, and the adhesion of the portion may be lowered. On the other hand, if the blank region is surrounded by the barrier-shaped conductor, the blank region and the mesh conductor layer (or the scatter conductor layer) around it are surely prevented from entering the liquid in the blank region. Therefore, it is possible to surely prevent the decrease in the adhesion in the blank area, and it is easy to achieve the improvement of the reliability. In the above-mentioned laminated substrate of the means 1 or 2, it is preferable to use as a stacked layer including at least one of the laminated substrate main surface and the laminated substrate inner surface including an insulating layer and a conductor layer. For the core layer substrate in the stacked multilayer wiring substrate. In this way, since a circuit can be formed in the stacked layer, the high performance of the laminated substrate can be achieved. Further, although the stacked layer may be formed only on either the laminated substrate main surface or the laminated substrate inner surface, it is preferably formed on both the laminated substrate main surface and the laminated substrate inner surface. According to this configuration, since a circuit can be formed on both the stacked layer formed on the main surface of the laminated substrate and the stacked layer formed on the inner surface of the laminated substrate, the laminated substrate can be further improved in function. Further, another method (method 3) for solving the above-mentioned problems is the method for producing a laminated substrate described in the above-mentioned means 1 or 2, which is a method for producing a base substrate, which is characterized in that it is included in the outer frame portion. The mesh-shaped conductor layer or the scatter-like conductor layer is formed on the surface, and the blank region or the inner layer of the planar conductor region is set in a region where the mesh conductor layer or the scatter conductor layer is formed. a step of preparing a resin insulating layer; stacking the resin insulating layer for the inner layer, the resin insulating layer for the outer layer, and the metal foil, and integrating them to form a laminated body of the laminated substrate; forming a through-layer in the product forming region a through-hole conductor forming step of the through-hole conductor of the substrate body; and in the outer metal layer including the metal foil, the imprinted portion is provided directly under the blank region or the planar conductor region by imprinting The step of marking the outer metal layer. Therefore, according to the manufacturing method of the means 3, in the imprinting step, the imprinted portion is provided directly above the blank region or the planar conductor region in the range of -12 to 200838375. Therefore, even if a collision is applied at the time of formation of the imprinted portion, since most of the collision is transmitted to the blank region or the planar conductor region where the uneven structure is not present, it is difficult to cause cracking due to stress concentration in the resin insulating layer. Therefore, it is possible to prevent cracking in the product forming region, or to cause the immersed liquid to flow into the product forming region along the mesh conductor layer or the scatter conductor layer by cracking, thereby preventing peeling of the resin insulating layer in the product forming region. Therefore, it is possible to prevent the yield of the laminated substrate from being lowered, and at the same time, it is possible to impart high reliability to the laminated substrate. Hereinafter, a method of manufacturing the laminated substrate according to the means 3 will be described. First, in the preparation step, the mesh-shaped conductor layer or the scatter-like conductor layer is formed on the surface of the outer frame portion, and is set in an area where the mesh-shaped conductor layer or the scatter-like conductor layer is formed. A resin insulating layer is used for the inner layer of the blank region or the planar conductor region. In particular, the material of the base material for forming the resin insulating layer for the inner layer is not particularly limited, and the preferred resin insulating layer for the inner layer is mainly composed of a polymer material. Specific examples of the polymer material for forming the resin insulating layer for the inner layer include, for example, an EP resin (epoxy resin), a Pi resin (polyimine resin), and a BT resin (bis-s-butylimine).肼 resin), pp E resin (polyphenylene ether resin), and the like. Further, composite materials of these resins and organic fibers such as glass fibers (glass woven fabric or glass non-woven fabric) or polyamide fibers may also be used. Further, in the preparation step, it is preferable to prepare a metal insulating layer for forming an inner layer of the inner layer conductor layer on the surface thereof after the resin insulating layer for the inner layer of the inner layer conductor layer forming metal layer is prepared, and The inner layer conductor layer is formed on the surface of the product forming region -13.200838375, and the mesh-shaped conductor layer or the scatter-shaped conductor layer in which the blank region or the planar conductor region is set on the surface of the outer frame portion is formed. In this case, the inner layer conductor layer 'which is a part of the article at the time of forming the mesh-like conductor layer or the scatter-like conductor layer can efficiently produce the article. Further, in the preparation step, a baffle-shaped conductor surrounding the blank region may be formed. In the above-mentioned preparation step, it is preferable to provide a resin layer for forming an inner layer for forming an inner layer of a metal layer for forming an inner layer conductor layer on the surface thereof. a step of sensitizing a resist material; a step of arranging an exposure mask for forming a predetermined mask pattern on the resist material; a step of exposing the uranium-repellent material via the exposure mask; and developing the foregoing a resist material to form a resist; and etching the inner layer conductor layer forming metal layer, and forming an inner layer conductor layer on a surface of the product forming region, and forming a surface on the surface of the outer frame portion The step of the blank region or the aforementioned mesh conductor layer or the scatter conductor layer of the planar conductor region. In this manner, a mesh-shaped conductor layer or a scatter-like conductor layer in which a blank region or a planar conductor region is set can be formed by using the same method as in the prior art and changing only the mask pattern of the exposure mask. Therefore, an increase in the number of steps necessary for the manufacture of the laminated substrate can be prevented, and an increase in the manufacturing cost of the laminated substrate can be prevented. Then, in the laminating step, the resin insulating layer for the inner layer, the resin insulating layer for the outer layer, and the metal foil are stacked and integrated to form a laminated substrate body. Further, the resin insulating layer for the outer layer is not particularly limited, and is preferably, for example, a prepreg layer. Here, the "prepreg layer" -14 - 200838375 % means a semi-hardened state sheet which is impregnated with a resin varnish and dried in a glass fiber (glass woven fabric or glass non-woven fabric) or a substrate such as paper. The temperature at the time of pressing the prepreg layer is preferably, for example, 10 (TC or more and 2 3 (TC or less, in terms of pressure when the prepreg layer is pressed, preferably 0.5 MPa or more and 5 MPa or less. Next, formation in the through-hole conductor) In the step of forming a through-hole conductor that penetrates the laminated substrate body, the outer layer metal layer including the metal foil is formed by the imprinting into the blank region or the plane in the marking step. The above-mentioned imprinted portion is provided on the outer layer metal layer directly above the shaped conductor region. Further, the engraving step may be performed after the through-hole conductor forming step, or the through-hole conductor forming step may be performed after the imprinting step. Then, When the through-hole conductor forming step and the marking step are completed, the laminated substrate is completed. Further, after the laminated substrate is completed, the laminated substrate main surface and the laminated substrate inner surface or the formed insulating layer may be applied. The insulating layer forming step of forming the insulating layer forms a k step with the conductor layer forming the conductor layer of the predetermined pattern. If the insulating layer forming step and the conductor layer forming step are alternately performed, a stacked layer composed of an alternating laminated conductor layer and an insulating layer may be formed on the laminated substrate, and an article may be formed. Also, on the insulating layer, for forming an interlayer The connecting conductor may be pre-formed with a connecting hole (blind hole 'b 1 indh ο 1 e ) °. Then, if the outer frame portion is removed from the product forming region of the intermediate product of the article, the cutting is scheduled along the product forming region. When the line is cut to separate the products from each other, a plurality of articles are obtained. Also, the middle of the product is a -15-.200838375 product, which is a commemoration of the finished product, and specifically indicates that the products are not separated from each other. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention will be described in detail based on the drawings. As shown in Fig. 1, an intermediate product 1 of a wiring board of the present embodiment is shown. The core substrate 11 (stacked substrate) having a substantially rectangular plate shape in a plan view, and the laminated substrate main surface 12 on the core substrate 11 (on the first drawing) The first stacked layer 31 formed on the first stacked layer 31 and the second stacked layer 32 formed on the laminated substrate inner surface 13 (lower in FIG. 1) of the core substrate 11 are formed. The core substrate 11 is used as a core substrate in a stacked multilayer wiring substrate. As shown in FIGS. 1 and 2, the core substrate 11 is partitioned so as to be plurally arranged along the plane direction of the substrate. The product forming region 15 as part of the product 14 and the outer frame portion 16 (outer product region) surrounding the product forming region 15 are formed into a portion of the article 14 which is approximately rectangular (approx. A plurality of vertically and horizontally disposed in the product forming region 15 are formed. Therefore, the product forming region 15 also has a substantially rectangular shape in a plan view. As shown in Fig. 2, on the opposite sides of the outer frame portion 16 Position determining holes 5 1 and 5 2 for determining the position of the core substrate 1 1 are separately provided. As shown in Fig. 1, the core substrate 11 has a structure in which an inner core layer 17 which is a resin insulating layer for an inner layer and an outer core layer 20 which is a resin insulating layer for an outer layer are stacked. In the present embodiment, the core layer 17 is a substantially rectangular substrate having a plan view of a glass epoxy resin. In addition, the -16-.200838375 external core layer 20 is formed on the upper surface of the inner core layer 18 and the inner core layer 19, and is impregnated with an organic material such as an epoxy resin in an inorganic material such as glass cloth. Approximately rectangular substrate. Further, a through hole 24 is formed in the core substrate Π, and a through hole conductor 25 for electrically connecting the stacked layers 31 and 32 is formed on the inner edge surface of the through hole 24. The entanglement material 26 is filled in the cavity portion of the through-hole conductor 25. As shown in Fig. 1, an inner conductor layer 2 1 made of copper is individually disposed on the upper surface of the inner core layer 18 of the product formation region 15 and on the lower surface 19 of the inner core layer. Further, in the product forming region 15 , on the outer core layer 20 formed on the outer surface 18 of the inner core layer (i.e., the laminated substrate main surface 12), and under the outer core layer 20 formed on the lower surface 19 of the inner core layer ( That is, the conductor pattern 23 is separately provided on the inner surface 1 3 of the laminated substrate. The first stacked layer 31 has a structure in which an insulating layer 3 3, 34, 35 composed of an epoxy resin and a conductor layer 36 made of copper are alternately laminated. The connection conductor 37 is formed at a plurality of positions in the insulating layers 33, 34, 35, and the conductor layer 36 is electrically connected to the connection conductor 37 and the like. Further, on the surface of the uppermost insulating layer 35, at the upper end of each of the connecting conductors 3, the terminal pads 38 are formed in an array. Further, the surface of the insulating layer 35 is covered approximately with the entire surface of the solder resist 39. Further, the terminal pads 38 are exposed, and a plurality of solder pumps (not shown) are disposed on the surface of the terminal pads 38. As shown in Fig. 1, the second stacked layer 32 has substantially the same structure as the first stacked laminate 31. That is, the second stacked layer 32 has a structure of -17-200838375 in which the insulating layers 40, 41, 42 and the conductor layer 36 composed of an epoxy resin are alternately laminated. The connection conductor 37 is formed at a plurality of positions in the insulating layers 40, 41, 42, and the conductor layer 36 is electrically connected to the connection conductor 37 or the like. Further, the terminal pads 43 are formed in a lattice shape at a position below the lowermost insulating layer 42 to be the lower end of each of the connection conductors 37. Further, the underside of the insulating layer 42 is covered with the solder resist 4 4 approximately. Further, the terminal pads 43 are in an exposed state, and a plurality of solder pumps (not shown) for making electrical connection with the main board (not shown) are disposed on the surface of the terminal pads 43. Then, the intermediate product 1 〇 is packaged on the main board by each solder pump. r Further, as shown in Fig. 2, the intermediate product 1 of the wiring board is cut along the outline of the portion 14 to be the product. A line along the outline lines is defined as a cut planned line 45. As shown in Fig. 1, Fig. 2, and Fig. 7, the core layer 17 of the outer frame portion 16 and the outer core layer 20, that is, the outer core layer 18 of the outer frame portion 16, On the lower surface 19 of the core layer, a mesh conductor layer 22 made of copper is formed. Specifically, the mesh-shaped conductor layer 22 is a conductor layer formed by arranging a strip pattern in a lattice shape. Then, the "mesh conductor layer 22 is formed into a rectangular outer frame shape so as to surround the above-described article forming region 15 . The outer edge of the mesh conductor layer 22 coincides with the outer edge of the inner core layer 17, and the inner edge of the mesh conductor layer 22 is located on the boundary line between the outer frame portion 16 and the product forming region 15. Also in this embodiment, the mesh-like conductor layer 22 is g and has a thickness of 35 / / m. Further, on the mesh-shaped conductor layer 2 2 formed on the upper surface of the core layer 18, a blank region 27 in which the same mesh-shaped conductor layer 22 does not exist is set. Blank area 27 becomes long 8111111><a width of 40 mm in a plan view rectangular shape, and on the side of the outer frame portion 丨6 having the above-mentioned position -1 - 8 - 200838375 fixed holes 5 1 , 5 2 , avoiding the position determining holes 5 1 , 5 2 Configured. Further, the blank region 27 is disposed at an intermediate portion between the outer edge and the inner edge of the mesh conductor layer 22. As shown in FIG. 1, FIG. 2, and FIG. 12, an outer metal layer is disposed on the surface layer of the outer core layer 20, that is, on the laminated substrate main surface 12 of the outer frame portion 16, and on the laminated substrate inner surface 13. 61. The outer metal layer 6 1 is formed into a rectangular outer frame shape to form a planar conductor surrounding the product forming region 15 , and the outer edge of the outer metal layer 61 is aligned with the outer r and edge of the outer core layer 20, and the outer metal layer The inner edge of 61 is located on the boundary line between the outer frame portion 16 and the article forming region 15. Further, the outer metal layer 61 is set to form about four times the thickness of the conductor layer 36 of the first stacked layer 31. In the present embodiment, the thickness of the conductor layer 36 is set to 2 5 // m, and the thickness of the outer metal layer 61 is set to be about l 〇〇 #m. Further, an imprinted portion 62 is provided on the outer metal layer 6 1 disposed on the main surface 1 2 of the laminated substrate in the outer frame portion 16. The engraved portion 62 is composed of a character such as a lot number or an article number (in the present embodiment, "ABCDE"). The engraved portion 62 is disposed on the side of the position determining holes 5 1 and 5 2 having the outer frame portion 16 and is disposed away from the position determining holes 5 1 and 5 2 . Further, the imprinted portion 6 2 is disposed at an intermediate portion between the outer edge and the inner edge of the outer metal layer 6 1 . The imprinting portions 6, 2 of this embodiment are characters having a length of 6 mm x a width of about 6 mm, and the depth of the engraving portion 62 is set to be about 30 // m. Further, the blank region 27 is set at a position immediately below the imprinted portion 62 in the mesh-shaped conductor layer 2 2 . The area of the blank area 27 is set to be slightly larger than the area of the formation area of the engraved portion 62. Therefore, -19-.200838375 becomes the position of the blank area 27 directly below the imprinted portion 62. Next, a method of manufacturing the intermediate product 1 of the wiring board will be described. First, the core layer substrate Π is fabricated. In the preparation step, a metal layer 7 1 for forming an inner layer conductor layer made of a copper foil having a thickness of 3 5 / m m is prepared on both sides of a substrate having a length of 410 mm x a width of 43 mm and a thickness of 0.8 mm (see the third Figure) Copper plated laminate (core layer 17). Next, in the uranium arsenic material disposing step, the susceptor-preventing uranium-repellent material 72 is provided on the inner-layer conductor layer-forming metal layer 71 (refer to Fig. 4 (Fig.). The exposure mask 74 forming the predetermined mask pattern 73 is disposed on the resist material 72. Then, in the exposure step, the resist material 72 is exposed through the exposure mask 74, followed by the development step. The resist material 72 is developed to form a resist 75 (see Fig. 5). Next, in the etching step, the inner layer conductor layer forming metal layer 71 is etched, and the inner layer conductor is partially dissolved and removed. The layer forming metal layer 71. The result is that an inner layer conductor layer is formed on the surface of the article forming region 15. At the same time, the mesh conductor layer 22 is patterned on the surface of the outer frame portion 16 and A blank region 27 is set in the region of the mesh conductor layer 22 (see FIGS. 6 and 7). Next, in the stacking step, the core layer 17, the outer core layer 20, and the copper foil 76 are stacked and integrated. To form a laminated substrate body 78. In detail, first in On the upper surface 18 of the core layer 17 and the lower surface 19 of the core layer, a pre-preg 77 of a copper foil 76 (metal foil) is placed on one side (see Fig. 8). In this embodiment, the thickness of the prepreg layer 77 is copper foil 76 having a thickness of 28//m or 33 -20 - 200838375 // m. Then, heating is performed to a temperature of more than 180 ° C and in the lamination direction. (joining direction) a pressing force (2 MPa) is applied (hot pressing). Subsequently, the core layer 17 , the prepreg layer 7 7 and the copper foil 7 6 are pressed along the lamination direction while preheating The organic material in the impregnated layer 7 7 becomes more viscous. The result is that the prepreg layer 77 and the copper foil 76 are individually pressed (hot pressed) on the upper surface 18 of the inner core layer and the lower surface 19 of the inner core layer, and the prepreg layer becomes the outer portion. The laminated substrate body 78 is completed by the core layer 20. Next, in the through-hole conductor forming step, the through-hole conductor 25 penetrating the laminated substrate body 7 is formed in the product forming region 15. In detail, first, the laminated substrate body is formed. 7 8 using a drilling machine for drilling, pre-formed for forming the through-hole conductor 25 The perforation 24 is at a predetermined position (see Fig. 9). Then, electroless copper plating is performed on the entire laminated body, and a through-hole conductor 25 is formed on the inner peripheral surface of each of the through holes 24 (see Fig. 10). In the imprinting step, on the copper foil 76 formed on the main surface 1 2 of the laminated substrate, by marking the position directly above the blank region 27, the engraved portion 6 2 is received at 1, - _ copper foil 7 6 g Specifically, the lower mold 8 1 supports the inner surface of the laminated substrate of the core substrate 1 1 on the side of the laminated substrate, and the upper mold 82 is placed on the laminated substrate main surface 1 2 side of the core substrate Π (see the first 〇图). Further, the upper mold 8 2 has a projection forming portion 8 3 on the lower surface side. Further, in the upper mold 8 2 of the present embodiment, in order to replace a plurality of projections 83, an imprint portion 62 displaying a different lot number or article number can be formed on each of the core substrate 1 1. Then, the pressing pressure (4 MPa) was applied in the lamination direction. Then, as a result of the -21 - .200838375, a part of the copper foil 76 is pressed into the convex portion 83 and recessed, and the imprinted portion 6 2 is formed (refer to Figs. 1 and 12). At this time, at least the portion on the lower side of the engraved portion 6 2 of the outer core layer 20 becomes concave. Next, a printed resin paste is printed in the through-hole conductor 25 and heat-hardened to form a chelating material 26. Further, after the cap plating is performed, honing is performed on the laminated substrate main surface 12 side of the core substrate 1 1 and the laminated substrate inner surface 13 side. As a result, in order to improve the flatness of the core substrate 11 , the stacked layers 31 and 32 can be formed with high precision in the subsequent steps (insulating layer forming step and conductor layer forming step). Then, the conductor pattern 23 is patterned with the outer metal layer 61 (see Fig. 1 1). Also, the core substrate 11 is completed at this point. After the completion of the core substrate 1 1 , an insulating layer forming step of forming the insulating layers 3 3 to 35, 40 to 42 and a conductor layer forming step of forming the conductor layer 36 of a predetermined pattern are alternately performed, in the core layer substrate 11 A stacked layer 3 is formed on the main surface 1 2 of the laminated substrate and on the inner surface 13 of the laminated substrate. Specifically, first, a plate-shaped thermosetting epoxy resin is laminated on the laminated substrate main surface 12 of the core substrate 11 and the laminated substrate inner surface 13 to form the first insulating layers 33 and 40 in an uncured state. . Next, it is heated to 17 (TC and the insulating layers 33, 40 are semi-hardened. Further, by means of a laser processing machine, a pupil is formed at a position where the connecting conductor 37 should be formed. Then, it is heated to 180 ° C. The insulating layer 3 3, 40 is hardened. Secondly, electrolytic copper plating is performed according to a conventionally recognized method (for example, a semi-additive method), and a connecting conductor 3 7 is formed inside the blind hole while being on the insulating layer 3 3, 40 The conductor layer 36 is formed. At this time, since electrolytic copper plating is also performed on the outer metal layer 61, the outer metal layer 61 is thickened to correspond to the thickness of the conductor layer 36 of -22-200838375. Then, the insulation of the first layer On the layer 3 3, 40, a plate-shaped thermosetting epoxy resin is laminated to form a second insulating layer 34, 41 in an uncured state. Next, the substrate is heated to 170 ° C and the insulating layers 34, 41 are provided. Further, a blind hole is formed at a position where the connecting conductor 37 should be formed by a laser processing machine. Then, it is heated to 180 ° C to harden the insulating layer 34, 41. Further, according to A well-established method for performing electrolytic copper plating to form a connecting conductor 3 7 inside the blind via hole The conductor layer 36 is formed on the insulating layers 34, 4 1. At this time, 'the electrolytic layer copper is also applied to the outer metal layer 61, and the outer metal layer 6 1 is thickened to correspond to the thickness of the conductor layer 36. A plate-shaped thermosetting epoxy resin is laminated on the second insulating layers 3 4 and 4 1 to form a third insulating layer 35 and 42 in an uncured state. Secondly, it is heated to 170 ° C. The insulating layer 35, 4 2 is semi-hardened. Further, a blind hole is formed at a position where the connecting conductor 37 should be formed by a laser processing machine. Then, it is heated to 180 ° C to harden the insulating layers 35, 42. Further, electrolytic copper plating is performed in accordance with a conventionally recognized method, and a connection lead body 3 7 is formed inside the blind via hole, and terminal pads 38, 43 are formed on the insulating layers 35, 42. Since electrolytic copper plating is also performed on the outer metal layer 61, the outer metal layer 61 is further thickened to correspond to the thickness of the terminal pads 38, 43. Further, the stacked layers 3 1 and 3 2 are completed at this stage. The solder resists 39, 44 are formed by applying a photosensitive epoxy resin to the third insulating layers 35, 42 and hardening them. Exposure and development are performed in a state in which a predetermined mask is placed, and the solder resists 39, 44 are etched to expose the terminal pads 38, 43. The result is obtained in the wiring substrate shown in Fig. 1 - 200838375 After that, the outer frame portion 16 is cut off from the product forming region 15 by using a conventionally known cutting device or the like, and is cut along the cutting planned line 45 of the product forming region 15 to thereby cut. A plurality of products (wiring substrates) are obtained by dividing the products. Therefore, according to the present embodiment, the following effects can be obtained. (1) According to the core substrate Π of the present embodiment, since the blank region f 27 in which the mesh-shaped conductor layer 22 does not exist is provided directly under the marking portion 62, there is no uneven structure in which stress concentration is easy, and externally The core layer 20 becomes less prone to cracking (refer to Fig. 18). Therefore, the liquid such as the plating solution which is prevented from being ruptured in the product forming region 15 or immersed through the rupture flows into the product forming region 15 along the mesh-like conductor layer 22, and the outer core of the product forming region 15 can be prevented. Peeling of layer 20 or inner conductor layer 21. Therefore, it is possible to prevent a decrease in the yield of the core substrate 11 due to cracking or peeling, and at the same time, to impart high reliability to the substrate 11. (2) Since the blank region 27 of the present embodiment has a region where the gold I / genus portion of the conductor layer or the like does not exist, the adhesion strength between the inner core layer 17 and the outer core layer 20 is higher than that of the other portions. Therefore, the blank portion 27 which is easily guided is formed at the time of formation of the imprinted portion 62, and cracking or peeling is less likely to occur. Further, when any metal portion exists in the blank region 27, when the crack occurs, the liquid such as the plating solution transports the metal portion and is immersed between the inner core layer i 7 and the outer middle core layer 20, as in the present embodiment. The blank area 2 7 is not present in the inner metal portion 'preventing the impregnation of the liquid as described above. Further, the mesh-shaped conductor layer 22 of this embodiment also has a function as a liquid which is immersed in the liquid immersed in the crack - 24 - ♦ 200838375. (3) However, in the exposure mask used in the exposure mask arrangement step (see Fig. 4), it is considered that a light-shielding tape or the like is attached to the original plate for exposure (glass cover or the like). However, it is difficult to properly apply the light-shielding tape. Further, when a light-shielding tape is used, on the one hand, pinholes are formed in the light-shielding tape due to peeling, deterioration, and adhesion of the light-shielding tape, and dust is generated on the one hand. Further, in the present embodiment, since the exposure mask to which the light-shielding tape is attached is not used, and the exposure mask f 74 which forms the predetermined mask pattern 73 is used, the above problem is eliminated. Further, the embodiment of the present invention may be modified as follows. In the above embodiment, the blank region 27 is set at a position directly below the imprinted portion 62 in the mesh conductor layer 22. However, as shown in Figs. 1 and 4, a planar conductor region 91 having no stamping pattern may be provided at a position directly below the imprinting portion 62 in the mesh conductor layer 22. Further, in the planar conductor region 91, a planar conductor 92 having a rectangular shape of 8 mm x 40 mm in width is present. The planar C i ^ conductor 92 is formed simultaneously with, for example, the mesh conductor layer 22. Even in this case, since the stress concentration caused by the collision applied at the time of formation of the imprinted portion 62 in the vicinity of the mesh-like conductor layer 22 can be prevented, the occurrence of cracking of the core layer 20 in the outer portion (refer to Fig. 18) can be prevented. Accordingly, a liquid such as a plating solution which is ruptured in the product forming region 15 or immersed in the rupture is prevented from flowing into the product forming region 15 along the strip pattern of the mesh-shaped conductor layer 22. Therefore, peeling of the outer middle core layer 20 or the inner layer -25 - 200838375 layer conductor layer 2 1 in the product forming region 15 due to the cracking or the immersed liquid can be prevented. Therefore, it is possible to prevent a decrease in the yield of the core substrate 11 due to cracking or peeling, while imparting high reliability to the substrate 11. In the above embodiment, the region 27 is provided only at a position directly below the imprinted portion 62 in the sieve layer 22 on the upper surface 18 of the inner core layer. However, it is also located in the screen-like guide on the lower surface 19 of the inner core layer at a position directly below the imprinted portion 62, and may be set to be empty 27 . In this case, since the portion which is easy to conduct at the time of formation of the f 6 2 on the lower side of the inner core layer also becomes a mesh-shaped guide bone, it is possible to surely prevent the occurrence of cracking. In the above embodiment, the formation of the squeezing material 26, the patterning of the covering electric conductor pattern 23 and the outer layer metal layer 61, and the like before the formation of the imprinting portion 62, and the formation of the covering electric body pattern 23 and the outer layer metal layer 61 can be carried out. After the cap plating is performed, patterning of the conductor pattern 23 and the genus layer 61 or patterning of the outer layer metal layer 61 may be performed, and then the cap plating may be performed to form the conductor pattern 2 3 . C j ^ In the embodiment, the surface pattern shape conductor layer 22 is formed on the outer frame portion 16 and the white region 2 7 is formed in the region where the mesh conductor layer 22 is formed, as shown in Fig. 15 and Fig. 16. Other embodiments of the figure can be combined to form a baffle-like conductor surrounding the blank region 27, and the blanking region 27 and the mesh-like conductor surrounding it are sure to block the plating solution in the blank region 27 Intrusion. Therefore, it is possible to prevent the decrease in the adhesion in the blank area 27, and further increase the reliability of the link. In addition, the baffle-like conductor 95 can be formed with the surrounding layer to cause the core layer to be blanked, and the white layer is printed with the portion I layer 22 or formed in the outer layer of the gold case to form a screen. Also by this configuration f 22 >, it is confirmed that the easy mesh -26 - 200838375-like conductor layer 22 is simultaneously formed. In the above embodiment, the mesh-like conductor layer 2 2 is formed, and as in the other embodiment shown in Fig. 7, a scatter-like conductor layer such as, for example, a water droplet pattern guide 22A may be formed. Next, the following is an idea of the above-described embodiments. (1) A method for manufacturing a laminated substrate, which has a structure in which a plurality of resin insulating layers are stacked and an outer layer metal layer is disposed on a surface layer thereof, and a plurality of product regions which are part of the product are arranged in a division of the substrate plane, and the product is surrounded. Forming an outer frame portion of the region, forming a mesh-shaped conductor layer or a conductor layer between the plurality of resin insulating layers in the outer frame portion, and providing a score on the outer metal layer of the outer frame portion in the mesh The position of the conductor layer or the scatter conductor layer is directly below the imprinted portion, and the blank region where the mesh conductor layer or the scatter conductor layer does not exist or the planar conductor region without the stamp is set. A method for producing a laminated substrate, characterized in that the insulating layer for the inner layer of the inner layer conductor layer forming metal layer is provided on the surface thereof, and the inner layer conductor layer forming metal layer is formed by uranium to form the former product. Forming an inner conductor layer on the surface of the region, and forming the mesh conductor layer or the scatter conductor layer on the outer surface; stacking the foregoing a resin insulating layer for a layer, a resin layer for an outer layer, and a metal foil are integrated, and a step of forming a laminated substrate main body to form a through-hole conductor forming step of the through-hole conductor of the laminated substrate main body in the product region; Preparing an insulating step by engraving a frame portion containing the pre-resin described above including the scatter portion of the first layer of the first layer; forming the outer layer of the metal -27-.200838375 foil The metal layer is a position immediately above the blank region or the planar conductor region, and an imprinting step of the imprint portion is provided on the outer metal layer. (2) A method for producing a laminated substrate, which has a structure in which a plurality of resin insulating layers are stacked and an outer layer metal layer is disposed on a surface layer thereof, and is divided into a product forming region which is a part of the product along a plane of the substrate, And an outer frame portion surrounding the product forming region, a mesh-shaped conductor layer or a scattered-point conductor layer is formed between the plurality of resin insulating layers of the outer frame portion, and the outer metal layer of the outer frame portion Providing a marking portion that is located immediately below the imprinting portion in the mesh conductor layer or the scatter conductor layer to set a blank region where the mesh conductor layer or the scatter conductor layer does not exist, Or a method of manufacturing a laminated substrate having a planar conductor region having no stamping pattern, characterized in that it is provided with a resin insulating layer for providing an inner layer for forming an inner layer conductor layer forming metal layer on the surface thereof, and then providing an etching for imparting photosensitivity a step of forming a resist material on the inner conductor layer forming metal layer; and arranging an exposure mask for forming a predetermined mask pattern a step of etching the resist material; a step of exposing the etching resist material through the exposure mask; a step of developing the etching resist to form an etching resist; and etching the inner layer conductor layer forming metal layer a step of preparing an inner layer conductor layer on a surface of the product forming region, and forming a mesh conductor layer or the scatter conductor layer on a surface of the outer frame portion; and stacking the resin insulating layer for the inner layer a step of forming a laminated substrate body by integrating a resin insulating layer for outer layer and a metal foil, and forming a through-hole conductor forming step of the through-hole guide -28 - 200838375 of the laminated substrate body in the product forming region; And an imprinting step of providing the imprinted portion on the outer layer metal layer by marking a position directly above the blank region or the planar conductor region in the outer metal layer including the metal foil. (3) An intermediate product of a wiring board, characterized in that a structure in which a plurality of resin insulating layers are stacked in an alternating layer and an outer layer metal layer is disposed on a surface layer thereof is partitioned so as to be a part of the product along a plane direction of the substrate. a product forming region, and an outer frame portion surrounding the product forming region, Γ 1 forming a mesh-like conductor layer or a scatter-like conductor layer between the plurality of resin insulating layers of the outer frame portion, in the outer frame portion The laminated layer of the imprinted portion of the outer layer metal layer, the insulating layer provided on at least one of the laminated substrate main surface and the laminated substrate inner surface provided on the laminated substrate, and the wiring substrate intermediate product formed by the stacked layers formed by the conductive layer In the mesh-shaped conductor layer or the scatter-like conductor layer, a blank region where the mesh conductor layer or the scatter conductor layer does not exist is set at a position immediately below the marking portion. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an important part of an intermediate product of a wiring board in the present embodiment. Fig. 2 is a schematic plan view showing an intermediate product of a wiring board. Fig. 3 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board (core layer substrate). Fig. 4 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board (core layer substrate). -29- 200838375 Fig. 5 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring substrate (medium core substrate). Fig. 6 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring substrate (medium core substrate). Fig. 7 is a schematic plan view showing an important part of a method of manufacturing a wiring substrate (medium core substrate). Fig. 8 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board (medium core substrate). Fig. 9 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board (core layer substrate). The first drawing shows a schematic cross-sectional view of an important part of a method of manufacturing a wiring board (medium core substrate). Fig. 1 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board (core layer substrate). Fig. 12 is a schematic plan view showing an important part of a method of manufacturing a wiring board (core layer substrate). Fig. 13 is a schematic cross-sectional view showing an important part of a method of manufacturing a wiring board in other embodiments. Fig. 14 is a schematic plan view showing an important part of a method of manufacturing a wiring board in other embodiments. Fig. 15 is a schematic plan view showing an important part of a method of manufacturing a wiring board in other embodiments. Fig. 16 is a cross-sectional schematic cross-sectional view showing a method of manufacturing the wiring substrate in other embodiments. -30- ^ 200838375 Figure 1 7 shows an important part of the manufacturing method of the wiring board in other implementations. Figure 18 shows the important part of the wiring board of the f ΐ 1槪 〇 〇 主要 [main element symbol description I 10 intermediate product 11 as the center of the laminated substrate, layer substrate 12 laminated substrate main surface 13 laminated substrate inner surface 14 Jft J / IU \ part of the product 15 product formation domain 16 outer frame part 17 core layer 18 as a resin insulating layer for the inner layer, upper core layer 19, inner core layer 20, outer core layer 2 as a resin insulating layer for outer layer 2 inner conductor layer 22 mesh conductor layer 22A as scatter Conductor layer water droplet pattern conductor layer 23 conductor pattern 24 through hole 25 shell perforated conductor 26 Filling material 27 Blank field 200838375 3 1 32 33, 34, 35, 40, 4 36 37 38 39 43 r " 44 45 5 1 52 6 1 62 7 1 72 l 73 74 75 76 77 78 8 1 82 As a stack The first stacked layer of the layer serves as the second stacked layer of the stacked layer 1, 42 the insulating layer conductor layer connecting conductor terminal pad solder resist terminal pad solder resist cutting predetermined line position determining hole position determining hole outer layer metal layer marking portion inner layer conductor Layer forming metal layer resist material mask pattern mask anti-uranium agent as metal foil copper foil prepreg layered substrate body lower mold upper mold -32 - 200838375 83 protruding portion 91 planar conductor region 92 planar Conductor 95 baffle conductor 100 intermediate product 101 inner core layer 102 outer central layer 103 stacked layer 104 article formation 13⁄4 domain 1 0 5 inner layer am body layer 106 mesh conductor layer 108 outer frame portion 109 imprinted portion 110 cracked -33 -