WO2009063730A1 - Screen printing mask, solder paste printing machine using the mask, and solder paste printing method using the mask - Google Patents

Screen printing mask, solder paste printing machine using the mask, and solder paste printing method using the mask Download PDF

Info

Publication number
WO2009063730A1
WO2009063730A1 PCT/JP2008/069255 JP2008069255W WO2009063730A1 WO 2009063730 A1 WO2009063730 A1 WO 2009063730A1 JP 2008069255 W JP2008069255 W JP 2008069255W WO 2009063730 A1 WO2009063730 A1 WO 2009063730A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
solder paste
contact
printing mask
paste printing
Prior art date
Application number
PCT/JP2008/069255
Other languages
French (fr)
Japanese (ja)
Inventor
Atsumasa Sawada
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009541084A priority Critical patent/JPWO2009063730A1/en
Publication of WO2009063730A1 publication Critical patent/WO2009063730A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

Contact between a printing mask and a printed wiring board does not fail without an excessive load on a squeegee. A printing mask (15) is composed of a laminate of a transparent mask (15a) and a piezochromic compound-containing elastic resin part (15b) made of a resin containing a piezochromic compound which is a dye whose color varies with the pressure exerted on the printing mask. The state of the contact between a printed wiring board (12) and the printing mask (15) is detected as a mask color variation by a surface color variation detector (19). If the contact between the printed wiring board (12) and the printing mask (15) fails, a semiconductor and the support pin provided to the portion of the back where a contact failure exists are lifted to solve the contact failure.
PCT/JP2008/069255 2007-11-12 2008-10-23 Screen printing mask, solder paste printing machine using the mask, and solder paste printing method using the mask WO2009063730A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009541084A JPWO2009063730A1 (en) 2007-11-12 2008-10-23 Screen printing mask, solder paste printing apparatus and solder paste printing method using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-292761 2007-11-12
JP2007292761 2007-11-12

Publications (1)

Publication Number Publication Date
WO2009063730A1 true WO2009063730A1 (en) 2009-05-22

Family

ID=40638583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069255 WO2009063730A1 (en) 2007-11-12 2008-10-23 Screen printing mask, solder paste printing machine using the mask, and solder paste printing method using the mask

Country Status (2)

Country Link
JP (1) JPWO2009063730A1 (en)
WO (1) WO2009063730A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109031882A (en) * 2018-09-20 2018-12-18 京东方科技集团股份有限公司 Mask set and mask control method
CN114859584A (en) * 2022-04-20 2022-08-05 广州华星光电半导体显示技术有限公司 Method, module and device for detecting bad binding process in display module manufacturing process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5058803U (en) * 1973-09-28 1975-05-31
JPH08197715A (en) * 1995-01-24 1996-08-06 Minoguruupu:Kk Apparatus for measuring pushing pressure of squeezee in screen printing machine
JP2007158316A (en) * 2005-11-11 2007-06-21 Semiconductor Energy Lab Co Ltd Compression bonder, compression bonding method, and method of producing semiconductor device
JP2007185919A (en) * 2006-01-16 2007-07-26 Sharp Corp Surface plate for printing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5058803U (en) * 1973-09-28 1975-05-31
JPH08197715A (en) * 1995-01-24 1996-08-06 Minoguruupu:Kk Apparatus for measuring pushing pressure of squeezee in screen printing machine
JP2007158316A (en) * 2005-11-11 2007-06-21 Semiconductor Energy Lab Co Ltd Compression bonder, compression bonding method, and method of producing semiconductor device
JP2007185919A (en) * 2006-01-16 2007-07-26 Sharp Corp Surface plate for printing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109031882A (en) * 2018-09-20 2018-12-18 京东方科技集团股份有限公司 Mask set and mask control method
CN114859584A (en) * 2022-04-20 2022-08-05 广州华星光电半导体显示技术有限公司 Method, module and device for detecting bad binding process in display module manufacturing process
CN114859584B (en) * 2022-04-20 2023-10-13 广州华星光电半导体显示技术有限公司 Binding process defect detection method, module and device in display module manufacturing process

Also Published As

Publication number Publication date
JPWO2009063730A1 (en) 2011-03-31

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