CN101426330A - Circuit board having bar code and manufacturing method thereof - Google Patents
Circuit board having bar code and manufacturing method thereof Download PDFInfo
- Publication number
- CN101426330A CN101426330A CNA2007101675894A CN200710167589A CN101426330A CN 101426330 A CN101426330 A CN 101426330A CN A2007101675894 A CNA2007101675894 A CN A2007101675894A CN 200710167589 A CN200710167589 A CN 200710167589A CN 101426330 A CN101426330 A CN 101426330A
- Authority
- CN
- China
- Prior art keywords
- bar code
- circuit board
- dry film
- pattern
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The present invention discloses a circuit board with bar code and a manufacturing method thereof. The manufacturing method comprises the following procedures: providing a substrate body which comprises an insulating layer and a copper foil on the surface of the insulating layer, forming a dry film on the copper coil, placing a negative plate provided with circuit pattern and bar code pattern on the dry film for exposure, hardening the dry film part provided with the circuit pattern and bar code pattern through exposure, removing the dry film part which does not harden through photoreception by developing, forming a corrosion resistant protecting layer with the dry film part provided with the circuit pattern and the bar code pattern, eliminating the part which is not protected by the dry film through etching to simultaneously form circuit and bar code in the copper foil thereby saving the cost for additionally manufacturing the commodity bar code and the operation time for manually pasting the commodity bar code.
Description
Technical field
The present invention relates to a kind of circuit board and method for making thereof, particularly relate to a kind of circuit board and method for making thereof with bar code.
Background technology
Commodity bar code is meant regularly arranged by one group, as to have different in width striped black, interval (between bar, Kongxiang) in vain (promptly, the unit code) with and the sign formed of corresponding character, in order to represent the symbol of certain merchandise news, again with the scanning recognition of bar code recognizing apparatus to convert binary system and the decimal system information with the computer compatibility to; Bar codes technique also is born with the development and the application of computer and information technology, is the new technique that integrates coding, printing, identification, data acquisition and processing (DAP).Simultaneously, owing to be to distinguish bar code by the bar and the empty color contrast of bar code, so need satisfy the color of the requirement of contrast (PCS value).In general, according to the barcode detection experience, red, golden and light yellow unsuitable color as corresponding black (bar), transparent and golden can not be as the color of correspondence white (sky).
It is for the quality of control product that commodity bar code is rendered in manufacturing industry, has all set up commodity bar code in the processing procedure for identification, maintenance and tracking on each part.
Relatively, when this commodity bar code is applied to circuit board, normally after this circuit board making is finished, in manually-operated mode pre-printed commodity bar code is attached on the circuit board again, use and differentiate that each circuit board is to obtain this circuit board in lot number or the out of Memory produced.
For saving bar code printing and artificial attaching bar code time, in the patent of invention that No. the 81107022nd, TaiWan, China patent application " contains the printed circuit board (PCB) of sign indicating number and the method for generated code on printed circuit board (PCB) ", disclose a kind of printed circuit board (PCB) that is provided with bar code, this patent is the method by spray casting or die casting, on the bottom surface of the recess of printed circuit board surface, form bar code, prevent that with this structure bar code from disappearing and peel off, and promotes the reliability of reading sign indicating number.
But, in the foregoing invention patent, this bar code is in the time of this circuit board of injection molding, and the method by spray casting or die casting forms bar code on printed circuit board (PCB), to reach the sign indicating number with concaveconvex shape, this measure makes the circuit board process of injection molding complicated.And, adopt spray casting or the formed bar code color of die-casting technique Chang Wufa to separate for machine interpretable; In other words, use the accuracy of identification that this kind prior art also can't reach the commodity bar code requirement.
Described before combining, when commodity bar code is applied to circuit board, if after this circuit board making is finished, in manually-operated mode pre-printed commodity bar code is attached on the circuit board again, so for stressing time efficiency and artificial expensive industry now, be not inconsistent economic benefit in fact; But if in the time of this circuit board of injection molding, the method by spray casting or die casting forms bar code on printed circuit board (PCB), be not inconsistent economic benefit because of processing procedure is complicated again, and accuracy of identification is not good.
Therefore, how to propose one and have the circuit board and the method for making thereof of bar code, to save the material cost and the artificial time that attaches commodity bar code of making commodity bar code, utilize easy processing procedure can on circuit board, form bar code simultaneously, avoid on circuit board, forming in the prior art complex process of bar code, become the problem that present industry is demanded urgently overcoming in fact.
Summary of the invention
In view of the defective of above-mentioned prior art, a purpose of the present invention is to provide a kind of circuit board and method for making thereof with bar code, thereby to save the material cost and the artificial time that attaches commodity bar code of making commodity bar code.
Another purpose of the present invention is to provide a kind of circuit board and method for making thereof with bar code, can also form bar code when forming circuit board line, to omit extra processing procedure man-hour and the cost that forms bar code.
A further object of the present invention is to provide a kind of circuit board and method for making thereof with bar code, thereby simplifies processing procedure.
For achieving the above object and other purpose, the present invention proposes a kind of circuit board with bar code, comprising: substrate body includes an insulating barrier and is located at the conducting wire of this surface of insulating layer; And the bonding jumper font code, be located at relatively this conducting wire one side of this surface of insulating layer, have a plurality of raised lines that are convexly set in this surface of insulating layer at interval, to constitute the unit code of this bonding jumper font code by this raised line respectively.
According to above-mentioned circuit board, the present invention also provides a kind of circuit board method for making with bar code, comprising: a substrate body is provided, is covered with Copper Foil (Copper) on the surface of this substrate body, and form dry film on this Copper Foil; The egative film of tool line pattern and bar code pattern is set on this dry film, and exposes, with the part of harden this dry film tool line pattern and bar code pattern; Make the part of this dry film tool line pattern and bar code pattern form the anticorrosion protection layer via developing manufacture process, and remove the not part of photosensitive hardening of this dry film; And remove the part that this Copper Foil does not have this anticorrosion protection layer via etch process, to form conducting wire and bonding jumper font code simultaneously.
This substrate body is made of insulating barrier pressing Copper Foil; and the dry film of tool line pattern and bar code pattern is hardened; again via development; utilize alkali lye to remove the not dry film part of photosensitive hardening; and the dry film that polymerization reaction take place forms line pattern and bar code pattern partly stayed; make the dry film of this part form the anticorrosion protection layer; afterwards again through etching; remove the part that this Copper Foil is not protected by dry film with acidic etching liquid, in Copper Foil, to form conducting wire and bonding jumper font code simultaneously.
In an embodiment, this insulating barrier is resin (Resin).This bonding jumper font code has and is convexly set at interval a plurality of raised lines of this surface of insulating layer according to predetermined thickness and positional alignment, to constitute the unit code of this bonding jumper font code by this raised line respectively.This developing manufacture process is to utilize alkali lye to remove the not part of photosensitive hardening of this dry film, and the part that this dry film has this line pattern and this bar code pattern is stayed, to form this anticorrosion protection layer.This etch process is to remove the part that this Copper Foil does not have this anticorrosion protection layer with acidic etching liquid.
In sum, circuit board and method for making thereof with bar code of the present invention, be by in the Copper Foil on this substrate body surface, being formed with simultaneously conducting wire and bar code, do not need to make separately and spend extra man-hour attaching commodity bar code, to save material cost of making commodity bar code separately and the manual operation cost that attaches commodity bar code.Simultaneously, use the present invention and can avoid prior art when the injection molding circuit board, the method by spray casting or die casting forms bar code on printed circuit board (PCB), and institute's processing procedure that causes is complicated and be not inconsistent economical efficiency, and accuracy of identification of the present invention is preferable.
Description of drawings
Fig. 1 is the floor map with circuit board one embodiment of bar code of the present invention; And
Fig. 2 A to Fig. 2 F is the schematic diagram of method for making one embodiment of the circuit board with bar code of the present invention.
The main element symbol description:
1 circuit board
10 insulating barriers
11 Copper Foils
12 dry films
121 anticorrosion protection layers
13 conducting wires
14 egative films
131 line patterns
20 bar code areas
21 bar codes
211 bar code pattern
213 raised lines
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.
Seeing also Fig. 1, is to show that the present invention has the floor map of circuit board one embodiment of bar code, cooperate simultaneously and consult Fig. 2 A to Fig. 2 F, and be the generalized section that shows method for making one embodiment of this circuit board.
As shown in Figure 1, circuit board 1 definition has bar code area shown in dotted line 20, and this bar code area 20 is surface of insulating layer of being located at this circuit board 1, and this bar code area 20 can be for forming bonding jumper font code 21.
When desire manufacturing present embodiment has the circuit board of bar code, at first, provide a substrate body, on the surface of this substrate body, be covered with Copper Foil (Copper).
Shown in Fig. 2 A, a substrate body is provided, this substrate body for for example copper clad laminate (Copper Clad Laminates, CCL), and the Copper Foil (Copper) 11 that comprises insulating barrier 10 and be located at these insulating barrier 10 surfaces.Though in these insulating barrier 10 both side surface this Copper Foil 11 is set in the present embodiment, that is, can be included in again that this substrate body forms an insulating barrier 10 and in these insulating barrier 10 surface pressure should the step of Copper Foil 11; But in other embodiment, also can be formed with this Copper Foil 11 in the pressing mode at least one surface of this insulating barrier 10, this insulating barrier 10 for example is a resin (Resin).
Shown in Fig. 2 B, on this Copper Foil 11, form dry film 12; In the present embodiment, be this dry film 12 of surface coverage in this Copper Foil 11, this dry film 12 is for example water-soluble dry film, can become the organic acid salt with highly basic reaction and in the water soluble.
Afterwards, provide the egative film of tool line pattern and bar code pattern, this egative film is to be arranged on this dry film.Expose, with the part of this this egative film of dry film tool that hardens.
Shown in Fig. 2 C, place the egative film 14 of tool line pattern 131 and bar code pattern 211 on this dry film 12 and make its exposure.This egative film 14 has the part of bar code pattern 211 corresponding to the default bar code area 20 in substrate body surface, forms bar code pattern for follow-up in this bar code area 20.
Shown in Fig. 2 D, can make dry film 12 polymerization reaction take places of tool line pattern 131 and bar code pattern 211 belows and harden via exposure.
In present embodiment, make the part of this dry film tool line pattern and bar code pattern form the anticorrosion protection layer via developing manufacture process, and remove the not part of photosensitive hardening of this dry film.
Shown in Fig. 2 E; can remove this egative film 14 earlier; again via development; remove the not part dry film 12 of photosensitive hardening to utilize alkali lye; and the part dry film 12 of polymerization reaction take place (being formed with line pattern 131 and bar code pattern 211) stayed; that is, stay the part of these dry film 12 tool line patterns 131 and bar code pattern 211, to form this anticorrosion protection layer 121.
At last, remove part and this anticorrosion protection layer that this Copper Foil does not have this anticorrosion protection layer via etch process, to form conducting wire and bonding jumper font code simultaneously.
Shown in Fig. 2 F, remove the part of not protected on this Copper Foil 11 via etch process with acidic etching liquid by dry film 12, with formation conducting wire 13 and bonding jumper font code 21 in Copper Foil 11, and remove remaining dry film 12.Wherein, cooperate and consult Fig. 1, this bar code area 20 is to be defined in these insulating barrier 10 surfaces these conducting wire 13 1 sides relatively.
By aforementioned method for making, shown in Fig. 2 F, the circuit board with bar code 1 of present embodiment comprises: a substrate body includes an insulating barrier 10 and is located at the conducting wire 13 on these insulating barrier 10 surfaces; And bonding jumper font code 21, be located at these insulating barrier 10 surfaces these conducting wire 13 1 sides relatively, have the interval and be convexly set in a plurality of raised lines 213 of this insulating barrier 10 surfaces, to pass through the respectively unit code of these raised line 213 these bonding jumper font codes 21 of formation according to predetermined thickness and positional alignment.This conducting wire 13 and this bonding jumper font code 21 are to be formed at this insulating barrier 10 surfaces simultaneously.Wherein, respectively the predetermined thickness of this raised line 213 is to should the unit code.Owing to represent that as sign the technology of certain merchandise news is a prior art, so no longer explaining with the unit code more.
So, can form bonding jumper font code 21, directly with naked eyes or this bonding jumper font code 21 of machine identification, and further obtain the information of relevant this circuit board 1 for the user in this circuit board 1 surface.
Than prior art after circuit board making is finished, in manually-operated mode pre-printed commodity bar code is attached on the circuit board again, causing increases the material cost and the artificial time that attaches commodity bar code of making commodity bar code, or when penetrating circuit board, on printed circuit board (PCB), form the complex process of bar code by the method for spray casting or die casting, circuit board and method for making thereof with bar code of the present invention, be that Copper Foil by this circuit board surface forms conducting wire and bonding jumper font code simultaneously, distinguish bar code thereby can easy mode on circuit board, form, do not need to make separately and and spend extra processing procedure man-hour and become the original commodity bar code that produces.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (8)
1, a kind of circuit board with bar code comprises:
Substrate body has an insulating barrier and is located at the conducting wire of this surface of insulating layer; And
The bonding jumper font code is arranged at relatively this conducting wire one side of this surface of insulating layer, has a plurality of raised lines that are convexly set in this surface of insulating layer at interval, to constitute the unit code of this bonding jumper font code by this raised line respectively.
2, the circuit board with bar code according to claim 1, wherein, this insulating barrier is a resin.
3, the circuit board with bar code according to claim 1, wherein, respectively this raised line is with to should the unit code according to predetermined thickness and positional alignment.
4, a kind of circuit board method for making with bar code comprises:
One substrate body is provided, on the surface of this substrate body, is covered with Copper Foil;
On this Copper Foil, form dry film;
The egative film of tool line pattern and bar code pattern is set on this dry film, and exposes, with the part of harden this dry film tool line pattern and bar code pattern;
Make the part of this dry film tool line pattern and bar code pattern form the anticorrosion protection layer via developing manufacture process, and remove the not part of photosensitive hardening of this dry film; And
Remove part and this anticorrosion protection layer that this Copper Foil does not have this anticorrosion protection layer via etch process, to form conducting wire and bonding jumper font code simultaneously.
5, the circuit board method for making with bar code according to claim 4, wherein, this substrate body surface is to be pre-formed an insulating barrier, again in this this Copper Foil of surface of insulating layer pressing.
6, the circuit board method for making with bar code according to claim 5, wherein, this bonding jumper font code has and is convexly set at interval a plurality of raised lines of this surface of insulating layer according to predetermined thickness and positional alignment, to constitute the unit code of this bonding jumper font code by this raised line respectively.
7, the circuit board method for making with bar code according to claim 4; wherein; this developing manufacture process is to utilize alkali lye to remove the not part of photosensitive hardening of this dry film, and the part that this dry film has this line pattern and this bar code pattern is stayed, to form this anticorrosion protection layer.
8, the circuit board method for making with bar code according to claim 4, wherein, this etch process is to remove the part that this Copper Foil does not have this anticorrosion protection layer with acidic etching liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101675894A CN101426330A (en) | 2007-10-29 | 2007-10-29 | Circuit board having bar code and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101675894A CN101426330A (en) | 2007-10-29 | 2007-10-29 | Circuit board having bar code and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101426330A true CN101426330A (en) | 2009-05-06 |
Family
ID=40616600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101675894A Pending CN101426330A (en) | 2007-10-29 | 2007-10-29 | Circuit board having bar code and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101426330A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300413A (en) * | 2010-06-25 | 2011-12-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with identification code |
| US8344955B2 (en) | 2010-01-08 | 2013-01-01 | Nokia Corporation | Integrated antenna with e-flex technology |
| US8716603B2 (en) | 2010-11-24 | 2014-05-06 | Nokia Corporation | Printed wiring board with dielectric material sections having different dissipation factors |
| CN105374691A (en) * | 2014-08-20 | 2016-03-02 | 恒劲科技股份有限公司 | Substrate structure and method for fabricating the same |
| CN106910417A (en) * | 2015-12-22 | 2017-06-30 | 德国贺利氏公司 | For carrying out separately encoded method to cermet substrate |
| CN107846774A (en) * | 2017-11-22 | 2018-03-27 | 厦门弘信电子科技股份有限公司 | FPC processing procedure traces Quick Response Code laser carving preparation method |
| CN108012437A (en) * | 2017-11-22 | 2018-05-08 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code etching production method |
| CN108345173A (en) * | 2017-12-31 | 2018-07-31 | 广州美维电子有限公司 | Quality traceability code identification method and system based on welding resistance windowing |
| CN109968847A (en) * | 2019-05-06 | 2019-07-05 | 陈色丽 | A kind of bar code making method |
| CN110662360A (en) * | 2019-11-13 | 2020-01-07 | 重庆秦嵩科技有限公司 | PCB assembly processing technology |
-
2007
- 2007-10-29 CN CNA2007101675894A patent/CN101426330A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8344955B2 (en) | 2010-01-08 | 2013-01-01 | Nokia Corporation | Integrated antenna with e-flex technology |
| CN102300413A (en) * | 2010-06-25 | 2011-12-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with identification code |
| US8716603B2 (en) | 2010-11-24 | 2014-05-06 | Nokia Corporation | Printed wiring board with dielectric material sections having different dissipation factors |
| CN105374691A (en) * | 2014-08-20 | 2016-03-02 | 恒劲科技股份有限公司 | Substrate structure and method for fabricating the same |
| CN106910417A (en) * | 2015-12-22 | 2017-06-30 | 德国贺利氏公司 | For carrying out separately encoded method to cermet substrate |
| CN107846774A (en) * | 2017-11-22 | 2018-03-27 | 厦门弘信电子科技股份有限公司 | FPC processing procedure traces Quick Response Code laser carving preparation method |
| CN108012437A (en) * | 2017-11-22 | 2018-05-08 | 厦门弘信电子科技股份有限公司 | Flexible circuit board processing procedure retrospect Quick Response Code etching production method |
| CN108345173A (en) * | 2017-12-31 | 2018-07-31 | 广州美维电子有限公司 | Quality traceability code identification method and system based on welding resistance windowing |
| CN109968847A (en) * | 2019-05-06 | 2019-07-05 | 陈色丽 | A kind of bar code making method |
| CN110662360A (en) * | 2019-11-13 | 2020-01-07 | 重庆秦嵩科技有限公司 | PCB assembly processing technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101426330A (en) | Circuit board having bar code and manufacturing method thereof | |
| JP5861641B2 (en) | Touch panel sensor film and manufacturing method thereof | |
| JP5577352B2 (en) | Method and apparatus for manufacturing flexible electronic product | |
| JP4834885B2 (en) | Method for manufacturing wiring board having identifiable data | |
| EP2587413B1 (en) | Antenna circuit structure body for ic card/tag and production method therefor | |
| CN106910417B (en) | Method for individually coding a metal-ceramic substrate | |
| CN102375331A (en) | Circuit board marking system and application method thereof | |
| EP2138021B1 (en) | Electrical connection of components | |
| CN102300413A (en) | Manufacturing method of circuit board with identification code | |
| US20070220742A1 (en) | Method for fabricating identification code | |
| JP5266279B2 (en) | Manufacturing method of multilayer wiring board with specific mark | |
| CN101452516B (en) | Bar code making method | |
| CN101431855A (en) | Circuit board with identification code and its production method | |
| US20090101391A1 (en) | Circuit board having barcode and fabrication method thereof | |
| CN1750740B (en) | Method for mounting printed circuit substrate | |
| JP2002368148A (en) | Substrate, manufacturing method and inspection method therefor, checker, and game machine | |
| CN101873761B (en) | Circuit board having optical readable mark code and manufacturing method thereof | |
| CN108650795B (en) | Coding method and processing method of packaging substrate and packaging substrate | |
| CN101393845A (en) | Making method for substrate identification code | |
| JP4356207B2 (en) | Non-contact type IC card manufacturing method | |
| CN217283538U (en) | Printed circuit board and electronic device | |
| CN115101551B (en) | Display device and method for manufacturing the same | |
| CN103390610A (en) | Electronic component module and method for manufacturing same | |
| CN105228338A (en) | PCB lamination identification method and system and manufacture method and system | |
| TWI413872B (en) | Marking system of printed circuit board and method for using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090506 |