CN211208477U

CN211208477U - L ED bracket adopting novel die bonding mode

Info

Publication number: CN211208477U
Application number: CN201921151801.2U
Authority: CN
Inventors: 杨风帆; 宁峥; 许长乐; 周世忠; 陈小刚; 韩志培; 黄书见; 时甲甲; 肖自然
Original assignee: ANHUI SHENGYE ELECTRONICS CO LTD
Current assignee: ANHUI SHENGYE ELECTRONICS CO LTD
Priority date: 2019-07-22
Filing date: 2019-07-22
Publication date: 2020-08-07
Anticipated expiration: 2029-07-22

Abstract

The utility model provides a novel L ED support of solid crystal mode, can solve current L ED lead frame solid crystal mode left and right sides light inhomogeneous, the light efficiency is relatively poor, and the heat capacity is little, technical problem such as heat conduction slow, and solid crystal mode singleness can not satisfy market demand including metal conductor base and insulating reflection of light cup, the metal conductor base is separated into two electrically conductive terminals independent each other through setting up the insulating bath, the insulating bath is a style of calligraphy, sets up the insulator in the insulating bath, insulating reflection of light cup sets up on the metal conductor base, insulating reflection of light cup is the uncovered bottomless cup, the insulating bath is separated into two electrically conductive terminals of mutual symmetry to the metal conductor base, the utility model discloses a novel L ED support center of solid crystal mode is equallyd divide, and the solid crystal mode can pluralism to can let the light efficiency fully send, and left and right sides light is even, and the light efficiency is good, and double-pad, heat conduction increases heat capacity, increases heat transfer rate simultaneously, promotes advantages such as ageing time and life.

Description

L ED bracket adopting novel die bonding mode

Technical Field

The utility model relates to the field of semiconductor technology, concretely relates to novel L ED support of solid brilliant mode.

Background

The lead frame is used for packaging an integrated circuit and a discrete device, is used as a chip carrier of the integrated circuit, and is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit. The lead frame is used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.

The common L ED lead frame is two bonding pads, an insulating groove is arranged between the two bonding pads, the two bonding pads are divided into a positive electrode and a negative electrode, one bonding pad is used for placing the luminescent crystal, in order to ensure the uniformity of light in a cup shape after the luminescent crystal is lightened, the position center of the luminescent crystal is consistent with the center of a product, and then the luminescent crystal is connected with the two bonding pads through a metal wire.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of novel L ED support of solid brilliant mode can solve about the solid brilliant mode of current L ED lead frame light inhomogeneous, and the light efficiency is relatively poor, and the heat capacity is little, and heat conduction waits technical problem slowly, and solid brilliant mode is single moreover can not satisfy the technical problem of market demand.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an L ED bracket adopting a novel die bonding mode comprises a metal conductor base and an insulating light reflecting cup body, wherein the metal conductor base is divided into two mutually independent conductive terminals by arranging an insulating groove, the insulating groove is in a straight shape, and an insulator is arranged in the insulating groove;

the insulating light reflecting cup body is arranged on the metal conductor base and is in a cup shape with an opening and no bottom;

the insulating groove divides the metal conductor base into two conductive terminals which are symmetrical to each other.

Further, the inner wall of the insulating reflective cup body is inclined and extends towards the center of the cup bottom, the light-emitting angle of the insulating reflective cup body in the length direction is greater than or equal to 100 degrees and less than 160 degrees, and the light-emitting angle of the insulating reflective cup body in the width direction is greater than or equal to 100 degrees and less than 160 degrees.

Furthermore, the outer ends of the two conductive terminals are respectively provided with solder feet, the solder feet exceed the appearance of the insulating reflective cup body, and the solder feet are in a concave type.

Further, the width of the top of the insulating groove is MAX 0.30MM, grooves are formed in the bottom of the insulating groove towards the two sides, the thinning depth of each groove is MAX0.15MM, and the width of the bottom of the insulating groove is MAX 0.70 MM.

Furthermore, two side surfaces of the metal conductor base are set to be thinned and have a break difference width MAX0.15MM and a break difference depth MAX0.15 MM.

Furthermore, the insulating light reflecting cup body is injection-molded on the metal conductor base, wherein the insulator in the insulating groove and the insulating light reflecting cup body are integrally formed.

According to the above technical scheme, the utility model discloses a set up the insulated slot at the central point of product and put, when placing the flip-chip luminescent crystal, can set up according to following mode: 1. can be inverted without gold wires; 2. the double crystals can be connected in series, and gold wires are needed; 3. double crystals can be connected in parallel, and gold wires are needed; 4. 4 crystals can be connected in series, and gold wires are needed; 5. 4 crystals can be connected in parallel, and gold wires are needed; the above various ways can satisfy various requirements.

Meanwhile, the center of the utility model is equally divided, so that the lighting effect can be fully emitted, the left and right lights are uniform, and the lighting effect is good; double-bonding-pad heat conduction increases heat capacity, increases heat transfer rate simultaneously, promotes advantages such as ageing time and life of lamp pearl.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a sectional view taken along line B-B of FIG. 1;

FIG. 3 is a schematic view of the specification parameters of the insulated reflector cup;

FIG. 4 is a sectional view taken along line A-A of FIG. 1;

FIG. 5 is a schematic diagram of the structural specifications of the present invention;

FIG. 6 is an enlarged schematic view of a structure of a lateral offset of a metal conductor base;

FIG. 7 is a schematic view of a solder fillet structure according to the present invention;

FIG. 8 is a layout of light emitting chips on a conventional L ED lead frame;

fig. 9 is a schematic diagram of the layout of the flip-chip light emitting chip of the present invention;

FIG. 10 is a schematic diagram of the present invention showing the layout of the front-mounted four small light-emitting chips in parallel;

FIG. 11 is a schematic view of the layout of the front-mounted four small light-emitting chips in series according to the present invention;

FIG. 12 is a schematic diagram of the present invention showing two light-emitting chips connected in parallel;

fig. 13 is a schematic diagram of the layout of the present invention for connecting two light emitting chips in series.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

As shown in fig. 1 to 7, the L ED bracket of the novel die bonding method of this embodiment includes:

comprises a metal conductor base 1 and an insulated reflecting cup body 2; the metal conductor base 1 is divided into two mutually independent conductive terminals by arranging an insulating groove 3; the outer ends of the two conductive terminals are respectively provided with two soldering tin pins, namely a first soldering tin pin 501 and a second soldering tin pin 502, the first soldering tin pin 501 comprises two soldering tin pins, and the second soldering tin pin 502 comprises two soldering tin pins; the soldering tin feet all exceed the appearance of the insulating reflecting cup body 2, and the soldering tin feet are of an inward concave type. Designed to be concave; the contact area between the solder paste and the product during soldering tin can be enlarged, and the soldering tin performance of the product can be better ensured.

The insulation groove 3 is in a straight shape, and an insulator is arranged in the insulation groove 3; the insulating light reflecting cup body 2 is injection-molded on the metal conductor base 1, wherein the insulator in the insulating groove 3 and the insulating light reflecting cup body 2 are integrally formed.

The insulating light reflecting cup body 2 is arranged on the metal conductor base 1, and the insulating light reflecting cup body 2 is in a cup shape with an opening and no bottom;

the insulating groove 3 divides the metal conductor base 1 into two conductive terminals which are symmetrical to each other.

The inner wall of the insulated light reflecting cup body 2 is inclined and extends towards the center of the cup bottom, the light emitting angle α 205 in the length direction of the insulated light reflecting cup body 2 is greater than or equal to 100 degrees and less than 160 degrees, and the light emitting angle α 206 in the width direction of the insulated light reflecting cup body 2 is greater than or equal to 100 degrees and less than 160 degrees, wherein α 205 can be interpreted that the insulated light reflecting cup body 2 is rectangular, the rectangle comprises a pair of long sides and a pair of short sides, the inner wall of the insulated light reflecting cup body 2 is inclined and extends towards the center of the cup bottom, wherein the included angle formed by the extension and intersection of the inner walls at the two sides on the central line parallel to the long sides of the rectangle is the included angle α 205, and similarly α 206 is the included angle formed by the extension and intersection of the inner walls at the two sides;

the two side surfaces of the metal conductor base 1 are set to be thinned and have a break difference width W401 of MAX0.15MM and a break difference depth D402 of MAX0.15 MM. The design part is thinned, so that the bonding strength of the metal base and the plastic can be increased, the permeation path of harmful substances is increased, and the air tightness of the product is improved.

The length L301 of the metal conductor base 1 is 3.40 MM to 3.70MM, the width W302 of the metal conductor base 1 is 2.70 MM to 2.90MM, and the thickness D303 of the metal conductor base 1 is 0.20 MM to 0.30 MM.

The width W101 of the top of the insulating groove 3 is MAX 0.30MM, grooves are formed in the bottom of the insulating groove 3 towards the two sides, the thinning depth D103 of each groove is MAX0.15MM, and the width W102 of the bottom of the insulating groove 3 is MAX 0.70 MM.

The cup bottom length L201 of the insulating reflective cup body 2 is 2.05-2.25 MM, the cup rim length L202 is 2.85-3.05 MM, the cup bottom width W204 is 1.50-1.70 MM, the cup rim width W203 is 2.30-2.50 MM, and the cup shape height H304 is 0.35-0.50 MM.

The total height of the support is 0.60-0.75 MM.

In summary, in the embodiment, the linear insulating groove is arranged at the center of a single product, the metal bottoms on two sides of the linear shape are divided into the positive electrode and the negative electrode, the luminescent crystal is directly placed at the center of the product during crystal solidification, and the luminescent crystal can be arranged in the following manner:

specifically, referring to fig. 8-13, the top half of fig. 8-13 is a top view, the bottom half is a cross-sectional view of a main viewing angle, wherein fig. 8 is a layout of light emitting chips of a conventional L ED lead frame, fig. 9 is a schematic diagram of a layout flip light emitting chip of the present invention, fig. 10 is a schematic diagram of a layout of a front-mounted four small light emitting chips in parallel, fig. 11 is a schematic diagram of a layout of a front-mounted four small light emitting chips in series, fig. 12 is a schematic diagram of a layout of a front-mounted two large light emitting chips in parallel, fig. 13 is a schematic diagram of a layout of a front-mounted two large light emitting chips in series, fig. 4 is a light emitting chip, and fig. 5 is a metal wire, by contrast, a conventional L ED support can only use one bonding pad, i.e., metal conductor base 1, and the heat generated by the light emitting chip 4 after emitting light emitting can only use one bonding pad for heat dissipation, both bonding pads of the L ED support can be die-bonded, and.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. An L ED support adopting a novel die bonding mode comprises a metal conductor base (1) and an insulating light-reflecting cup body (2), wherein the metal conductor base (1) is divided into two mutually independent conductive terminals by arranging an insulating groove (3), the insulating groove (3) is in a straight shape, and an insulator is arranged in the insulating groove (3);

the insulating light reflecting cup body (2) is arranged on the metal conductor base (1), and the insulating light reflecting cup body (2) is in a cup shape with an opening and no bottom; the method is characterized in that:

the insulating groove (3) divides the metal conductor base (1) into two conductive terminals which are symmetrical to each other;

the insulating light reflecting cup body (2) is injection-molded on the metal conductor base (1), wherein the insulator in the insulating groove (3) and the insulating light reflecting cup body (2) are integrally formed.

2. The L ED support frame with novel die attach method according to claim 1, wherein the inner wall of the insulating light-reflecting cup body (2) is inclined to extend toward the center of the cup bottom, the light-emitting angle (α 205) of the insulating light-reflecting cup body (2) in the cup length direction is greater than or equal to 100 degrees and less than 160 degrees, and the light-emitting angle (α 206) of the insulating light-reflecting cup body (2) in the cup width direction is greater than or equal to 100 degrees and less than 160 degrees.

3. The L ED bracket with the novel die attach method according to claim 1, wherein solder fillets are respectively disposed at outer ends of the two conductive terminals, the solder fillets exceed the shape of the insulating light-reflecting cup body (2), and the solder fillets are concave.

4. The L ED support frame with novel die bonding mode according to claim 1, wherein the two side faces of the metal conductor base (1) are thinned and have a step width (W401) of MAX0.15MM and a step depth (D402) of MAX0.15 MM.

5. The L ED support frame with novel die bonding mode according to claim 1, wherein the length (L301) of the metal conductor base (1) is 3.40-3.70 MM, the width (W302) of the metal conductor base (1) is 2.70-2.90 MM, and the thickness (D303) of the metal conductor base (1) is 0.20-0.30 MM.

6. The L ED support frame with the novel die bonding mode according to claim 1, wherein the width (W101) of the top of the insulation groove (3) is MAX 0.30MM, the bottom of the insulation groove (3) is provided with grooves towards two sides, the thinning depth (D103) of the grooves is MAX0.15MM, and the width (W102) of the bottom of the insulation groove (3) is MAX 0.70 MM.

7. The L ED support frame with novel die attach method according to claim 1, wherein the insulating light-reflecting cup body (2) has a cup bottom length (L201) of 2.05-2.25 MM, a cup rim length (L202) of 2.85-3.05 MM, a cup bottom width (W204) of 1.50-1.70 MM, a cup rim width (W203) of 2.30-2.50 MM, and a cup height (H304) of 0.35-0.50 MM.

8. The L ED support with the novel die bonding mode as claimed in claim 1, wherein the total height of the support is 0.60-0.75 MM.

9. The L ED support frame with novel die attach method according to claim 3, wherein the outer ends of the two conductive terminals are respectively provided with solder tails, namely solder first (501) and solder second (502), the solder first (501) comprises two solder tails, and the solder second (502) comprises two solder tails.