TWI413872B - Marking system of printed circuit board and method for using the same - Google Patents

Abstract

A marking system includes an exposing device, a developing device, and an etching device. The exposing device includes a two-dimensional code generating unit, a liquid crystal display unit, an exposing light source and a cover. The two-dimensional code generating unit is used for generating a two-dimensional code. The liquid crystal display unit is used for displaying the two-dimensional code. The exposing light source is used to developing a printed circuit board by using the two-dimensional code as exposing pattern. The cover is used for making the light emitted by the exposing light source projecting to the liquid crystal display unit. The developing device is used for developing the printed circuit board to form a developing pattern corresponding to the exposing pattern. The etching device is used for etching the printed circuit board to form a two-dimensional code mark corresponding to the developing pattern. A method for using the marking system to form a mark in a printed circuit board is also provided.

Description

Circuit board marking system and method of use thereof

The present invention relates to circuit board technology, and more particularly to a circuit board marking system and method of use thereof.

With the rapid development of the electronics industry, circuit board manufacturing technology, which is the basic component of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, exposing, developing, etching, pressing, and molding of a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

In general, the board will record information about the board's production process by forming a variety of different markings. For example, in the first type, holes with different apertures are drilled at the edge of the board or stamps of different patterns are stamped to distinguish different boards, and the holes or seals are used to track the problems of the board in subsequent processes. The stages of these undesirable problems can be documented to analyze the causes of the failures and to find solutions. However, when the inner layer circuit is fabricated by the image transfer process, the board cannot be drilled or stamped after the photoresist is applied, so that the problem of the board in the image transfer process cannot be tracked. Second, use in image transfer The mask is written (for example, the date of manufacture and the machine number), and the mask is used as a mark by exposure, development, and etching. However, if the marking of each board is different, it is necessary to replace the mask once after each board is exposed, which is a waste of time and cost. If the mask is replaced only once a day, the boards made on the same production machine will be marked the same on the same day, and each board cannot be distinguished by the mark, so that the problem of the board cannot be effectively tracked. . Moreover, the above two types of marks are relatively single, and the amount of information that can be carried is small. When a large number of circuit boards need to be produced, it is not possible to mark the boards of the batch one by one with a large number of different marks.

In view of the above, in view of the above problems, it is necessary to provide a circuit board marking system capable of effectively marking a circuit board in a picture transfer process and using the same.

A circuit board marking system and method of use thereof will now be described in the context of a specific embodiment.

A circuit board marking system for forming a two-dimensional code mark in a circuit board. A photoresist is formed on the surface of the board. The board marking system includes an exposure device, a developing device, and an etching device that are sequentially disposed. The exposure apparatus includes a two-dimensional code generating unit, a liquid crystal display unit, an exposure light source, and a cover. The two-dimensional code generating unit is configured to generate a two-dimensional code. The liquid crystal display unit is connected to the two-dimensional code generating unit for acquiring and displaying the two-dimensional code generated by the two-dimensional code generating unit. The exposure light source is opposite to the liquid crystal display unit for exposing the photoresist on the surface of the circuit board by using the two-dimensional code displayed by the liquid crystal display unit as an exposure pattern. The cover is enclosed between the exposure light source and the liquid crystal display unit for projecting light emitted by the exposure light source to the liquid crystal display unit. The The developing device is disposed between the exposure device and the etching device for developing the exposed circuit board to form a developing pattern corresponding to the exposure pattern in the photoresist. The etching apparatus is for etching the developed circuit board to form a two-dimensional code mark corresponding to the developing pattern in the circuit board.

A method of using a circuit board marking system as described above, comprising the steps of: providing a circuit board having at least one surface formed with a photoresist; generating a two-dimensional code by using a two-dimensional code generating unit; and acquiring and using a liquid crystal display unit Displaying the two-dimensional code; turning on the exposure light source to expose the photoresist of the circuit board by using the two-dimensional code displayed by the liquid crystal display unit as an exposure pattern; developing the photoresist by the developing device, so that the photoresist is formed in the photoresist corresponding to the exposure pattern a developing pattern; etching the circuit board with an etching device to form a two-dimensional code mark corresponding to the developing pattern in the circuit board.

Compared with the prior art, the circuit board marking system of the present technical solution and the method for using the same, first generate a two-dimensional code by using a two-dimensional code generating unit, and then acquire and display the two-dimensional code by using a liquid crystal display unit, and then turn on the exposure light source to The two-dimensional code displayed on the liquid crystal display unit exposes the circuit board as an exposure pattern, and finally develops and etches by a developing device and an etching device to form a two-dimensional code mark. Since the two-dimensional code generating unit can generate a large number of different two-dimensional codes, a large number of circuit boards can be marked one by one in the image transfer process; and, since the liquid crystal display unit can display different two-dimensional codes, It does not require frequent replacement of the reticle, saving time and cost of exposure.

100‧‧‧Board marking system

10‧‧‧Exposure device

20‧‧‧Developing device

30‧‧‧ etching device

11‧‧‧ QR code generation unit

12‧‧‧LCD unit

13‧‧‧Exposure source

14‧‧‧ Cover

200‧‧‧ boards

210‧‧‧Insulation

220‧‧‧copper layer

230‧‧‧Light resistance

211‧‧‧ first surface

212‧‧‧ second surface

201‧‧‧Molding area

202‧‧‧Edge area

205‧‧‧marked area

206‧‧‧Exposure Mark

207‧‧‧Development pattern

208‧‧‧ QR code mark

FIG. 1 is a schematic diagram of a circuit board marking system provided by an embodiment of the present technical solution.

2 is a flow chart of a method for using a circuit board marking system provided by an embodiment of the present technical solution. Figure.

3 is a schematic diagram of a circuit board provided in the method of using the circuit board marking system of FIG.

4 is a schematic diagram showing the display of a two-dimensional code in a liquid crystal display unit in the method of using the circuit board marking system of FIG.

Figure 5 is a schematic illustration of the alignment of the circuit board with the liquid crystal display unit in the method of using the circuit board marking system of Figure 2.

6 is a schematic diagram showing the formation of an exposure mark on the photoresist of the circuit board in the method of using the circuit board marking system of FIG.

Figure 7 is a schematic illustration of the development of the exposure mark in the method of using the circuit board marking system of Figure 2.

FIG. 8 is a schematic diagram showing the etching of a circuit board to form a two-dimensional code mark in the method of using the circuit board marking system of FIG. 2. FIG.

FIG. 9 is a schematic diagram showing the method of using the circuit board marking system of FIG. 2 to peel off the photoresist of the circuit board.

The circuit board marking system of the present technical solution and the method of using the same will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , an embodiment of the present invention provides a circuit board marking system 100 for forming a two-dimensional code mark in a circuit board, and a surface of the circuit board is formed with a photoresist. The circuit board marking system 100 includes an exposure device 10, a developing device 20, and a display device 20, which are sequentially disposed, Etching device 30. The exposure device 10, the developing device 20, and the etching device 30 are used to sequentially expose, develop, and etch a circuit board to form a circuit board mark.

The exposure device 10 includes a two-dimensional code generating unit 11, a liquid crystal display unit 12, an exposure light source 13, and a cover 14.

The two-dimensional code generating unit 11 is for generating a two-dimensional code. In this embodiment, the two-dimensional code generating unit 11 can be a computer, and different types of two-dimensional codes can be generated by installing different two-dimensional code software in the computer. The two-dimensional code generating unit 11 can generate various random two-dimensional codes, such as a stacked/row row two-dimensional code, or a matrix two-dimensional code, and the like. The coding principle of the stacked/row row two-dimensional code is based on a one-dimensional barcode, and is stacked into two or more rows as needed. For example, Code 16K, Code 49, PDF417, etc. are representative stacked/row type two-dimensional codes. The matrix two-dimensional code is encoded in a rectangular space by different distributions of black and white pixels in the matrix. In the position of the corresponding element of the matrix, the occurrence of the binary point "1" is represented by the appearance of black dots (square dots, dots), squares or other graphics, and the black dots, squares or other graphics do not appear to represent the binary "0". The arrangement of points, squares or other figures determines the meaning of the matrix two-dimensional code. For example, Code One, Maxi Code, QR Code, Data Matrix, etc. are representative matrix type two-dimensional codes.

The liquid crystal display unit 12 is connected to the two-dimensional code generating unit 11 for acquiring and displaying the two-dimensional code generated by the two-dimensional code generating unit 11. After the two-dimensional code generating unit 11 generates a two-dimensional code and transmits it to the liquid crystal display unit 12, the liquid crystal display unit 12 can acquire and display the two-dimensional code. In this embodiment, the shape of the liquid crystal display unit 12 is a rectangle. The two-dimensional code generated by the two-dimensional code generating unit 11 is a matrix two-dimensional code, and the two-dimensional code displayed by the liquid crystal display unit 12 is a matrix array composed of black and white pixel arrangements. of course, The shape of the liquid crystal display unit 12 can be specifically set according to the shape of the circuit board mark to be formed. Further, the type of the liquid crystal display unit 12 is not limited, and for example, it may be a twisted nematic type, a super twisted nematic type, a double layer super twisted nematic type or a thin film transistor type or the like.

The exposure light source 13 is opposite to the liquid crystal display unit 12 for exposing the photoresist of the surface of the circuit board by using the two-dimensional code displayed by the liquid crystal display unit 12 as an exposure pattern. The wavelength of the light emitted by the exposure light source 13 is short, so that the operating temperature of the liquid crystal display unit 12 is not excessively high, and the liquid crystal display unit 12 is prevented from being excessively heated to be damaged or failed. Generally, the operating temperature of the liquid crystal display unit 12 should be less than 50 degrees Celsius. In this embodiment, the exposure light source 13 is an ultraviolet light source, and the exposure light source 13 is a point light source. Of course, the exposure light source 13 may also select a light source having a wavelength slightly larger than ultraviolet light or less than ultraviolet light, which may be selected according to the dielectric material to be exposed. In addition, the exposure light source 13 can also adopt a line light source or a surface light source.

The cover 14 is enclosed between the exposure light source 13 and the liquid crystal display unit 12 for projecting light emitted from the exposure light source 13 to the liquid crystal display unit 12. In this embodiment, since the shape of the liquid crystal display unit 12 is rectangular, the shape of the outer cover 14 is a quadrangular pyramid, the exposure light source 13 is located at the apex of the quadrangular pyramid cover 14, and the liquid crystal display unit 12 is located at the quadrangular pyramid. The bottom surface of the outer cover 14. In addition, when the liquid crystal display unit 12 has a shape such as a triangle or a circle, the shape of the outer cover 14 may correspondingly be a triangular pyramid, a conical shape or the like. When the shape of the outer cover 14 is tapered, the exposure light source 13 is close to the apex of the tapered outer cover 14, and the liquid crystal display unit 12 is adjacent to the bottom surface of the tapered outer cover 14.

Of course, the shape of the cover 14 can be according to the shape of the liquid crystal display unit 12, and the exposure light source. The shape of 13 and the relative positional relationship between the exposure light source 13 and the liquid crystal display unit 12 are specifically set. The cover 14 only needs to project the light emitted by the exposure light source 13 in the area where the liquid crystal display unit 12 is located, thereby preventing the exposure light source 13 from erroneously exposing other areas of the circuit board. Preferably, the inner surface of the outer cover 14 is a reflective surface or an opaque surface, so that the light emitted by the exposure light source 13 is prevented from penetrating through the outer cover 14.

The developing device 20 is disposed between the exposure device 10 and the etching device 30 for developing the exposed circuit board to form a developing pattern corresponding to the exposure pattern in the photoresist. The developing device 20 is loaded with a developing solution for developing the circuit board.

The etching device 30 is for etching the developed circuit board to form a two-dimensional code mark corresponding to the developing pattern in the circuit board. The etching device 30 is loaded with an etching liquid for etching the circuit board.

Referring to FIG. 2, the embodiment of the present invention further provides a method for using the circuit board marking system 100, which includes the following steps:

Step 110, referring to FIG. 3, a circuit board 200 is provided, at least one surface of which is formed with a photoresist 230.

In this embodiment, the circuit board 200 includes an insulating layer 210, a copper foil layer 220, and a photoresist 230. The insulating layer 210 has opposite first and second surfaces 211, 212. The first surface 211 is parallel to the second surface 212. A first copper foil layer 220 is disposed on each of the first surface 211 and the second surface 212, that is, the circuit board 200 is a two-layer circuit board. The photoresist 230 is located on the surface of the copper foil layer 220 of the first surface 211 of the insulating layer 210. The circuit board 200 can also be a single-layer circuit board having only one copper foil layer 220, or have two A multilayer circuit board having a layer of copper foil 220 or more. The circuit board 200 has a molding area 201 and an edge area 202 surrounding the molding area 201. That is, the edge region 202 is located on the outer side of the molding region 201. The molding area 201 is the area where the finished circuit board is finally formed, and the edge area 202 is an area to be cut and removed when forming a finished circuit board.

In step 120, the two-dimensional code is generated by the two-dimensional code generating unit 11.

In this embodiment, the two-dimensional code generated by the two-dimensional code generating unit 11 is a matrix two-dimensional code. The matrix type two-dimensional code is formed by matrixing the squares of black and white pixels. The two-dimensional code generating unit 11 can randomly generate different matrix two-dimensional codes.

Step 130, referring to FIG. 4, the two-dimensional code is acquired and displayed by the liquid crystal display unit 12.

The liquid crystal display unit 12 is connected to the two-dimensional code generating unit 11. The two-dimensional code generated by the two-dimensional code generating unit 11 is transmitted to the liquid crystal display unit 12, and the liquid crystal display unit 12 can acquire and display the two-dimensional code.

Step 140, referring to FIG. 5, the marking area 205 of the circuit board 200 to be marked is aligned with the liquid crystal display unit 12.

The circuit board 200 is placed on one side of the liquid crystal display unit 12 away from the exposure light source 13 , and then the circuit board 200 is aligned with the liquid crystal display unit 12 by using a matching device (not shown), so that the circuit board 200 needs to be formed. The marked mark area 205 is aligned with the liquid crystal display unit 12. In this embodiment, the marking area 205 of the circuit board 200 to be marked is located at the edge region 202 of the circuit board 200.

Step 150, referring to FIG. 6, the exposure light source 13 is turned on to expose the photoresist 230 of the circuit board 200.

The exposure light source 13 is turned on, and the photoresist 230 of the circuit board 200 is exposed by using the two-dimensional code displayed by the liquid crystal display unit 12 as an exposure pattern to form an exposure mark 206 in a region where the circuit board 200 needs to form a mark. The exposure mark 206 is located on the photoresist 230. The exposure light source 13 preferably uses an ultraviolet light source.

Step 160, referring to FIG. 7, the photoresist 230 is developed by the developing device 20.

The developing device 20 has a developing solution for developing the position of the exposure mark 206 of the photoresist 230 by using the developing solution, thereby removing unnecessary portions of the photoresist 230 in the exposure mark 206, so that the exposure pattern is formed in the photoresist 230. Corresponding development pattern 207. The photoresist region that is developed and removed in the developed pattern 207 corresponds to the white pixel region in the two-dimensional code exposure pattern.

Step 170, referring to FIG. 8 and FIG. 9, etching is performed by the etching device 30 to form the two-dimensional code mark 208.

The etching device 30 has an etching liquid, and the circuit board 200 is etched by the etching liquid in the etching device 30 to form a two-dimensional code mark 208 corresponding to the developing pattern 207 in the circuit board 200. The etching solution can etch away a portion of the copper foil in the copper foil layer 220 of the first surface 211 of the insulating layer 210 that is not covered by the photoresist 230 in the developing pattern 207, thereby forming a two-dimensional code mark 208 corresponding to the exposure pattern. . The area of the two-dimensional code mark 208 that is etched away corresponds to the white pixel area in the two-dimensional code exposure pattern.

Finally, if the photoresist 230 is not needed, the photoresist 230 can also be peeled off, as shown in the figure. 8 is shown. Of course, the photoresist 230 can also be retained to protect the circuit board 200.

Compared with the prior art, the circuit board marking system of the present technical solution and the method for using the same, first generate a two-dimensional code by using a two-dimensional code generating unit, and then acquire and display the two-dimensional code by using a liquid crystal display unit, and then turn on the exposure light source to The two-dimensional code displayed on the liquid crystal display unit exposes the circuit board as an exposure pattern, and finally develops and etches by a developing device and an etching device to form a two-dimensional code mark. Since the two-dimensional code generating unit can generate a large number of different two-dimensional codes, a large number of circuit boards can be marked one by one in the image transfer process; and, since the liquid crystal display unit can display different two-dimensional codes, It does not require frequent replacement of the reticle, saving time and cost of exposure.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Board marking system

10‧‧‧Exposure device

20‧‧‧Developing device

30‧‧‧ etching device

11‧‧‧ QR code generation unit

12‧‧‧LCD unit

13‧‧‧Exposure source

14‧‧‧ Cover

Claims (10)

A circuit board marking system for forming a two-dimensional code mark for each circuit board to be marked one by one in a plurality of circuit boards, the circuit board surface is formed with a photoresist, and the circuit board marking system includes an exposure device sequentially disposed a developing device and a etching device, the exposure device comprising a two-dimensional code generating unit, a liquid crystal display unit, an exposure light source, and a cover, the two-dimensional code generating unit configured to generate a random two-dimensional code, the liquid crystal display unit and the two-dimensional code generating unit Connected to obtain and display a two-dimensional code generated by the two-dimensional code generating unit, the exposure light source is opposite to the liquid crystal display unit, and is configured to use the two-dimensional code displayed by the liquid crystal display unit as an exposure pattern to the surface of the circuit board. Exposing an exposure between the exposure light source and the liquid crystal display unit for projecting light emitted by the exposure light source to the liquid crystal display unit, the developing device being disposed between the exposure device and the etching device for Developing the exposed circuit board to form a developing pattern corresponding to the exposure pattern in the photoresist, the etching device is used for etching After the circuit board, to form a two-dimensional code corresponding to the mark and developing the pattern in the circuit board. The circuit board marking system of claim 1, wherein the two-dimensional code is a stacked/row type two-dimensional code. The circuit board marking system of claim 1, wherein the two-dimensional code is a matrix two-dimensional code, the shape of the liquid crystal display unit is a rectangle, and the two-dimensional code displayed by the liquid crystal display unit is black, A matrix array of white pixels arranged. The circuit board marking system of claim 1, wherein the outer cover is tapered, the exposure light source is adjacent to an apex of the tapered outer cover, and the liquid crystal display unit is adjacent to a bottom surface of the tapered outer cover. The circuit board marking system of claim 1, wherein the liquid crystal display unit is of a twisted nematic type, a super twisted nematic type, a double layer super twisted nematic type or a thin film transistor type. The circuit board marking system of claim 1, wherein the exposure light source is an ultraviolet light source, and the liquid crystal display unit has an operating temperature of less than 50 degrees Celsius. A method of using a circuit board marking system as described in claim 1, comprising the steps of: providing a circuit board having at least one surface formed with a photoresist; generating a random two-dimensional using the two-dimensional code generating unit Obtaining and displaying the two-dimensional code by using a liquid crystal display unit; turning on the exposure light source, exposing the photoresist of the circuit board by using the two-dimensional code displayed by the liquid crystal display unit as an exposure pattern; developing the photoresist by using a developing device to A developing pattern corresponding to the exposure pattern is formed in the photoresist; the circuit board is etched by the etching device to form a two-dimensional code mark corresponding to the developing pattern in the circuit board. The method of using the circuit board marking system of claim 7, wherein before the exposing the photoresist of the circuit board, the circuit board is further disposed on the side of the liquid crystal display unit away from the exposure light source. And the step of aligning the printed circuit board with the marked area with the liquid crystal display unit. The method of using the circuit board marking system of claim 7, wherein the exposure light source is an ultraviolet light source. The method for using a circuit board marking system according to claim 7, wherein the two-dimensional code generated by the two-dimensional code generating unit is a matrix two-dimensional code, and the matrix two The dimension code is formed by a matrix of black and white pixels.