KR101106108B1 - minute linewidth processing method of printing roll - Google Patents

Abstract

The present invention relates to a plate making process that can process the fine pattern of the gravure printing roll in the R2R printing method for printed electronics, and more specifically, to the photosensitive resin, the protective film and the black lacquer on the copper plate surface of the printing roll cylinder The photosensitive resin exposed by irradiating a laser and light does not dissolve in the developer by a crosslinking reaction, and relates to a fine line width processing method of a printing roll for printed electronics which forms a fine pattern by etching the exposed portion after development.

R2R, Gravure, Printing Roll, Printing Electronics

Description

{Minute linewidth processing method of printing roll}

The present invention relates to a plate making process that can process the fine pattern of the gravure printing roll in the R2R printing method for printed electronics, and more specifically, to the photosensitive resin, the protective film and the black lacquer on the copper plate surface of the printing roll cylinder The photosensitive resin exposed by irradiating a laser and light does not dissolve in the developer by a crosslinking reaction, and relates to a fine line width processing method of a printing roll for printed electronics which forms a fine pattern by etching the exposed portion after development.

 In the coming ubiquitous era, there will be an information age where a central management system will be established to give IDs, such as social security numbers, to information and commodities. The technology for realizing the information age needs a technology capable of realizing low-cost mass production of electronic products such as displays and RFID that can exchange information.

Such manufacturing processes for semiconductors and electronic products are manufactured using expensive equipment or extreme process technology. Especially, in order to form a thin film on a substrate, it is necessary to repeatedly perform a process such as damaging a material or exposing or developing a film. There is a limit to reducing manufacturing costs. In other words, as an expensive process, there is a limit to mass production of electronic products necessary in the ubiquitous era.

As a representative example of the electronic printing technology developed to date, a roll to roll (R2R) printing process that can produce mass production and low cost products is emerging.

The R2R printing process is a process of directly printing an electronic element of several tens to hundreds of microelements by transferring and printing an electronic ink onto a substrate using a printing roll having a printed circuit. For example, there are e-paper, RFID-tag, Solar-Cell, Sensor, Flexible Display, etc., which are essential electronic devices in the ubiquitous era.

R2R printing process is a technology that applies the printing technology for manufacturing printed materials such as newspapers, magazines, posters, etc. to manufacture electronic components, unlike the existing method of producing electronic products. It is called printed electronics. The biggest potential market for these printed electronics, as announced at the Civil Engineering Forum, is an intelligent, mass-produced product called Smart Media, which features custom manufacturing.

In the commercialization of the printing device manufacturing process, first of all, the development of printing rolls and plate making and printing systems capable of printing electronic ink and electronic ink should be made in advance.

On the other hand, in general, R2R printing technology is the most widely used flat plate offset, embossed printing and gravure printing, of which gravure printing is a type of intaglio printing, which is a chemical corrosion method, engraved by Herio electron engraving and laser engraving The printing roll is used to print in a rotary manner.

In addition, there are three types of processes for making intaglio printing rolls, such as electromechanical engraving, direct laser engraving, and indirect laser engraving. Currently, a method of coating a polymer or black lacquer on a printing roll surface, patterning an electronic device circuit using a laser beam, and then etching the circuit on a roll surface in an etching process is used. In this case, an indirect laser engraving process is used. The minimum line width that can be processed at is hundreds of micrometers, making it unsuitable for use in fine printed electronics.

Specifically, in the prior arts, first, a method of coating a black lacquer on a cylinder of a printing roll, forming a pattern using a laser, etching, and plating is performed, and secondly, a photosensitive polymer is coated on a cylinder of a printing roll. After coating, a film mask (film pattern) is wound on a roll to irradiate ultraviolet rays.

In case of the former, the binder has to be sublimated by applying energy, and thus the beam size becomes large, and thus a fine pattern cannot be obtained.It is difficult to remove the black lacquer remaining on the surface. There is a problem that can occur.

In addition, in the latter case, a film mask is rolled around the roll to use a seam where the film overlaps the roll. When laminating the film on the roll, light scattering occurs depending on the adhesion of the photosensitive polymer coating and the film mask. There is a disadvantage that the limitation of processing occurs.

Therefore, the present invention has been made to solve the above problems, by processing the fine pattern with the minimum line width on the surface of the gravure printing roll for printed electronics, printing the fine pattern of the electronic circuit produced in the roll-to-roll printing process An object of the present invention is to provide a fine line width processing method of a printing roll for printed electronics.

In accordance with another aspect of the present invention, there is provided a method for processing a fine line width of a printed electronic printing roll, the method comprising: a first coating step of coating a photosensitive resin on a surface of a printing roll cylinder; A second coating step of coating a protective film on the upper surface of the photosensitive resin; A third coating step of coating the black lacquer on the upper surface of the protective film; A pattern forming step of forming a pattern on the surface of the cylinder using a laser and ultraviolet rays; A dissolving step of dissolving the protective film, the black lacquer and the unexposed photosensitive resin using a developer; An etching step of etching the pattern by etching the surface of the cylinder using a corrosion solution; And a peeling step of dissolving the exposed photosensitive resin using a peeling liquid.

At this time, the pattern forming step, the step of forming a pattern to expose the photosensitive resin using a laser; And irradiating ultraviolet rays to the exposed photosensitive resin to change the physical properties.

In addition, the protective film in the first coating step is characterized in that the water-soluble polymer.

On the other hand, after the peeling step may further include a plating step of plating the chromium or chromium alloy on the cylinder surface.

As described above, the fine line width processing method of the printing roll for printed electronics of the present invention prints the fine pattern of the electronic circuit manufactured in the roll-to-roll printing process by processing the fine pattern with the minimum line width on the surface of the gravure printing roll for printed electronics. There is an advantage to this.

In addition, by providing a protective film in the intermediate layer in the multilayer coating structure, the adhesion of the black lacquer and the photosensitive resin is excellent to minimize the scattering of light, there is an advantage that the seam does not exist in the printing roll by processing the pattern with a laser.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method for processing a fine line width of a printed electronic printing roll according to a preferred embodiment of the present invention, Figure 2 is a method for processing a fine line width of a printed electronic printing roll according to a preferred embodiment of the present invention Figure 3 is a plan view for explaining, Figure 3 is a view showing a fine pattern of the printing roll manufactured by the process according to a preferred embodiment of the present invention.

The present invention relates to a plate making process that can process the fine pattern of the gravure printing roll in the R2R printing method for printed electronics, coating a photosensitive resin, a protective film and a black lacquer on the copper plate surface of the printing roll cylinder and irradiating laser and light As a result, the exposed photosensitive resin is not dissolved in the developer by a crosslinking reaction, and the unexposed portion is etched to form a fine pattern.

 1 is a flow chart showing a processing method according to a preferred embodiment of the present invention, as shown in the drawing, first, the first, second and third coating step (S10, S20, S30) on the cylinder surface of the printing roll To perform.

In the first coating step S10, the photosensitive resin 20 is coated on the surface of the printing roll cylinder 10.

At this time, the surface of the cylinder 10 is made of copper (copper) or copper alloy bar, to corrode the surface of the cylinder 10 in the etching step (S60) to be described later. In addition, the photosensitive resin 20 is a kind of functional polymer, and in detail in the pattern forming step (S40) to be described later as a synthetic resin which causes a change in the leg straddling reaction or color decomposition by irradiating light (ultraviolet rays). Let's explain.

Meanwhile, in the second coating step S20, the protective film 30 is coated on the upper surface of the photosensitive resin 20 in a coated state. In addition, in the third coating step S30, the black locker 40 is coated on the upper surface of the protective film 30.

The role of the protective film 30 is coated on the upper surface of the photosensitive resin 20 forming the lower layer, to minimize the damage (damage) of the photosensitive resin 20 by the solvent during coating of the black locker 40 forming the uppermost layer. To do this. Since the solvent used in the photosensitive resin 20 and the black locker 40 has similar components as the organic solvent, the protective film 30 is provided in the intermediate layer by using a water-soluble high molecular material or water as a solvent. 30) The coating does not dissolve or damage the photosensitive resin 20. Here, as the organic solvent, methyl ethyl ketone, toluene, xvlene, ethyl acetate, or the like may be used.

In addition, the protective film 30 is not dissolved in an organic solvent when the black lacquer 40 is coated so that the protective film 30 may not be damaged.

Thus, according to the present invention, the intermediate layer is provided with a water-soluble protective film 30, there is a feature that can be used without damage in coating two coating liquids using a similar organic solvent.

In addition, due to the protective film 30 provided in the intermediate layer, the adhesion between the photosensitive resin 20 and the black lacquer 40 forming the upper layer and the lower layer may be excellent, and light scattering may be minimized.

The black locker 40 is for preventing ultraviolet rays from being irradiated with the photosensitive resin 20. For example, the black locker 40 may be a product such as old chemical Plascoat or RY-480. In addition, the black locker 40 is a coating liquid in which carbon is dispersed, and when exposed to a laser, a pattern may be formed by a laser by sublimation of an organic material such as a binder of carbon particles.

That is, the black lacquer 40 coating liquid in the third coating step (S30) is composed of a binder and carbon particles as the main component and a small amount of surfactant.

On the other hand, after the above-described coating step (S10, S20, S30) is performed a pattern forming step (S40) for forming a pattern on the surface of the cylinder 20 by using a laser and ultraviolet light.

Looking at the pattern forming step (S40) in detail, first to form a pattern so that the photosensitive resin 20 is exposed to the outside using a laser. That is, the photosensitive resin 20 may be exposed to the outside by removing the protective film 30 and the black locker 30 coated on the upper portion of the photosensitive resin 20 using a laser.

Thereafter, the exposed photosensitive resin 20 is irradiated with ultraviolet rays to change the physical properties of the photosensitive resin 20.

As an example, the photosensitive resin coating solution is composed of an initiator, a reactive polymer, a monomer, and a solvent that react with ultraviolet rays (UV) in a process similar to the photolithography process of a semiconductor or a PCB. Initially, the initiator reacts to generate radicals, and the generated radicals react with the monomers in the polymer to cause a crosslinking reaction.

Due to this reaction, the physical properties of the photosensitive resin coating solution are changed to form a film which does not dissolve in the developing solution. In the dissolution step described later, ultraviolet rays are irradiated through the developing solution so that the crosslinked reaction part is not dissolved, and the remaining part is dissolved. It is possible to form a fine pattern.

Then proceed to the dissolution step (S50) to the process.

In the dissolution step (S50) is developed using a developer on the surface of the printing roll cylinder 10 coated with a multi-layer. In other words, due to the principle described above, the rest of the portions excluding the portion 22 exposed to ultraviolet rays, that is, the protective film 30, the black locker 40, and the unexposed photosensitive resin 21 are dissolved.

In this case, as the developer used, NaCo 3 or an amine-based chemical is used.

In addition, the pattern formed through the dissolution step (S50) process can be processed to at least 5㎛, but the line width is somewhat increased through the etching step (S60) to be described later. This is because the etching process is made of isotropic, because the deeper the depth of etching is spread proportionally to the side.

Due to the above-described process, only the portion 22 which remains undissolved by the crosslinking reaction after being exposed to ultraviolet rays remains on the surface of the cylinder 10 of the printing roll, and finally, as the etching step S60 is performed, a pattern is finally formed.

The etching step (S60) to corrode the surface of the cylinder 10 of the copper or copper alloy material using a corrosion solution, as described above, a pattern is formed by corrosion of the remaining portions except the portion 22 that is not dissolved in the developer. .

Specifically, to be processed in the etching step (S60) is a metal surface of the cylinder 10, because it is difficult to directly process the metal surface is to perform an indirect processing. Therefore, through the above-described processes first to form a pattern on the surface of the cylinder (10).

A portion 22 that is irradiated with ultraviolet rays from the surface of the cylinder 10 and is present on the surface of the cylinder 10, that is, does not dissolve through the developer, is commonly referred to as a resist, and serves to prevent copper from dissolving in the corrosion solution. The portion removed from the developer because it is not irradiated with ultraviolet rays is exposed to copper and reacts with the corrosion solution to form an final pattern by etching.

According to this process, the pattern of the surface of the completed cylinder 10 may be at least 8 μm, as shown in FIG. 3.

As a final process, after the etching step (S60), a peeling step (S70) is finally performed to remove the photosensitive resin 22 existing on the surface of the printing roll cylinder (10). This removes the undissolved portion of the photosensitive resin 22 exposed to the surface of the printing roll cylinder 10, that is, the dissolution step S50, by using a peeling solution similar to the developer.

On the other hand, according to a preferred embodiment of the present invention, after the peeling step (S70) it may be configured to further comprise a plating step of plating a chromium or chromium alloy on the surface of the cylinder (10).

As such, the fine line width processing method of the printing roll for printed electronics according to the preferred embodiment of the present invention has the advantage that the seam does not exist in the printing roll by processing the pattern with a laser, and the fine pattern is due to the size of the laser beam. The advantage is that it enables the impossible.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

1 is a flow chart for explaining a method for processing the fine line width of the printing roll for printing electronics according to a preferred embodiment of the present invention.

Figure 2 is a plan view for explaining a fine line width processing method of a printing roll for printed electronics according to a preferred embodiment of the present invention.

Figure 3 is a view showing a fine pattern of the printing roll produced by the process according to a preferred embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10 printing roll cylinder 20 photosensitive resin

30: protective film 40: black locker

Claims (4)

In the method of making a gravure printing roll for printed electronics, A first coating step of coating the photosensitive resin on the surface of the printing roll cylinder; A second coating step of coating a protective film on the upper surface of the photosensitive resin; A third coating step of coating the black lacquer on the upper surface of the protective film; A pattern forming step of removing the protective film and the black lacquer coated on the photosensitive resin by using a laser, and changing the physical properties of the photosensitive resin by irradiating ultraviolet rays; A dissolving step of dissolving the protective film, the black lacquer and the unexposed photosensitive resin using a developer; An etching step of etching the pattern by etching the surface of the cylinder using a corrosion solution; And And a stripping step of dissolving the exposed photosensitive resin using a stripping solution. delete The method of claim 1, In the first coating step, The protective film is a fine line width processing method of a printing roll for printed electronics, characterized in that the water-soluble polymer. The method of claim 1, After the peeling step, The fine line width processing method of the printing roll for printing electronics, characterized in that it further comprises a plating step of plating a chromium or chromium alloy on the cylinder surface.

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