CN114859584B - Binding process defect detection method, module and device in display module manufacturing process - Google Patents
Binding process defect detection method, module and device in display module manufacturing process Download PDFInfo
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Abstract
The application provides a binding process defect detection method, a binding process defect detection module and a binding process defect detection device in a display module manufacturing process, wherein the binding process defect detection method comprises the steps of preparing anisotropic conductive adhesive added with piezochromic materials; adopting anisotropic conductive adhesive added with piezochromic material, and manufacturing a panel according to a binding process; acquiring the color development condition of each point position on the anisotropic conductive adhesive after the binding process; and obtaining adverse conditions in the binding process according to the color development conditions of each point position on the anisotropic conductive adhesive. According to the binding process bad detection method in the display module manufacturing process, bad points in the binding process are judged according to the color development condition of the anisotropic conductive adhesive after the binding process, so that the binding process function is normally realized, meanwhile, the quick detection and positioning and the investigation of feedback equipment can be realized when the binding process circuit is not conducted, short circuit and other bad conditions occur, the bad analysis speed can be improved, the idle time of a production line is reduced, and the operation efficiency is improved.
Description
Technical Field
The application belongs to the technical field of display screens, and particularly relates to a method, a module and a device for detecting bad binding process in a display module manufacturing process.
Background
The display is widely applied to various display scenes in life due to the advantages of high penetration, high color gamut, high contrast and the like. The main process flow of the Liquid Crystal Display (LCD) can be briefly described as the process flow of a Color Filter (CF) and a glass substrate (TFT) ) And (3) carrying out vacuum alignment after the liquid crystal is instilled in the middle, and forming a final product after the single box after the alignment is subjected to module manufacturing process display module manufacturing processes such as polaroid attachment and flexible circuit board (PCB) binding. The binding process (bonding) is the most important ring in the whole module process, and mainly has the effects of realizing functions of integrated connection, circuit conduction and the like by respectively connecting and conducting two ends of a Chip On Film (COF) with preset circuits on glass and a flexible circuit board.
In the binding process, due to the arrangement of conductive gold balls in anisotropic conductive adhesive, pressure setting of binding process equipment and other reasons, the problems that upper and lower electrodes are not conducted (binding miss) or two adjacent electrodes are misled (binding short circuit) and the like can occur, when the binding process is poor, specific points of the poor occurrence are required to be found in resolving, the existing method mainly comprises the steps of observing and searching under a microscope, the consumed time is long, the production line is stopped for a long time, the operation of the production line is influenced, and in addition, whether all the problem points of the poor occurrence are found or not is difficult to judge.
Disclosure of Invention
The embodiment of the application provides a binding process defect detection method in a display module manufacturing process, a display module and a display device, and aims to solve the problem that all defect points are difficult to find out rapidly in the existing binding process.
In a first aspect, an embodiment of the present application provides a method for detecting bad binding process in a display module manufacturing process, including:
preparing anisotropic conductive adhesive added with piezochromic material;
adopting anisotropic conductive adhesive added with piezochromic material, and manufacturing a panel according to a binding process in the display module manufacturing process;
acquiring the color development condition of each point position on the anisotropic conductive adhesive after the binding process;
and obtaining adverse conditions in the binding process according to the color development conditions of each point position on the anisotropic conductive adhesive.
Optionally, the step of preparing the anisotropic conductive adhesive added with the piezochromic material includes:
obtaining the adding proportion of the piezochromic material through an orthogonal experiment;
adding the piezochromic material into a resin adhesive according to an adding proportion;
dispersing the conductive gold balls in the resin adhesive to obtain the anisotropic conductive adhesive.
Optionally, the step of obtaining the adding proportion of the piezochromic material through orthogonal experiments includes:
preparing a plurality of anisotropic conductive adhesives containing different preset adding ratios of piezochromic materials;
adjusting the binding process pressure and correspondingly confirming the color development intervals of the piezochromic material in different pressure ranges;
and reversely deducing the required adding proportion of the piezochromic material according to different color development intervals.
Optionally, the step of adjusting the binding process pressure and correspondingly identifying the color development intervals of the piezochromic material in different pressure ranges includes:
when the binding process pressure is within a first preset pressure range, the color display of the piezochromic material corresponds to a first color development interval;
when the binding process pressure is within a second preset pressure range, the color display of the piezochromic material corresponds to a second color development interval;
when the binding process pressure is within a third preset pressure range, the color display of the piezochromic material corresponds to a third color development interval;
wherein the first preset pressure is less than the second preset pressure is less than the third preset pressure.
Optionally, the step of obtaining the adverse condition in the binding process according to the color development condition of each point on the anisotropic conductive adhesive includes:
identifying color changes on each point of the anisotropic conductive adhesive in the binding process;
and correspondingly judging whether the point is a bad point or not according to the color change condition.
Optionally, the step of correspondingly judging whether the point is a bad point according to the color change condition includes:
when the color change is in the first color development zone or the third color development zone, prompting that the point position is a bad point position;
and when the color change is in the second color development interval, prompting that the point is a normal point.
Optionally, the step of manufacturing the panel by using anisotropic conductive adhesive added with piezochromic material according to the binding process in the display module manufacturing process includes:
pressing and pasting the anisotropic conductive adhesive added with the piezochromic material on a glass substrate;
and applying preset pressure to the anisotropic conductive adhesive to enable the anisotropic conductive adhesive to be normally attached to the glass substrate.
Optionally, the piezochromic material is cyano-substituted p-phenylene vinyl compound or anthracene-containing fluorescent ligand compound.
In a second aspect, an embodiment of the present application further provides a display module, where the display module uses the method for detecting poor binding process in the manufacturing process of the display module according to any one of the above description.
In a third aspect, an embodiment of the present application further provides a display device, where the display device includes a display module in the display module manufacturing process.
The binding process defect detection method in the display module manufacturing process provided by the embodiment of the application comprises the steps of firstly preparing anisotropic conductive adhesive added with a piezochromic material; adopting anisotropic conductive adhesive added with piezochromic material, and manufacturing a Panel (Panel) according to a binding process; acquiring the color development condition of each point position on the anisotropic conductive adhesive after the binding process; according to the application, the piezochromic material is added into the anisotropic conductive adhesive, the color development condition of each point position on the anisotropic conductive adhesive after the binding process is obtained, and finally, the bad condition in the binding process is obtained according to the color development condition of each point position on the anisotropic conductive adhesive, so that the purposes of rapidly detecting and positioning and checking feedback equipment when the binding process circuit is not conducted, the binding process is short-circuited and other bad conditions are realized while the binding process function is normally realized, the bad analysis speed can be improved, the idle time of a production line is reduced, and the operation efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the figures in the following description are only some embodiments of the application, from which other figures can be obtained without inventive effort for a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a flowchart of a first embodiment of a method for detecting bad binding process in a display module manufacturing process according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of a second embodiment of a binding process failure detection method in a display module manufacturing process according to an embodiment of the present application.
Fig. 3 is a schematic flow chart of a third embodiment of a binding process failure detection method in a display module manufacturing process according to an embodiment of the present application.
Fig. 4 is a schematic flow chart of a fourth embodiment of a binding process failure detection method in a display module manufacturing process according to an embodiment of the present application.
FIG. 5 is a schematic flow chart of a fifth embodiment of a binding process failure detection method in a display module manufacturing process according to an embodiment of the present application;
fig. 6 is a schematic flow chart of a sixth embodiment of a binding process failure detection method in a display module manufacturing process according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
The embodiment of the application provides a binding process defect detection method in a display module manufacturing process, a display module and a display device, and aims to solve the problem that all defect points are difficult to find out rapidly in the existing binding process. The following description will be given with reference to the accompanying drawings.
The method for detecting the poor binding process in the manufacturing process of the display module provided by the embodiment of the application can be applied to performance detection in the manufacturing process of the display module, and the display module can be used in display devices such as computers, televisions and flat panels for illustration. The bad point positions appearing in the binding process can be detected timely, completely and quickly, the quality of the binding process can be improved, and the problem that the production line is stopped for a long time due to untimely discovery when bad conditions appear is prevented, so that the operation of the production line is influenced.
As is well known, the binding process (binding process) mainly realizes the effect of physical bonding and circuit conduction through anisotropic conductive adhesive. Anisotropic conductive adhesive (ACF adhesive) mainly comprises resin adhesive and conductive particles, wherein the resin adhesive mainly plays roles of moisture proofing, heat insulation, solidification and the like, and the conductive particles are generally gold balls, so that the effect of conducting a circuit is achieved. The binding process has the main steps of softening resin at certain temperature and applying certain pressure to make the gold ball contact with the upper electrode and the lower electrode to realize conduction. The anisotropic conductive adhesive has high process maturity and high reliability, and is the most widely applied material in the current module binding process. In order to solve the problem that bad points are difficult to find in the binding process, in a first aspect, as shown in fig. 1, in a first embodiment, an embodiment of the present application provides a method for detecting bad points in a binding process in a display module manufacturing process, including the following steps:
step S10: preparing anisotropic conductive adhesive added with piezochromic material;
the piezochromic material with a certain proportion is added into the anisotropic conductive adhesive, so that the anisotropic conductive adhesive can be subjected to color development under different binding process pressures.
Step S20: adopting anisotropic conductive adhesive added with piezochromic material, and manufacturing a panel according to a binding process in the manufacturing process of the display module;
the binding process in the display module assembly process is a conventional binding process of the display module assembly in the prior art.
Step S30: acquiring the color development condition of each point position on the anisotropic conductive adhesive after the binding process;
step S40: and obtaining adverse conditions in the binding process according to the color development conditions of each point position on the anisotropic conductive adhesive.
According to the embodiment, the piezochromic material is added into the anisotropic conductive adhesive, the color development condition of each point position on the anisotropic conductive adhesive after the binding process is obtained, and finally the bad condition in the binding process is obtained according to the color development condition of each point position on the anisotropic conductive adhesive, so that the purposes of rapidly detecting and positioning and checking feedback equipment when the defects such as non-conduction of a circuit and short circuit of the binding process occur in the binding process are achieved while the binding process function is normally realized, the bad analysis speed can be improved, the idle time of a production line is reduced, and the operation efficiency is improved.
Optionally, in a second embodiment, as shown in fig. 2, the step of preparing the anisotropic conductive adhesive to which the piezochromic material is added includes:
step S11: obtaining the adding proportion of the piezochromic material through an orthogonal experiment;
and finding out the proper adding proportion of the piezochromic material by an orthogonal experiment mode, so that the ACF adhesive can display different colors under different binding process pressures corresponding to the adding proportion.
Step S12: adding the piezochromic material into the resin adhesive according to the adding proportion;
step S13: dispersing the conductive gold balls in a resin adhesive to obtain the anisotropic conductive adhesive.
The anisotropic conductive adhesive in the embodiment comprises three parts of a resin adhesive, conductive particles and a piezochromic material, wherein in the preparation process, the piezochromic material is firstly added into the resin adhesive according to the determined adding proportion of the piezochromic material, and then the conductive gold balls are dispersed in the added resin adhesive, so that the anisotropic conductive adhesive can be obtained. The resin adhesive functions to fix the relative position of the electrode between the flexible wiring and the glass substrate and to provide a pressing force to maintain the contact area between the electrode and the conductive particles, in addition to the moisture-proof, adhesion, heat-resistant and insulating functions. The particle size uniformity and the distribution uniformity of the conductive particles can also influence the conductive characteristics so as to ensure that the contact area between the electrode and the conductive particles is consistent, maintain the same on-resistance, and simultaneously avoid the occurrence of an open circuit condition caused by the fact that part of the electrode is not contacted with the conductive particles, wherein the particle size range of the common conductive particles is 3-8 microns; wherein, the mass fraction of the piezochromic material in the range of the adding proportion is 5-10%, and the specific optimal adding proportion is verified reversely by adopting different experiments under the condition of adjusting the pressure of the binding process.
Optionally, in a third embodiment, as shown in fig. 3, the step of obtaining the adding ratio of the piezochromic material through an orthogonal experiment includes:
step S111: preparing a plurality of anisotropic conductive adhesives containing different preset adding ratios of piezochromic materials;
step S112: adjusting the binding process pressure and correspondingly confirming the color development intervals of the piezochromic materials in different pressure ranges;
step S113: and deducing the required adding proportion of the piezochromic material according to different color development intervals in a reverse way.
The color development intervals of the piezochromic material under the conditions of over-small pressure, normal pressure and over-large pressure are respectively found out by adjusting the binding process pressure, namely, the conditions of over-small pressure and over-large pressure are all conditions of abnormal pressure.
It should be noted that when the pressure is too small, the adhesion force between the ACF adhesive and the glass substrate is relatively small, which may cause the poor occurrence of non-conduction of the circuit in the binding process, so that the binding process pressure is too small to simulate a poor binding process phenomenon; when the pressure is normal, the adhesion force of the ACF glue and the glass substrate is high, so that the circuit is normally conducted to simulate a normal point position state; when the pressure is too high, the circuit between the ACF glue and the glass substrate is short-circuited due to the too high pressure, so that the defect of short circuit of the binding process occurs, and the defect of the binding process of point short circuit is simulated.
Different binding process states are simulated by adjusting the binding process pressure so as to find out the proper adding proportion of the piezochromic material which can be subjected to color development change under different binding process states. When the added preset adding proportion of the piezochromic material can correspondingly display different color change intervals in different pressure ranges, namely, when the point position of the binding process is good or bad, the piezochromic material can give certain color development information, and different colors are displayed in bad and normal states, so that the preset adding proportion of the piezochromic material is the required proper actual adding proportion.
Optionally, as shown in fig. 4, in the fourth embodiment, the step of adjusting the binding process pressure and correspondingly identifying the color development intervals of the piezochromic material in different pressure ranges includes:
step S1121: when the binding process pressure is within a first preset pressure range, the color display of the piezochromic material corresponds to a first color development interval;
step S1122: when the binding process pressure is within a second preset pressure range, the color display of the piezochromic material corresponds to a second color development interval;
step S1123: when the binding process pressure is within a third preset pressure range, the color display of the piezochromic material corresponds to a third color development interval;
wherein the first preset pressure is less than the second preset pressure is less than the third preset pressure.
The conducting principle in the binding process is to utilize conductive particles to connect electrodes between a soft wiring and a glass substrate (TFT substrate) to conduct, and meanwhile, the conducting short circuit between two adjacent electrodes can be avoided, so that the aim of conducting in the Z-axis direction is fulfilled, and the binding process pressure plays a vital role in normal conduction or not. According to the embodiment, the normal state and the abnormal state are simulated by adjusting the range of the preset pressure, and the color development intervals of the piezochromic color under the normal state and the abnormal state are recorded, so that the piezochromic material can give corresponding color development prompts under the normal state and the abnormal state, namely, the piezochromic material with the proportion is the proper addition proportion to be searched. Furthermore, it is emphasized that the first preset pressure range is a range in which the pressure is too small, the second preset pressure range is a normal pressure range, and the third preset pressure range is a range in which the pressure is too large. The first preset pressure range, the second preset pressure range and the third preset pressure range can be determined according to practical situations and do not exceed the pressure setting range of the module assembly equipment.
Optionally, as shown in fig. 5, in the fifth embodiment, the step of obtaining the adverse condition in the binding process according to the color development condition of each point on the anisotropic conductive adhesive includes:
step S41: identifying color changes on each point of the anisotropic conductive adhesive in the binding process;
step S42: and correspondingly judging whether the point is a bad point or not according to the color change condition.
In the process of pressing ACF glue and a glass substrate, the color change of the ACF glue sites can be focused at any time, and the identification modes can be the identification modes of human eyes, automatic acquisition of image acquisition equipment and the like; after the colors on the point positions are identified, whether the point positions are bad point positions or not is judged according to different color conditions, and the method is simple and reliable, improves bad analysis speed and further improves operation efficiency.
The step of correspondingly judging whether the point is a bad point according to the color change condition comprises the following steps:
step S421: when the color change is in the first color development zone or the third color development zone, prompting that the point position is a bad point position;
step S422: and when the color change is in the second color development interval, prompting that the point is a normal point.
The color change of the piezochromic material can be determined according to the actually adopted color-changing material in the prior art, the color of the piezochromic material is mainly red, and of course, some other color-changing materials in the prior art are blue, and the specific situation is determined according to the type of the color-changing material selected by an operator. According to the embodiment, the color change of a plurality of sites is intuitively obtained, the colors are corresponding to the color display intervals of the corresponding piezochromic materials, and whether the current site is a normal site or a bad site is judged according to the color intervals. The color display mode is visual, the sites are not easy to miss, the detection efficiency of bad binding process is improved, the detection coverage range is more comprehensive, and the condition of missing detection is prevented. Wherein, the color change corresponds to the corresponding color development interval, and the color development interval can be automatically corresponding to the human eye judgment or through the image acquisition equipment or the detection component.
Optionally, as shown in fig. 6, in the sixth embodiment, the steps of manufacturing the panel according to the binding process using the anisotropic conductive paste to which the piezochromic material is added include:
step S21: pressing and adhering the anisotropic conductive adhesive added with the piezochromic material on a glass substrate;
step S22: and applying preset pressure to the anisotropic conductive adhesive to enable the anisotropic conductive adhesive to be normally attached to the glass substrate.
The process of Panel preparation is the same as the process of the display module in the prior art, anisotropic conductive adhesive added with a piezochromic material is pressed and stuck on a glass substrate by adopting pressing equipment, and bad points of a binding process are detected in the pressing process, wherein the equipment adopted by the binding process is common binding process equipment in the prior art, the equipment is a module driving circuit actual installation machine, and the pressure setting range of the equipment is 0.1-0.2 MPa.
It should be further noted that the piezochromic material belongs to one of organic sensitive materials, belongs to a relatively novel material, and is mainly applied to the fields of encryption, anti-counterfeiting, pressure monitoring and the like at present, and the main principle of the piezochromic is that the pressure makes molecules produce cis-trans isomerism balance to cause color change. Essentially, pressure affects microstructure, such as pressure perturbs electron energy levels, creating phase changes and defects, pressure creates various molecular structural isomers, etc. Preferably, the piezochromic material used in the embodiments of the present application is a cyano-substituted p-phenylene vinylene compound or an anthracene-containing fluorescent ligand compound. Of course, the piezochromic material is not limited to the color-changing material mentioned in the present application, and may be any other material capable of developing color, which is commonly known in the art, so long as it can satisfy the color change within a certain pressure range.
In a second aspect, an embodiment of the present application further provides a display module, where the display module uses the method for detecting poor binding process in the manufacturing process of the display module according to any one of the above description.
In a third aspect, an embodiment of the present application further provides a display device, where the display device includes a display module in the display module manufacturing process. Since the display module and the display device both adopt all embodiments of the binding process failure detection method in the display module manufacturing process, all the beneficial effects brought by the binding process failure detection method in the display module manufacturing process are not described in detail herein.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. The foregoing describes the method for detecting poor binding process in the manufacturing process of the display module provided by the embodiment of the present application in detail, and specific examples are applied to the description of the principle and implementation of the present application, and the description of the foregoing examples is only used to help understand the method and core idea of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the present description should not be construed as limiting the present application in summary.
Claims (10)
1. A binding process defect detection method in a display module manufacturing process is characterized by comprising the following steps:
preparing anisotropic conductive adhesive added with piezochromic material;
adopting anisotropic conductive adhesive added with piezochromic material, and manufacturing a panel according to a binding process in the manufacturing process of the display module;
acquiring the color development condition of each point position on the anisotropic conductive adhesive after the binding process;
and obtaining adverse conditions in the binding process according to the color development conditions of each point position on the anisotropic conductive adhesive.
2. The method for detecting defective binding process in a display module manufacturing process according to claim 1, wherein the step of preparing the anisotropic conductive paste to which the piezochromic material is added comprises:
obtaining the adding proportion of the piezochromic material through an orthogonal experiment;
adding the piezochromic material into a resin adhesive according to an adding proportion;
dispersing the conductive gold balls in the resin adhesive to obtain the anisotropic conductive adhesive.
3. The method for detecting poor bonding process in manufacturing a display module according to claim 2, wherein the step of obtaining the adding ratio of the piezochromic material through an orthogonal experiment comprises:
preparing a plurality of anisotropic conductive adhesives containing different preset adding ratios of piezochromic materials;
adjusting the binding process pressure and correspondingly confirming the color development intervals of the piezochromic material in different pressure ranges;
and reversely deducing the required adding proportion of the piezochromic material according to different color development intervals.
4. The method for detecting bonding process failure in a display module manufacturing process according to claim 3, wherein the step of adjusting the bonding process pressure and correspondingly confirming the color development intervals of the piezochromic material in different pressure ranges comprises:
when the binding process pressure is within a first preset pressure range, the color display of the piezochromic material corresponds to a first color development interval;
when the binding process pressure is within a second preset pressure range, the color display of the piezochromic material corresponds to a second color development interval;
when the binding process pressure is within a third preset pressure range, the color display of the piezochromic material corresponds to a third color development interval;
wherein the first preset pressure is less than the second preset pressure is less than the third preset pressure.
5. The method for detecting poor binding process in a display module manufacturing process according to claim 4, wherein the step of obtaining the poor binding process according to the color development of each point on the anisotropic conductive adhesive comprises the steps of:
identifying color changes on each point of the anisotropic conductive adhesive in the binding process;
and correspondingly judging whether the point is a bad point or not according to the color change condition.
6. The method for detecting defective binding process in a display module manufacturing process according to claim 5, wherein the step of correspondingly determining whether the point is a defective point according to a color change condition comprises:
when the color change is in the first color development zone or the third color development zone, prompting that the point position is a bad point position;
and when the color change is in the second color development interval, prompting that the point is a normal point.
7. The method for detecting poor bonding process in manufacturing a display module according to any one of claims 1 to 6, wherein the step of manufacturing a panel according to the bonding process in manufacturing a display module using anisotropic conductive paste to which a piezochromic material is added comprises:
pressing and pasting the anisotropic conductive adhesive added with the piezochromic material on a glass substrate;
and applying preset pressure to the anisotropic conductive adhesive to enable the anisotropic conductive adhesive to be normally attached to the glass substrate.
8. The method for detecting poor binding process in a display module manufacturing process according to claim 7, wherein the piezochromic material is cyano-substituted p-phenylene vinyl compound or anthracene-containing fluorescent ligand compound.
9. A display module, wherein the display module employs the binding process failure detection method in the display module manufacturing process according to any one of claims 1 to 8 in the manufacturing process.
10. A display device comprising the display module of claim 9.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07211374A (en) * | 1994-01-25 | 1995-08-11 | Sony Corp | Anisotropic conductive film |
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| CN114371566A (en) * | 2022-01-21 | 2022-04-19 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display panel and light leakage pressure point detection method thereof |
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| CN114859584A (en) | 2022-08-05 |
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