CN112739001A - PCB solder mask hole plugging method - Google Patents
PCB solder mask hole plugging method Download PDFInfo
- Publication number
- CN112739001A CN112739001A CN202011213997.0A CN202011213997A CN112739001A CN 112739001 A CN112739001 A CN 112739001A CN 202011213997 A CN202011213997 A CN 202011213997A CN 112739001 A CN112739001 A CN 112739001A
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- CN
- China
- Prior art keywords
- pcb
- ink jet
- yellowing
- aoi
- solder mask
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention relates to a PCB solder mask hole plugging method, which comprises the steps of firstly carrying out AOI detection on a yellowing PCB, judging the yellowing degree and the yellowing position of the PCB by the AOI, transmitting a signal to an automatic ink jet printer, carrying out ink jet on the yellowing position by the automatic ink jet printer according to the signal transmitted by the AOI, and finally baking and curing the PCB; after the baking and curing are finished, carrying out surface treatment on the PCB; the distance between the spray head of the automatic ink jet machine and the PCB is + 1.5-2 mm of the thickness of the PCB; the AOI can accurately detect the yellowing part of the PCB, and the automatic ink jet printer can jet ink to the PCB according to a signal transmitted by the AOI; the technology of combining AOI and automatic ink jet is used for realizing accurate remediation of the yellowing area of the PCB. The PCB solder mask hole plugging method has the advantages of simple process, avoiding ink bulge and saving working hours.
Description
Technical Field
The invention belongs to the technical field of PCBs, and particularly relates to a PCB solder mask hole plugging method.
Background
In recent ten years, the printed circuit board manufacturing industry in China develops rapidly, and the total output value and the total output both exist in the first world; due to the fact that electronic products are changing day by day, price war changes the structure of a supply chain, China has industrial distribution, cost and market advantages, and the price war becomes the most important production base of the printed circuit board in the world. The PTH hole is gong in advance usually to current PCB board half-hole, and this kind of mode causes the tin face easily to wipe the phenomenon of flower and takes place to there is tin hidden danger behind the leading to drawing electricity, and can cause the broken plate to scrap when printing ink hand-hole backwash, very big increase the product disability rate.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a PCB solder mask hole plugging method which is simple in process, avoids ink protrusion and saves working hours.
In order to achieve the purpose, the invention provides a PCB solder mask hole plugging method, which comprises the steps of firstly carrying out AOI detection on a yellowing PCB, judging the yellowing degree and the yellowing position of the PCB by the AOI, transmitting a signal to an automatic ink jet printer, carrying out accurate ink jet on the yellowing position by the automatic ink jet printer according to the signal transmitted by the AOI, and finally baking and curing the PCB.
As an improvement of the invention, after the baking and curing are finished, the PCB is subjected to surface treatment.
As an improvement of the invention, the AOI detects the position of the through hole of the PCB.
As an improvement of the invention, the distance between the spray head of the automatic ink jet printer and the PCB is + 1.5-2 mm of the thickness of the PCB.
As a modification of the invention, the diameter of the automatic ink jet head is 0.1-0.15 mm.
As a modification of the invention, the ink-jet speed of the automatic ink-jet machine is 4.0-4.2L/min.
As an improvement of the invention, the baking curing temperature is 50-60 ℃.
As an improvement of the invention, the baking curing time is 25-30 min.
From the above, the application of the technical scheme of the invention has the following beneficial effects:
firstly, AOI can accurately detect the yellowing part of the PCB, and an automatic ink jet printer can jet ink to the PCB according to a signal transmitted by the AOI; the technology of combining AOI and automatic ink jet is used for realizing accurate remediation of the yellowing area of the PCB.
Secondly, the surface treatment enables the surface of the PCB to be neat and free of debris; the detection of the through hole of the PCB only aims at the quality inspection standard that the through hole is only required to be free of yellowing and the outside of the through hole of the PCB is not required to be free of yellowing, so that the detection time can be shortened.
Thirdly, when the distance between the nozzle of the automatic ink jet machine and the PCB is + 1.5-2 mm of the thickness of the PCB, the ink is uniformly jetted without sputtering; the diameter of a nozzle of the automatic ink jet machine is 0.1-0.15mm, and the diameter of ink jet is proper and can be achieved by one time; the ink-jet speed of the automatic ink-jet machine is 4.0-4.2L/min, and the ink is uniformly covered; the baking curing temperature is 50-60 ℃, the plate is not influenced, and the drying efficiency is high; the baking curing time is 25-30min, and the ink is completely cured.
In conclusion, the PCB solder mask hole plugging method is simple in process, avoids ink protrusion and saves working hours.
Drawings
FIG. 1 is a schematic flow chart of the PCB solder mask hole plugging method of the present invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The following embodiments are provided to facilitate understanding of the present invention, but are not intended to limit the present invention.
FIG. 1 shows a PCB solder mask hole plugging method disclosed by the invention, which comprises the steps of firstly carrying out AOI detection on a yellowing PCB, judging the yellowing degree and the yellowing position of the PCB by the AOI, transmitting a signal to an automatic ink jet printer, carrying out accurate ink jet on the yellowing position by the automatic ink jet printer according to the signal transmitted by the AOI, and finally baking and curing the PCB.
In the technical scheme, the AOI can accurately detect the yellowing part of the PCB, and the automatic ink jet printer can jet ink to the PCB according to a signal transmitted by the AOI; the technology of combining AOI and automatic ink jet is used for realizing accurate remediation of the yellowing area of the PCB.
As a preferable scheme of the invention, after baking and curing are finished, the PCB is subjected to surface treatment.
As a preferable scheme of the invention, the AOI detects the position of the through hole of the PCB.
As a preferable scheme of the invention, the distance between the spray head of the automatic ink jet printer and the PCB is + 1.5-2 mm of the thickness of the PCB.
In a preferred embodiment of the present invention, the diameter of the head of the automatic ink jet printer is 0.1 to 0.15 mm.
In a preferred embodiment of the present invention, the ink jet speed of the automatic ink jet printer is 4.0 to 4.2L/min.
As a preferable embodiment of the present invention, the baking curing temperature is 50 to 60 ℃.
As a preferable scheme of the invention, the baking curing time is 25-30 min.
In the embodiment, because customers require that yellowing (copper exposure) is not allowed to occur at the via holes, and yellowing of the lines and the board surface is not more than 4, the AOI detects the whole PCB, judges the yellowing degree and the yellowing position of the PCB and transmits signals to the automatic ink jet printer, the automatic ink jet printer adjusts the ink jet speed and the ink jet distance of the automatic ink jet printer according to the yellowing degree and the yellowing position transmitted by the AOI, performs accurate ink jet on the PCB, then performs baking and curing on the PCB, and dries the ink; finally, carrying out air blowing treatment on the surface of the PCB; the distance between the automatic ink jet machine nozzle and the PCB is +1.5mm of the thickness of the PCB, the diameter of the automatic ink jet machine nozzle is 0.1mm, the ink jet speed of the automatic ink jet machine is 4.2L/min, the baking curing temperature is 50 ℃, and the baking curing time is 30 min.
In the invention, the AOI is set specifically according to the requirement of a customer on the PCB, and is not limited specifically.
In conclusion, the PCB solder mask hole plugging method is simple in process, avoids ink protrusion and saves working hours.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A PCB solder mask hole plugging method is characterized in that AOI detection is carried out on a yellowing PCB firstly, the AOI is used for judging the yellowing degree and the yellowing position of the PCB, signals are transmitted to an automatic ink jet printer, the automatic ink jet printer is used for carrying out ink jet on the yellowing position according to the signals transmitted by the AOI, and finally the PCB is baked and cured.
2. The method as claimed in claim 1, wherein the baking and curing are performed before the surface treatment of the PCB.
3. The PCB solder mask hole plugging method of claim 1, wherein the AOI is detected for PCB via hole positions.
4. The method as claimed in claim 1, wherein the distance between the nozzle of the automatic ink jet printer and the PCB is + 1.5-2 mm.
5. The PCB solder mask hole plugging method of claim 1 wherein said automatic ink jet head diameter is 0.1-0.15 mm.
6. The PCB solder mask via hole filling method of claim 3, wherein the ink jet speed of the automatic ink jet printer is 4.0-4.2L/min.
7. The PCB solder mask via hole method of claim 1 wherein the bake cure temperature is 50-60 ℃.
8. The PCB solder mask via hole method of claim 1 wherein the bake cure time is 25-30 min.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011213997.0A CN112739001A (en) | 2020-11-04 | 2020-11-04 | PCB solder mask hole plugging method |
| PCT/CN2021/128787 WO2022095937A1 (en) | 2020-11-04 | 2021-11-04 | Method for pcb hole plugging using solder resist |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011213997.0A CN112739001A (en) | 2020-11-04 | 2020-11-04 | PCB solder mask hole plugging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739001A true CN112739001A (en) | 2021-04-30 |
Family
ID=75597378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011213997.0A Pending CN112739001A (en) | 2020-11-04 | 2020-11-04 | PCB solder mask hole plugging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112739001A (en) |
| WO (1) | WO2022095937A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382542A (en) * | 2021-05-14 | 2021-09-10 | 深圳市博敏电子有限公司 | Method for automatically supplementing resin for resin hole plugging plate |
| WO2022095937A1 (en) * | 2020-11-04 | 2022-05-12 | 智恩电子(大亚湾)有限公司 | Method for pcb hole plugging using solder resist |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594901B (en) * | 2003-02-27 | 2004-06-21 | Chi Mei Optoelectronics Corp | Method for detecting and repairing defects |
| CN102576405A (en) * | 2009-07-06 | 2012-07-11 | 卡姆特有限公司 | A system and a method for solder mask inspection |
| CN108207092A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board laser takes off lid cut wound flex plate |
| CN110678003A (en) * | 2019-10-18 | 2020-01-10 | 深圳劲鑫科技有限公司 | PCB solder mask detection and repair integrated machine and process method |
| CN111707678A (en) * | 2020-07-24 | 2020-09-25 | 深圳芯通互联科技有限公司 | PCB system detection method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121413A1 (en) * | 2006-11-27 | 2008-05-29 | Cardona Sergio E | Method for manufacturing printed circuit boards |
| CN107367682B (en) * | 2017-06-26 | 2019-11-19 | 王俊 | Printed circuit board repair method and system |
| CN208708022U (en) * | 2018-07-27 | 2019-04-05 | 深圳市深逸通电子有限公司 | A kind of ink jet type filling holes with resin mechanism |
| CN211047434U (en) * | 2019-10-18 | 2020-07-17 | 深圳劲鑫科技有限公司 | PCB solder mask detects repair all-in-one |
| CN112739001A (en) * | 2020-11-04 | 2021-04-30 | 智恩电子(大亚湾)有限公司 | PCB solder mask hole plugging method |
-
2020
- 2020-11-04 CN CN202011213997.0A patent/CN112739001A/en active Pending
-
2021
- 2021-11-04 WO PCT/CN2021/128787 patent/WO2022095937A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594901B (en) * | 2003-02-27 | 2004-06-21 | Chi Mei Optoelectronics Corp | Method for detecting and repairing defects |
| CN102576405A (en) * | 2009-07-06 | 2012-07-11 | 卡姆特有限公司 | A system and a method for solder mask inspection |
| CN108207092A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board laser takes off lid cut wound flex plate |
| CN110678003A (en) * | 2019-10-18 | 2020-01-10 | 深圳劲鑫科技有限公司 | PCB solder mask detection and repair integrated machine and process method |
| CN111707678A (en) * | 2020-07-24 | 2020-09-25 | 深圳芯通互联科技有限公司 | PCB system detection method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022095937A1 (en) * | 2020-11-04 | 2022-05-12 | 智恩电子(大亚湾)有限公司 | Method for pcb hole plugging using solder resist |
| CN113382542A (en) * | 2021-05-14 | 2021-09-10 | 深圳市博敏电子有限公司 | Method for automatically supplementing resin for resin hole plugging plate |
| CN113382542B (en) * | 2021-05-14 | 2022-11-08 | 深圳市博敏电子有限公司 | Method for automatically supplementing resin for resin hole plugging plate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022095937A1 (en) | 2022-05-12 |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210430 |
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| RJ01 | Rejection of invention patent application after publication |