CN108649053B - Display substrate, detection method thereof, display panel and display device - Google Patents
Display substrate, detection method thereof, display panel and display device Download PDFInfo
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- CN108649053B CN108649053B CN201810427576.4A CN201810427576A CN108649053B CN 108649053 B CN108649053 B CN 108649053B CN 201810427576 A CN201810427576 A CN 201810427576A CN 108649053 B CN108649053 B CN 108649053B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
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Abstract
The invention relates to the technical field of display, and discloses a display substrate, a detection method of the display substrate, a display panel and a display device. A resistor layer graph is arranged on one side, close to the center of the display substrate, of the packaging area of the display substrate, and the resistor layer graph is made of a moisture-sensitive resistor material and can sense whether water vapor penetrates through the packaging area to enter the display area or not. And set up the first end of two conducting wires and be located the outside that deviates from the display area of encapsulation region, and the second end of two conducting wires respectively with the both ends electric connection of resistance layer figure to can both obtain the resistance value of resistance layer figure through the part that is located encapsulation region outlying of two conducting wires in the manufacture process and the preparation of demonstration product after accomplishing, realize the detection to the encapsulation effect, can in time carry out corresponding processing, overcome the not good life-span that influences the display product of encapsulation effect, even cause the problem of the inefficacy of demonstration product.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a detection method thereof, a display panel and a display device.
Background
An Organic Light Emitting Diode (OLED) display device is a new display technology, the display quality of which is comparable to that of a thin film transistor active drive liquid crystal display (TFT-LCD), and the price of which is much lower than that of the Organic Light Emitting Diode (OLED), which will create a challenge to the widely used LCD technology. Organic electroluminescent devices have characteristics of high brightness, wide viewing angle, active light emission, high contrast, ultra-thin, portability, etc., and are well known as a new generation of display technology following Cathode Ray Tubes (CRTs), Plasma Displays (PDPs), and Liquid Crystal Displays (LCDs).
Researches show that the components such as moisture and oxygen in the air greatly affect the service life of the OLED, and the reasons are mainly considered from the following aspects: the OLED is operated by injecting electrons from the cathode, which requires that the cathode work function be as low as possible, but these metals, such as aluminum, magnesium, calcium, etc., used as the cathode are generally more reactive than water vapor that permeates into them. In addition, water vapor can chemically react with the hole transport layer and the electron transport layer, which can cause device failure. Therefore, the OLED is effectively packaged, and each functional layer of the device is separated from components such as water vapor, oxygen and the like in the atmosphere, so that the service life of the device can be greatly prolonged.
There are four main packaging technologies: packaging cover + dry sheet packaging, glass cement packaging, Dam & fill packaging and film packaging, but there is no good means in the industry for how to detect the packaging effect.
Disclosure of Invention
The invention provides a display substrate, a detection method thereof, a display panel and a display device, which are used for solving the problem that the packaging effect of the display panel cannot be effectively detected.
In order to solve the foregoing technical problem, an embodiment of the present invention provides a display substrate, including a display area and a non-display area located at a periphery of the display area, where the non-display area includes an encapsulation area, and the display substrate further includes a resistive layer pattern located at a side of the encapsulation area close to a center of the display substrate; the material of the resistance layer graph is a humidity sensitive resistance material and is used for sensing whether water vapor penetrates through the packaging area to enter the display area or not;
the display substrate further comprises two conducting wires, the first ends of the two conducting wires are located on one side, away from the display area, of the packaging area, the second end of one conducting wire is electrically connected with one end of the resistance layer graph, and the second end of the other conducting wire is electrically connected with the other end of the resistance layer graph.
The display substrate as described above, wherein the non-display area further includes a chip bonding area located on a side of the package area facing away from the display area, the chip bonding area having two first leads; the first ends of the two conductive wires are located in the chip binding region, the first end of one conductive wire is electrically connected with one pin of the test chip through one first lead, and the first end of the other conductive wire is electrically connected with the other pin of the test chip through the other first lead, so that the test chip can obtain the resistance of the resistance layer pattern.
The display substrate as described above, wherein the display area further includes a PAD area located on a side of the package area facing away from the display area, the PAD area having two first conductive patterns; a part of the two conductive lines is positioned in the PAD area, wherein one conductive line is electrically connected with one first conductive pattern, and the other conductive line is electrically connected with the other first conductive pattern; the two first conductive patterns are used for being electrically contacted with the probes, so that the probes can acquire the resistance of the resistance layer patterns.
The display substrate as described above, wherein the resistive layer pattern is located between the display area and the encapsulation area.
The display substrate as described above, wherein the resistive layer pattern is a ring structure, and the ring structure is disposed around the display area and has a gap.
The display substrate as described above, wherein the material of the resistive layer pattern is selected from a lithium chloride humidity sensitive resistor material or an organic polymer film humidity sensitive resistor material.
The embodiment of the invention also provides a method for detecting the display substrate, which comprises the following steps:
and acquiring the resistance of the resistance layer graph through the part, which is positioned in the packaging area and deviates from the display area, of the two conducting wires, and judging that water vapor enters the display area through the packaging area when the resistance of the resistance layer graph is greater than a preset threshold value.
The detection method as described above, wherein the chip bonding area of the display substrate has two first leads, a first end of one of the conductive wires is electrically connected to one pin of the test chip through one of the first leads, and a first end of the other conductive wire is electrically connected to the other pin of the test chip through the other of the first leads; the step of obtaining the resistance of the resistance layer pattern includes:
and welding pins of the test chip on the corresponding first leads, and controlling the test chip to obtain the resistance of the resistance layer graph.
The detection method as described above, wherein the test chip is a lighting chip.
The detection method as described above, wherein the PAD area of the display substrate has two first conductive patterns, one of the conductive lines is electrically connected to one of the first conductive patterns of the PAD area, and the other conductive line is electrically connected to the other of the first conductive patterns of the PAD area; the step of obtaining the resistance of the resistance layer pattern includes:
and electrically contacting the probe with the first conductive pattern to obtain the resistance of the resistance layer pattern.
The embodiment of the invention also provides a display panel which adopts the display substrate.
The embodiment of the invention also provides a display device which adopts the display panel.
The technical scheme of the invention has the following beneficial effects:
in the technical scheme, the resistor layer graph is arranged on one side, close to the center of the display substrate, of the packaging area, and the moisture-sensitive resistor material is selected as the material of the resistor layer graph, so that whether water vapor penetrates through the packaging area to enter the display area or not can be sensed. And the first end that sets up two conductor wires is located the outside that deviates from the display area of encapsulation region, and the second end of two conductor wires respectively with the both ends electric connection of resistance layer figure, thereby in the manufacture process of demonstration product and after the preparation is accomplished can both obtain the resistance value of resistance layer figure through the part that is located encapsulation region outlying of two conductor wires, when this resistance value is greater than predetermined resistance value, judge that there is steam to see through the encapsulation region and get into the display area, thereby when steam sees through the encapsulation region and gets into the display area, can in time carry out dehumidification technology, and repair packaging structure, overcome the not good life-span that influences the display product of encapsulation effect, cause the problem of the inefficacy of display product even.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first schematic view illustrating a structure of a display substrate according to an embodiment of the present invention;
FIG. 2 illustrates a cross-sectional view of a display panel using the display substrate of FIG. 1 taken along A-A in FIG. 1;
FIG. 3 illustrates a cross-sectional view of a display panel using the display substrate of FIG. 1 taken along B-B in FIG. 1;
FIG. 4 is a schematic structural diagram of a second display substrate according to an embodiment of the invention;
fig. 5-8 are schematic structural diagrams of an OLED display panel adopting four different packaging methods according to an embodiment of the present invention.
Detailed Description
The prior art display products make extensive use of semiconductor devices such as: thin film transistors, organic electroluminescent diodes, moisture and oxygen can seriously affect the performance and lifetime of these semiconductor devices. Therefore, high requirements are placed on the packaging of display products. However, in the prior art, a means for detecting the packaging effect is lacked, and the packaging effect can be found to be poor only after the display product cannot work due to the failure of the semiconductor, so that great loss is caused.
In order to solve the above technical problems, the present invention provides a display substrate for providing a means capable of detecting a package effect.
The display substrate comprises a display area and a non-display area located on the periphery of the display area, wherein the non-display area comprises an encapsulation area. The display substrate further comprises a resistance layer pattern, and the resistance layer pattern is located on one side, close to the center of the display substrate, of the packaging area. The material of the resistance layer graph is a humidity sensitive resistance material and is used for sensing whether water vapor penetrates through the packaging area to enter the display area or not;
the display substrate further comprises two conducting wires, the first ends of the two conducting wires are located on one side, away from the display area, of the packaging area, the second end of one conducting wire is electrically connected with one end of the resistance layer graph, and the second end of the other conducting wire is electrically connected with the other end of the resistance layer graph.
The display substrate with the structure can still obtain the resistor positioned in the resistor layer graph through the first ends of the two conducting wires after the box matching process and the assembly of the display product, and the resistor layer graph is positioned on one side, close to the center of the display substrate, of the packaging area, so that the resistor layer graph can sense whether water vapor enters the display area through the packaging area or not. When water vapor enters the display area through the packaging area, the resistance of the resistance layer graph can be increased, and whether the water vapor enters the display area through the packaging area can be accurately judged according to whether the resistance layer graph is increased. Therefore, when water vapor penetrates through the packaging area to enter the display area, the dehumidification process can be carried out in time, the packaging structure is repaired, the problem that the service life of a display product is influenced due to poor packaging effect, and even the failure of the display product is caused is solved.
The material of the resistance layer pattern can be selected from a semiconductor ceramic humidity sensitive material, a lithium chloride humidity sensitive resistance material or an organic polymer film humidity sensitive resistance material. The semiconductor ceramic humidity sensitive material has poor feasibility due to the complex manufacturing process. The lithium chloride humidity sensitive material can be prepared by mixing lithium chloride and polyvinyl alcohol, is coated on a display substrate through a dispenser, and is heated to remove an organic solvent in the display substrate. The organic high-molecular humidity-sensitive material is made of a high-molecular film, the common high-molecular material comprises polystyrene, polyimide, acetate butyrate and the like, the high-molecular material is dissolved in an organic solution, the organic solution is coated on a display substrate through a glue dispenser, and then an organic solvent in the display substrate is removed through heating.
The resistive layer pattern may be disposed in the display region or between the encapsulation region and the display region.
Preferably, the resistive layer pattern is disposed between the encapsulation region and the display region, which facilitates the disposition and does not affect the display effect. Specifically, the resistive layer pattern may be an annular structure annularly disposed on the periphery of the display area, the annular structure has a gap to form two free ends, and the second ends of the two conductive wires are respectively connected to the two free ends of the resistive layer pattern for detecting the resistance of the resistive layer pattern. The annular structure enables the resistance layer graph to detect whether water vapor enters the whole periphery of the display area, and the detection structure is more accurate and effective.
Of course, the resistive layer pattern is not limited to a ring-shaped structure, such as: the resistor blocks may be arranged at intervals on the periphery of the display area, which is not listed here.
The non-display area of the display substrate further comprises a chip binding area and a PAD area which are located on one side of the packaging area, which is far away from the display area. The chip binding area and the PAD area are crimping areas, the chip binding area is used for crimping a signal line of the display area and a pin of an external chip, and the PAD area is used for crimping the signal line of the display area and a lead of an external driving circuit board. The chip binding area is provided with a plurality of leads, and the PAD area is provided with a conductive pattern. And the lead of the chip binding region and the pin of the chip are used for connecting an external chip and a signal wire of the display substrate. The conductive pattern of the PAD area is used for connecting the external lead of the driving circuit board and the signal line of the array substrate, so that no insulating layer is required to be arranged above the lead of the chip binding area and the conductive pattern of the PAD area, and the lead of the chip binding area and the conductive pattern of the PAD area are exposed.
In a specific embodiment, the chip bonding area has two first leads. The first ends of the two conductive wires are located in the chip binding region, the first end of one conductive wire is electrically connected with one pin of the test chip through one first lead, and the first end of the other conductive wire is electrically connected with the other pin of the test chip through the other first lead, so that the test chip can obtain the resistance of the resistance layer pattern.
Specifically, the test chip may be a lighting chip, a program for acquiring the resistance of the resistive layer pattern is added to a lighting program, and the acquired resistance value of the resistive layer pattern is displayed on a display screen of the lighting device, so as to detect the packaging effect. Through setting up the detection of the chip compatible encapsulation effect of lighting a lamp, can practice thrift and detect the cost.
Of course, the detection of the package effect may also be compatible with other existing chips, that is, the first ends of the two conductive wires are electrically connected to the corresponding pins of the chip through the first leads, and a procedure for obtaining the resistance of the resistive layer pattern is added. Alternatively, a separate test chip is provided to detect the packaging effect.
In another specific embodiment, the PAD region has two first conductive patterns, and a part of the two conductive lines of the present invention is located in the PAD region. One conductive line is electrically connected with one first conductive pattern, and the other conductive line is electrically connected with the other first conductive pattern; the two first conductive patterns are used for being electrically contacted with the probes, so that the probes can acquire the resistance of the resistance layer patterns.
Preferably, in combination with the two specific embodiments, the two conductive wires are arranged to extend to the chip bonding area through the PAD area, so that the resistance of the resistive layer pattern can be obtained through the probe in the PAD area, and the resistance of the resistive layer pattern can also be obtained through the test chip in the chip bonding area, so that the packaging effect can be detected in different manufacturing process stages of the display substrate. And after the finished product is assembled, the permanent detection can be realized by testing the chip detection packaging effect.
The invention also provides a display panel and a display device, wherein the display panel adopts the display substrate, and the detection on the packaging effect of the display panel can be realized. The display device adopts the display panel, and the permanent detection of the packaging effect of the display device can be realized. When water vapor penetrates through the packaging area to enter the display area, the dehumidification process can be carried out in time, the packaging structure is repaired, the problem that the service life of a display product is not influenced well by the packaging effect, and even the failure of the display product is caused is solved.
The technical scheme of the invention is suitable for OLED display products and also suitable for thin film transistor display products.
Taking OLED display products as an example, the packaging method can be four types as follows:
the first method comprises the following steps: as shown in fig. 5, the specific structure of the encapsulation cover + the drying sheet encapsulation is as follows: a packaging cover 20 and an OLED display substrate 10 are used for aligning the box, an ultraviolet light curing adhesive 30 is coated on a packaging area for sealing, and a drying sheet 31 is arranged on the surface of the packaging cover close to the OLED display substrate;
and the second method comprises the following steps: as shown in fig. 6, the glass frit encapsulation has a specific structure: the box is sealed by an encapsulation cover 20 and the OLED display substrate 10, and glass cement 40 is coated on the encapsulation area;
and the third is that: as shown in fig. 7, Dam & Fill package has a specific structure: the box is aligned with the OLED display substrate 10 by an encapsulation cover 20, the encapsulation area is coated with ultraviolet light curing glue 30 for sealing, and filling glue 50 is filled between the encapsulation cover 20 and the OLED display substrate 10;
and fourthly: as shown in fig. 8, the specific structure of the film package is: a composite film 60 is formed on the surface of the OLED display substrate 10, and the composite film 60 covers the display area and the encapsulation area, and includes an organic film and an inorganic film.
The technical scheme of the invention is suitable for the four packaging modes.
It should be noted that, names of the same structures in the above four packaging methods are identified by the same reference numerals to facilitate understanding.
Based on the same inventive concept, the present invention further provides a method for inspecting the display substrate, including:
and acquiring the resistance of the resistance layer graph through the part, which is positioned in the packaging area and deviates from the display area, of the two conducting wires, and judging that water vapor enters the display area through the packaging area when the resistance of the resistance layer graph is greater than a preset threshold value.
According to the detection method, after the display substrate is subjected to the box aligning process and assembled into a display product, the resistor located in the resistor layer graph can still be obtained through the first ends of the two conducting wires, and the resistor layer graph is located on one side, close to the center of the display substrate, of the packaging area, so that the resistor layer graph can sense whether water vapor enters the display area through the packaging area or not. When water vapor enters the display area through the packaging area, the resistance of the resistance layer graph can be increased, and whether the water vapor enters the display area through the packaging area can be accurately judged according to whether the resistance layer graph is increased. Therefore, when water vapor penetrates through the packaging area to enter the display area, the dehumidification process can be carried out in time, the packaging structure is repaired, the problem that the service life of a display product is influenced due to poor packaging effect, and even the failure of the display product is caused is solved.
The preset threshold value is the resistance value of the resistance layer graph when the resistance layer graph is manufactured on the display substrate.
In a specific embodiment, the chip bonding region of the display substrate has two first leads, wherein a first end of one of the conductive wires is electrically connected to one pin of the test chip through one of the first leads, and a first end of the other conductive wire is electrically connected to the other pin of the test chip through the other of the first leads, and the step of obtaining the resistance of the resistance layer pattern includes:
and welding pins of the test chip on the corresponding first leads, and controlling the test chip to obtain the resistance of the resistance layer graph.
The test chip can be a lighting chip, a program for acquiring the resistance of the resistance layer graph is added in a lighting program, and the acquired resistance value of the resistance layer graph is displayed on a display screen of lighting equipment, so that the detection of the packaging effect is realized. Through setting up the detection of the chip compatible encapsulation effect of lighting a lamp, can practice thrift and detect the cost.
In another specific embodiment, the PAD area of the display substrate has two first conductive patterns, one conductive line is electrically connected to one first conductive pattern of the PAD area, and the other conductive line is electrically connected to the other first conductive pattern of the PAD area, and the step of obtaining the resistance of the resistive layer pattern includes:
and electrically contacting the probe with the first conductive pattern to obtain the resistance of the resistance layer pattern.
Preferably, in combination with the two specific embodiments, the two conductive wires are arranged to extend to the chip bonding area through the PAD area, so that the resistance of the resistive layer pattern can be obtained through the probe in the PAD area, and the resistance of the resistive layer pattern can also be obtained through the test chip in the chip bonding area, so that the packaging effect can be detected in different manufacturing process stages of the display substrate. And after the finished product is assembled, the permanent detection can be realized by testing the chip detection packaging effect.
The following detailed description of embodiments of the present invention will be made with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In this embodiment, an OLED display product packaged by glass cement is taken as an example to specifically describe the technical scheme of the present invention.
Referring to fig. 1 to 3, the OLED display substrate in the present embodiment includes a substrate 100, where the substrate 100 includes a display area 101 and a non-display area located at the periphery of the display area 101, the non-display area includes an encapsulation area 102, a glass paste 40 may be formed in the encapsulation area 102, and then the OLED display substrate 10 and the encapsulation cover 20 are aligned to form an OLED display panel, and finally assembled to form a display device.
The OLED display substrate further includes a resistive layer pattern 1 disposed on the substrate 100, the resistive layer pattern 1 being located between the encapsulation area 102 and the display area 101. The material of the resistor layer pattern 1 is selected to be a moisture sensitive resistor material for sensing whether or not moisture penetrates through the package region into the display region 101. Specifically, a lithium chloride humidity sensitive resistance material or an organic polymer film humidity sensitive resistance material can be selected. The resistive layer pattern 1 is a ring-shaped structure, which is annularly disposed on the periphery of the display region 101, and the ring-shaped structure has a gap 11, forming two free ends.
As shown in fig. 4, the OLED display substrate further includes two conductive lines 2, and first ends of the two conductive lines 2 extend to the chip bonding region through the PAD region and are located on a side of the package region 102 away from the display region 101. The second end of one of the conductive wires 2 is electrically connected to one free end of the resistive layer pattern 1, and the second end of the other conductive wire 2 is electrically connected to the other free end of the resistive layer pattern 1.
The conductive line 2 may be made of the same metal thin film as the anode or cathode of the OLED to simplify the fabrication process. After the display area of the display substrate is manufactured, the resistive layer pattern 1 is formed between the encapsulation area 102 and the display area 101, and the conductive wire 2 is located on one side of the resistive layer pattern 1 close to the substrate 100 and is in electrical contact with one free end of the resistive layer pattern 1.
The PAD region has first conductive patterns 3, wherein one conductive line 2 is electrically connected to one first conductive pattern 3, and the other conductive line 2 is electrically connected to the other first conductive pattern 3. The two first conductive patterns 3 are used for electrically contacting with the probes so that the probes acquire the resistance of the resistive layer patterns.
The chip bonding region has two first leads (not shown in the figure), wherein a first end of one conductive wire 2 is electrically connected with one pin of the test chip 4 through one first lead, and a first end of the other conductive wire is electrically connected with the other pin of the test chip through the other first lead, so that the test chip obtains the resistance of the resistance layer pattern.
The test chip 4 may be a lighting chip, and is connected to the flexible circuit board 5 for lighting detection, a program for obtaining the resistance of the resistive layer pattern is added to the lighting program, and the obtained resistance value of the resistive layer pattern is displayed on a display screen of the lighting device, so as to achieve detection of the packaging effect. Through setting up the detection of the chip compatible encapsulation effect of lighting a lamp, can practice thrift and detect the cost.
The method for detecting the OLED display substrate in the embodiment specifically comprises the following steps:
after the OLED display substrate 10 and the packaging cover 20 are aligned, the probe is electrically contacted with the two first conductive patterns 3 of the PAD area to obtain the resistance value of the resistance layer pattern 1, and the resistance value is compared with the preset threshold value, if the obtained resistance value is larger than the preset threshold value, it is judged that water vapor enters the display area 101;
after the display device is assembled, the resistance value of the resistive layer pattern 1 can be acquired by the lighting chip 4 while lighting detection is performed, and the acquired resistance value of the resistive layer pattern 1 is displayed on the display screen of the lighting apparatus. And then comparing the acquired resistance value of the resistance layer pattern 1 with the preset threshold value, and if the acquired resistance value is larger than the preset threshold value, judging that water vapor enters the display area 101.
And the lighting chip 4, the flexible circuit board 5 and the display screen of the lighting equipment can be integrated in the whole display device, so that the permanent monitoring of the resistance layer graph 1 can be realized.
Through setting up resistance layer figure in this embodiment to the one end that sets up two conductor wires is connected with the both ends of resistance layer figure respectively, and the other end of two conductor wires extends to the chip through the PAD region and binds the region, thereby can accomplish the back at display panel encapsulation, detect the encapsulation effect many times, with judge whether there is steam to get into the display area, can in time carry out dehumidification technology, and repair packaging structure, overcome the not good life-span that can influence the display product of encapsulation effect, cause the problem of the inefficacy of display product even.
It should be noted that the technical solution of the present invention is specifically described above by taking the OLED display substrate as an example, and when the technical solution of the present invention is applied to a thin film transistor display substrate or a display substrate with a semiconductor device arranged in other display areas, the specific implementation principle is the same as that of the OLED display substrate, and is not described in detail.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (9)
1. A display substrate comprises a display area and a non-display area positioned at the periphery of the display area, wherein the non-display area comprises a packaging area; the material of the resistance layer graph is a humidity sensitive resistance material and is used for sensing whether water vapor penetrates through the packaging area to enter the display area or not;
the display substrate further comprises two conductive wires, wherein the first ends of the two conductive wires are located on one side, away from the display area, of the packaging area, the second end of one conductive wire is electrically connected with one end of the resistance layer graph, and the second end of the other conductive wire is electrically connected with the other end of the resistance layer graph;
the non-display area further comprises a chip binding area positioned on one side of the packaging area, which is far away from the display area, and the chip binding area is provided with two first leads; the first ends of the two conducting wires are positioned in the chip binding region, the first end of one conducting wire is electrically connected with one pin of the test chip through one first lead, and the first end of the other conducting wire is electrically connected with the other pin of the test chip through the other first lead, so that the test chip can obtain the resistance of the resistance layer pattern;
the display area further comprises a PAD area positioned on one side of the packaging area, which is far away from the display area, and the PAD area is provided with two first conductive patterns; a part of the two conductive lines is positioned in the PAD area, wherein one conductive line is electrically connected with one first conductive pattern, and the other conductive line is electrically connected with the other first conductive pattern; the two first conductive patterns are used for being electrically contacted with the probes so that the probes can acquire the resistance of the resistance layer patterns;
the resistance layer graph is of an annular structure and is annularly arranged on the periphery of the display area, the annular structure is provided with a notch to form two free ends, and the second ends of the two conducting wires are respectively connected with the two free ends of the resistance layer graph and used for detecting the resistance of the resistance layer graph.
2. The display substrate of claim 1, wherein the resistive layer pattern is located between the display area and the encapsulation area.
3. The display substrate of claim 1, wherein the resistive layer pattern is made of a material selected from a lithium chloride moisture sensitive resistive material or an organic polymer film moisture sensitive resistive material.
4. A method of inspecting the display substrate of any of claims 1-3, comprising:
and acquiring the resistance of the resistance layer graph through the part, which is positioned in the packaging area and deviates from the display area, of the two conducting wires, and judging that water vapor enters the display area through the packaging area when the resistance of the resistance layer graph is greater than a preset threshold value.
5. The detecting method according to claim 4, wherein the chip bonding area of the display substrate has two first leads, wherein a first end of one of the conductive wires is electrically connected to one pin of the test chip through one of the first leads, and a first end of the other conductive wire is electrically connected to the other pin of the test chip through the other of the first leads; the step of obtaining the resistance of the resistance layer pattern includes:
and welding pins of the test chip on the corresponding first leads, and controlling the test chip to obtain the resistance of the resistance layer graph.
6. The detection method according to claim 5, wherein the test chip is a lighting chip.
7. The detecting method according to claim 4, wherein the PAD region of the display substrate has two first conductive patterns, one of the conductive lines is electrically connected to one of the first conductive patterns of the PAD region, and the other conductive line is electrically connected to the other of the first conductive patterns of the PAD region; the step of obtaining the resistance of the resistance layer pattern includes:
and electrically contacting the probe with the first conductive pattern to obtain the resistance of the resistance layer pattern.
8. A display panel characterized by using the display substrate according to any one of claims 1 to 3.
9. A display device characterized by using the display panel according to claim 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810427576.4A CN108649053B (en) | 2018-05-07 | 2018-05-07 | Display substrate, detection method thereof, display panel and display device |
| PCT/CN2019/083221 WO2019214415A1 (en) | 2018-05-07 | 2019-04-18 | Display substrate and detection method therefor, display panel, and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810427576.4A CN108649053B (en) | 2018-05-07 | 2018-05-07 | Display substrate, detection method thereof, display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108649053A CN108649053A (en) | 2018-10-12 |
| CN108649053B true CN108649053B (en) | 2021-08-27 |
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| CN108649053B (en) * | 2018-05-07 | 2021-08-27 | 京东方科技集团股份有限公司 | Display substrate, detection method thereof, display panel and display device |
| CN111710618B (en) * | 2020-07-15 | 2021-10-12 | 广芯微电子（广州）股份有限公司 | Method for detecting defects of passivation layer of wafer |
| CN112018158B (en) * | 2020-08-06 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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| CN105392272B (en) * | 2015-10-16 | 2018-06-05 | 京东方科技集团股份有限公司 | Flexible PCB, chip on film, binding method and display device using it |
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| CN108649053B (en) * | 2018-05-07 | 2021-08-27 | 京东方科技集团股份有限公司 | Display substrate, detection method thereof, display panel and display device |
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| CN108649053A (en) | 2018-10-12 |
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