CN113707791B - LED manufacturing process - Google Patents
LED manufacturing process Download PDFInfo
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- CN113707791B CN113707791B CN202111023923.5A CN202111023923A CN113707791B CN 113707791 B CN113707791 B CN 113707791B CN 202111023923 A CN202111023923 A CN 202111023923A CN 113707791 B CN113707791 B CN 113707791B
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- bonding pad
- metal connecting
- connecting part
- transverse
- copper sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
An LED manufacturing process comprising the steps of: (1) Stamping, namely stamping a plurality of single bonding pad supports on the copper sheet coiled material, wherein longitudinal material belts are arranged on two longitudinal sides of each single bonding pad support, transverse material belts are arranged on two transverse sides of each single bonding pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a material frame, and bonding pads are connected with the transverse material belts through metal connecting parts; (2) electroplating; (3) Injection molding, namely injection molding a plastic bowl cup at the position of a single bonding pad bracket on a copper sheet coiled material; (4) appearance, black marks are coated at positions of poor plastics; (5) Packaging, namely winding a copper sheet coiled material with a bonding pad bracket and a plastic bowl cup on a reel; (6) Packaging, unreeling the copper sheet through a reel, and carrying out die bonding, bonding wires and dispensing in a plastic bowl cup; (7) Stripping, namely continuously stamping the coiled copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
Description
Technical Field
The invention relates to the field of LEDs, in particular to an LED manufacturing process.
Background
The existing LED manufacturing process flow comprises the following steps: stamping, namely stamping a plurality of single bonding pad supports, longitudinal material belts and transverse material belts on the copper sheet, wherein the single bonding pad supports are arranged between adjacent transverse material belts and adjacent longitudinal material belts, each single bonding pad support comprises an anode bonding pad and a cathode bonding pad, the anode bonding pad and the cathode bonding pad are connected with the transverse material belts through metal connecting belts, and one side of each longitudinal material belt facing the bonding pad support is provided with a convex clamping point; electroplating, namely electroplating the surface of the copper sheet; injection molding, namely injection molding a plastic bowl cup at the position of the bonding pad bracket, wherein the metal connecting belt and the clamping point are embedded into the plastic bowl cup to form connection; the appearance, find out the bad plastic bowl cup of injection molding through appearance detection and make it break away from through the stamping mode; stamping, namely cutting off the metal connecting belt and the injection molding guide groove in a stamping mode, and fixedly supporting the plastic bowl cup only by a clamping point; packaging, namely cutting the copper sheet coiled material into sheets; packaging, namely fixing crystals, welding wires and dispensing in a plastic bowl cup on the chip mounting bracket; stripping, namely stripping by using a roller, and overturning the strip edge to separate the clamping point from the single LED. The LED manufacturing process has the defects that: too shallow of the stuck point control is easy to drop particles, too deep of the stuck point is easy to peel materials to damage a bracket structure, and the particles are easy to drop when the packaging process is deformed or fallen; the fluorescent agent at the particle falling position pollutes the dispensing base plate and the bonding pad adhesive; as shown in fig. 4, due to the existence of the clamping points, grooves 11 are formed on two sides of the plastic bowl cup 10, so that flatness of two sides of a single LED is affected, and the LED is clamped at the track of the light splitting machine.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an LED manufacturing process, and the situation of falling off and particle falling off can not occur in the packaging process; the process flow is reduced, and the production cost is reduced.
In order to solve the technical problems, the technical scheme of the invention is as follows: an LED manufacturing process comprising the steps of:
(1) Stamping, namely stamping a plurality of single bonding pad supports on a copper sheet coiled material, wherein longitudinal material belts are arranged on two longitudinal sides of each single bonding pad support, transverse material belts are arranged on two transverse sides of each single bonding pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a work or material rest, each single bonding pad support comprises an anode bonding pad and a cathode bonding pad, an isolation groove is arranged between each anode bonding pad and each cathode bonding pad, stamping empty grooves are arranged between each single bonding pad support and the longitudinal material belts on two sides, the isolation grooves are communicated with the stamping empty grooves, one end of each anode bonding pad is connected with the transverse material belts on one side of each single bonding pad support through a first metal connecting part, and one end of each cathode bonding pad is connected with the transverse material belts on the other side of each single bonding pad support through a second metal connecting part;
(2) Electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) Injection molding, namely, injection molding a plastic bowl cup at the position of a single bonding pad bracket on a copper sheet coiled material, wherein the positive bonding pad and the negative bonding pad are embedded at the bottom of the plastic bowl cup, the longitudinal two sides of the plastic bowl cup are separated from a longitudinal material belt, and the transverse two sides of the plastic bowl cup are connected with a transverse material belt only through a first metal connecting part and a second metal connecting part;
(4) Appearance, namely, black marks are coated on positions with poor plastic through appearance detection;
(5) Packaging, namely winding a copper sheet coiled material with a bonding pad bracket and a plastic bowl cup on a reel;
(6) Packaging, unreeling the copper sheet through a reel, and carrying out die bonding, bonding wires and dispensing in a plastic bowl cup;
(7) Stripping, namely continuously stamping the coiled copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
According to the invention, through changing the manufacturing process flow of the LED, the clamping point at the edge of the longitudinal material belt is removed, and the plastic bowl cup and the bonding pad are supported only by the metal connecting part, so that the problems that the inverted bracket is damaged and easily falls due to the existence of the clamping point are solved; in the packaging process, the poor plastic bowl cup and the bonding pad bracket are not required to be washed away, so that the process flow can be saved; in the stripping process, the continuous operation is performed in a coil unreeling and stamping mode, the operation efficiency is high, and the material is stored in a coil mode, so that the packaging can be saved; in the beam splitting process, as the two sides of the single LED are smooth, the material cannot be blocked at the track of the beam splitter.
As an improvement, the first metal connecting part is arranged at the middle position of one end of the positive electrode bonding pad; the second metal connecting part is arranged at the middle position of one end of the negative electrode bonding pad.
As an improvement, the positive electrode bonding pad, the negative electrode bonding pad, the first metal connecting part, the second metal connecting part, the longitudinal material belt and the transverse material belt are integrally formed by stamping.
As an improvement, the middle position of one end of the positive electrode bonding pad corresponding to the first metal connecting part is convex; the middle position of one end of the negative electrode bonding pad corresponding to the second metal connecting part is convex.
In the process of stripping, the root part connected with the positive electrode bonding pad at the first metal connecting part is broken, and the root part connected with the negative electrode bonding pad at the second metal connecting part is broken.
As an improvement, two sides of the length direction of the material rack are corresponding to the positions of the transverse material belts to punch a plurality of cutting grooves.
As an improvement, the width of the two ends of the transverse material belt is narrowed to form an on-line positive and negative electrode breaking point for suction test.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, through changing the manufacturing process flow of the LED, the clamping point at the edge of the longitudinal material belt is removed, and the plastic bowl cup and the bonding pad are supported only by the metal connecting part, so that the problems that the inverted bracket is damaged and easily falls due to the existence of the clamping point are solved; in the packaging process, the poor plastic bowl cup and the bonding pad bracket are not required to be washed away, so that the process flow can be saved; in the stripping process, the continuous operation is performed in a coil unreeling and stamping mode, the operation efficiency is high, and the material is stored in a coil mode, so that the packaging can be saved; in the beam splitting process, as the two sides of the single LED are smooth, the material cannot be blocked at the track of the beam splitter.
Drawings
FIG. 1 is a process flow diagram of a manufacturing process according to the present invention.
Fig. 2 is a schematic view of the copper sheet after the stamping process.
Fig. 3 is a schematic view of the copper sheet after the injection molding process.
Fig. 4 is a schematic view of a single LED manufactured by the prior art.
Fig. 5 is a schematic view of a single LED manufactured by the process of the present invention.
Detailed Description
The invention is further described below with reference to the drawings.
As shown in fig. 1, an LED manufacturing process includes the steps of:
(1) Stamping, as shown in fig. 2, a plurality of single bonding pad supports are stamped on a copper sheet coiled material, longitudinal material belts 1 are arranged on two longitudinal sides of each single bonding pad support, transverse material belts 2 are arranged on two transverse sides of each single bonding pad support, the longitudinal material belts 1 and the transverse material belts 2 are connected with each other to form a work or material rest, each single bonding pad support comprises an anode bonding pad 4 and a cathode bonding pad 5, a separation groove is arranged between the anode bonding pad 4 and the cathode bonding pad 5, a stamping empty groove is arranged between each single bonding pad support and the longitudinal material belts 1 on two sides, the separation groove is communicated with the stamping empty groove, one end of each anode bonding pad 4 is connected with the transverse material belts 2 on one side of each single bonding pad support through a first metal connecting part 7, and one end of each cathode bonding pad 5 is connected with the transverse material belts 2 on the other side of each single bonding pad support through a second metal connecting part 6; the positive electrode bonding pad 4, the negative electrode bonding pad 5, the first metal connecting part 7, the second metal connecting part 6, the longitudinal material belt 1 and the transverse material belt 2 are integrally formed by stamping; the middle position of one end of the positive electrode bonding pad 4 corresponding to the first metal connecting part 7 is convex; the middle position of one end of the negative electrode bonding pad 5 corresponding to the second metal connecting part 6 is convex, and the first metal connecting part 7 is arranged at the middle position of one end of the positive electrode bonding pad 4; the second metal connecting part 6 is arranged at the middle position of one end of the negative electrode bonding pad 5;
(2) Electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) Injection molding, as shown in fig. 3, a plastic bowl cup 10 is injection molded at the position of a single bonding pad bracket on a copper sheet coiled material, wherein the positive bonding pad 4 and the negative bonding pad 5 are embedded at the bottom of the plastic bowl cup 10, the two longitudinal sides of the plastic bowl cup 10 are separated from the longitudinal material belt 1, and the two transverse sides of the plastic bowl cup 10 are connected with the transverse material belt 2 only through a first metal connecting part 7 and a second metal connecting part 6;
(4) Appearance, namely, black marks are coated on positions with poor plastic through appearance detection;
(5) Packaging, namely winding a copper sheet coiled material with a bonding pad bracket and a plastic bowl cup 10 on a reel;
(6) Packaging, unreeling the copper sheet through a reel, and carrying out die bonding, wire bonding and dispensing in the plastic bowl cup 10;
(7) Stripping, namely continuously stamping the coiled copper sheet, punching off the root part connected with the positive electrode bonding pad 4 at the first metal connecting part 7, punching off the root part connected with the negative electrode bonding pad 5 at the second metal connecting part 6, cutting off the injection molding guide groove, and separating the single LED from the material frame.
According to the invention, through changing the LED manufacturing process flow, the clamping points at the edge of the longitudinal material belt 1 are removed, and the plastic bowl cup 10 and the bonding pad are supported only by the metal connecting part, so that the problems of damage and easy falling of an inverted bracket due to the existence of the clamping points are solved; in the packaging process, the poor plastic bowl cup 10 and the bonding pad bracket are not required to be washed away, so that the process flow can be saved; in the stripping process, the continuous operation is performed in a coil unreeling and stamping mode, the operation efficiency is high, and the material is stored in a coil mode, so that the packaging can be saved; as shown in fig. 5, in the beam splitting process, since two sides of a single LED are flat, the material cannot be blocked at the beam splitter track.
As shown in fig. 2, a plurality of cutting grooves 8 are punched at the two sides of the length direction of the material frame corresponding to the positions of the transverse material strips 2, and the material rolls are cut at the positions of the cutting grooves 8, so that the material rolls with the required length are obtained.
As shown in fig. 2, the widths of the two ends of the transverse material belt 2 are narrowed to form an on-line positive and negative electrode breaking point 3 for spot measurement, when a single LED needs to be spot-measured, the on-line positive and negative electrode breaking point is broken, so that the positive and negative electrodes of the single LED are broken, and the narrowed copper sheet is easier to break.
Claims (7)
1. An LED manufacturing process, comprising the steps of:
(1) Stamping, namely stamping a plurality of single bonding pad supports on a copper sheet coiled material, wherein longitudinal material belts are arranged on two longitudinal sides of each single bonding pad support, transverse material belts are arranged on two transverse sides of each single bonding pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a work or material rest, each single bonding pad support comprises an anode bonding pad and a cathode bonding pad, an isolation groove is arranged between each anode bonding pad and each cathode bonding pad, stamping empty grooves are formed between each single bonding pad support and the longitudinal material belts on two sides, each stamping empty groove is in a strip shape, each isolation groove is communicated with each stamping empty groove, one end of each anode bonding pad is connected with the transverse material belt on one side of each single bonding pad support through a first metal connecting part, and one end of each cathode bonding pad is connected with the transverse material belt on the other side of each single bonding pad support through a second metal connecting part;
(2) Electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) Injection molding, namely, injection molding a plastic bowl cup at the position of a single bonding pad bracket on a copper sheet coiled material, wherein the positive bonding pad and the negative bonding pad are embedded at the bottom of the plastic bowl cup, the longitudinal two sides of the plastic bowl cup are separated from a longitudinal material belt, and the transverse two sides of the plastic bowl cup are connected with a transverse material belt only through a first metal connecting part and a second metal connecting part;
(4) Appearance, namely, black marks are coated on positions with poor plastic through appearance detection;
(5) Packaging, namely winding a copper sheet coiled material with a bonding pad bracket and a plastic bowl cup on a reel;
(6) Packaging, unreeling the copper sheet through a reel, and carrying out die bonding, bonding wires and dispensing in a plastic bowl cup;
(7) Stripping, namely continuously stamping the coiled copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
2. An LED manufacturing process according to claim 1, wherein: the first metal connecting part is arranged in the middle of one end of the positive electrode bonding pad; the second metal connecting part is arranged at the middle position of one end of the negative electrode bonding pad.
3. An LED manufacturing process according to claim 1, wherein: the positive electrode bonding pad, the negative electrode bonding pad, the first metal connecting part, the second metal connecting part, the longitudinal material belt and the transverse material belt are integrally formed by stamping.
4. An LED manufacturing process according to claim 1, wherein: the middle position of one end of the positive electrode bonding pad, which corresponds to the first metal connecting part, is convex; the middle position of one end of the negative electrode bonding pad corresponding to the second metal connecting part is convex.
5. An LED manufacturing process according to claim 4, wherein: during stripping, the root part of the first metal connecting part connected with the positive electrode bonding pad is broken, and the root part of the second metal connecting part connected with the negative electrode bonding pad is broken.
6. An LED manufacturing process according to claim 1, wherein: and punching a plurality of cutting grooves on two sides of the length direction of the material frame corresponding to the positions of the transverse material belts.
7. An LED manufacturing process according to claim 1, wherein: and the widths of the two ends of the transverse material belt are narrowed to form an on-line positive and negative electrode breaking point for the suction test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111023923.5A CN113707791B (en) | 2021-09-02 | 2021-09-02 | LED manufacturing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111023923.5A CN113707791B (en) | 2021-09-02 | 2021-09-02 | LED manufacturing process |
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| CN113707791A CN113707791A (en) | 2021-11-26 |
| CN113707791B true CN113707791B (en) | 2023-05-26 |
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| CN204289506U (en) * | 2014-09-02 | 2015-04-22 | 木林森股份有限公司 | Can the electrically-conductive backing plate of injection mo(u)lding LED support and high density LED support module |
| CN204289515U (en) * | 2014-12-05 | 2015-04-22 | 博罗承创精密工业有限公司 | LED support material-strap structure |
| CN106784251A (en) * | 2017-01-09 | 2017-05-31 | 宜昌惠科科技有限公司 | A kind of SMC plastic-packageds LED support structure |
| CN206558538U (en) * | 2017-02-17 | 2017-10-13 | 东莞市纳博科精密模具有限公司 | A kind of flat cup supporting structures of LED |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201994337U (en) * | 2011-02-22 | 2011-09-28 | 广东德豪润达电气股份有限公司 | LED (Light Emitting Diode) packaging support structure and LED device |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
| CN104201273A (en) * | 2014-09-02 | 2014-12-10 | 木林森股份有限公司 | Efficient LED (Light Emitting Diode) lamp bead manufacturing method, conductive substrate of LED supports allowing injection forming and high intensity LED support module |
| CN111916435A (en) * | 2020-08-14 | 2020-11-10 | 盐城东山精密制造有限公司 | Flip LED packaging device and preparation method and application thereof |
| CN112151656A (en) * | 2020-09-10 | 2020-12-29 | 深圳市中顺半导体照明有限公司 | LED support machining method |
| CN213958947U (en) * | 2020-12-21 | 2021-08-13 | 山西高科华兴电子科技有限公司 | Do benefit to high density TOP structure LED frame of cutting |
| CN112993125A (en) * | 2021-02-07 | 2021-06-18 | 盐城东山精密制造有限公司 | Processing technology for packaging large-angle LED bracket |
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| CN113707791A (en) | 2021-11-26 |
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