CN108012437A - Flexible circuit board processing procedure retrospect Quick Response Code etching production method - Google Patents

Flexible circuit board processing procedure retrospect Quick Response Code etching production method Download PDF

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Publication number
CN108012437A
CN108012437A CN201711173256.2A CN201711173256A CN108012437A CN 108012437 A CN108012437 A CN 108012437A CN 201711173256 A CN201711173256 A CN 201711173256A CN 108012437 A CN108012437 A CN 108012437A
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Prior art keywords
fpc
quick response
response code
processing procedure
film
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CN201711173256.2A
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Chinese (zh)
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CN108012437B (en
Inventor
续振林
陈妙芳
钟泽发
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Xiamen Hongxin Electronic Technology Group Co Ltd
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Xiamen Hongxin Electron Tech Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

Abstract

The invention discloses a kind of flexible circuit board processing procedure retrospect Quick Response Code etching production method, comprise the following steps：Including processing procedure before FPC, paste dry film, LDI exposes circuit and Quick Response Code, DES, FPC intermediate process, film is fitted on FPC, FPC follow-up process and etc., since the present invention specifies region setting Quick Response Code in flexible circuit board, Quick Response Code functional software is developed on LDI exposure machine equipments, realize that Quick Response Code is automatically generated by device software, the processing procedure serial number information that Quick Response Code includes is automatically generated or networked by device software to be extracted from system, the two-dimension code pattern for including each processing procedure serial number information is transferred on every product successively using the realization of LDI technologies and etching forming is produced, make possess independent identification mark Quick Response Code on every product, FPC production processes can be included to the automatic management and control of system.

Description

Flexible circuit board processing procedure retrospect Quick Response Code etching production method
Technical field
The present invention relates to flexible circuit board production technical field, and two dimension is traced more particularly to a kind of flexible circuit board processing procedure Code etching production method.
Background technology
Manufacturing production and intelligent management and control growth requirement, particularly flexible circuitry type（Abbreviation FPC）Product class The manufacturing that type and output are more, technological process is lengthy and tedious, production equipment species and manpower demand are intensive is, it is necessary to import MES（System Make enterprise production process execution system）Or SFIS（Field data integration system）Etc. system software management, can monitor from raw material Overall production process into factory to the storage of product, records material, equipment used in production process product, the number of product testing According to produced with result and product in each process time, the information such as personnel.Production can be presented in real time by System inventory Manufacturing schedule, the target at scene reach situation, product quality situation, and the people of producing line, machine, the utilization obstacle of material, so allow Whole production scene fully transparentization.To achieve the above object, the procedure for producing information and system docking of flexible circuit board, it is desirable to Possess independent identification mark on every product, and can by scan mode recognition input system to reduce manual operation, The Quick Response Code that can contain processing procedure serial number information need to be produced on every product.The SMT in flexible circuit board may be realized at present Previous procedure coding, but because code-spraying printing ink cannot resistance to liquid medicine and high temperature and pressure, can not before FPC processing procedure make, make FPC's Process before SMT can not be realized and MES system or SFIS system dockings.Therefore, to realize that more FPC production processes are included The automatic management and control of system, the present invention is for the retrospect Quick Response Code etching production method expansion research of flexible circuit board processing procedure.
The content of the invention
It is an object of the invention to provide a kind of flexible circuit board system that FPC production processes can be included to the automatic management and control of system Journey retrospect Quick Response Code etching production method.
To achieve the above object, technical solution of the invention is：
The present invention is a kind of flexible circuit board processing procedure retrospect Quick Response Code etching production method, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：LDI exposes circuit and Quick Response Code, is exposed circuit and Quick Response Code using LDI exposure machines, LDI exposure machines will The two-dimension code pattern of line pattern and the information containing serial number being sequentially generated exposes successively to be transferred on the photopolymer layer of every plate；
Step 4：Development etching demoulding, demoulding line is etched by the exclusive two dimension of the circuit on every plate and every plate by development Code etches；
Step 5：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 6：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 7：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
The present invention is a kind of flexible circuit board processing procedure retrospect Quick Response Code etching production method, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
Step 4：Circuit exposes, and using rotine exposure machine whole plate exposure circuit, the two-dimension code area in exposure film is black；
Step 5：Development etching demoulding, by DES lines by the exclusive Quick Response Code etching forming of the circuit on every plate and every plate Produce；
Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
The present invention is a kind of flexible circuit board processing procedure retrospect Quick Response Code etching production method, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：Circuit exposes, and using rotine exposure machine whole plate exposure circuit, the two-dimension code area in exposure film is black；
Step 4：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
Step 5：Development etching demoulding, demoulding line is etched by the exclusive two dimension of the circuit on every plate and every plate by development Code etching forming is produced；
Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
After using the above scheme, since the present invention specifies region setting Quick Response Code in flexible circuit board, in LDI exposure machines Quick Response Code functional software is developed in equipment, realizes that Quick Response Code is automatically generated by device software, the processing procedure serial number that Quick Response Code includes Information is automatically generated or networked by device software to be extracted from system, and each processing procedure serial number information will be included by being realized using LDI technologies Two-dimension code pattern be transferred to successively on every product and etching forming is produced, make to possess independent identity on every product and know Quick Response Code is not identified, the DES processes of FPC production processes follow-up each processing procedure can be played and include the automatic management and control of system.
The present invention is further illustrated with specific embodiment below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is present invention etching two-dimension code pattern example one（DM Quick Response Code forward direction figures）；
Fig. 2 is present invention etching two-dimension code pattern example two（DM Quick Response Code negative sense figures）；
Fig. 3 is present invention etching two-dimension code pattern example three（QR Quick Response Code forward direction figures）；
Fig. 4 is present invention etching two-dimension code pattern example four（QR Quick Response Code negative sense figures）；
Fig. 5 is the process flow chart of first embodiment of the invention；
Fig. 6 is the process flow chart of second embodiment of the invention；
Fig. 7 is the process flow chart of third embodiment of the invention.
Embodiment
As shown in figure 5, the present invention is a kind of first reality of flexible circuit board processing procedure retrospect Quick Response Code etching production method Example is applied, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：LDI exposes circuit and Quick Response Code, is exposed circuit and Quick Response Code using LDI exposure machines, LDI exposure machines will The two-dimension code pattern of line pattern and the information containing serial number being sequentially generated exposes successively to be transferred on the photopolymer layer of every plate；
Step 4：Development etching demoulding（DES）, the exclusive Quick Response Code of the circuit on every plate and every plate is lost by DES lines Carve；
Step 5：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 6：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 7：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
As shown in fig. 6, the present invention is a kind of second reality of flexible circuit board processing procedure retrospect Quick Response Code etching production method Example is applied, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
Step 4：Circuit exposes, and exposes circuit using rotine exposure machine whole plate, the two-dimension code area in exposure film for black with Prevent Quick Response Code from exposing again；
Step 5：Development etching demoulding, by DES lines by the exclusive Quick Response Code etching forming of the circuit on every plate and every plate Produce；
Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
As shown in fig. 7, the present invention is a kind of 3rd reality of flexible circuit board processing procedure retrospect Quick Response Code etching production method Example is applied, is comprised the following steps：
Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
Step 2：Dry film is pasted, dry film is bonded on FPC；
Step 3：Circuit exposes, and exposes circuit using rotine exposure machine whole plate, the two-dimension code area in exposure film for black with Quick Response Code is prevented to be exposed；
Step 4：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
Step 5：Development etching demoulding, by DES lines by the exclusive Quick Response Code etching forming of the circuit on every plate and every plate Produce；
Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
The two-dimentional code type of etching is as follows：
Fig. 1 is that the two-dimentional code type of the present invention is the positive figure of DM codes, including positive pattern point 1A and lattice vacancy 2A；
Fig. 2 is that the two-dimentional code type of the present invention is the negative sense figure of DM codes, including negative sense pattern point 1B and lattice vacancy 2B；
Fig. 3 is that the two-dimentional code type of the present invention is the positive figure of QR codes, including positive pattern point 1C and lattice vacancy 2C；
Fig. 4 is that the two-dimentional code type of the present invention is the negative sense figure of QR codes, including negative sense pattern point 1D and lattice vacancy 2D；
After using the above scheme, automatically generated or joined by LDI exposure machine device softwares because Quick Response Code includes processing procedure serial number information Net is produced from system extraction and etching forming, can be scanned instrument identification and be read, therefore, can be from FPC fabrication processings DES processes play follow-up each processing procedure and realize and system docking and tracing function.
Quick Response Code includes processing procedure serial number tracing information, and according to information difference is included, two-dimension code pattern is different, i.e. its pattern point It is different from the dot matrix and alignment placement of lattice vacancy, the identity of every panel products can be done, two-dimension code pattern is after etching, therein Layers of copper corresponding to positive pattern point or negative sense pattern point retains, and the layers of copper corresponding to lattice vacancy etches away PI layers of dew of base material Go out, make pattern point and lattice vacancy there is obvious aberration to distinguish, instrument identification can be scanned and read.
Setting Quick Response Code in region is specified in flexible circuit board, position is set according to specific product, and every plate sets 1-3 letter The identical Quick Response Code of content is ceased, to prevent individualized reasons, wherein a certain Quick Response Code None- identified, can recognize that other same Quick Response Code, Ensure every plate processing procedure information and system docking.
The above, is only present pre-ferred embodiments, therefore the scope implemented of the present invention cannot be limited with this, i.e., according to The equivalent changes and modifications that scope of the present invention patent and description are made, all should still belong to the model that patent of the present invention covers In enclosing.

Claims (3)

  1. A kind of 1. flexible circuit board processing procedure retrospect Quick Response Code etching production method, it is characterised in that：Comprise the following steps：
    Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
    Step 2：Dry film is pasted, dry film is bonded on FPC；
    Step 3：LDI exposes circuit and Quick Response Code, is exposed circuit and Quick Response Code using LDI exposure machines, LDI exposure machines will The two-dimension code pattern of line pattern and the information containing serial number being sequentially generated exposes successively to be transferred on the photopolymer layer of every plate；
    Step 4：Development etching demoulding, etches the exclusive Quick Response Code of the circuit on every plate and every plate by DES lines；
    Step 5：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
    Step 6：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
    Step 7：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
  2. A kind of 2. flexible circuit board processing procedure retrospect Quick Response Code etching production method, it is characterised in that：Comprise the following steps：
    Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
    Step 2：Dry film is pasted, dry film is bonded on FPC；
    Step 3：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
    Step 4：Circuit exposes, and using rotine exposure machine whole plate exposure circuit, the two-dimension code area in exposure film is black；
    Step 5：Development etching demoulding, by DES lines by the exclusive Quick Response Code etching forming of the circuit on every plate and every plate Produce；
    Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
    Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
    Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
  3. A kind of 3. flexible circuit board processing procedure retrospect Quick Response Code etching production method, it is characterised in that：Comprise the following steps：
    Step 1：Processing procedure before FPC, FPC paste the conventional production process before dry film；
    Step 2：Dry film is pasted, dry film is bonded on FPC；
    Step 3：Circuit exposes, and using rotine exposure machine whole plate exposure circuit, the two-dimension code area in exposure film is black；
    Step 4：Quick Response Code LDI exposes, Quick Response Code is exposed using LDI exposure machines, and LDI exposure machines will be sequentially generated The two-dimension code pattern of the information containing serial number exposes successively to be transferred to the Quick Response Code of every plate and specifies on the photopolymer layer of region；
    Step 5：Development etching demoulding, by DES lines by the exclusive Quick Response Code etching forming of the circuit on every plate and every plate Produce；
    Step 6：FPC intermediate process, after FPC etchings, pastes the conventional production process before epiphragma；
    Step 7：Film is fitted on FPC, the cover layer of two-dimension code area, which can design, not to open a window or open a window；
    Step 8：FPC follow-up process, fits over the subsequently conventional processing procedure of film by FPC and makes.
CN201711173256.2A 2017-11-22 2017-11-22 Flexible circuit board process tracing two-dimensional code etching manufacturing method Active CN108012437B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113260161A (en) * 2021-06-29 2021-08-13 惠州市大亚湾科翔科技电路板有限公司 Traceable circuit board manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426330A (en) * 2007-10-29 2009-05-06 英业达股份有限公司 Circuit board having bar code and manufacturing method thereof
CN102300413A (en) * 2010-06-25 2011-12-28 富葵精密组件(深圳)有限公司 Manufacturing method of circuit board with identification code
CN104582328A (en) * 2014-12-22 2015-04-29 东莞美维电路有限公司 PCB manufacturing technology capable of preventing board arrangement errors
CN106373904A (en) * 2016-09-29 2017-02-01 广州兴森快捷电路科技有限公司 Production marking method of IC (Integrated Circuit) support plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426330A (en) * 2007-10-29 2009-05-06 英业达股份有限公司 Circuit board having bar code and manufacturing method thereof
CN102300413A (en) * 2010-06-25 2011-12-28 富葵精密组件(深圳)有限公司 Manufacturing method of circuit board with identification code
CN104582328A (en) * 2014-12-22 2015-04-29 东莞美维电路有限公司 PCB manufacturing technology capable of preventing board arrangement errors
CN106373904A (en) * 2016-09-29 2017-02-01 广州兴森快捷电路科技有限公司 Production marking method of IC (Integrated Circuit) support plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113260161A (en) * 2021-06-29 2021-08-13 惠州市大亚湾科翔科技电路板有限公司 Traceable circuit board manufacturing method

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Address after: 361000 2nd floor, No.19, Xianghai Road, industrial zone (Xiang'an), torch high tech Zone, Xiamen City, Fujian Province

Patentee after: Xiamen Hongxin Electronic Technology Group Co., Ltd

Address before: 361000, No. 19, No. 1, building No. 2, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province

Patentee before: XIAMEN HONGXIN ELECTRON-TECH Co.,Ltd.

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