CN117475783A - Display module - Google Patents
Display module Download PDFInfo
- Publication number
- CN117475783A CN117475783A CN202311058792.3A CN202311058792A CN117475783A CN 117475783 A CN117475783 A CN 117475783A CN 202311058792 A CN202311058792 A CN 202311058792A CN 117475783 A CN117475783 A CN 117475783A
- Authority
- CN
- China
- Prior art keywords
- display module
- substrate
- connecting piece
- base plate
- bonding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000002313 adhesive film Substances 0.000 claims description 7
- 239000012535 impurity Substances 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 6
- 229920000297 Rayon Polymers 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display module assembly, this display module assembly includes display panel, drain pan and fixed knot constructs, display panel includes base plate and a plurality of luminescent device, fixed knot constructs including a plurality of first connecting pieces and a plurality of second connecting piece, through setting firmly the first connecting piece in the base plate deviating from the luminescent device on the surface, utilize the second connecting piece to wear to locate the mounting hole on the drain pan and can dismantle with corresponding first connecting piece and be connected, with this tight with drain pan and base plate support, need not to combine drain pan and base plate through the sticky mode fixed, consequently, can not take place the problem that glue spilling pollutes, adhesion impurity and viscose cohesion decline, only need dismantle the second connecting piece during the dismouting, can separate drain pan and display panel, so can avoid causing the damage to the base plate, thereby can reduce the dismouting and maintain the degree of difficulty, improve display module assembly's life.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module.
Background
The sub-millimeter Light-Emitting Diode (Mini LED) direct display technology is a new generation display technology following a Liquid crystal display device (Liquid CrystalDisplay, LCD), an Organic Light-Emitting Diode (OLED), and a Mini-LED backlight, and is one of the hot spots of future display technologies.
At present, a substrate of a display panel and a bottom shell are generally fixed and combined in an adhesive mode by a Mini LED direct display active glass-based display module, and due to poor temperature resistance of adhesive materials, the problems of adhesive overflow pollution, adhesion impurities, reduced binding force and the like are easily caused due to the influence of high-temperature environment in long-term use, and the service life of products is influenced. In addition, in terms of maintenance, the Mini LED direct display active glass-based display module is high in disassembly and maintenance difficulty, and a substrate is easy to damage during disassembly and assembly.
Therefore, it is necessary to provide a display module to improve the defect.
Disclosure of Invention
The embodiment of the application provides a display module assembly, can avoid the circumstances that leads to the base plate damaged to take place when the dismouting, reduces the dismouting and maintains the degree of difficulty, improves display module assembly's life.
The embodiment of the application provides a display module assembly, include:
a display panel including a substrate and a plurality of light emitting devices disposed on one side surface of the substrate;
the bottom shell is arranged on the surface of one side, away from the light-emitting device, of the substrate, and a plurality of mounting holes are formed in the bottom shell;
a fixing structure for detachably mounting the display panel on the bottom chassis, the fixing structure comprising:
the first connecting pieces are fixedly arranged on the surface of one side of the substrate, which faces away from the light-emitting device;
the second connecting pieces penetrate through the mounting holes and are detachably connected with the corresponding first connecting pieces, and the bottom shell is abutted against the base plate by the second connecting pieces.
According to an embodiment of the present application, the fixing structure further includes a bonding layer, where the bonding layer is disposed between the substrate and the first connection member, and the bonding layer is used to bond the first connection member to the substrate.
According to an embodiment of the present application, the bonding layer has a plurality of bonding patterns distributed at intervals, and at least one first connection member is disposed on each bonding pattern.
According to an embodiment of the present application, an adhesive layer is disposed between the first connection member and the bonding layer, and the adhesive layer is used for adhering the first connection member to the bonding layer.
According to an embodiment of the present application, the adhesive layer is a non-conductive adhesive film.
According to an embodiment of the present application, the material of the bonding layer is metal.
According to an embodiment of the present application, the first connecting piece is a nut, and the second connecting piece is a screw;
or, the first connecting piece is a magnetic nut, and the second connecting piece is a magnetic column.
According to an embodiment of the application, the surface of the bottom shell, which is close to the substrate, is provided with a plurality of accommodating grooves, and when the display panel is mounted on the bottom shell, the first connecting piece is accommodated in the accommodating grooves.
According to an embodiment of the application, the display module further includes a buffer member, and the buffer member is sandwiched between the substrate and the bottom case.
According to an embodiment of the application, the display module is provided with a plurality of display panels, and the display panels are spliced and installed on the bottom shell.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display module assembly, this display module assembly includes display panel, drain pan and fixed knot constructs, display panel includes base plate and a plurality of luminescent device, luminescent device sets up on the one side surface of base plate, fixed knot constructs including a plurality of first connecting pieces and a plurality of second connecting pieces, through setting firmly on the base plate deviates from the one side surface of luminescent device with first connecting piece, utilize the mounting hole on the drain pan to wear to locate with corresponding first connecting piece to dismantle and be connected, with drain pan and base plate support tightly, need not to combine drain pan and base plate fixed through the sticky mode, consequently, can not take place the problem that glue spilling pollutes, adhesion impurity and viscose cohesion decline, only need dismantle the second connecting piece during the dismouting, can separate drain pan and display panel, so can avoid causing the damage to the base plate, thereby can reduce the dismouting and maintain the degree of difficulty, improve display module assembly's life.
Drawings
Fig. 1 is a schematic structural diagram of a first display module provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a second display module according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a third display module according to an embodiment of the present application;
fig. 4a and fig. 4b are schematic flow diagrams of a manufacturing method of a display module according to an embodiment of the present application.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals.
The present application is further described below with reference to the drawings and specific examples.
The embodiment of the application provides a display module assembly, can avoid the circumstances that leads to the base plate damaged to take place when the dismouting, reduces the dismouting and maintains the degree of difficulty, improves display module assembly's life.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first display module according to an embodiment of the present application, the display module includes a display panel 1, the display panel 1 includes a substrate 10 and a plurality of light emitting devices 11, and the light emitting devices 11 are disposed on a side surface of the substrate 10.
It should be noted that, the display panel 1 further includes a metal circuit layer 12 and an encapsulation layer 13, where the light emitting device 11 is disposed on one side surface of the substrate 10, that is, the light emitting device 11 is disposed on one side surface of the substrate 10, the light emitting device 11 is separated from the substrate 10 by the metal circuit layer 12, the light emitting device 11 is electrically connected to the metal circuit in the metal circuit layer 12, and the encapsulation layer 13 covers the metal circuit layer 12 and the light emitting device 11. The film layer structure and the circuit structure of the metal circuit layer 12 can refer to the existing Mini LED direct display active glass-based display module, and the limitation is not limited herein.
In one embodiment, the light emitting device 11 is a sub-millimeter light emitting diode, i.e., mini LED. In other embodiments, the types of the Light Emitting devices 11 are not limited to the sub-millimeter Light Emitting Diode, but may be Light-Emitting Diode (LED) or Micro Light-Emitting Diode (Micro LED).
The plurality of light emitting devices 11 are divided into a first light emitting device 111, a second light emitting device 112, and a third light emitting device 113, and the first light emitting device 111 and the second light emitting device 112 and the third light emitting device 113 emit light in different colors. For example, the first light emitting device 111 emits red light, the second light emitting device 112 emits green light, and the third light emitting device 113 emits blue light.
As shown in fig. 1, the display module further includes a bottom case 4 and a fixing structure, wherein the bottom case 4 is disposed on a surface of the substrate 10 facing away from the light emitting device 11, and the fixing structure is used for detachably mounting the display panel 1 on the bottom case 4.
The bottom shell 4 is provided with a plurality of mounting holes 41, and the fixing structure comprises a plurality of first connecting pieces 3 and a plurality of second connecting pieces 5, and the number of the mounting holes 41 is the same as that of the second connecting pieces 5. The first connecting pieces 3 are fixedly arranged on the surface of one side of the substrate 10, which faces away from the light emitting device 11, and the second connecting pieces 5 are penetrated through the mounting holes 41 and detachably connected with the corresponding first connecting pieces 3. When the second connecting piece 5 is inserted into the mounting hole 41 and detachably connected with the corresponding first connecting piece 3, the second connecting piece 5 abuts the bottom shell 4 against the substrate 10, so that the bottom shell 4 and the display panel 1 are fixedly combined.
It should be noted that, the first connection member 3 is fixedly disposed on a surface of the substrate 10 facing away from the light emitting device 11 may mean that the first connection member 3 is disposed on a surface of the substrate 10 facing away from the light emitting device 11, and the first connection member 3 and the substrate 10 are separated by the bonding layer 2 or other adhesive layer having adhesiveness.
In some embodiments, as shown in connection with fig. 1, the fixation structure further comprises a bonding layer 2, the bonding layer 2 being arranged between the substrate 10 and the first connector 3, the bonding layer 2 being used for bonding the first connector 3 to the substrate 10.
It should be noted that, the bonding layer 2 is disposed between the substrate 10 and the first connection member 3, that is, the bonding layer 2 is located on the surface of the substrate 10 facing away from the light emitting device 11 and is in direct contact with the surface of the substrate 10, the first connection member 3 is located on the surface of the bonding layer 2 facing away from the substrate 10, and the first connection member 3 is in direct contact with the surface of the bonding layer 2 facing away from the substrate 10, or may be separated by another adhesive film layer.
In one embodiment, the substrate 10 is a glass substrate. In practical applications, the material of the substrate 10 is not limited to glass, and the substrate 10 may be made of hard or soft materials.
It should be noted that, since the bottom case 4 is not fixedly bonded to the substrate 10 of the display panel 1 by means of adhesion, the problems of glue overflow contamination, adhesion impurities, and reduction of adhesive bonding force do not occur. Because the connected mode of second connecting piece 5 and first connecting piece 3 is detachable connection, only need dismantle the second connecting piece during the dismouting, can separate drain pan and display panel, cause the damage to the base plate when so can avoid the dismouting to can reduce the dismouting and maintain the degree of difficulty, improve display module assembly's life.
In some embodiments, the bonding layer 2 has a plurality of bonding patterns 21 spaced apart, each bonding pattern 21 having at least one first connector 3 disposed thereon.
In one embodiment, as shown in fig. 1, the bonding layer 2 has a plurality of bonding patterns 21, and the plurality of bonding patterns 21 are spaced apart from each other, and one first connection member 3 is disposed on each bonding pattern 21.
In other embodiments, the number of the first connectors 3 provided on each bonding pattern 21 is not limited to 1 in the above embodiments, and 2 or 3 or more first connectors 3 may be simultaneously provided on each bonding pattern 21, which is not limited only.
In one embodiment, as shown in fig. 2, fig. 2 is a schematic structural diagram of a second display module provided in the embodiment of the present application, and the structure of the second display module is substantially the same as that of the display module shown in fig. 1, except that: the bonding layer 2 is disposed on the whole surface, and is not divided into a plurality of bonding patterns distributed at intervals, that is, the whole surface of the bonding layer 2 covers the surface of the substrate 10 facing away from the light emitting device 11, and a plurality of first connectors 3 may be distributed on the surface of the bonding layer 2 facing away from the substrate 10 in an array.
In the embodiment shown in fig. 2, by disposing the bonding layer 2 over the entire surface, the process of etching to form the plurality of bonding patterns 21 can be omitted, so that the number of production steps can be reduced and the production cost can be reduced.
In some embodiments, an adhesive layer 6 is provided between the first connector 3 and the bonding layer 2, the adhesive layer 6 being used to adhere the first connector 3 to the bonding layer 2.
In one embodiment, as shown in fig. 1, the bonding layer 2 has a plurality of bonding patterns 21, each bonding pattern 21 is provided with an adhesive layer 6, the first connector 3 is adhered to the bonding pattern 21 by the adhesive layer 6, and the adhesive layer 6 is a Non-conductive adhesive film (Non-Conductive Adhesive Film, NCF). The adhesive layer 6 is only coated on the bonding pattern 21, and the whole surface coating is not needed, so that the use amount of the adhesive layer 6 can be reduced, the production cost can be reduced, the coating range of the adhesive can be reduced, the risk of glue overflow pollution can be reduced, and the adhesion of impurities can be reduced.
In other embodiments, when the bonding layer 2 is disposed on the whole surface, the adhesive layer 6 may be disposed only at the position corresponding to the first connecting piece 3, so that the amount of the adhesive layer 6 can be reduced, the production cost can be reduced, and meanwhile, the risk of glue overflow pollution and impurity adhesion can be reduced by reducing the coating range of the adhesive.
In other embodiments, the kind of the adhesive layer 6 is not limited to the non-conductive adhesive film in the above embodiments, but may be an anisotropic conductive adhesive film (Anisotropic Conductive Film, ACF).
In one embodiment, the material of the bonding layer 2 is metal. The bonding layer 2 may be prepared by the same process and equipment as those of the metal layers in the metal wiring layer 12 before or after the metal wiring layer 12 is formed, so that no new equipment is required to be added, and the increase of production cost is avoided.
When the material of the bonding layer 2 is metal, the first connector 3 may be welded to the bonding layer 2 by means of welding, and the welded material may be, but is not limited to, tin.
In other embodiments, the material of the bonding layer 2 is not limited to metal, but may be other inorganic nonmetallic materials, such as silicon nitride, silicon oxide, or silicon oxynitride.
In one embodiment, as shown in fig. 1, the first connecting member 3 is a nut, an inner ring of the nut is provided with threads, and the second connecting member 5 is a screw. When the second connecting piece 5 is inserted into the mounting hole 41 and detachably connected with the corresponding first connecting piece 3, the head of the screw is pressed on the bottom shell 4, and the rod of the screw is inserted into the mounting hole 41 and is in threaded connection with the corresponding nut.
In one embodiment, the first connecting piece 3 is a magnetic nut, the second connecting piece 5 is a magnetic post, the second connecting piece 5 has magnetism, the material of the first connecting piece 3 is metal, and has no magnetism, when the display panel 1 is mounted on the bottom shell 4, the first connecting piece 3 and the second connecting piece 5 can attract each other under the effect of magnetic force, so that the fixed combination of the display panel 1 and the bottom shell 4 is realized. In other embodiments, the second connector 5 is non-magnetic and the first connector 3 is magnetic; alternatively, the first connector 3 and the second connector 5 are both magnetic, so that the display panel 1 and the bottom chassis 4 can be fixedly combined.
In one embodiment, as shown in fig. 1, the surface of the bottom shell 4, which is close to the substrate 10, has a plurality of accommodating grooves 42, and the number of the accommodating grooves 42 is the same as and corresponds to the number of the first connectors 3 one by one. When the display panel 1 is mounted on the bottom shell 4, the first connecting piece 3 is accommodated in the accommodating groove 42, so that the interference between the bottom shell 4 and the first connecting piece 3 can be avoided, and the increase of the thickness of the whole display module due to the addition of the bonding layer 2, the bonding layer 6 and the first connecting piece 3 can be avoided.
In some embodiments, the display module further includes a buffer member 7, where the buffer member 7 is sandwiched between the substrate 10 and the bottom case 4. With this structure, the buffer member 7 can be used to fill the gap between the substrate 10 and the bottom case 4, so as to avoid the influence of the suspended stress of the substrate 10 on the service life of the substrate 10, and also avoid the abrasion of the substrate 10 caused by the direct contact between the housing 4 and the substrate 10.
In one embodiment, as shown in fig. 1, the buffer member 7 is integrally formed and covers the surface of the base plate 10 near the bottom shell 4, and a plurality of avoidance holes may be formed in the buffer member 7, and the second connecting member 5 may pass through the avoidance holes.
In other embodiments, the buffer member 7 may have a plurality of sub-buffer members, where the plurality of sub-buffer members are spaced apart from each other and are disposed at respective principal stress points of the base plate 10 and the bottom case 4.
In one embodiment, the thickness of the buffer 7 is 1 mm. In other embodiments, the thickness of the buffer member 7 is not limited to 1 mm in the above embodiments, but may be 0.5 mm, 0.7 mm, 1.5 mm, 1.8 mm, or 2 mm, and the like, and only between 0.5 mm and 2 mm is needed, so that the substrate 10 is prevented from being suspended and stressed, and meanwhile, the cost increase caused by the excessive thickness of the buffer member 7 can be avoided.
In one embodiment, the buffer member 7 may be adhered to the substrate 10 by using adhesive, so that the risk of damage to the substrate caused by the buffer member 7 being offset during installation is avoided. In other embodiments, the buffer 7 may be fixed between the base plate 10 and the bottom case 4 by a clamping force between the base plate 10 and the bottom case 4.
In some embodiments, the display module is a tiled display module, and the display module includes a plurality of display panels 1, and the plurality of display panels 1 are tiled and mounted on the bottom shell 4.
In one embodiment, as shown in fig. 3, fig. 3 is a schematic structural diagram of a third display module provided in the embodiment of the present application, where the display module includes 2 display panels 1, and the structures of the 2 display panels 1 are the same, and are fixedly mounted on the bottom shell 4 by splicing in the same manner as in any one of the embodiments. In practical applications, the number of display panels in the display module is not limited to 2 in the above embodiments, but may be 3 or 4 or more.
According to the display module provided in the foregoing embodiments of the present application, the embodiments of the present application further provide a method for manufacturing a display module, and as shown in fig. 1 and fig. 4a and fig. 4b, fig. 4a and fig. 4b are schematic flow diagrams of the method for manufacturing a display module provided in the embodiments of the present application, where the method for manufacturing a display module includes:
step S1: forming a metal wiring layer 12 on one side surface of the substrate 10;
step S2: forming a bonding layer 2 on the other side surface of the substrate 10;
step S3: fixedly mounting the first connecting piece 3 on the bonding layer 2;
step S4: mounting the bottom case 4 on the substrate 10;
step S5: the second connecting piece 5 is penetrated through the mounting hole on the bottom shell 4 and detachably connected with the corresponding first connecting piece 3, and the bottom shell 4 is abutted against the substrate 10 by the second connecting piece 5.
In one embodiment, in step S2, the material of the bonding layer 2 is metal, and the bonding layer 2 may be prepared by the same process and equipment as those used for forming the metal circuit layer 12 before or after the metal circuit layer 12 is formed, so that no new equipment is required to be added, and thus, the production cost is not increased.
In one embodiment, before step S3 is performed, a protective layer 14 is formed on the metal circuit layer 12, and the protective layer 14 covers the metal circuit layer 12, so as to avoid damage to the metal circuit layer 12 caused by subsequent processes.
In one embodiment, as shown in fig. 4b, in step S3, before the first connector 3 is fixedly mounted on the bonding layer 2, an adhesive layer 6 needs to be disposed between the bonding layer 2 and the first connector 3, and a thermal compression buffer material 9 needs to be disposed between the thermal compression head 8 and the first connector 3, so as to avoid the damage to the first connector 3 caused by the thermal compression head 8, and the front surface of the substrate 10 is supported by the support 20. The first connecting piece 3 is pressed and covered above the first connecting piece 3 by the hot pressing head 8, and the first connecting piece 3 is heated and pressed by the hot pressing head 8 according to the direction indicated by an arrow in the figure, so that the bonding layer 6 is melted and then the first connecting piece 3 is bonded with the bonding layer 2.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display module assembly, this display module assembly includes display panel, drain pan and fixed knot constructs, display panel includes base plate and a plurality of luminescent device, luminescent device sets up on the one side surface of base plate, fixed knot constructs including a plurality of first connecting pieces and a plurality of second connecting pieces, through setting firmly on the base plate deviates from the one side surface of luminescent device with first connecting piece, utilize the mounting hole on the drain pan to wear to locate with corresponding first connecting piece to dismantle and be connected, with drain pan and base plate support tightly, need not to combine drain pan and base plate fixed through the sticky mode, consequently, can not take place the problem that glue spilling pollutes, adhesion impurity and viscose cohesion decline, only need dismantle the second connecting piece during the dismouting, can separate drain pan and display panel, so can avoid causing the damage to the base plate, thereby can reduce the dismouting and maintain the degree of difficulty, improve display module assembly's life.
In summary, although the present application discloses the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the application, so the scope of the application is defined by the claims.
Claims (10)
1. A display module, comprising:
a display panel including a substrate and a plurality of light emitting devices disposed on one side surface of the substrate;
the bottom shell is arranged on the surface of one side, away from the light-emitting device, of the substrate, and a plurality of mounting holes are formed in the bottom shell;
a fixing structure for detachably mounting the display panel on the bottom chassis, the fixing structure comprising:
the first connecting pieces are fixedly arranged on the surface of one side of the substrate, which faces away from the light-emitting device;
the second connecting pieces penetrate through the mounting holes and are detachably connected with the corresponding first connecting pieces, and the bottom shell is abutted against the base plate by the second connecting pieces.
2. The display module of claim 1, wherein the fixing structure further comprises a bonding layer disposed between the substrate and the first connector, the bonding layer being used to bond the first connector to the substrate.
3. The display module of claim 2, wherein the bonding layer has a plurality of bonding patterns spaced apart, each of the bonding patterns having at least one of the first connectors disposed thereon.
4. The display module of claim 2, wherein an adhesive layer is disposed between the first connector and the bonding layer, the adhesive layer being used to adhere the first connector to the bonding layer.
5. The display module of claim 4, wherein the adhesive layer is a non-conductive adhesive film.
6. The display module of claim 2, wherein the bonding layer is a metal.
7. The display module of claim 1, wherein the first connector is a nut and the second connector is a screw;
or, the first connecting piece is a magnetic nut, and the second connecting piece is a magnetic column.
8. The display module of claim 1, wherein the bottom chassis has a plurality of receiving grooves near the surface of the substrate, and the first connector is received in the receiving grooves when the display panel is mounted on the bottom chassis.
9. The display module of claim 1, further comprising a buffer sandwiched between the base plate and the bottom case.
10. The display module of claim 1, wherein the display module has a plurality of the display panels, and the plurality of display panels are mounted on the bottom case in a spliced manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311058792.3A CN117475783A (en) | 2023-08-21 | 2023-08-21 | Display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311058792.3A CN117475783A (en) | 2023-08-21 | 2023-08-21 | Display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117475783A true CN117475783A (en) | 2024-01-30 |
Family
ID=89626453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311058792.3A Pending CN117475783A (en) | 2023-08-21 | 2023-08-21 | Display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117475783A (en) |
-
2023
- 2023-08-21 CN CN202311058792.3A patent/CN117475783A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10451257B2 (en) | Micro-light-emitting diode backlight system | |
| US11164934B2 (en) | Tiled displays with black-matrix support screens | |
| US20200373282A1 (en) | Manufacturing method of micro-led display panel | |
| CN101482229B (en) | Light source unit, backlight unit and liquid crystal display having the same | |
| CN103135267B (en) | Drive printed circuit board (PCB) and include the liquid crystal indicator of this driving printed circuit board (PCB) | |
| EP2538462B1 (en) | Light emitting device module | |
| US6262696B1 (en) | Tiled flat panel displays | |
| US8714763B2 (en) | Lighting device, display device and television receiver | |
| CN101521183B (en) | Semiconductor light emitting device and method for manufacturing the same | |
| US20070194340A1 (en) | Light source and liquid crystal display device using the same | |
| US8172446B2 (en) | Light emitting device and surface light source device | |
| CN110277365B (en) | Electronic device and splicing electronic system | |
| EP3807934B1 (en) | Display panel and display apparatus including the same | |
| US11355484B2 (en) | Display panel comprising micro light-emitting diodes and a connection layer comprising conductive particles and method for making same | |
| KR20200022626A (en) | Display panel having micro led and method of manufacturing the same | |
| WO2021087726A1 (en) | Array substrate, manufacturing method therefor and display device | |
| TW202032780A (en) | Wiring substrate for display device, display device, wiring substrate and method for producing thereof | |
| CN110865485A (en) | Illumination device and display device provided with illumination device | |
| CN117475783A (en) | Display module | |
| US20060119263A1 (en) | Double-side display device and method of making same | |
| CN215067626U (en) | Lamp panel and splicing display screen | |
| KR100964790B1 (en) | Manufacturing Method and Structure of Metal PCB for Backlight Driving | |
| KR102327463B1 (en) | Liquid crystal display device | |
| CN115832001B (en) | Display module, preparation method and spliced display screen | |
| US20230420431A1 (en) | Light-emitting substrate, manufacturing method thereof, and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |