CN115249445A - Manufacturing method of ultrathin glass-based display module - Google Patents
Manufacturing method of ultrathin glass-based display module Download PDFInfo
- Publication number
- CN115249445A CN115249445A CN202210980257.2A CN202210980257A CN115249445A CN 115249445 A CN115249445 A CN 115249445A CN 202210980257 A CN202210980257 A CN 202210980257A CN 115249445 A CN115249445 A CN 115249445A
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- Prior art keywords
- glass substrate
- display module
- glass
- led lamp
- welding
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- 239000011521 glass Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000003466 welding Methods 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000002861 polymer material Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 12
- 230000032683 aging Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 17
- 239000007888 film coating Substances 0.000 abstract description 6
- 238000009501 film coating Methods 0.000 abstract description 6
- 238000009825 accumulation Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000004907 flux Effects 0.000 description 7
- 210000002489 tectorial membrane Anatomy 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
Abstract
The invention discloses a manufacturing method of an ultrathin glass-based display module, which is applied to the technical field of display equipment and comprises the following steps: s1, carrying out surface mounting of an electronic element by using a glass base as a substrate; s2, inserting the LED lamp on the glass substrate and fixing the LED lamp through welding; s3, filling liquid glue into gaps among the LED lamps, and exhausting gas in the gaps; and S4, coating a polymer material layer on the surface of the glass substrate subjected to welding. The invention adopts the ultrathin glass substrate, so that the thickness of the display module is reduced, and the single display module has small size, is easy to install and can be spliced for use; the problems of heat accumulation, low air tightness and uneven film coating layer are avoided, and the service life of the display module is prolonged; through the distance setting between the LED lamps, the luminous uniformity can be guaranteed by the display module when the display module is used independently and spliced.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a manufacturing method of an ultrathin glass-based display module.
Background
LED display module assembly is one of the off-the-shelf major component of constituteing LED display screen, and at present, glass substrate is more and more welcome, compares in PCB base plate, and glass substrate has many advantages: the heat conduction performance is better, the roughness is good, the coefficient of expansion and contraction is low, can better support the encapsulation of chip, can realize narrow frame, can make the backplate area bigger as required, realize unlimited concatenation. But current display module assembly is when carrying out the coating process on tectorial membrane layer, between the LED lamp on the base plate, there is the interval between lamp and the solder joint, after the coating is accomplished on tectorial membrane layer, thereby can lead to the unevenness of tectorial membrane layer to influence display module assembly's display effect, and the gap that exists can lead to display module assembly's leakproofness decline under the tectorial membrane layer, thereby reduce the life-span of LED lamp, and then influence whole display module assembly, among the current technical scheme, through increasing the roughness of supporting layer in order to guarantee the tectorial membrane layer, but this kind of scheme can make display module assembly's thickness increase, and can't splice the use, therefore, thereby it solves the problem that the unevenness of tectorial membrane layer influences display effect and display life to urgently need a technical scheme under the prerequisite of guaranteeing display module assembly's size and thickness.
Disclosure of Invention
In view of the above, the invention provides a manufacturing method of an ultrathin glass-based display module, which can solve the problem of uneven coating film by filling liquid glue in gaps on the premise of ensuring the thickness and size of the display module, and ensure the display effect.
In order to achieve the above purpose, the invention provides the following technical scheme:
a manufacturing method of an ultrathin glass-based display module comprises the following steps:
s1, carrying out surface mounting of an electronic element by using a glass base as a substrate;
s2, inserting the LED lamp on the glass substrate and fixing the LED lamp through welding;
s3, filling liquid glue into gaps among the LED lamps, and exhausting gas in the gaps;
and S4, coating a high polymer material layer on the surface of the glass substrate which is welded.
Preferably, S1 specifically is:
s11, printing the soldering paste on the glass substrate in a leaking mode;
s12, accurately mounting the electronic element on a fixed position of the glass substrate;
s13, melting the soldering paste to firmly adhere the electronic element and the glass substrate together;
and S14, detecting the welding quality and the assembling quality of the glass substrate subjected to surface mounting.
Preferably, the distance between the LED lamps in S2 is equal, and the distance between the edge of the glass substrate and the outermost LED lamp of the glass substrate is one half of the distance between the LED lamps.
Preferably, S4 specifically is: the glass substrate is divided into a plurality of subareas, the same amount of polymer material is coated on each subarea, and a coating film is formed on the surface of the glass substrate by the polymer material through a coating module.
Preferably, after S4, the method further includes: s5, testing; the test comprises a brightness test, a welding test and an aging test.
Preferably, the thickness of the glass substrate is 1.1mm to 1.85mm.
Preferably, the liquid glue in S3 is a heat-conducting glue.
According to the technical scheme, compared with the prior art, the invention discloses the manufacturing method of the ultrathin glass-based display module, which has the following beneficial effects:
1. the ultrathin glass substrate is adopted, the coating layer is made of a high polymer material, the thickness of the display module is low, the size of a single display module is small, the installation is easy, and a plurality of display modules can be spliced for use;
2, heat conducting glue is coated between the LED lamps, so that the problems of heat accumulation, low air tightness and unevenness of a film coating layer are avoided, and the service life of the display module is prolonged;
3. through the distance setting between the LED lamps, the luminous uniformity can be guaranteed by the display module when the display module is used independently and spliced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the embodiment of the invention discloses a manufacturing method of an ultrathin glass-based display module, which comprises the following steps as shown in figure 1:
s1, carrying out surface mounting of an electronic element by using a glass base as a substrate;
s2, inserting the LED lamp on the glass substrate and fixing the LED lamp through welding;
s3, filling liquid glue into gaps among the LED lamps, and exhausting gas in the gaps; the gap is filled with the liquid glue, so that the smoothness of the film coating layer can be ensured when the subsequent film coating layer is coated, and meanwhile, the gas in the gap is discharged, so that the gas tightness of the display module is improved;
and S4, coating a polymer material layer on the surface of the glass substrate subjected to welding.
Example two:
the embodiment of the invention discloses a manufacturing method of an ultrathin glass-based display module, and on the basis of the first embodiment, S1 specifically comprises the following steps:
s11, printing the soldering paste on the glass substrate in a leaking mode; it should be understood that S11 can also be realized by dispensing, and dropping the glue on the fixed position of the glass substrate by a dispenser.
S12, accurately mounting the electronic element on a fixed position of the glass substrate;
s13, performing reflow soldering, and melting the soldering paste to firmly adhere the electronic element and the glass substrate together; it should be understood that when dispensing is used, S13 melts the adhesive by curing, so as to firmly bond the electronic component and the glass substrate together.
S14, performing detection on the welding quality and the assembling quality of the glass substrate subjected to surface mounting, it should be understood that, in this embodiment, whether defects such as a cold joint, a missing joint, and a crack exist may be detected by using a magnifying glass, a microscope, an on-line tester (ICT), a flying probe tester, an Automatic Optical Inspection (AOI), an X-RAY inspection system, and a function tester. Before the glass substrate is detected in the welding quality and the assembly quality, the glass substrate can be cleaned to remove substances such as soldering flux on the glass substrate.
Example three:
the embodiment of the invention discloses a manufacturing method of an ultrathin glass-based display module, on the basis of the first embodiment, the distances between LED lamps in S2 are equal, and the distance between the edge of a glass substrate and the LED lamp at the outermost periphery of the glass substrate is one half of the distance between the LED lamps; it needs to be understood that, the LED lamps are equidistantly arranged on the glass substrate, the distance is L, the distance d from the outermost LED lamp closest to the edge on the glass substrate is equal to 1/2, namely d =1/2L, so that after the display module is spliced into a large screen, the distance L2 between the LED lamps on the two sides of the splicing seam is approximately equal to the line spacing value L between the two LEDs, each LED lamp is visually continuous, the light is uniform, and the spliced display module can still uniformly display pictures.
Further, the LED lamp welding method in S2 is wave soldering, specifically, the LED lamp is inserted into the corresponding hole, and then the flux is pre-coated by using a wave-crest, foaming or spraying method, because most of the flux must reach and maintain an activation temperature to ensure complete infiltration of the welding spot during welding, the glass substrate passes through a preheating zone before wave soldering, preheating after the flux is coated can gradually raise the temperature of the substrate and activate the flux, and can also reduce thermal shock generated when the substrate enters the wave crest and evaporate all possible absorbed moisture or carrier solvents for dilution, the wave soldering adopts a flux thermal radiation method to preheat the flux at a preheating temperature of 90-100 ℃, the substrate enters the wave crest to be soldered after preheating, cooling is performed after soldering is completed, and redundant plug-in pins are cut off and inspected.
Further, S4 specifically is: the glass substrate is divided into a plurality of subareas, the same amount of polymer material is coated on each subarea, and the polymer material forms a coating film on the surface of the glass substrate through a coating module. The materials of the film coating layer are uniform in a mode of simultaneously laminating in a subarea manner, and the smoothness of the film coating layer is further improved. It should be understood that the polymer material in this embodiment is one of PVB, EVA, epoxy resin, silicone, and silicone.
Further, after S4, the method further includes: s5, testing; the test comprises a brightness test, a welding test and an aging test. It needs to be understood that the test items mainly include whether the LED lamp has a dark lamp or a dead lamp, whether the electronic element can work normally, whether the welding has a cold joint or a false joint, whether the signal time sequence is correct, and the like. When the semi-finished product aging test is carried out, the whole screen is continuously lightened for more than 72 hours, and the items such as the service life and the attenuation condition of the LED lamp, the display chromatic aberration, the quality of display content and the like are observed.
Furthermore, the thickness of the glass substrate is 1.1mm-1.85mm.
Further, the liquid glue in S3 is heat-conducting glue, can produce the heat and pile up at the LED lamp during operation, and long-time accumulated heat can influence the life-span of display module assembly, glues under the prerequisite of having guaranteed tectorial membrane layer planarization and gas tightness through filling the heat conduction, improves display module assembly' S radiating efficiency.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A manufacturing method of an ultrathin glass-based display module is characterized by comprising the following steps:
s1, carrying out surface mounting of an electronic element by using a glass base as a substrate;
s2, inserting the LED lamp on the glass substrate and fixing the LED lamp through welding;
s3, filling liquid glue into gaps among the LED lamps, and exhausting gas in the gaps;
and S4, coating a high polymer material layer on the surface of the glass substrate which is welded.
2. The method for manufacturing an ultrathin glass-based display module as defined in claim 1, wherein S1 specifically is:
s11, printing the soldering paste on the glass substrate in a leaking mode;
s12, accurately mounting the electronic element on a fixed position of the glass substrate;
s13, melting the soldering paste to firmly adhere the electronic element and the glass substrate together;
and S14, detecting the welding quality and the assembling quality of the glass substrate subjected to surface mounting.
3. The method as claimed in claim 1, wherein the distance between the LED lamps in S2 is equal, and the distance between the edge of the glass substrate and the outermost LED lamp of the glass substrate is one half of the distance between the LED lamps.
4. The method for manufacturing an ultrathin glass-based display module as defined in claim 1, wherein S4 specifically is: dividing the glass substrate into a plurality of subareas, coating the same amount of polymer material on each subarea, and forming a coating film on the surface of the glass substrate by the polymer material through a coating module.
5. The method of claim 1, further comprising, after the step S4: s5, testing; the test comprises a brightness test, a welding test and an aging test.
6. The method of claim 1, wherein the thickness of the glass substrate is 1.1mm to 1.85mm.
7. The method of claim 1, wherein the liquid glue in S3 is a thermally conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210980257.2A CN115249445A (en) | 2022-08-16 | 2022-08-16 | Manufacturing method of ultrathin glass-based display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210980257.2A CN115249445A (en) | 2022-08-16 | 2022-08-16 | Manufacturing method of ultrathin glass-based display module |
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| Publication Number | Publication Date |
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| CN115249445A true CN115249445A (en) | 2022-10-28 |
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| CN202210980257.2A Pending CN115249445A (en) | 2022-08-16 | 2022-08-16 | Manufacturing method of ultrathin glass-based display module |
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| CN1873882A (en) * | 2006-06-29 | 2006-12-06 | 彩虹集团电子股份有限公司 | Method for fabricating fluoresent tube in long service life |
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| CN104766914A (en) * | 2015-04-20 | 2015-07-08 | 电子科技大学 | High-lighting-rate high-voltage LED chip structure |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN112767848A (en) * | 2021-01-12 | 2021-05-07 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN114566462A (en) * | 2022-02-24 | 2022-05-31 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
| CN114760775A (en) * | 2022-04-08 | 2022-07-15 | 百为智能科技(广州)有限公司 | Lamp bead circuit preparation method based on large-size glass substrate and display device |
| CN114828401A (en) * | 2022-04-08 | 2022-07-29 | 百为智能科技(广州)有限公司 | Lamp bead circuit preparation method based on large-size hollow glass substrate and display device |
-
2022
- 2022-08-16 CN CN202210980257.2A patent/CN115249445A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873882A (en) * | 2006-06-29 | 2006-12-06 | 彩虹集团电子股份有限公司 | Method for fabricating fluoresent tube in long service life |
| CN202957287U (en) * | 2012-04-12 | 2013-05-29 | 隆达电子股份有限公司 | Packaging structure of semiconductor light-emitting element |
| CN104766914A (en) * | 2015-04-20 | 2015-07-08 | 电子科技大学 | High-lighting-rate high-voltage LED chip structure |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN112767848A (en) * | 2021-01-12 | 2021-05-07 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN114566462A (en) * | 2022-02-24 | 2022-05-31 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
| CN114760775A (en) * | 2022-04-08 | 2022-07-15 | 百为智能科技(广州)有限公司 | Lamp bead circuit preparation method based on large-size glass substrate and display device |
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