CN210245494U - Novel LED lead frame of cup-shaped structure - Google Patents
Novel LED lead frame of cup-shaped structure Download PDFInfo
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- CN210245494U CN210245494U CN201921324262.8U CN201921324262U CN210245494U CN 210245494 U CN210245494 U CN 210245494U CN 201921324262 U CN201921324262 U CN 201921324262U CN 210245494 U CN210245494 U CN 210245494U
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Abstract
A novel cup-shaped LED lead frame can solve the technical problem that the number of bonding pads of the traditional LED lead frame monomer is limited by two options, and comprises LED lead frame monomers, a plurality of LED lead frames and a plurality of LED lead frames, wherein the LED lead frame monomers are arranged on a conductive base material and are arranged in an array manner; the LED lead frame monomer comprises a metal conductor base and an insulating reflecting cup body, wherein the insulating reflecting cup body is arranged on the metal conductor base and is in a cup shape with an opening and no bottom; the metal conductor base is arranged into three conductive pad areas, wherein the first conductive pad and the third conductive pad are communicated and conductive and are integrally formed; the second conductive bonding pad is an independent bonding pad; the LED lead frame has three bonding pads, the Zener can be placed in the LED lead frame, and the Zener is black and has light absorption effect, so that a section of height is specially arranged on the insulating light-emitting cup to block the light absorption of the Zener; the product is suitable for the fields of automobile light sources, infrared monitoring light sources, daily lighting light sources and the like.
Description
Technical Field
The utility model relates to a LED technical field, concretely relates to novel cup type structure's LED lead frame.
Background
The LED lead frame is used for packaging an LED device and is used as a carrier of an LED wafer, the conduction and heat conduction of positive and negative electric wires are provided for an LED light source, and meanwhile, the light effect required by the light source is achieved through the adjustment of the angle and the light shape of the light-emitting cup; it acts as a bridge to external wires and is an important base material in the LED industry.
The number of the bonding pads of the traditional LED lead frame is two, and no space for placing a Zener exists.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel LED lead frame of cup type structure can solve traditional LED lead frame free pad quantity and be two, selects limited technical problem.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the novel cup-shaped LED lead frame comprises LED lead frame monomers, wherein the LED lead frame monomers are arranged on a conductive base material and are arranged in an array manner;
the LED lead frame monomer comprises a metal conductor base and an insulating light reflecting cup body, wherein the insulating light reflecting cup body is arranged on the metal conductor base and is in a cup shape with an opening and no bottom;
the metal conductor base is provided with three conductive bonding pad areas, namely a conductive bonding pad I, a conductive bonding pad II and a conductive bonding pad III, wherein the conductive bonding pad I and the conductive bonding pad III are communicated and conductive and are integrally formed to be used as an electrode; the second conductive bonding pad is an independent bonding pad and is used as the other electrode; the first and third conductive pads are isolated from the first and third conductive pads through the insulating grooves;
the first conductive bonding pad is a die bonding pad, and the second conductive bonding pad and the third conductive bonding pad can be used as Zener bonding pads; the bonding pads can be connected by using metal wires so as to achieve the functions of electrode communication and conduction;
three angles are arranged in the insulating reflecting cup body, namely, the light-emitting angle of the whole cup shape, the angle of the die bonding pad and the angle of the Zener bonding pad are fixed;
wherein, the whole cup-shaped light-emitting angle is less than or equal to 70 degrees, the angle of the die bonding pad is less than or equal to 60 degrees, and the angle of the Zener pad is less than or equal to 50 degrees; the arrangement of the light-emitting angle can enable the product to obtain better light effect so as to achieve the use performance of the product; the angle arrangement of the die bonding pad and the Zener bonding pad can ensure the smooth production of products, prevent the die sticking problem in the forming process and also can give a good leading-in function to the metal wire in the wire bonding process;
furthermore, the insulating reflecting cup bodies are sequentially arranged into four sections in the longitudinal direction, and the outer diameters of the four sections are different from each other.
Furthermore, four sections of the insulating reflective cup body sequentially comprise a first section, a second section, a third section and a fourth section from bottom to top, wherein the height of the first section is less than or equal to 0.05MM, the height of the second section is less than or equal to 0.20MM, the height of the third section is less than or equal to 0.6MM, and the height of the fourth section is less than or equal to 0.20 MM; the setting of the height of the fourth section can well avoid the light absorption characteristic of the Zener, thereby ensuring the lighting effect of the product;
furthermore, four soldering tin pins are arranged on the metal conductor base, wherein three soldering tin pins form a loop which is communicated with the first bonding pad and the third bonding pad; the other solder foot is a separate structure and is communicated with the second pad.
Furthermore, a round hole is respectively arranged at the connecting position of the conductive terminal and each soldering tin pin.
Furthermore, four impermeable threads are arranged around each round hole respectively.
Further, the total length of the LED lead frame monomers is 3.40-3.60 MM, the total width of the LED lead frame monomers is 2.70-2.90 MM, and the total height of the LED lead frame monomers is 1.70-1.90 MM.
Furthermore, the length of the insulating reflective cup body is 3.10-3.30 MM, the MARK angle of the insulating reflective cup body is 0.50-C0.70MM, the cup depth of the insulating reflective cup body is 0.70-0.90 MM, and the total height of the insulating reflective cup body is 1.65-1.85 MM.
Further, the width of the conductive base material is 59.50-60.50 MM;
the conductive base materials are longitudinally arranged to 15 LED lead frame monomers, the center distance between every two LED lead frame monomers which are transversely arranged and adjacent to each other is 7.10-7.30 MM, and the PIN distance between every two LED lead frame monomers which are longitudinally adjacent to each other is 3.50-3.70 MM;
the two sides of the conductive substrate are respectively and symmetrically provided with positioning holes, the longitudinal distance between the positioning holes is 56.90-57.10 MM, and the transverse distance between the positioning holes is 7.10-7.30 MM.
Furthermore, positioning holes are respectively formed in two side edges of the conductive base material of the frame in the width direction, wherein one side of the conductive base material is a first positioning hole, the diameter of the first positioning hole is 1.40-1.60 MM, the other side of the conductive base material is a second positioning hole, and the diameter of the second positioning hole is 1.40-1.60 MM;
and a third positioning hole is also formed in the side edge where the first positioning hole is located, the third positioning hole is arranged close to the first positioning hole, and the third positioning hole and the first positioning hole form a group for foolproof.
According to the above technical scheme, the utility model discloses a novel cup type structure's three pad of LED lead frame design is regional, has solved the independent regional problem of zener chip.
The utility model has the advantages as follows:
1. the number of the bonding pads of the LED lead frame monomer is three, and Zener can be placed in the bonding pads;
2. because the utility model is provided with the Zener which is a black substance and has the light absorption function, the utility model is specially provided with a height on the insulating luminous cup to block the light absorption of the Zener;
3. the number of the single soldering tin feet of the common frame is two, the two soldering tin feet correspond to the two soldering pads respectively, and no selectivity exists in application, and the utility model is provided with 4 soldering tin feet;
4. the utility model discloses to the free location problem of lead frame, set up less chamfer in the pad shape and handled, this is for the product plays the discernment positioning action in the packaging process.
Drawings
Fig. 1 is a schematic front view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a highly schematic view of the single body of the present invention;
FIG. 4 is a schematic view of a four-section structure of the single luminous cup of the present invention;
FIG. 5 is a schematic view of the structure of the light-emitting angle contained in the single light-emitting cup of the present invention;
FIG. 6 is a schematic view of the single soldering foot of the present invention;
FIG. 7 is a schematic view of a circular hole structure formed on the single pad of the present invention;
fig. 8 is a schematic view of the layout structure of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
As shown in fig. 1 to 8, the LED lead frame with the novel cup-shaped structure in this embodiment includes LED lead frame monomers, and the LED lead frame monomers are disposed on a conductive substrate and arranged in an array arrangement;
the LED lead frame monomer comprises a metal conductor base 1 and an insulating light reflecting cup body 2, wherein the insulating light reflecting cup body 2 is arranged on the metal conductor base 1, and the insulating light reflecting cup body 2 is in a cup shape with an opening and no bottom;
the metal conductor base 1 is provided with three conductive pad areas, namely a conductive pad I111, a conductive pad II 112 and a conductive pad III 113, wherein the conductive pad I111 and the conductive pad III 113 are communicated and conductive and are integrally formed; the second conductive bonding pad 112 is an independent bonding pad and is isolated from the first conductive bonding pad and the third conductive bonding pad through an insulating groove; one of the second and third bonding pads is subjected to small chamfering treatment 211, so that the product can be identified and positioned in the packaging process;
the first conductive bonding pad 111 is a die bonding pad, and the second conductive bonding pad and the third conductive bonding pad can be used as zener bonding pads; the bonding pads can be connected by using metal wires so as to achieve the functions of electrode communication and conduction;
the Zener has the function of stabilizing voltage and preventing the product from losing performance due to overlarge voltage;
the metal conductor base 1 comprises 4 soldering tin pins which are cut and symmetrically arranged, a first welding pad 111 and a third welding pad 113 are connected with 3 soldering tin pins 501, 504 and 505 and integrally formed, and a second welding pad 112 is connected with the other soldering tin pin 502 and integrally formed; the symmetrical arrangement of the plurality of welding feet is beneficial to improving the aesthetic property of the LED lead frame monomer; meanwhile, through the rectangular distribution of the soldering tin feet, the reasonable distribution of the soldering tin feet on the LED lead frame monomer is improved, the communication selectivity is increased, and the application range is enlarged;
the structure of the present embodiment is specifically described below:
the arrangement of the novel cup-shaped LED lead frame of this embodiment: the frame is arranged on a conductive base material with the width of 59.50-60.50 MM (millimeter) in the frame 101, the distance between longitudinal positioning holes is 56.90-57.10 MM, the distance between transverse positioning holes is 7.10-7.30 MM, the center distance 104 between two transversely arranged adjacent products is 7.10-7.30 MM, the PIN distance 105 between two longitudinally adjacent products is 3.50-3.70 MM, and the size of the positioning hole 106 is designed to be 1.40-1.60 MM in diameter; the size of the positioning hole 107 is designed to be 1.40-1.60 MM in diameter; because the sizes of the positioning holes 106 and 107 are the same, in order to prevent the problem of product reversal, the fool-proof design 108 is specially designed to ensure the correctness of the production direction of the product; 106,107 are positioning holes needed by the product in the production process, and because the sizes of the upper positioning hole and the lower positioning hole are consistent, in order to prevent the reverse abnormity of the product caused by the product positioning problem in the production process, the positioning hole 108 is added, one side of the whole frame is one positioning hole, and the other side is two positioning holes; the orientation of the whole frame can be determined by observing the arrangement of the positioning holes in the production process;
this implement single product size after LED lead frame of novel cup type structure cuts: the total length 201 of the product is 3.40-3.60 MM, the total width 202 of the product is 2.70-2.90 MM, the length 203 of the product plastic is 3.10-3.30 MM, the MARK angle 204 of the product is C0.50-C0.70MM, the cup depth 205 of the product is 0.70-0.90 MM, the total height 206 of the product is 1.70-1.90 MM, and the total height 207 of the product plastic is 1.65-1.85 MM; wherein, MARK angle means identification angle for identifying direction, C0.50-0.70 MM refers to identification angle size;
the cup type structure of the novel cup type structure of the LED lead frame of this embodiment: after the injection molding of the product is finished, the cup-shaped structure of the product is 4-section type, the height dimension 301 of a first section is not more than 0.05MM, the height dimension 302 of a second section is not more than 0.20MM, the height dimension 303 of a third section is not more than 0.6MM, and the height dimension 304 of a fourth section is not more than 0.20 MM; wherein the height of the fourth section 304 is used to block the zener absorption;
the luminous angle of the novel cup-shaped LED lead frame of this embodiment: in order to ensure that the finished lamp bead has excellent brightness to meet the requirements of users and the rigid requirements in the production process, 4 kinds of light-emitting angles are designed in the same cup shape to be matched with each other to achieve the aim of maximizing the brightness when a product is designed to ensure the brightness of a lamp bead product to be maximized, wherein the light-emitting angle 401 is not more than 70.00 degrees, the light-emitting angle 402 is not more than 60.00 degrees, and the light-emitting angle 403 is not more than 50.00 degrees;
the terminal structure of the novel cup-shaped structure of the LED lead frame of this embodiment: in order to ensure the multi-selectivity of product bonding wires, four soldering tin feet are designed, wherein a first bonding pad 111 and a third bonding pad 113 are connected with 3 soldering tin feet 501, 504 and 505 and are integrally formed, and a second bonding pad 112 is connected with another soldering tin foot 502 and is integrally formed; in addition, in order to facilitate the recognition and increase the associativity between the core and the bonding pad when a customer packages, a recognition cross 503 is designed in the center of the product;
the novel air-tight structure of LED lead frame of cup type structure of this embodiment: in order to promote the direct associativity of product plastic and terminal, prevent to lead to plastic and five metals terminal not hard up phenomenon to take place because of combining inadequately, four round holes 601 of special design connect the product about the lid form a whole, prevent that plastic and five metals terminal from taking place not hard up phenomenon, and in order to strengthen the product gas tightness, prevent that harmful element from getting into the product cup through the clearance in, lead to the product life-span to subtract the weak point, 4 anti-permeability lines 602 of special design, increase the infiltration route of product, strengthen the gas tightness of product according to this.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. The novel cup-shaped LED lead frame comprises LED lead frame monomers, wherein the LED lead frame monomers are arranged on a conductive base material and are arranged in an array manner;
the LED lead frame monomer comprises a metal conductor base (1) and an insulating light reflecting cup body (2), wherein the insulating light reflecting cup body (2) is arranged on the metal conductor base (1), and the insulating light reflecting cup body (2) is in a cup shape with an opening and no bottom;
the method is characterized in that:
the metal conductor base (1) is provided with three conductive pad areas, namely a conductive pad I (111), a conductive pad II (112) and a conductive pad III (113), wherein the conductive pad I (111) and the conductive pad III (113) are communicated and conductive and are integrally formed; the second conductive pad (112) is an independent pad and is isolated from the first conductive pad (111) and the third conductive pad (113) through an insulating groove;
the first conductive bonding pad (111) is a die bonding pad, and the second conductive bonding pad and the third conductive bonding pad are zener bonding pads;
three angles, namely an integral cup-shaped light-emitting angle (α 401), a die bonding pad angle (α 402) and a Zener bonding pad angle (α 403) are arranged in the insulating light-reflecting cup body (2);
wherein the overall cup-shaped light emitting angle (α 401) is less than or equal to 70 degrees, the die attach pad angle (α 402) is less than or equal to 60 degrees, and the zener pad angle (α 403) is less than or equal to 50 degrees.
2. The novel cup-shaped LED lead frame of claim 1, wherein: the insulating light reflecting cup body (2) is sequentially arranged into four sections in the longitudinal direction, and the outer diameters of the four sections are different.
3. The novel cup-shaped LED lead frame of claim 2, wherein: four sections of the insulating reflective cup body (2) are a first section, a second section, a third section and a fourth section from bottom to bottom in sequence, wherein the height (H301) of the first section is less than or equal to 0.08MM, the height (H302) of the second section is less than or equal to 0.20MM, the height (H303) of the third section is less than or equal to 0.70MM, and the height (H304) of the fourth section is less than or equal to 0.20 MM.
4. The novel cup-shaped LED lead frame of claim 1, wherein: four soldering tin feet are arranged on the metal conductor base (1), the first soldering tin foot (111) and the third soldering tin foot (113) are connected with 3 soldering tin feet (501, 504 and 505) and are integrally formed, and the second soldering tin foot (112) is connected with the other soldering tin foot (502) and is integrally formed.
5. The novel cup-shaped LED lead frame of claim 4, wherein: the connection positions of the conductive terminals and the soldering tin pins are respectively provided with a round hole (601).
6. The novel cup-shaped LED lead frame of claim 1, wherein: four impermeable threads are respectively arranged on the periphery of each round hole (601).
7. The novel cup-shaped LED lead frame of claim 1, wherein: the total length (L201) of the LED lead frame monomers is 3.40-3.60 MM, the total width (W202) of the LED lead frame monomers is 2.70-2.90 MM, and the total height (H206) of the LED lead frame monomers is 1.70-1.90 MM.
8. The novel cup-shaped LED lead frame of claim 1, wherein: the length (L203) of the insulating reflective cup body (2) is 3.10-3.30 MM, the MARK angle (204) of the insulating reflective cup body (2) is C0.50-C0.70MM, the cup depth (D205) of the insulating reflective cup body (2) is 0.70-0.90 MM, and the total height (H207) of the insulating reflective cup body (2) is 1.65-1.85 MM.
9. The novel cup-shaped LED lead frame of claim 1, wherein: the width (W101) of the conductive base material is 59.50-60.50 MM;
the conductive base materials are longitudinally arranged to 15 LED lead frame monomers, the central distance (D104) between every two LED lead frame monomers which are transversely arranged and adjacent to each other is 7.10-7.30 MM, and the PIN distance (D105) between every two LED lead frame monomers which are longitudinally adjacent to each other is 3.50-3.70 MM;
the two sides of the conductive substrate are respectively and symmetrically provided with positioning holes (100), the longitudinal distance (D102) of the positioning holes is 56.90-57.10 MM, and the transverse distance (D103) of the positioning holes is 7.10-7.30 MM.
10. The novel cup-shaped LED lead frame of claim 1, wherein: the conductive base material of the frame is respectively provided with positioning holes at two sides in the width direction, wherein one side of the conductive base material is a first positioning hole (106), the diameter of the first positioning hole (106) is 1.40-1.60 MM, the other side of the conductive base material is a second positioning hole (107), and the diameter of the second positioning hole (107) is 1.40-1.60 MM;
and a third positioning hole (108) is further formed in the side edge where the first positioning hole (106) is located, the third positioning hole (108) is arranged close to the first positioning hole (106), and the third positioning hole (108) and the first positioning hole (106) form a group for foolproof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921324262.8U CN210245494U (en) | 2019-08-15 | 2019-08-15 | Novel LED lead frame of cup-shaped structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921324262.8U CN210245494U (en) | 2019-08-15 | 2019-08-15 | Novel LED lead frame of cup-shaped structure |
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| CN210245494U true CN210245494U (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921324262.8U Active CN210245494U (en) | 2019-08-15 | 2019-08-15 | Novel LED lead frame of cup-shaped structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978883A (en) * | 2023-09-25 | 2023-10-31 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
-
2019
- 2019-08-15 CN CN201921324262.8U patent/CN210245494U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978883A (en) * | 2023-09-25 | 2023-10-31 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
| CN116978883B (en) * | 2023-09-25 | 2023-12-12 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
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